Application Spotlight on: Industrial Automationmedia.futureelectronics.com/doc/FTMAsia2017_0809_view.pdf · Multi-pin connectors for harsh applications carry up to 7.5A per contact

富昌电子技术杂志 Future Technology Magazine

FTM asia pacific

Application Spotlight on:

Industrial Automation

Component Focus - page 2Analogue controller SoC can drive up to eight valves

and a pumpNXP Semiconductors

Application Spotlight - page 8Infineon SOI technology

Infineon

Technical view - page 13Graphics Display-Based Human-Machine Interfaces:

the New Capabilities of the Latest MCUs Future Electronics

Design Notes - page 6New TSN SoC and reference design smooth the path to

real-time Ethernet networking for Industry 4.0NXP Semiconductors

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C O M P O N E N T F O C U S

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100V N-channel gate-drive MOSFET offers high efficiency in switching power converters

Nexperia

4

CONTENTSAnalogue controller SoC can drive up to eight valves and a pump

Nxp SemicoNductorS

3

20V, dual N-channel trench MOSFET produces low leakage current

Nexperia

Rugged cylindrical connector accepts multiple contact sizes in a single shell

te coNNectivity

Multi-pin connectors for harsh applications carry up to 7.5A per contact

te coNNectivity

Advertisement: Switches for Factory Automation

c&K

Infineon SOI technology

iNfiNeoN

Advertisement: Industrial RJ45 Jacks with Integrated Magnetics

te coNNectivity

New TSN SoC and reference design smooth the path to real-time Ethernet networking for Industry 4.0

Nxp SemicoNductorS

13 Graphics Display-Based Human-Machine Interfaces: the New Capabilities of the Latest MCUs

future electroNicS

Advertisement: Solutions for Industrial Power Applications

viShay16

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MC34SB0800 valve controller: Integrated safety features

Ultra-Compact Open Frame ACDC Power Supplies are Ideal for Space-Constrained Applications

cui iNc

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Integrated motor driver and controller backed by STM32 tools and firmware

St microelectroNicS

Increased fire safety requirements for fuseholders - Impacts of the change in the IECEN 60127-6 standard

Schurter

11

5

Analogue controller SoC can drive up to eight valves and a pump

The MC34SB0800 octal valve and pump controller System-on-Chip (SoC) from NXP Semiconductors provides a highly integrated solution for driving proportional and digital valves, as well as a pump. It is ideal for applications which are required to drive hydraulic or pneumatic valves with a simple electronic circuit.

The MC34SB0800 consists of four regulated low-side drivers and four low-side digital drivers, plus a high-side driver to control a DC motor.

NXP also supplies a valve and pump control reference design based on the MC34SB0800 SoC together with a Kinetis® microcontroller and two power MOSFETs. Monitoring and protection features are implemented to protect the system from hazards such as short-circuits, over-current or over-voltage events and other abnormal conditions. A predriver MOSFET increases safety by turning off all valves in the event of system problems.

The reference design is supported by an NXP Processor Expert® embedded component for the MC34SB0800. This component provides access to all the valve driver features such as writing/reading SPI registers, initialisation, monitoring and control of drivers.

NXP SEMICONDUCTORS

EMAIL [email protected]

Reader Response No. 1

APPLICATIONS:

� Medical - Oxygen flow control - Blood pressure monitoring

� Industrial - Heavy equipment - Irrigation systems - Cooling systems - Petrol pump

� Consumer devices - Soda dispensers - 3D printers - Shower/bath systems

FEATURES:

� Supply-voltage range: 6V to 36V � Valve drivers have low on-resistance � Switch-off energy drained by digital valve

driver so no freewheeling diode required � All actuators controllable via SPI � 10-bit ADC � Integrated DC pump motor predriver

controller

The MC34SB0800 is suitable for loads with a high inrush current, and can drive them at frequencies up to 5kHz.

The device is suited to use in harsh environments.

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oN SemicoNductor

7

Advertisement: Cypress Industrial Solutions

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20V, dual N-channel trench MOSFET produces low leakage current

The PMDXB600UNEL from Nexperia is a dual N-channel enhancement-mode MOSFET which has a maximum drain-source voltage rating of 20V.

Housed in a small, leadless DFN1010B-6 (SOT1216) surfacemount package

NEXPERIA

APPLICATIONS:

� Battery-operated and low-power applications � Relay drivers � High-speed line drivers � Low-side load switches � Switching circuits

FEATURES:

� 600mA maximum continuous drain current � 2.5A peak pulsed drain current � 0.4A maximum source current � >1kV ESD protection on the human body

model � Operating-temperature range: -55°C to

150°C



measuring 1.1mm × 1.0mm × 0.37mm, the PMDXB600UNEL is notable for its low leakage current:

� Drain leakage current is a maximum 25nA at a drain-source voltage of 5V and at 25°C

� Gate leakage current is a maximum ±50nA at a gate-source voltage of ±1.8V, again at 25°C

The PMDXB600UNEL’s package features an exposed drain pad for improved thermal conductivity. Thermal resistance from junction to solder point is just 31K/W.

Drain-source on-resistance is rated at a low 470mΩ, helping the device to achieve good efficiency in switching power converters.

