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7/22/2019 22LD350-TA Ch.LB01A (sm-MFL62865309 (1002-REV00)
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LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LB01A
MODEL : 22LD350 22LD350-TA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62865309 (1002-REV00)
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM...................................................................................16
EXPLODED VIEW .................................................................................. 17
SVC. SHEET ...............................................................................................
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 M and 5.2 M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only unti l the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. Module General Specification
1. Application rangeThis specification is applied to the LCD TV used LB01A
chassis.
2. Requirement for TestEach part is tested as below without special appointment.
1) Temperature: 25 C 5 C (77 F 9 F), CST : 40 C 5 C
2) Relative Humidity : 65 % 10 %3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followedeach drawing and specification by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed
2) Demanded other specification- Safety: CE, IEC specification- EMC:CE, IEC
No. Item Specification Remark
1 Display Screen Device 55 cm(22 inch) wide color display module LCD
2 Aspect Ratio 16:9
3 LCD Module 55 cm(22 inch) TFT LCD HD LGD/ CMO
4 Storage Environment Temp. : -20 deg ~ 60 deg
Humidity : 10 % ~ 90 %
5 Operating Environment Temp. : -0 deg ~ 40 deg
Humidity : 0 % ~ 85 %
6 Input Voltage AC 100-240 V~ 50 / 60 Hz
7 Power Consumption Power on (Blue)
LGD 26.05 W LCD (Module) + Backlight(Lamp)
CMO 22.1 W
8 Pixel Pitch LGD 116.5 um x 349.5 um
CMO 116 um x 379 um
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5. Module optical specifications(1) LGD Module
1) Standard Test Condition (The unit has been ON)2) Stable for approximately 30 minutes in a dark environment at 25 C 2 C.3) The values specified are at approximate distance 50 cm from the LCD surface.4) Ta = 25 C 2 C, VLCD = 12.0 V, fv = 60 Hz, Dclk = 74.25 MHz, VBR_A = 1.65 V, EXTVBR-B = 100 %
(2) CMO Module
1) Standard Test Condition (The unit has been ON)
2) Stable for approximately 30 minutes in a dark environment at 25 C 2 C.3) The values specified are at approximate distance 50 cm from the LCD surface.4) Ta = 25 C 2 C, VLCD = 12.0 V, fv = 60 Hz, Dclk = 74.25 MHz, VBR_A = 1.65 V, EXTVBR-B = 100 %
- 7 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle (CR > 10) Up/Down(Right/Left) 155(170) Degree
2. Luminance Luminance (cd/m2) 280 350
Variation - 1.3 MAX / MIN
3. Contrast Ratio CR 700 1000
4. CIE Color Coordinates White Wx 0.285
Wy 0.293
RED Rx 0.643
Ry Typ. 0.333 Typ.
Green Gx -0.03 0.295 +0.03
Gy 0.608
Blue Bx 0.1147
By 0.063
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle (CR > 10) Up/Down(Right/Left) 140(150) Degree
2. Luminance Luminance (cd/m2) 280 350
Variation - 1.3 MAX / MIN
3. Contrast Ratio CR 750 1000
4. CIE Color Coordinates White Wx 0.285
Wy 0.293
RED Rx 0.644
Ry Typ. 0.331 Typ.
Green Gx -0.03 0.273 +0.03
Gy 0.588
Blue Bx 0.151
By 0.061
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- 8 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)
No.Specification
RemarkResolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60.00 SDTV,DVD 480i
2. 720x480 15.63 59.94 SDTV,DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x480 31.50 60.00 480p
5. 720x576 15.625 50.00 SDTV,DVD 625 Line
6. 720x576 31.25 50.00 HDTV 576p
7. 1280x720 45.00 50.00 HDTV 720p
8. 1280x720 44.96 59.94 HDTV 720p
9. 1280x720 45.00 60.00 HDTV 720p
10. 1920x1080 31.25 50.00 HDTV 1080i
11. 1920x1080 33.75 60.00 HDTV 1080i
12. 1920x1080 33.72 59.94 HDTV 1080i
13. 1920x1080 56.250 50 HDTV 1080p14. 1920x1080 67.5 60 HDTV 1080p
No.Specification
Proposed RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1. 720*400 31.468 70.08 28.321 For only DOS mode
2. 640*480 31.469 59.94 25.17 VESA Input 848*480 60 Hz, 852*480 60 Hz
-> 640*480 60 Hz Display
3. 800*600 37.879 60.31 40.00 VESA
4. 1024*768 48.363 60.00 65.00 VESA(XGA)
5. 1280*768 47.78 59.87 79.5 WXGA
6. 1360*768 47.72 59.8 84.75 WXGA
7. 1280*1024 63.981 60.02 108.875 SXGA FHD Model
8. 1920*1080 66.587 59.93 138.625 WUXGA FHD model
7. RGB (PC)
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- 9 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
8. HDMI Input(1) DTV Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*400 31.468 70.08 28.321 HDCP
2. 640*480 31.469 59.94 25.17 VESA HDCP
3. 800*600 37.879 60.31 40.00 VESA HDCP
4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
5. 1280*768 47.78 59.87 79.5 WXGA HDCP
6. 1360*768 47.72 59.8 84.75 WXGA HDCP
7. 1280*1024 63.981 60.02 108.875 SXGA HDCP/FHD model
8. 1920*1080 67.5 60.00 138.625 WUXGA HDCP/FHD model
(2) PC Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 31.469 /31.5 59.94 /60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 /45 59.94 /60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 /33.75 59.94 /60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 /27 23.97 /24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716 /33.75 29.976 /30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 /67.5 59.94 /60 148.35/148.50 HDTV 1080P
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LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 10 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV withLB01A chassis.
2. Designation1) The adjustment is according to the order which is designated
and which must be followed, according to the plan which can
be changed only on agreeing.
2) Power Adjustment: Free Voltage3) Magnetic Field Condition: Nil.4) Input signal Unit: Product Specification Standard5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 C 5 C
Relative humidity : 65 % 10 %Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control.
7) Push the IN STOP key - For memory initialization.
3. Main PCB check process* APC - After Manual-Insult, executing APC
* Boot file Download1) Execute ISP program Mstar ISP Utility and then click
Config tab.
2) Set as below, and then click Auto Detect and check OKmessageIf Error is displayed, Check connection between
computer, jig, and set.3) Click Read tab, and then load download file (XXXX.bin)
by clicking Read4) Click Connect tab. If Can t is di splayed, check
connection between computer, jig, and set.
