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Excellence In Distribution SYBS Technical Marketing
Package
2019.06.20
Excellence In Distribution SYBS Technical Marketing/ 82
1. Package란?u Package의 역할
1. 환경으로 터 반 체 칩을 지킨다
2. 기판과 전기적으로 접 한다
3. 반 체 칩에 의 발열을 방열한다
u Package가 까만 이유
1. 반 체 PN접합에 이 닿으 전자에 의한 전 가 발생
2. 이로 인하여 Noise가 발생 동작을 일으킬 수 있다.
3. 흰색의 경 장기간에 걸쳐 변색의 려가 있다
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 83
u EIAJ Package Code
(1) 패키지 본체 재료코드
(2) 패키지 특징코드
(3) 패키지 칭코드
(4)패키지단자수코드
(5)패키지호칭치수코드
(6)단자직선간격코드
(1)패키지본체재료코드
예) P-SOP28-10.03 X 19.05-1.27
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 84
(2) 패키지 특징코드
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 85
(2) 패키지 특징코드
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 86
(3) 패키지명칭코드
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 87
3. Package (Through-hole type)
DO41 Glass DO35 Glass SOD57 Axial Lead
TO-220 TO-220AC TO220F TO247
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 88
3. Package (Through-hole type)
DPAK-3DIP
(Dual Inline Package )
SIP(Single In-line
Package)
ZIP(Zigzag In-line
Package)
TO-92 TO-92L TO-46 TO-3
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 89
4. Package (SMD)
SOT-23 SOT-23-5L MELFMetal ELectrode Face
SOD123
SOT-223TO-252
(DPAK)
TO-263
(D2PAK)
SOD-523
(SC79)
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 810
4. Package (SMD)DO-214AC
(SMA)
DO-214AA
(SMB)
DO-214AB
(SMC)
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 811
4. Package (SMD)
QFP(Quad Flat package)
SOIC(Small Outline)
BGA(Ball Grid Array)
LLP(Leadless Leadframe
Package)
TSSOP(Thin Shrinked SOP)
QFJ,PLCC(Plastic Leaded Chip
Carrier)
QFN(Quad Flat No Lead
package)
SOJ(Small Outline J-Leaded package)
PACKAGE
Excellence In Distribution SYBS Technical Marketing/ 812