In addition to the PMDXB600UNEL, Nexperia supplies the PMCXB900UEL, a 20V complementary N-/P-channel counterpart to the PMDXB600UNEL,

FEATURES:

� 7.5mΩ on-resistance at a drain current of 25A � 44.5nC total gate charge � 281mJ maximum non-repetitive

avalanche energy � TO220 package measuring 15.6mm x

10mm x 4.4mm

100V N-channel gate-drive MOSFET offers high efficiency in switching power converters

Nexperia has released the latest product in its NextPower family of gate-drive MOSFETs.

The PSMN8R5-100PSF is a 100V gate-drive MOSFET which is qualified for operation at temperatures up to 175°C. Featuring a maximum drain current of 98A, it is intended for use in industrial and consumer applications.

APPLICATIONS:

� Brushed and brushless DC motor control � Uninterruptible power supplies � Solar inverters � LED lighting � Battery protection



The PSMN8R5-100PSF is suitable for use as the power switch in the synchronous rectification circuit in both AC-DC and DC-DC converters, in which its support for fast switching and low spiking are valuable. It can also be used in full-bridge and half-bridge power circuits, and in power converters based on flyback or resonant topologies.

The device has a low reverse-recovery charge for low body-diode losses, and offers fast reverse-recovery times.

The PSMN8R5-100PSF MOSFET’s figure of merit – the product of gate charge and on-resistance – is also low, helping users to achieve high efficiency in switching power converters.

Nexperia has also recently introduced the PSMN018-100PSF, another 100V gate-drive MOSFET. It has a maximum drain current of 53A.

PSMN8R5-100PSF MOSFET: Fast reverse recovery

PMDXB600UNEL: Exposed drain pad

NEXPERIA

and the PMDXB950UPEL, a 20V, dual P-channel MOSFET. Both these parts also offer lowleakage operation.



Multi-pin connectors for harsh applications carry up to 7.5A per contact

TE CONNECTIVITY

TE Connectivity’s (TE) DEUTSCH DTM connectors are capable of withstanding the harsh conditions to which the components in trucks and lorries, construction equipment and farming vehicles are exposed.

Intended for use in cable-to-cable and cable-to-board connections, the DEUTSCH DTM plugs and receptacles are available in 2-, 3-, 4-, 6-, 8- and 12-pin

APPLICATIONS:

� Trucks and buses � Off-highway vehicles � Construction equipment � Agricultural and forestry equipment � Emergency vehicles � Recreational boats � Motorcycles

FEATURES:

� Accept contact size 20 with a 7.5A current rating � Accept wire in the size range 14-22 AWG � Integrated latch for mating � Wedgelocks confirm contact alignment

and retention



configurations. Each contact can carry a 7.5A continuous current.

The DTM connectors may be mounted in-line, flanged, or mounted on a PCB.

The connectors are made of rugged thermoplastic and feature silicone rear wire and interfacial seals which enable them to withstand conditions of extreme temperature and moisture. They suffer no damage when exposed to most fluids used in industrial applications. In addition, properly wired and mated connections will withstand immersion under three feet of water without loss of electrical qualities or leakage.

Thermal cycling tests show that the DTM connectors suffer no cracking, chipping or leakage after 20 cycles from -55°C to 125°C.

DTM series: Extreme temperature and moisture tolerance

FEATURES:

� Accept contact sizes 4 (100A), 12 (25A) and 16 (13A) � Accept wire sizes in the range 6-20 AWG � Coupling ring for mating � Rated endurance: 100 engage/release

cycles � <2mA leakage current at 1.5kV AC � IP68 immersion rating � Operating-temperature range: -55°C to

125°C � 1,000MΩ insulation resistance � Accessories available include backshells,

strain relief and dust caps

Rugged cylindrical connector accepts multiple contact sizes in a single shell

TE Connectivity’s (TE) DEUTSCH HD10 connectors are environmentally sealed, thermoplastic cylindrical connectors offered in arrangements providing from three to nine cavities. These rugged connectors are designed to withstand the harsh conditions to which off-highway and industrial vehicles are exposed.

DEUTSCH HD10 connectors provide reliability and performance on the engine or transmission, under the bonnet, on controllers, as a data link connector for diagnostic systems, on the chassis, or in the cab.

The HD10’s design strengths include optional flange mounting, multi-pin arrangements and lower cost. Design flexibility is another attribute of the HD10 series: the connectors give the designer the ability to use contacts of multiple sizes within a single shell.

APPLICATIONS:

� Trucks and buses � Off-highway vehicles � Construction equipment � Agricultural and forestry equipment � Emergency vehicles � Recreational boats � Motorcycles

TE CONNECTIVITYThe connectors are ideal for use in applications which expose them to severe vibration. They are capable of withstanding vibrations up to 20g at frequencies between 10Hz and 2kHz, producing no electrical discontinuities lasting longer than 1µs.



HD10 connectors: Accept contacts of different sizes

DEUTSCH, TE Connectivity and TE connectivity (logo) are trademarks.

DEUTSCH, TE Connectivity and TE connectivity (logo) are trademarks.

KEY FEATURES

Industrial RJ45 jacks with integrated magnetics offer a highly integrated connectivity solution-from the cable to the physical layer-for Industrial Ethernet. Integrating the magnetics into the jack allows for a much improved EMI noise shielding, enabling more reliable connections. A standardized portfolio with 1x1 straight and R / A, 1x2, 2x1 form factors addresses many of the industrial applications, which allows customers to find the solution they are looking for. Specific industrial requirements such as high reliability through improved corrosion resistance, extended temperature range and long product lifetime are all addressed, including support of the latest reflow soldering production processes.