5) Click Auto tab and set as below6) Click Run.7) After downloading, check OK message.
* USB DOWNLOAD1) Put the USB Stick to the USB socket2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,it didnt work. But your downloaded version is High, USB
data is automatically detecting3) Show the message Copying files from memory
filexxx.bin
(4)
(7) .OK
(5)
(6)
(1)
filexxx.bin
(2) (3)
Please Check the Speed :To use speed betweenfrom 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push In-stop key
3. Push Power on key
4. Function inspection
5. After function inspection, Push In-stop key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
In-stop key at first.
2. Push Power on key for turning it on.
-> If you push Power on key, TV set will recover
channel information by itself.3. After function inspection, Push In-stop key.
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4) Updating is staring.
5) Uploading completed, The TV will restart automatically.6) If your TV is turned on, check your updated version and
Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,TV can lost all channel data. In this case, you have tochannel recover. if all channel data is cleared, you didnthave a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.1) Push "IN-START" key in service remote control.
2) Select Tool Option 1 and Push OK button.3) Punch in the number. (Each model has their number)
4) Completed selecting Tool option.
3.1. ADC Process(1) ADC
- Enter Service Mode by pushing ADJ key,
- Enter Internal ADC mode by pushing G key at 5. ADCCalibration
Using power on button of the Adjustment R/C,
power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence aa 00 00 [Enter Adjust Mode] xb 00 40 [Component1 Input (480i)] ad 00 10 [Adjust 480i Comp1] xb 00 60 [RGB Input (1024*768)] ad 00 10 [Adjust 1024*768 RGB]
aa 00 90 End Adjust mode* Required equipment : Adjustment R/C.
3.2. Function Check* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV2) AV (SCART1/SCART2/ CVBS)3) COMPONENT (480i)4) RGB (PC : 1024 x 768 @ 60hz)5) HDMI6) PC Audio In
* Display and Sound check is executed by Remote control.
- 11 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
Module Tool option1 Tool option2 Tool option3 Tool option4 Tool option5
LGD 8192 522 3076 26892 3104
CMO 8196 522 3076 26892 3104
No Item CMD1 CMD2 Data0
Enter Adjust Adjust A A 0 0 When transfer the Mode In,
Mode Mode In Carry the command.
ADC adjust ADC Adjust A D 1 0 Automatically adjustment
(The use of a internal pattern)
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4. Total Assembly line process4.1. Adjustment Preparation
W/B Equipment conditionCA210 : CH 9, Test signal : Inner pattern (85IRE)
Above 5 minutes H/run in the inner pattern. (power on key
of adjust remote control)
* Connecting picture of the measuring instrument(On Automatic control)Inside PATTERN is used when W/B is controlled. Connect toauto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the moduleless than 10 cm distance, keep it with the surface of the
Module and Color Analyzers prove vertically.(80 ~ 100).3) Aging time
- After aging start, keep the power on (no suspension ofpower supply) and heat-run over 5 minutes.
- Using no signal or full white pattern or the others,check the back light on.
Auto adjustment Map(RS-232C)RS-232C COMMAND[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
Color Temperature : COOL, Medium, Warm.One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(when R/G/B Gain are all C0, it is the FULL Dynamic Rangeof Module)
* Manual W/B process using adjusts Remote control. After enter Service Mode by pushing ADJ key,
Enter White Balance by pushing G key at 6. WhiteBalance.
* After done all adjustments, Press In-start button andcompare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is notsame, then correct it same with BOM and unplug AC cable.For correct it to the models module from factory Jig model.
* Push the IN STOP key after completing the functioninspection. And Mechanical Power Switch must be set
ON.
4.2. DDC EDID Write (RGB 128Byte ) Connect D-sub Signal Cable to D-sub Jack.
Write EDID Data to EEPROM(24C02) by using DDC2Bprotocol. Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded toInsert Process in advance.
4.3. DDC EDID Write (HDMI 256Byte) Connect HDMI Signal Cable to HDMI Jack. Write EDID Data to EEPROM(24C02) by using DDC2B
protocol. Check whether written EDID data is correct or not.* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.4. EDID DATA1) All Data : HEXA Value2) Changeable Data :*: Serial No : Controlled / Data:01**: Month : Controlled / Data:00***:Year : Controlled****:Check sum
- 12 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
Cool 9,300 K X=0.285(0.002)
Y=0.293(0.002)
Medium 8,000 K X=0.295(0.002) Inner pattern
Y=0.305(0.002) (216gray,85IRE)
Warm 6,500 K X=0.313(0.002)
Y=0.329(0.002)
Full White Pattern
COLOR
ANALYZERTYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MIN CENTER MAX
[CMD ID DATA] (DEFAULT)
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain j i Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
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4.5. Auto Download1) Press Adj. key on the Adj. Remote control.2) Select EDID D/L menu.3) By pressing Enter key, EDID download will begin4) If Download is successful, OK is display, but If Download if
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
* Edid data and Model option download (RS232)
- Manual Download* Caution1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.3) Use the proper cables below for EDID Writing4) Download HDMI1, HDMI2, separately because HDMI1 is
different from HDMI2
1) HD RGB EDID data
2) HD HDMI EDID data
* Detail EDID Options are below
Product ID
Serial No: Controlled on production line.
Month, Year: Controlled on production line:
ex) Monthly : 02 -> 01
Year : 2010 -> 14
Model Name(Hex):
Checksum: Changeable by total EDID data.
Vendor Specific(HDMI)
Model Name HEX EDID Table DDC Function
HD Model 0000 00 00 Analog/Digital
LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
- 13 -
MODEL MODEL NAME(HEX)
all 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
For HDMI EDIDFor Analog EDID
INPUT MODEL NAME(HEX)
HDMI1 65030C001000011D
HDMI2 65030C002000011D
HDMI3 65030C003000011D
0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 01 03 68 73 41 78 0A CF 74 A3 57 4C B0 23
20 09 48 4C A1 08 00 81 C0 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70
40 36 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A
60 3E 1F 46 10 00 0A 20 20 20 20 20 20 d
70 d 00 e
80 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
90 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
A0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
B0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
C0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
D0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
E0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
F0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b10 c 01 03 80 73 41 78 0A CF 74 A3 57 4C B0 23
20 09 48 4C A1 08 00 81 C0 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70
40 36 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A
60 3E 1F 46 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 20 F1 4E 10 1F 84 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 80 18 71 1C 16 20 58 2C 25 00 7E 8A 42 00
B0 00 9E 01 1D 00 80 51 D0 0C 20 40 80 35 00 7E 8A
C0 42 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00
D0 7E 8A 42 00 00 18 02 3A 80 18 71 38 2D 40 58 2C
E0 45 00 7E 8A 42 00 00 1E 01 1D 80 D0 72 1C 16 20
F0 10 2C 25 80 7E 8A 42 00 00 9E 00 00 00 00 00 D5
NO Item CMD1 CMD2 Data0
Enter Download A A 0 0 When transfer the Mode In,
download Mode Mode In Carry the command.
