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Detail explaination about the relationship between product design and SQA
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, CaseyJen TheRelationshipbetweentheProductDesignandtheSupplierQualityAssessmentandManagement,,,,,,,,,1.:,(Appearance),,,,,,(Cosmetic),,,,,/,,,,,;,,,,,,,,,,,,,,?,,,,,,,,,,,,(1),,2.,:,,,,,,,, ,,,,,,,,(QualitySystemAuditandQualityProcessAudit),,,,(),(40%,30%,30%,),,,,,,(Material)(Resources),ERP(EnterpriseResourcePlanning),,,,,,(HP,Dell,Apple,IBM,Sony),(SQA,SupplierQualityAssessment),(GM,Chrysler,Ford),TS16949QSA (QualitySystemAssessmentManual),APQP,PPAP,FMEA,MSA,SPC (2),,,SQA ,,(,,),,,,,,/,,:1.,,(Sleepingvendor):,,QSAQPA ,(AuditEvidence)(ConformityAudit),,,2.,,,,,,,(Robustness),,,,,,ISO/TS169492002PPAP (ProductionPartApprovalProcess,3),18 (,PPAP ,,):2.1(DesignRecords)(4)2.2(AuthorizedEngineeringChangedocuments)2.3 (CustomerEngineeringApproval)2.4 (DesignFMEA),2.5 (ProcessFlowDiagram)2.6 (ProcessFMEA)2.7 (ControlPlan)2.8 (MeasurementSystemAnalysisStudies),,,,2.9 (DimensionalResults)2.10 /(RecordsofMaterial/PerformanceTestResult),,2.11(InitialProcessStudies) Cpk,Ppk; XbarR 25 100 1.67,1.331.66 , 4,(subgroupvariation,5),d2C4,: 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20C4 1.128 1.693 2.059 2.326 2.534 2.704 2.847 2.97 3.078 3.173 3.258 3.336 3.407 3.472 3.532 3.588 3.64 3.689 3.735d2 0.7979 0.8862 0.9213 0.94 0.9515 0.9594 0.965 0.9693 0.9727 0.9754 0.9776 0.9794 0.981 0.9823 0.9835 0.9845 0.9854 0.9862 0.9869R
=Rk, S =Sk, S = _(X-X
)2n-1,K ,CPUCPLCPKPPK(,ProcessPerformanceindex)PPK=Min(PPUPPL)PPKCPK,,(Total variation, Actual Sigma, root mean square)oso,os = _(X-X
)2N-1, X
,()Accuracy Ca =|X
-|12 , = ,X
- = u,X
= ,,PPKos,,R ,,,,,CP=T/6,CPK=(1|Ca|)XCP,Ca ,,R ,,,,,,CPKPPK,,,,,,PPK>1.67, 1.33 PPK 1.66,CPK>1.33,,,,,,(),(R
),,(SPC),X
-S, X
-R,,,,,,,,,,:1. (,),,100% 2. ,,3. ,,4. ,,,,? ,??GR&R ?()5. ,,,6. ?,??(,GageR&R),,?,?7. (Masterorlimitsample),,,?8. ,,,9. ,,,10. ,,MSD(MoistureSensitiveDevice ),ESD(ElectrostaticDischargeProtection,,,,(Lean production)JIT(Just in Time),,,;,,MRP (Material requirement planning ),,,,: 1.() 2.JIT ,,3.,(,,,)4.5.,/,CAR,6.WIP ,7.(EngineeringChange),(Closeloop)8.9.10. (SparePartsratio),,,,,,(GIGO,Garbagein,Garbageout),,(Testcoverage),,(QAAgreement),,,,,,,SPCFMEA,FTA QC7 ,6sigma 8D,QC7 PDCA,6sigma 8D ,(),,PDCA ,(Bottomup);6sigma (Topdown),(Criticaltoquality,CTQ) ;8D (6,7), ,,:1.(AuditSuggestion),2.(Auditfinding):,(MajorNonconformity:),;,,,,,,,,,,,,;,,,,, ,,(Seller's market),,,, 1: (http://www.wpto.com.tw), (USPTO,http://portal.uspto.gov/external/portal/home)(JapanPatentOffice,http://www.jpo.go.jp)(http://www.epo.org/),(IPOhttp://www.tipo.gov.tw/)2:PPAP,FMEA,SPC,MSA,APQP ,AIAG,,http://www.aiag.org/scriptcontent/index.cfm3: ISO/TS16949:2002 ,PPAP,ProductionPartApprovalProcess 2006,4 4:IMDS/IMDS http://www.mdsystcm.com/index.jsp 5: n ,http://www.qimacros.com/controlchartformulas/cpcpkformula/ 6:8D ,ProcessImprovementGroup,PIG ,,,,http://www.mostquality.com/Quality/pig.pdf7: ,,http://www.au.af.mil/au/awc/awcgate/navy/bpi_manual/handbook.htm http://www.balancedscorecard.org/BSCResources/ArticlesWhitePapers/ProcessImprovementTools/tabid/243/Default.aspx