• Extended temperature. range -40…+85 °C• Minimum product life requirement of 10 years• 260 °C reflow Pin in Paste Soldering• Plating thickness 0,76 µm [30 µinch] gold over 1,27 µm [50 µinch] nickel• Improved EMI integrity and signal integrity performance• Both current and voltage mode PHY-chips supported

BENEFITS

• The standardized RJ45 jack portfolio with integrated magnetics with 1x1 straight and R / A, 1x2, 2x1 form factors addresses many of the industrial applications• Integrated magnetics reduces the (analog) design efforts required by the customer• Thicker gold plating (30 µinch over 50 µinch nickel) improves corrosion resistance reducing equipment electrical problems over lifetime• TE’s products (260 °C reflow capable) fit industrial assembly / solder processes without the need for an extra assembly / solder step• Extended temperature range addresses industrial equipment requirements where standard temperature (0…70 °C) range is too limited• Offering standardized Tape & Reel or Tray packing for fully automated or manual assembly process

APPLICATIONS

• All industrial applications requiring Ethernet• All industrial equipment with RJ45 connectivity• Industry Computers

• Hubs• Routers• Wireless access points

• PLC’s• Switches• All Ethernet enabled equipment

ELECTRICAL

• 10 / 100 Base-T Ethernet, 1 Gbps• Dielectric Withstanding Voltage: 2250 V DC

MECHANICAL

• -40…+85 °C; min. 750 mating cycles

MATERIALS

• Plating thickness 0,76 µm [30 µinch] gold over 1,27 µm [50 µinch] nickel• UL 94 V-0• 260 °C reflow capable• High grade LCP (liquid crystal polymer material)

STANDARDS & SPECIFICATIONS

• IEC 60603-7-51 for 1 Gbps• IEC 60603-7-5 for 10 / 100 Mbps• Product Specification 108-94552• Application Specification 114-94447

PRODUCT COMPLIANCE

• UL recognized• RoHS compliant

AUTOMATION & CONTROL /// INDUSTRIAL RJ45 JACKS WITH INTEGRATED MAGNETICS

Industrial RJ45 Jacks with Integrated Magnetics



KEY FEATURES

Industrial RJ45 jacks with integrated magnetics offer a highly integrated connectivity solution-from the cable to the physical layer-for Industrial Ethernet. Integrating the magnetics into the jack allows for a much improved EMI noise shielding, enabling more reliable connections. A standardized portfolio with 1x1 straight and R / A, 1x2, 2x1 form factors addresses many of the industrial applications, which allows customers to find the solution they are looking for. Specific industrial requirements such as high reliability through improved corrosion resistance, extended temperature range and long product lifetime are all addressed, including support of the latest reflow soldering production processes.

• Extended temperature. range -40…+85 °C• Minimum product life requirement of 10 years• 260 °C reflow Pin in Paste Soldering• Plating thickness 0,76 µm [30 µinch] gold over 1,27 µm [50 µinch] nickel• Improved EMI integrity and signal integrity performance• Both current and voltage mode PHY-chips supported

BENEFITS

• The standardized RJ45 jack portfolio with integrated magnetics with 1x1 straight and R / A, 1x2, 2x1 form factors addresses many of the industrial applications• Integrated magnetics reduces the (analog) design efforts required by the customer• Thicker gold plating (30 µinch over 50 µinch nickel) improves corrosion resistance reducing equipment electrical problems over lifetime• TE’s products (260 °C reflow capable) fit industrial assembly / solder processes without the need for an extra assembly / solder step• Extended temperature range addresses industrial equipment requirements where standard temperature (0…70 °C) range is too limited• Offering standardized Tape & Reel or Tray packing for fully automated or manual assembly process

APPLICATIONS

• All industrial applications requiring Ethernet• All industrial equipment with RJ45 connectivity• Industry Computers

• Hubs• Routers• Wireless access points

• PLC’s• Switches• All Ethernet enabled equipment

ELECTRICAL

• 10 / 100 Base-T Ethernet, 1 Gbps• Dielectric Withstanding Voltage: 2250 V DC

MECHANICAL

• -40…+85 °C; min. 750 mating cycles

MATERIALS

• Plating thickness 0,76 µm [30 µinch] gold over 1,27 µm [50 µinch] nickel• UL 94 V-0• 260 °C reflow capable• High grade LCP (liquid crystal polymer material)

STANDARDS & SPECIFICATIONS

• IEC 60603-7-51 for 1 Gbps• IEC 60603-7-5 for 10 / 100 Mbps• Product Specification 108-94552• Application Specification 114-94447

PRODUCT COMPLIANCE

• UL recognized• RoHS compliant

AUTOMATION & CONTROL /// INDUSTRIAL RJ45 JACKS WITH INTEGRATED MAGNETICS

Industrial RJ45 Jacks with Integrated Magnetics

D E S I G N N O T E S


New TSN SoC and reference design smooth the path to real-time Ethernet networking for Industry 4.0

NXP SEMICONDUCTORS

NXP Semiconductors is providing designers of equipment for Industry 4.0 – the new generation of industrial systems which typically provide real-time control, analysis of vast data sets and support for cloud connectivity – with two new ways to achieve robust real-time Ethernet performance. A new System-on-Chip (SoC), the LS1028A, and a reference design based on the LS1021A applications processor enable designers to quickly implement Ethernet networking systems with Time-Sensitive Networking (TSN) capabilities as specified by the IEEE 802.1 standards.