EDID data Download A E 00 10 Automatically Download
and Model (The use of a internal pattern)
option download
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- 14 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
4.5. V-COM Adjust(Only LGD(M+S) Module)- Why need Vcom adjustment?A The Vcom (Common Voltage) is a Reference Voltage of
Liquid Crystal Driving.-> Liquid Crystal need for Polarity Change with every frame.
- Adjust sequence Press the PIP key of th ADJ remote control.(This PIP key ishot key to enter the VCOM adjusting mode)(Or After enter Service Mode by pushing ADJ key, then
Enter V-Com Adjust mode by pushing G key at 10. V-Com
As pushing the right or the left key on the remote control,and find the V-COM value which is no or minimized theFlicker. (If there is no flicker at default value, Press the exit
key and finish the VCOM adjustment.) Push the OK key to store value. Then the messageSaving OK is pop.
Press the exit key to finish VCOM adjustment.
(Visual Adjust and control the Voltage level)
4.6. Outgoing condition Configuration- When pressing IN-STOP key by SVC remocon, Red LED are
blinked alternatively. And then Automatically turn off.(Must not AC power OFF during blinking)
4.7. Internal pressure
Confirm whether is normal or not when between powerboards ac block and GND is impacted on 1.5 kV(dc) or 2.2kV(dc) for one second.
5. Model name & Serial number D/L Press Power on key of service remocon.
(Baud rate : 115200 bps) Connect RS232 Signal Cable to RS-232 Jack.
Write Serial number by use RS-232. Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
5.1. Signal TABLE
CMD : A0hLENGTH : 85~94h (1~16 bytes)ADH : EEPROM Sub Address high (00~1F)ADL : EEPROM Sub Address low (00~FF)Data : Write dataCS : CMD + LENGTH + ADH + ADL + Data_1 ++ Data_nDelay : 20ms
5.2. Command Set
* DescriptionFOS Default write : writeVtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,PhaseData write : Model Name and Seri al Numbe r writ e in
EEPROM,.
5.3. Method & noticeA. Serial number D/L is using of scan equipment.B. Setting of scan equipment operated by Manufacturing
Technology Group.C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatoryby D-book 4.0.
* Manual Download (Model Name and Serial Number)If the TV set is downloaded by OTA or Service man, Sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It needManual download.1) Press the instart key of ADJ remote controller.2) Go to the menu 5.Model Number D/L like below photo.3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY
No. Adjust mode CMD(hex) LENGTH(hex) Description
1 EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)
Row Line
Column Line
CLC CST
Panel
S
Y
S
T
E
M
Gate
Driv
e
IC
Source D r i v e IC
Circuit Block
TimingContr o l le r
Pow erBlo ck
VCOM
GammaReference V oltage
Gamma R eferenceVoltage
Data(R,G,B) & C ontrol signal
Control signal
Data(R,G,B) &Control signal
In
terface
TFT
Po w e r I n p u tPower Input
Da t a I n p u tDa t a I n p u t
V COM
LiquidCrystal
VCOM
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4) Check the model name Instart menu -> Factory namedisplayed (ex 42LD450-ZA)
5) Check the Diagnostics (DTV country only) -> Buyer model
displayed (ex 42LD450)
6. CI+ key download(Only for CI model)6-1. Download Procedure
(1) Press "Power on" button of a service R/C.(Baud rate :115200 bps)
(2) Connect RS232-C Signal Cable.(3) Write CI+ Key through RS-232-C.
(4) Check whether the key was downloaded or not at In Startmenu. (Refer to below).
=> Check the Download to CI+ Key value in LGset.
6-2. check the method of CI+ Key value(1) Check the method on Instart menu
(2) check the method of RS232C Command1) into the main assy mode (RS232 : aa 00 00)
2) check the key download for transmitted command(RS232 : ci 00 10)
3) result value- normally status for download : OKx- abnormally status for download : NGx
6-3. Check the method of CI+ key value (RS232)(1) into the main assy mode (RS232 : aa 00 00)
(2) Check the method of CI+ key by command(RS232 : ci 00 20)
(3) Result valuei 01 OK 1d1852d21c1ed5dcx
- 15 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
CMD 1 CMD 2 Data 0
A A 0 0
CMD 1 CMD 2 Data 0
C I 1 0
CMD 1 CMD 2 Data 0
A A 0 0
CMD 1 CMD 2 Data 0
C I 2 0
CI+ key Value
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- 16 - LGE Internal Use OnlyCopyright 2010 LG Electronics. Inc. All rights reserved.Only for training and service purposes
BLOCK DIAGRAM
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- 17 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
300
200
8
03
521
802
511
510
400
801
530
540
401
12
0
122
500
A2
A5
A21
LV1
402
910 9
00
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
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7/22/2019 22LD350-TA Ch.LB01A (sm-MFL62865309 (1002-REV00)
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3
.5V
_ST
OCD1B
R1018 22
OCD1A
+3.5V_ST
R1080
22
MODEL1_OPT_2
R1062
22
NON
_M
_REMOTE
R 10 60 2 2
M_REMOTE
OCD1B
C1003
0.1uF
NEC
_RXD
R1036
22
R 10 67 2 2
R 10 81 2 2
TP1001
OCD1A
R1043
22
R 10 59 2 2
NON_M_REMOTE
IR
WIRELESS
_DETECT
R 10 65 2 2R1073 10K
POWER
_ON
/OFF2
_2
CEC_REMOTE_NEC
IC1002
UPD78F0513AGA-GAM-AX
NEC_MICOM
1P60/SCL0
2P61/SDA0
3P62/EXSCL0
4P63
5P33/TI51/TO51/INTP4
6P75
7P74
8P73/KR3
9P72/KR2
10P71/KR1
11P70/KR0
12P32/INTP3/OCD1B
13
P31
/INTP2
/OCD1A
14
P30
/INTP1
15
P17
/TI50
/TO50
16
P16
/TOH1
/INTP5
17
P15
/TOH0
18
P14
/RXD6
19
P13
/TXD6
20
P12
/SO10
21
P11
/SL10
/RXD0
22
P10
/SCK10
/TXD0
23
AVREF
24
AVSS
2
2
2
2
2
3
3
3
3
3
3
337
P120
/INTP0
/EXLVI
38
P41
39
P40
40
RESET
41
P124
/XT2
/EXCLKS
42
P123
/XT1
43
FLMD0
44
P122
/X2
/EXCLK
/OCD0B
45
P121
/X1
/OCD0A
46
REGC
47
VSS
48
VDD
FLMD0
R1019 22
R 10 23 2 2
R1041
22
POWER
_DET
R1061
22
M_
REMOTE
NEC_ISP_Tx
P100112505WS-12A00
MICOM_DEBUG
1
2
3
4
5
6
7
8
9
10
11
12
13
OCD1B
POWER_ON/OFF2_1
NEC_ISP_Rx
R 10 07 1 00
IC1001
M24C16-WMN6T
3NC_3
2NC_2
4VSS
1NC_1
5SDA
6SCL
7WC
8VCC
R 10 76 2 2
NEC_SCL
+3.5V_ST
MODEL1_OPT_3
R1037
22
NEC
_ISP
_Rx
GND
R1069
22
+3.5V_ST
MODEL1_OPT_1
MICOM_RESET
C1002
0.