Rapidly changing IT infrastructuresAs industrial OEMs design solutions for Industry 4.0, they must converge the Operations Technology (OT) domain with their Information Technology (IT) infrastructure. However, OT networks require guaranteed and timely delivery of packets, not the typical best-effort approach used in IT networks today.

At the same time, current technologies in the OT domain often operate at a data rate in the range 10-100Mbits/s, and do not have the bandwidth to support new capabilities which are being implemented in manufacturing systems, such as high-definition video. The new TSN standards enable legacy IT equipment and OT equipment to operate on the same network, providing Gigabit bandwidth while simplifying network deployment and management.

To provide deterministic Ethernet capability for industrial applications, the IEEE defined the TSN standards to support real-time, reliable networking. TSN represents the next step in the evolution of Ethernet as a ubiquitous networking technology, and TSN-enabled Ethernet will play an important role in the Internet of Things (IoT) and the Industry 4.0 revolution. Industry estimates suggest that the industrial internet market could reach a value of $225bn by 2020.

To support industrial OEMs’ moves towards Industry 4.0, NXP has announced a new QorIQ® Layerscape SoC, the LS1028A with integrated TSN capabilities.

The LS1028A builds on NXP’s Layerscape family of SoCs while adding significant capabilities, including upgraded dual 64-bit ARM® V8 processor cores, an integrated 3D Graphics

Processing Unit (GPU) and LCD controller, a four-port TSN switch and two separate TSN Ethernet controllers.

The combination of time-sensitive networking with a GPU enable the SoC to run sophisticated industrial human-machine interfaces and control applications. The device is built on NXP’s Trust Architecture, which provides a root of trust for securing applications and services. It is designed to support TSN bridging as well as TSN endpoint applications.

Robust reference design platform for rapid product developmentWhile the LS1028A is a newly introduced device in pre-production as of June 2017, OEMs can begin developing TSN-enabled systems today using NXP’s TSN reference design platform. The LS1021A Time-Sensitive Networking (TSN) Reference Design board, which has the part number LS1021ATSN-PA, is based on a high-performance QorIQ Layerscape LS1021A industrial applications processor. The LS1021A has dual ARM® Cortex®-A7 cores running at up to 1.2GHz, and built-in memory controllers for DDR3L or DDR4 DRAM memory. The board also features an SJA1105T TSN Ethernet switch, which provides four external Gigabit Ethernet interfaces all with TSN support.

The reference design platform includes an open-source, industrial Linux Software Development Kit (SDK) offering real-time performance, TSN configuration support, and the IEEE 1588 precision time protocol. Developers can quickly explore the benefits of TSN time-aware shaping and per-stream policing using the configuration software included with the SDK. Applications written for the reference design will be forward-compatible with the LS1028A SoC through standard application programming interfaces.

The platform also supports virtualisation, and provides a secure Trust Architecture platform. The board has an Arduino connector which may be used to plug in Arduino shields for peripheral functions such as wireless connectivity.

The LS1021ATSN-PA board is also supplied with:

For applications such as TSN PLCs and automotive gateways

For applications such as legacy industrial PLC and industrial gateways

� 12V power supply � Universal plug adaptor � SATA connector � mPCIe connector (PCIe

Gen 2.0) � CAN interface � Two UART interfaces

� USB3.0 and USB2.0 interfaces � USB-A Male to USB

Micro-B Male cable � Ethernet cable � SD card � MicroSD card

For applications such as robotics controllers, motor controls, synchronised

audio playback


A P P L I C AT I O N S P O T L I G H T

High Performance Imaging for Robotics and Machine Vision

onsemi.com/python

PYTHON image sensors from ON Semiconductor deliver:

• A full family of devices from VGA to 25 megapixels with multiple spectral sensitivity and packaging options.

• High image quality and low noise from an advanced CMOS global shutter pixel design with correlated double sampling.

• Bandwidths that meet and exceed CoaXPress-6, USB3.1, and 10 GigE interfaces.

• Fast time to market from an integrated architecture that allows all resolutions to be supported usingonly two PCBs.

• Advanced imaging capabilities for machine vision, motion monitoring, security and surveillance,intelligent transportation systems, and more.

innoVationVisionary

innoVationHigh Performance Imaging for Robotics and Machine Vision

onsemi.com/python





• Fast time to market from an integrated architecture that allows all resolutions to be supported usingonly two PCBs.


innoVation

High Performance Imaging for

Visionary

PYTHON image sensors from

Industrial and Machine Vision ON Semiconductor deliver:




• Fast time to market from an integrated architecturethat allows all resolutions to be supported usingonly two PCBs.


innoVation

The tools to help:• Evaluation Boards• Reference Designs• Printed and Video Guides• Design Simulation Support/Software

The devices to use:Python10K 11.1 MPPython12K 12.5 MPPython1300 1.3 MPPython16K 16.8 MP

Python25K 25.2 MPPython300 0.3 MPPython480 Coming Q3'17Python500 0.5 MP

Where to use Python:• Industrial and security systems• Motion Monitoring• Intelligent Traffic Systems

• Medical imaging systems• Inspection systems• Machine Vision

High Performance Imaging for Industrial and Machine Vision


• AfullfamilyofdevicesfromVGAto25megapixelswithmultiplespectralsensitivityandpackagingoptions.

• HighimagequalityandlownoisefromanadvancedCMOSglobalshutterpixeldesignwithcorrelateddoublesampling.

• BandwidthsthatmeetandexceedCoaXPress-6,USB3.1and10GigEinterfaces.

The tools to help:

• EvaluationBoards• ReferenceDesigns• PrintedandVideoGuides• DesignSimulationSupport/Software

• IndustrialandSecuritySystems• MotionMonitoring• IntelligentTrafficSystems

• MedicalImagingSystems• InspectionSystems• MachineVision

Where to use Python:

• FasttimetomarketfromanintegratedarchitecturethatallowsallresolutionstobesupportedusingonlytwoPCBs.

• Advancedimagingcapabilitiesformachinevision,motionmonitoring,securityandsurveillance,intelligenttransportationsystems,andmore.

The devices to use:Python10KPython12KPython1300Python16K

11.1MP12.5MP1.3MP16.8MP

For more information or to buy products, go to www.FutureElectronics.com/FTM

Python250Python30s0Python480Python500

25.2MP0.3MPComingQ3'170.5MP



INFINEON

Infineon SOI technology

Negative VS transient (-VS) operation robustnessIn a today’s high-power switching converters carrying a large load current, the VS voltage swing does not stop at the level of the negative DC bus but instead swings below the level of the negative DC bus due to the parasitic inductances in the power circuit from the die bonding to the PCB tracks. This undershoot voltage is called “negative VS transient”. High-voltage EiceDRIVER™ products using Infineon SOI have the best-inthe-industry operational robustness. In Figure 2, the safe operating line is shown at VBS = 15 V for pulse widths up to 1000 ns. Above this line, the products do not show unwanted functional anomalies or permanent damage to the IC.

2EDL EiceDRIVER™ compact600-V half-bridge gate driver ICs with integrated bootstrap diode

The new 2EDL EiceDRIVER™ Compact high-voltage gate driver family meets the ever-growing need for higher application efficiency and smaller form factors in consumer electronics and home appliances. It is optimized for the switching behavior and power losses of today’s power supplies using IGBT and MOSFETs with dramatically reduced gate charges such as the



Figure 1: Parasitic elements of a half-bridge configuration

latest generation of Infineon’s CoolMOS™. With a monolithically integrated ultrafast low-ohmic bootstrap diode, the 2EDL Compact sets the benchmark for driver ICs needed in applications with more than 2 A output currents.

» The 2EDL Compact family comprises seven 600 V drivers with output currents of 0.5 A and 2.3 A in DSO-8 and DSO-14 150 mil packages for applications based on IGBT or MOSFET switches:

» The 2EDL05I06BF in DSO-8, optimized for IGBTs, comes without interlock or dead time. It is ideal for switched reluctance motor drives and two-transistor forward switchedmode power supply topologies.

» The 2EDL05I06PF in DSO-8 and the 2EDL05I06PJ in DSO-14 are optimized for IGBTs and include interlock and dead time. They are recommended for applications such as fans, pumps, major home appliances, power tools, and general purpose inverters. The DSO-14 version is recommended for industrial applications with higher creepage distance requirements.

» The 2EDL05N06PF in DSO-8 and the 2EDL05N06PJ in DSO - 14 boast the same features as the IGBT driver versions and an under-voltage lockout adapted for MOSFETs. They are recommended for servers and telecommunications equipment, low-voltage drives, e-bikes, battery chargers, and half-bridge-based switched-mode power supply applications.

» The 2EDL23I06PJ and 2EDL23N06PJ are 2.3 A half-bridge driver ICs in DSO-14 with interlock, dead time, fault enable, and overcurrent protection. The 2EDL23I06PJ for IGBTs is ideal for applications such as multi-oven IH cookers, fans, pumps, and drives. The 2EDL23N06PJ for MOSFETs is best suited for switched-mode power supplies, servers and telecommunications equipment, e-scooters, forklifts, and battery chargers.

Figure 2: Negative VS transient SOA characterization @ VBS=15 V





Ultra-Compact Open Frame ACDC Power Supplies are Ideal for Space-Constrained Applications

CUI’s family of ultra-compact AC/DC power supplies is available in an open frame SIP package. The 3W and 5W configurations of the PBO series measure as small as 35 x 11 x 18mm (1.38 x 0.43 x 0.71in), allowing them to occupy less board real-estate than other power solutions. The 3W models are also available in low-profile, right-angle versions measuring as small 35 x 18 x 11mm (1.38 x 0.71 x 0.43in), making them ideal for applications where vertical board space is at a premium.

CUIAvailable with typical efficiencies up to 79%, the high density PBO series offers a wide input voltage range of 85VAC to 264VAC or 70VDC to 400VDC for high voltage DC/DC systems. Single output voltages of 3.3, 5, 9, 12, 15 and 24VDC are available depending upon the series. For use in challenging environments, the 3W models offer a wide operating temperature range of -40°C to +85°C while the 5W models provide a range from -25°C to +85°C. Additionally, all models are designed to provide 3,000VAC input to output isolation.