1u
F
RF_RESET
R1014
4.
7K
R1001
47K
TP1002
LED
_B
/LG
_LOGO
R10
39
22
R 10 70 1 00
FLMD0
WIRELESS
_PWR
_EN
NEC_EEPROM_SDA
NEC_SDA
INV_CTL
NEC_EEPROM_SDA
TP1003
R1005 10KAMP_MUTE
NEC_ISP_Rx
AMP_RESET_N
NEC
_ISP
_Tx
MICOM
_RESET
PANEL_CTL
OCD1A
R1072 10K
R 10 63 2 2
C1006
0
.1u
F
R 10 64 2 2
MODEL1_OPT_0
+3.5V_ST
R 10 66 2 2
R1008
22
+3.5V_ST
NEC_EEPROM_SCL
MODEL1_OPT_0
R1015
4.
7K
R1068
22
NEC_ISP_Tx
NEC_EEPROM_SCL
RF
_ENABLE
R 10 10 2 2
R 10 13 2 2
MODEL1_OPT_1
R1044 10
OP
R1045 10
OP
R 10 78 2 2
LED
_R
/BUZZ
R1006 10K
NEC
_TXD
SOC_RESET
R1002 10K
R1083 1
R1084
10K
OPT
+3.5V_ST
R1086
47K
OPT
+3
.5V
_ST
R1034
4.7MCRYSTAL_KDS
R1071
10K
B/L
_LED
R1011
10K
TACT
_KEY
R1004
10K
PWM
_LED
R1012
10K
B/L
_LAMP
R1009
10K
PWM
_BUZZ
/IIC
_LED
R1075
10K
TOUCH
_KEY
R1074
10K
NON
_GPIO
_LED
R1079
10K
GPIO
_LED
R1030
10K
R1091 10K
CEC_ON/OFFR 10 03 0
R 10 20 0
X1002-*132.768KHz
CRYSTAL_EPSON
C1008
15p
F
C1007
15p
F
X1002
32.768KHz
CRYSTAL_KDS
for Debugger
MICOM MODEL OPTION
EEPROM for Micom
B/L_LED
PIN NO.
11
HIGH
MODEL OPTION
B/L_LAMP
MODEL_OPT_2
MODEL_OPT_0
LOWPIN NAME
MODEL_OPT_1
8
MODEL_OPT_3
30
3 1 G PI O_ LE D NON_GPIO_LED
T OU CH _K EY T AC T_ KE Y
PWM_LEDPWM_BUZZ/IIC_LED
MODEL_OPT_1 MODEL_OPT_2MODEL_OPT_0 MODEL_OPT_3
LOW LOW LOW LOW
LOW LOW
LOW
LOWLOWLOW
HIGH HIGH
HIGH HIGH HIGH
HIGH
HIGH HIGHLOW LOW
LD350/450/550
19/22/26LE3300(5500)
32/37/42/47/55LE5300(10)
LD420
LE7300
HIGH HIGH TBD
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
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Fi
ber
Opti
c
HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DSUB_R-
SPDIF_OUT
090:T20
R110815K
DSUB_G-
DSUB_G+
C1108
100pF50V
R112622
OPT
DSUB_HSYNC
R11380
R110715K
R11360
R1103
470K
PC_R_IN 090:S13
DSUB_R+
R111110K
D1101
5.6VOPT
AMOTECH
C1117
0.1uF16V
OPTR1102470K
DSUB_B-
AT24C0
3A2
2A1
4GND
1A0
JK1103
JST1223
-001
1GND
2VCC
3VINPUT
4
FIX
_POLE
+3.3V_Normal
C1121
100pF50V
DSUB_B+
DSUB_VSYNC
R111010K
C1107100pF50V
D1102
5.6VOPT
AMOTECH
C1122
68pF
50V
OPT
PC_L_IN 090:S13
IC1104NL17SZ00DFT2G
OPT
3GND
2B
4Y
1A
5VCC
R11340
R11270
C1131
0.1uF
16V
R1152
4.7K
OPT
Q1103
MMBT3904-(F)
E
B
C
HP_ROUT
090:V8
+3.5V_STR1130
10K
C1115
1000pF
50VOPT
SIDE_HP_MUTE
C1116
1000pF
50VOPT
+3.3V_Normal
SPK_R-_HOTEL
052:I22
SPK_R+_HOTEL
052:I22
HP_DET
R11551K
HP_LOUT
090:V9
Q1101
MMBT3904-(F)
E
B
C
Q1102
MMBT3904-(F)
E
B
C
C1119
10uF16V
EXCEPT_CHINA_HOTEL_OPT
C111810uF
16V
EXCEPT_CHINA_HOTEL_OPT
Q1104MMBT3904-(F)
E
B
C
R11251K
R11281K
R113375
R113575
R1137
75
JK1102
PEJ027-01
6B T_TERMINAL2
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
R11120
R11130
JK3301KJA-PH-0-0177
3DETECT
4L
5GND
1RQ1105
ISA1530AC1
E
B
C
Q1106
2SC3052E
B
C
R11293.3K
5.15 Mstar Circuit Application
PC AUDIO RGB PCSPDIF OPTIC JACK
COMMON AREANew Item DevelopmentEARPHONE BLOCK
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C1101 0.33uF
C11050.1uF
R1157 0
R1156 0
R1124100
NEC_RXD
C11060.1uF
+3.5V_ST
R1153 0
R1154 0
D1108
30VCDS3C30GTH
IR_OUT
C11030.1uF
S7_TXD1
D1107
30VCDS3C30GTH
R1114
4.7K
OPT
NEC_TXD
IC1101
MAX3232CDR
EAN41348201
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9ROUT2
10DIN2
11DIN1
12ROUT1