The PBO series also meets UL60950-1/EN 60950-1 standards, complies with EN55022 Class B limits for conducted and radiated emissions and includes overcurrent and short circuit protections. The ultra-compact models are ideally suited for a variety of applications including industrial systems, automation equipment, security, telecommunications and smart home devices.



FEATURES:

� Ultra-compact package � High density � Wide operating temperature range

APPLICATIONS:

� Industrial systems � Automation � Security � Telecommunications � Smart home

FEATURES:

� Operating-voltage range: 8V to 45V � 16 GPIOs � Five general-purpose timers � 12-bit ADC converter � I2C, USART and serial peripheral interfaces � Four operational amplifiers for signal conditioning � Stand-by mode for low-power

consumption

Integrated motor driver and controller backed by STM32 tools and firmware

STMicroelectronics has launched the STSPIN32F0 motor-control System-in-Package (SiP), which offers the power and flexibility of a microcontroller-based drive system as well as ease-of-use and space efficiency.

The STSPIN32F0 combines an MCU and an analogue gate driver in a 7mm x 7mm QFN package. It provides a platform for developers who are committed to using existing proprietary motor-control IP, but is also ideal for those seeking to use an off-the-shelf motor-control algorithm.

For this second group in particular, the STSPIN32F0 markedly simplifies the

STMICROELECTRONICS



APPLICATIONS:

� Smart manufacturing equipment � Power tools � Cooling fans � Drones � Small robots � Home appliances

design challenge by enabling the use of the extensive STM32 development ecosystem, which includes software tools, firmware libraries and middleware.

The STM32F0 MCU inside the STSPIN32F0 is based on the ARM® Cortex®-M0 core, which can host versatile motor-control algorithms such as sensored or sensorless Field-Oriented Control (FOC), six-step control and others. Its high performance enables fast execution of the algorithms, resulting in precise control of torque and speed even at high rotation speeds.

The STSPIN32F0’s analogue IC implements a three-phase, half-bridge gate driver with integrated bootstrap diodes. Providing a gate-drive current of up to 600mA, it allows designers to select from a wide variety of power MOSFETs of an adequate rating for the chosen motor.

The built-in protection mechanisms include real-time programmable over-current protection, cross-conduction prevention to eliminate potentially damaging shoot-through currents, and under-voltage and over-temperature protection.

An internal 3.3V DC-DC buck converter and 12V linear regulator provide the voltage rails to supply the MCU, external circuitry and the gate driver.



Increased fire safety requirements for fuseholders - Impacts of the change in the IEC/EN 60127-6 standard

The fuseholder standard IEC/EN 60127-6 has been revised to improve fire safety. Effective in October 2017, manufacturers of fuseholders will only be permitted to market products that have been tested and authorized in accordance with the updated standard. SCHURTER will offer its customers upgraded solutions by the deadline.

SCHURTER

Fuseholders are suitable for the use of fuse links in electrical and electronic appliances. They are an essential safety-related part of the appliance protection. Manufacturers of electrical appliances must comply with the relevant standards and regulations (Europe: the fuseholder standard IEC/EN 60127-6, USA/Canada UL 4248-1 and the household appliance standard IEC/EN 60335-1). Besides the fuseholders, IEC appliance inlets and power entry modules with and without EMC filters are also affected if they have a fuse drawer.

New standard improves fire safetyThe first edition of the IEC standard (04/1994) focused on contact protection. Little attention was paid to fire safety. Therefore, unsupervised appliances such as coffee machines, dryers or high-speed heaters repeatedly caused fires. These were caused current overloads (glowing parts), defective parts, faulty electrical connections or electrical arcs when switching contacts.

Glow-wire resistance has been in-creasedWith the fourth edition of the household appliance standard IEC/EN 60335-1, the fire safety of these appliances was improved in May 2001 in that all components had to pass a glow-wire test (glow-wire test according to IEC/EN 60695-2-12 and -13, see also the White Paper

FPG4 fuseholder (source: SCHURTER)

on the household appliance standard IEC 60335-1 [1]). Now the requirements defined for the household appliance standard are also being applied to the fuseholder standard. The requirement with regard to the glow-wire resistance of the material is being increased. Pursuant to the updated standard, a glow-wire test according to IEC/EN 60695-2-12 and -13 is required. Furthermore, the components to be tested now have to be tested horizontally and vertically during the endurance test. Previously they were tested only horizontally and in the intended installation position.

1) Specimen 2) Glow-wire 3) Flame 4) Tissue 5) Cotton

Different test methods according to IEC 60695 and UL 94-V (source: SCHURTER)

Consequences for manufacturersThe manufacturers of fuseholders and appliance inlets with integrated fuseholders must test the glow-wire resistance of the used materials and replace the materials used with new glow-wire resistant material if need be. Furthermore, the marketing authorizations must be updated and a supplementary test according to the IEC 60127-6 standard performed by the VDE certification authority. In the event of a change in material to achieve the increased temperature requirements, the material tests according to UL 4248.1 must also be repeated. An important aspect is also the verification of the temperature increases in the new installation position and if

DD11 entry module with fuse drawers (source: SCHURTER)

needed - the implementation of technical upgrades to meet the updated standard. The manufacturers are required to change the material logistics, documentation and production accordingly.

The transition period runs until the autumn 2017: beginning in October 2017 manufacturers may only supply products that have been authorized according to the new standard.

According to the new standard, all fuseholders and all appliance power entry modules with fuseholders can be used in all household appliances since they now are also glow-wire resistant. With the increase in the requirements the fire safety of all electrical appliances has thus been improved.

5707 entry module with fuseholder (source: SCHURTER)





Cypress Industrial SolutionsCypress Industrial Solutions


CYPRESS SIMPLIFIES DESIGN OF ADVANCED MOTOR CONTROL SYSTEMS

The PSoC® 4 Motor Control EVK (CY8CKIT-037) is an ideal development platform for designing motor control applications including BLDC motors, PMSM motors, and Stepper motors. This kit comes equipped with example projects including support for FOC, BLDC, and Stepper motor control techniques/algorithms. Utilize this dev kit with the PSoC 4 Pioneer Kit (CY8CKIT-042) and Cypress’ EVK User Guide to easily design advanced motor control solutions.

CYPRESS FL-L NOR FLASH ENABLES INDUSTRIAL APPLICATIONS WITH ENHANCED SECURITY AND RELIABILITY

Cypress’ FL-L 3.0-V Quad SPI NOR Flash memory provides the highest reliability, enhanced security and 67 MBps read bandwidth even at an extended temperature range of -40°C to +125°C to match the operating ambient temperatures of various machines, industrial, equipment, etc. on a factory floor. Cypress applies stringent testing and qualification processes to ensure all parts meet our world-class quality requirements.

CYPRESS BLE SOLUTIONS PROVIDE LONG RANGE CONNECTIVITY IN INDUSTRIAL IoT APPLICATIONS

Long range BLE connectivity in devices on a large factory floor can help greatly reduce the preexisting time an equipment issue exists before it is addressed. Cypress’ new EZ-BLE™ PRoC™ BT 4.2 Long-Range Modules are turnkey solutions for these types of industrial IoT applications that require long range communication. The modules are fully-qualified (Bluetooth 4.2), fully-certified (FCC, IC, TELEC, KCC, CE) and integrate a PA (for 7.5 dBm output TX power) and an LNA (for up to -93 dBm receive sensitivity), along with 3 different antenna options.

Cypress’ product portfolio empowers the formation of the Industrial IoT and the transition to Industry 4.0. Next-generation industrial devices require the highest performance, most energy efficient, and most secure microcontrollers, radios and memories. And that is exactly what Cypress offers our customers.

Learn more below about how Cypress MCU, Connectivity, and Memory solutions are solving the Industrial Problems of tomorrow.

Module MPN Size Antenna Type

CYBLE-212006-01 15 x 23 x 2.00mm PCB Antenna

CYBLE-202007-01 15 x 23 x 2.05mm Ext. Antenna via u.FL Connector

CYBLE-202013-11 15 x 23 x 1.55mm Ext. Antenna via RF Pad



T E C H N I C A L V I E W

Graphics Display-Based Human-Machine Interfaces: the New Capabilities of the Latest MCUs By: Justin Palmer, Vertical Segment Director, Embedded and Healthcare, Future Electronics

The evidence from consumer research, analyst reports, OEM customer feedback and the forecasts from semiconductor manufacturers all points in the same direction: few embedded designers will be immune over the next five years from pressure to dramatically enhance the capabilities, mode of operation and appeal of the Human-Machine Interface (HMI) in their products.

Although the move to create more graphical and touch-sensitive interfaces was largely initiated in devices such as smartphones and tablets, the demand for such a rich user experience has expanded far beyond the consumer market. In fact, products for the industrial, automotive, medical, military and aerospace markets are all facing the same requirement. Several factors are driving the revolution in HMI design:

� Sensors, processors and wireless devices have become much better and much cheaper at the same time, greatly enhancing systems’ ability to measure and track their own operation.

� A generational shift has taken place in the user base which requires product manufacturers to meet the expectations of millennials rather than baby boomers.

� A color TFT display costs less now than a monochrome STN display cost just five years ago. Touchscreen overlays have also become both better and cheaper, with capacitive touch-sensing technology now widely available, and offering a better and more interactive interface than older resistive technology options.

� Companies have discovered the scope to improve efficiency and reduce operating costs when equipment has an easy-to-use and intuitive interface. They benefit both from a lower requirement for training and from a reduced incidence of human error.

In the past, redesigning an embedded product’s HMI to feature more and better graphical content would have been out of the question for systems that were based on a microcontroller. There used to be a sharp divide between, on the one hand, embedded systems based on a microprocessor with sophisticated graphics capability, and a rich operating system such as the Windows®

or Linux™ platforms; and on the other hand, those based on a microcontroller, often with no operating system and typically running nothing more complex than a segment LCD.

The ground is shifting fast, however, and improving MCU capabilities gives design engineers hope that they can stay one step ahead of their customers’ changing expectations without having to abandon their familiar and productive MCU platform. So how much scope are MCU manufacturers offering their users to dramatically improve the HMI’s functionality?

How and Why the HMI is Evolving Before looking at how system designers might implement an improved HMI, it is worth under-standing why and how the HMI needs to be improved.

The fundamental underlying cause of the shift in HMI design is the development of new and improved semiconductor technology.