13RIN1
14DOUT1
15GND
16VCC
C11040.1uF
R11094.7KOPT
C11020.1uF
+3.5V_ST
S7_RXD1
R1123100
R11220
OPT
JP1121
JP1122
RS232C
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDEAV_R_IN
SIDEAV_L_IN
D33025.6V
SIDE_AV_OPT
R3306
10K
SIDE_AV_OPT
R330812K
SIDE_AV_OPT
SIDEAV_CVBS_IN
D33045.6V
SIDE_AV_OPT
R3307
10K
SIDE_AV_OPT
C3303
100pF50V
SIDE_AV_OPT
L3303
BLM18PG121SN1D
SIDE_AV_OPT
D330130V
SIDE_AV_OPT
L3301BLM18PG121SN1D
SIDE_AV_OPT
R33051K
SIDE_AV_OPT
R3302
10KSIDE_AV_OPT
C3302
100pF50V
SIDE_AV_OPT
D33035.6V
SIDE_AV_OPT
+3.3V_Normal
R3304470K
SIDE_AV_OPT
R3303
470K
SIDE_AV_OPT
R3309
12K
SIDE_AV_OPT
L3302BLM18PG121SN1D
SIDE_AV_OPT
C3301
100pFSIDE_AV_OPT
C3304
100pF
OPT
SIDEAV_DET
R330175
SIDE_AV_OPT
JK3302
PPJ235-01
SIDE_AV_OPT
4A [YL]O-SPRING
5A [YL]E-LUG
3A [YL]CONTACT
4B [WH]O-SPRING
3C [RD]CONTACT
4C [RD]O-SPRING
5C [RD]E-LUG
(New Item Developmen H:9.2mm)
SIDE_AV
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
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USBD
OWN
STREAM
E SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.LRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIGN6409
R1453 0
D1452
5.6V
CDS3C05HDMI1
OPT
JK1450
KJA-
UB-
4-
0004
1
2
3
4
5
L1451
MLB-201209-0120P-N2
120-ohm
SIDE_USB_DP
SIDE_USB_DM
R1452 0
TP1451
D1451
5.6VCDS3C05HDMI1
OPT
/RST_HUB
C1451
22uF
10V
IC1450
AP2191SG-13
3IN_2
2IN_1
4EN
1GND
5FLG
6OUT_1
7OUT_2
8NC
C1452
10uF
10V
+5V_USB
C1453
0.1uF
R1455
4.7K
OPT
+3.3V_Normal
R1456 0
USB1_CTL
R145410K
R1451 47 USB1_OCD
USB_DIODES
$0.077
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPI_SCK/FLASH_WP
R14020
R1401
0OPT
/SPI_CS
R1404
4.
7K
C1401
0.1uF
+3.3V_Normal+3.3V_Normal
Q1401
KRC103S
E
B
C
+3.3V_Normal
R1403
10K
R140533
SPI_SDO
SPI_SDI
IC1401
MX25L8005M2I-15G
S_FLASH
3WP#
2SO
4GND
1CS#
5SI
6SCLK
7HOLD#
8VCC
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
FE_TS_CLK
C29210.1uF16V
ISDB_DEMOD
IF_N_EXT
R 29 13 2 2ISDB_DEMOD
R2906 10K
ISDB_DEMOD
C29110.1uF
16V
ISDB_DEMOD
IF_P_EXT
C29170.1uF16V
ISDB_DEMOD
R2915
2.2K
OPT
C2926 0.1uF
ISDB_DEMOD
C29240.1uF16V
ISDB_DEMOD
R 29 11 2 2ISDB_DEMOD
C2928 0.1uF
ISDB_DEMOD
C29100.1uF
ISDB_DEMOD
C29200.1uF16V
ISDB_DEMOD
DEMOD_SCL
C2927 0.1uF
ISDB_DEMOD
C29180.1uF16V
ISDB_DEMOD
DEMOD_RESETR 29 07 2 .2 KISDB_DEMOD
C29130.1uF16V
ISDB_DEMOD
C2905 0.1uF ISDB_DEMOD
R29091M
ISDB_OPTIF_AGC_ISDB
+3.3V_DE
C2925 0.1uF
ISDB_DEMOD
R 29 12 2 2ISDB_DEMOD
C2908 0.1uF ISDB_DEMOD
FE_TS_VAL_ERR
C2906 0.1uF ISDB_DEMOD
C2907 0.1uF ISDB_DEMOD
R 29 05 2 .2 KISDB_DEMOD
C29160.1uF16V
ISDB_DEMOD
C291915pF
50V
ISDB_DEMOD
R 29 10 2 2ISDB_DEMOD
C29230.1uF16V
ISDB_DEMOD
C2903 0.1uFISDB_DEMOD
FE_TS_SYNC
+3.3V_DE
R2914
2.2K
OPT
DEMOD_SDA
C29220.1uF16V
ISDB_DEMOD
C2915
15pF
50V
ISDB_DEMOD
C2909 0.1uF ISDB_DEMOD
C2904 0.1uFISDB_DEMOD
R 29 08 2 .2 KISDB_DEMOD
+1.2V_DE
C29120.1uF16V
ISDB_DEMOD
C2901 0.1uF
ISDB_DEMOD
FE_TS_DATA[0]
C2902 0.1uFISDB_DEMOD
R 29 04 2 .2 KISDB_DEMOD
C2914
0.1uF
16V
ISDB_DEMOD
R290310K 1%
ISDB_DEMOD
X290125MHz
ISDB_DEMOD
IC2901
MN884433
ISDB_DEMOD
1VSS_1
2AVDD_S
3AII_S
4AIQ_S
5AVSS_S
6VRT_S
7VRB_S
8TCPO_S
9VDDL_1
10MSCL_S
11MSDA_S
12VSS_2
13VSSH
14PSEL
15ZSEL
16VDDL_2
17ACKI
18TCPO_T
19IR_T
20VRT_T
21VRB_T
22AVDD_T
23AIN_T
24AIP_T
25AVSS_T
26
VSS
_3
27
MSCL
_T
28
MSDA
_T
29
VDDH
_1
30
GPO1
31
AGCI
_T
32
AGCR
_T
33
GPO0
34
VDDL
_3
35
VSS
_4
36
XO
37
XI
38
VDDH
_2
39
GPI1
40
GPI0
41
TEST4
42
SHVPP
43
SHVDDH
44
NC
_1
45
VSS
_5
46
VDDL
_4
47
TCK
48
TDI
49
NRST
50
TEST3
51 VSS_652 VDDL_553 TRST54 TMS
55 CSEL0
56 CSEL1
57 TDO
58 SYNCA59 ERRA60
SYNCB61 ERRB
62 VSS_7
63 VDDL_6
64 SADR_T
65 NC_2
66 SADR_S67 HDVDDL068 VSS_8
69 SDA
70 SCL
71 VDDH_3
72 SADR
73 INTA74 INTB75 VSS_9
76
TEST1
77
TEST2
78
SCKA
79
GPI2
80
SDOA
81
PCKA
82
DENA
83
VDDH
_4
84
VSS
_10
85
HDVPP
86
RON
87
NC
_3
88
HDVDDH
89
NC
_4
90
HDVDDL1
91
VSS
_11
92
VDDL
_7
93
SCKB
94
TEST0
95
SDOB
96
PCKB
97
DENB
98
GPO2
99
VDDH
_5
100
AGC
_S
PANASONIC (ISDB-T)
MN884433
(FE_TS_SERIAL)
AMP_I2C HAVE PULL-UP
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCM_D[2]
PCM_D[6]
FE_TS_DATA[5]
FE_TS_DATA[7]
FE_TS_DATA[3]
PCM_D[1]
FE_TS_DATA[0]
FE_TS_DATA[6]
FE_TS_DATA[4]
PCM_D[3]
PCM_D[7]
FE_TS_DATA[1]
PCM_D[5]
PCM_D[4]
PCM_D[0]
FE_TS_DATA[2]
PCM_A[13]
/PCM_IORD
CI_TS_DATA[7]
CI_TS_CLK
CI_TS_SYNC
PCM_A[14]
/PCM_REG
CI_TS_DATA[5]
PCM_A[12]
/PCM_CD
PCM_A[10]
CI_TS_DATA[3]
FE_TS_VAL_ERR
PCM_A[8]
/PCM_WE
PCM_A[3]CI_TS_DATA[4]
CI_TS_DATA[1]
CI_TS_DATA[0]
/PCM_IOWR
PCM_A[0]
PCM_A[4]
FE_TS_CLK
PCM_5V_CTL
PCM_RST
PCM_A[11]
PCM_A[6]
PCM_A[9]
FE_TS_SYNC
PCM_A[2]
PCM_A[5]
/PCM_IRQA
/PCM_WAIT
CI_TS_VAL
/PCM_CE
FE_TS_DATA[0-7]
CI_TS_DATA[2]PCM_A[1]
PCM_A[7]
/PCM_OE
CI_TS_DATA[6]
PCM_D[0-7]
NON CI Region
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TP2502
TP2501
TP2504 RF_ENABLE
RF_RESET
M_REMOTE_TX
M_REMOTE_RX
TP2503
NON Motion Remocon Region
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AMP_MUTE_HOTEL
SPK_R-_HOTEL
SPK_R+_HOTEL
NON CHINA HOTEL
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R 26 26 0
S7_RXD1S7_RXD
S7_TXD1
WIRELESS_DL_RX
WIRELESS_PWR_EN
WIRELESS_SW_CTRL
S7_TXD
WIRELESS_DL_TX
WIRELESS_DETECT
R 26 27 0
NON-WIRELESS MODEL
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E SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.LRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Q7602
2SC3052
Commercial_EU E
B
C
KEY2 D76
5.6CDS
R7619100
EYEQ/TOUCH_KEY
R761122
Commercial
+3.5V_ST
R7615
47K
Commercial
C76091000pF
50VOPT
R761647K
Commercial
+3.5V_ST
C76060.1uF
16V
C76030.1uF
D76025.6V
AMOTECH
R7613
47K
Commercial_EU
R7601100
C7608100pF50V
C76051000pF50V
L7603BLM18PG121SN1D
C76020.1uF
LED_R/BUZZ
+3.3V_Normal
+3.5V_ST
C76071000pF50V
D7604
5.6VCDS3C05
R7617100
C76110.1uF
16V
OPT
R7600100
LED_B/LG_LOGO
C7610
1000pF
50VOPT
R761410K
Commercial_EU
+3.5V_ST
KEY1
L7604
BLM18PG121SN1D
L7602
BLM18PG121SN1D
R7618100
EYEQ/TOUCH_KEY
C76040.1uF
16V
R7
O
Q7603
2SC3052
Commercial
E
B
C
D76065.6V
AMOTECH
L7605
BLM18PG121SN1D
IR_OUT
D76035.6V
AMOTECH
R76120
Commercial_US
R7605
10K1%
R7606
10K
1%
R7604
47K
Q7600
2SC3052E
B
C
R7608
47K
R760710K
R760947K
R760222
+3.5V_ST
Q7601
2SC3052E
B
C
+3.5V_ST
IR+3.5V_ST
R7610
3.3K
OPT
R76030
OPT
NEC_EEPROM_SCL
NEC_EEPROM_SDA
P7600
12507WR-03L
1
2
3
4
L7600
BLM18PG121SN1D
L7601
BLM18PG121SN1D
C7600
0.1uF
16V
C7601
0.1uF
16V
D7601
5.
6V
D7600
5.
6V
R7621
1.5K
R 76 20 1 .5 K
CONTROL
IR & LED
IR
Zener Diode is
GP2_
COMMERCIAL
close to wafe
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JP7704
R7727 0
DDC_SCL_1
R7738 0
Q7700
2SC3052
E
B
C
+3.5V_ST
R772910K
JP7703
R7716 0
R7732
3.
3K
D2-_HDMI1
R7730
1K
C7700
0.1uF16V
R7717 22
5V_DET_HDMI_1
R7735 100
HDMI_CEC
R7708 100
D2-_HDMI2
R7702
1K
CK+_HDMI4
D2+_HDMI4
R7741 0
D1-_HDMI4
Q7702
2SC3052
E
B
C
D7701
R770722
CK-_HDMI1
CEC_REMOTE_NEC
JK7700
EAG59023302
HDMI
_2
14
13
5D1_GND
20
SHIELD
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
D2+_HDMI2
DDC_SDA_4
R7734 22
JP7700
D0-_HDMI1
C77010.1uF
16V
JP7701
R7723 0
DDC_SCL_2
R7718 22
D0-_HDMI4
JP7702
R7742 0
R7739 0
D1-_HDMI2
D0+_HDMI2
R7722 0
R7710 0
R7719 100
R7744
10K
D7703
CK+_HDMI2
D7702
D1-_HDMI1
R7700
1K
HPD4R7728
10K
DDC_SDA_1
5V_HDMI_4
R7705
3.
3K
R7726 0
D0+_HDMI4
R7725 0
R7733 22
R7709 0
C7702
0.1uF
16V
JP7705
R7736 0
D2-_HDMI4
HDMI_CEC
D1+_HDMI1
CK+_HDMI1
CK-_HDMI4
D0+_HDMI1
D1+_HDMI4
D2+_HDMI1
R7721 0
5V_DET_HDMI_4
R7713 0
R7743 0
R7737 0
D0-_HDMI2
R7703
1.8K
R7701
1.8K
R7731
1.8K
R7714 0
DDC_SCL_4
5V_HDMI_2
R776210K
CK-_HDMI2
JK7701
EAG59023302
HDMI
_1
14
13
5D1_GND
20
SHIELD
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
R7706 22
D7700
R7712 0
R7720 0
HDMI_CEC
HPD1
R7715 0
D1+_HDMI2
HPD2
HDMI_CEC
R7711 0
R7724 0
R7704
3.
3K
C7706
0.1uF16V
5V_HDMI_1
5V_DET_HDMI_2
R7740 0
Q77012SC3052
E
B
C
DDC_SDA_2
JK7702
EAG42463001
HDMI
_SIDE
14
13
5D1_GND
20
JACK_GND
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7 D0+
6D1-
15
D7707
AVRL161A1R1NT
OPT Q7703
BSS83
S B D
G
R77630
OPT
R7745
68K
R776468K
BSS83
Q7704
S B D
G
R776710K
D7708
R7765
68K
+3.3V_Normal
R7768
68KOPT
R77660
OPT
CEC_REMOTE_S7
D7709
AVRL161A1R1NT
OPT
C77070.1uF
16V
R77690
CEC_ON/OFF
$0.253
For CEC
HDMI_1
HDMI_2
SIDE_HDMI
$0.253
$0.253
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E SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.LRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
5V_DET_HDMI_3
FRC_RESET
SCAN_BLK1/OPC_OUT
SCAN_BLK2
TP7013
TP7014
TP7016
TP7017
WIRELESS_DL_TX
WIRELESS_DL_RXTP7018
TP7019
/PIF_SPI_CS
ET_RXER
/RST_PHY
WIRELESS_DETECT
WIRELESS_PWR_EN
TP7032
TP7033
RF_ENABLE
RF_RESET
TP7035
TP7036
TP7020
TP7021
TP7022
M_REMOTE_TX
M_REMOTE_RXTP7023
TP7024
FRC_SCLTP7025
FRC_SDATP7026
TP7027
UART_FRC_TXTP7028
UART_FRC_RX
FRC_PWM1
TP7029
TP7030
FRC_PWM0
TP7034 WIRELESS_SW_CTRL
MICOM BLOCKMAIN1 BLOCK
GP2_S
TP_
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THERMAL
HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C7834390pF50V
C782610uF
35V
AMP_SDA
+1.8V_AMP
AUD_LRCH
C78380.47uF50V
C7814
22pF50V
OPT
0.
C7
5
C782922000pF
50V
R781612
R781712
L7804
AD-8770
15uH
2S
1S 1F
2F
C7806
100pF
50V
AUD_SCK
+1.8V_AMP
R78093.3
OPT
AUD_MASTER_CLK
C782322000pF50V
D7802
100V
1N4148W
OPT
R781512
C7835
390pF50V
C7813
22pF50V
OPT
0.1uFC7824
50V
+3.3V_Normal
C7819
22000pF50V
R7802 100
C78101000pF50V
0.
C7
50
AMP_RESET_N
R781312
R7806
3.3K
+1.8V_AMP
C78030.1uF
16V
R781812
R7803 100
0.C7
5
0.1uF
C7830
50V
C7833
10uF35V
C7802
10uF10V
C78251uF25V
0.1uFC7807
16V
D7801
100V
1N4148W
OPT
L7801
BLM18PG121SN1D
C7817
22pF50V
OPT
0.1uFC7818
16V
AMP
_MUTE
_HOTEL
+1.8V_AMP
C7831
0.01uF
50V
OPT
C780510uF10V
OPT
0.C7
5
C78081000pF
50V
AMP_MUTE
0.1uFC7820
50V
C7828
22000pF50V
AMP_VCC
R781412
+3.3V_Normal
C7836390pF50V
+3.5V_ST
R781212
C78221uF25V
AMP_VCC
C78000.1uF
16V
AUD_LRCK
C78040.1uF
16V
R781912
AMP_SCL
R78070
OPT
D7803
100V
1N4148W
OPT
L7802
BLM18PG121SN1D
C78271uF25V
Q78002SC3052
E
B
C
D7800
100V
1N4148W
OPT
R7808 100
L7803
AD-8770
15uH
2S
1S 1F
2F
0.1uF
C7832
50V
0.1uFC7811
L7800
BLM18PG121SN1D
TP7800
C7821
1000pF50V
C7837390pF50V
C7816
1uF 25V
R7811
10K
POWER_DET
R7801 100
R781010K
C781510uF10V
OPT
R7800
1
C780110uF10V
OPT
C78390.47uF50V
IC7801
NTP-7000
EAN60969601
1BST1A
2VDR1A
3/RESET
4AD
5DGND_1
6GND_IO
7CLK_I
8VDD_IO
9DGND_PLL
10AGND_PLL
11LF
12AVDD_PLL
13DVDD_PLL
14GND
15
DGND
_2
16
DVDD
17
SDATA
18
WCK
19
BCK
20
SDA
21
SCL
22
MONITOR0
23
MONITOR1
24
MONITOR2
25
/FAULT
26
VDR2B
27
BST2B
28
PGND2B
_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_232 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
43
VDR1B
44
BST1B
45
PGND1B
_1
46
PGND1B
_2
47
OUT1B
_1
48
OUT1B
_2
49
PVDD1B
_1
50
PVDD1B
_2
51
PVDD1A
_1
52
PVDD1A
_2
53
OUT1A
_1
54
OUT1A
_2
55
PGND1A
_1
56
PGND1A
_2
57
EP
_PAD
R 78 04 3 3
R 78 05 3 3
C7809
18pF50V
C7812
18pF50V
IC7800-*1
KIA1117ST18
Replacement
2
OUT
3IN
1ADJ/GND
IC7800AP1117E18G-13
OUT
INADJ/GND
2
120 mA
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
7/22/2019 22LD350-TA Ch.LB01A (sm-MFL62865309 (1002-REV00)
40/42
HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RXA0+
RXB0-
RXA2+
R7901 0
EXCEPT_LGD_22
RXA1+
R7912
10K
LVDS_SEL_LOW
RXBCK+
RXB3-
RXB3+
RXB2+
RXA1-
R7900 0
EXCEPT_LGD_22
C7900
10uF16VOPT
RXA3-
RXACK-
RXACK+
RXB1-
C7902
0.1uF16V
RXB0+
RXB1+
RXA3+
RXA2-
RXB4-
R791010K
BIT_SEL_LOW
RXBCK-
RXA0-
R7911
3.3K
LVDS_SEL_HIGH
RXA4+
PANEL_VCC
P7900
TF05-51S
FHD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
L7900120-ohm
FHD
RXA4-
+3.3V_Normal
C7901
1000pF
50V
RXB4+
RXB2-
R7914 0
HD_60Hz_NORMAL
HD_6
RXACK+
R7919
3.3K
LVDS_SEL_HIGH
R7917 0
OPT
R7915 0
HD_60Hz_NORMAL
+3.3V_Normal
RXA0+
P7901
FF10001-30HD_60Hz_NORMAL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
OPC_EN
SMALL_OPC_EN
RXA1-
RXA3-
OPC_OUT
SMALL_NC2
PAN
SMALL_NC4
RXA3+
RXA0-
RXA2-
SMALL_OPC_OUT
R7913 0
OPT
SMALL_NC1
RXACK-
R7920
10K
LVDS_SEL_LOW
PWM_DIMR7916 0
OPT
SMALL_NC3
RXA2+
RXA1+
C7904
1000pF50V
HD_60Hz_
C7905
10uF16VOPT
L7904120-ohm
30PIN_FHD
RXA3+
RXA3-
RXA2-
RXA0-
C7909
0.1uF16V
30PIN_FHD
RXA1-
PANEL_VCC
C7911
1000pF50V
30PIN_FHD
RXACK-
RXACK+
RXA0+
P7903
FF10001-30
30PIN_FHD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXA2+
C7912
10uF16VOPT
RXA1+
RXB0-
RXB2+
RXB3-
RXB0+
RXBCK+
RXB1+
RXB1-
RXB3+
RXB2-
RXBCK-
[51Pin LVDS Connector]
(For FHD 60Hz)
[30Pin LVDS Connector](For HD 60Hz_Normal)
must be located Bottom side
[30Pin LVDS Connector]
(For HD 60Hz_Small)
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
7/22/2019 22LD350-TA Ch.LB01A (sm-MFL62865309 (1002-REV00)
41/42
HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.ILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIGN4269
SIGN4270
SIGN4272
SIGN4271
C9800100pF50V
OPT
D98065.6V
R98060
D9802
30V
R98040
D98085.6V
D9800
5.6V
D98015.6V
R980010K
R9813470K
R980210K
R981710K
C9803
10pF
50VOPT
R9814470K
R9810470K
AV_CVBS_DET
R981610K
C9808
1000pF50V
D98055.6V
C9801
10pF
50V
OPT
+3.3V_Normal
R981510K
R981810K
D980430V
+3.3V_Normal
R980775
R98212K
C9806
1000pF
50V
D980330V
COMP2_DET
R981275
C980210pF
50VOPT
C9804
1000pF
50V
C98051000pF
50V
R98011K
R982012K
R9811470K
D98075.6V
R980975
D980930V
R980875
R98031K
R98050
C980710pF
50V
OPT
SCART1_MUTE
TP9809
TP9803
TP9801
TP9802
SC1_CVBS_IN
TP9808
SC_RE2
SCART1_Rout
SC1_SOG_IN
SC1_ID
TP9807
TP9804
TP9806
SC_RE1
DTV/MNT_VOUT
SCART1_Lout
SC1_FB
TP9805
JK9800
PPJ238-01
5D [GN2]O-SPRING
6D [GN2]E-LUG
4D [GN2]CONTACT
7E [BL2]E-LUG-S
5E [BL2]O-SPRING
7F [RD2]E-LUG-S
5F [RD2]O-SPRING_1
5G [WH2]O-SPRING
4H[RD2]CONTACT
5H [RD2]O-SPRING_2
6H [RD2]E-LUG
6A [YL1]E-LUG
5A [YL1]O-SPRING
4A [YL1]CONTACT
5B [WH1]O-SPRING
4C [RD1]CONTACT
5C [RD1]O-SPRING
6C [RD1]E-LUG
MDS62110204
GAS3
OPT
MDS62110204
GAS2
OPT
MDS62110204
GAS1
OPT
SCART OPTION BLOCK
SMALL_US_KR_EM_JACK PACK_HONGSU_090818
PLACE UNDER TUNER
yright 2010 LG Electronics. Inc. All ri ghts reserved. for training and service purposes
7/22/2019 22LD350-TA Ch.LB01A (sm-MFL62865309 (1002-REV00)
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