Sensors, RF transceivers and microcontrollers have become so powerful and yet so cheap that it is possible for OEMs to embed them in greater numbers than ever, and in more devices than ever. In factories, this enables factory-automation systems to track all important parameters of both the manufacturing equipment and the manufactured product in real time, at any point in the production process. In medicine, it enables health professionals to remotely monitor a patient’s condition constantly, and to set alerts when critical thresholds are crossed.

The result is that vast amounts of data are being generated and transmitted to control units. As the Internet of Things gains traction, this data is increasingly being hosted online in the cloud, where it may be aggregated and analyzed, and the results of the analysis displayed on any internet terminal anywhere. So the extent and types of data available to users are changing rapidly.

At exactly the same time, the make-up of the user base, and in particular of the workforce, is changing, as baby boomers go into retirement to be replaced by ‘millennials’, the generation starting with people born in the early 1980s, and by later generations. These people are digital natives, accustomed since childhood to interact with computers and displays (see Figure 1).

Figure 1. The Tesla Model S dashboard – a response to modern users’ preference for graphics-rich control interfaces. (Image credit: Steve Jurvetson under Creative

Commons 2.0 license)

Interestingly, the preferences and working style of millennials are different from those of baby boomers. Whereas baby boomers expected to be trained to implement a process, and measured on their execution of it, millennials expect to understand a system, to track it with real-time data, and to make their own decisions based on the data rather than following a set process.

So now we have masses of data generated by sensors, the ability via the internet to communicate and share it in real time, and the people with the native ability to process and use it. Clearly, simple segment LCDs and push-button inputs do not fit in with this mode of interacting with complex equipment.


CYPRESS SIMPLIFIES DESIGN OF ADVANCED MOTOR CONTROL SYSTEMS

The PSoC® 4 Motor Control EVK (CY8CKIT-037) is an ideal development platform for designing motor control applications including BLDC motors, PMSM motors, and Stepper motors. This kit comes equipped with example projects including support for FOC, BLDC, and Stepper motor control techniques/algorithms. Utilize this dev kit with the PSoC 4 Pioneer Kit (CY8CKIT-042) and Cypress’ EVK User Guide to easily design advanced motor control solutions.

CYPRESS FL-L NOR FLASH ENABLES INDUSTRIAL APPLICATIONS WITH ENHANCED SECURITY AND RELIABILITY

Cypress’ FL-L 3.0-V Quad SPI NOR Flash memory provides the highest reliability, enhanced security and 67 MBps read bandwidth even at an extended temperature range of -40°C to +125°C to match the operating ambient temperatures of various machines, industrial, equipment, etc. on a factory floor. Cypress applies stringent testing and qualification processes to ensure all parts meet our world-class quality requirements.

CYPRESS BLE SOLUTIONS PROVIDE LONG RANGE CONNECTIVITY IN INDUSTRIAL IoT APPLICATIONS

Long range BLE connectivity in devices on a large factory floor can help greatly reduce the preexisting time an equipment issue exists before it is addressed. Cypress’ new EZ-BLE™ PRoC™ BT 4.2 Long-Range Modules are turnkey solutions for these types of industrial IoT applications that require long range communication. The modules are fully-qualified (Bluetooth 4.2), fully-certified (FCC, IC, TELEC, KCC, CE) and integrate a PA (for 7.5 dBm output TX power) and an LNA (for up to -93 dBm receive sensitivity), along with 3 different antenna options.

Cypress’ product portfolio empowers the formation of the Industrial IoT and the transition to Industry 4.0. Next-generation industrial devices require the highest performance, most energy efficient, and most secure microcontrollers, radios and memories. And that is exactly what Cypress offers our customers.

Learn more below about how Cypress MCU, Connectivity, and Memory solutions are solving the Industrial Problems of tomorrow.

Module MPN Size Antenna Type

CYBLE-212006-01 15 x 23 x 2.00mm PCB Antenna

CYBLE-202007-01 15 x 23 x 2.05mm Ext. Antenna via u.FL Connector

CYBLE-202013-11 15 x 23 x 1.55mm Ext. Antenna via RF Pad




Figure 2. STMicroelectronics’ 32F769IDISCOVERY development board for the STM32F7x9 series of MCUs includes a 4” LCD touchscreen. (Image credit:

STMicroelectronics)

Displays Must Present Menus of Data to UsersThe key factor is the availability of Big Data, and the extraordinary value which can be derived from its use. In fields as diverse as intensive medical care and predictive maintenance of machines, it is the patterns discoverable in multiple streams of data or multiple parameters which provide the most valuable insights. And humans can most easily and most quickly discover these patterns visually; we learn more about complex data sets from diagrams, graphs and charts than we do from hundreds of lines of letters and numerals.

To enable millennials to do what they do well – making intelligent decisions based on rich, real-time data – embedded devices should present information graphically, and allow the user to interact with it intuitively. Systems, then, need graphics capability and must support touch-sensing interfaces.

The most sophisticated graphical systems, capable of handling video streams in high definition, for instance, will run on a high-performance MPU such as the i.MX family from NXP Semiconductors, based on ARM® Cortex®-A processors operating within a Linux® or Android™ environment. Such systems are complex and expensive in both software and hardware terms, and present considerable implementation challenges for those not versed in development on a rich Operating System (OS).

More and more embedded systems, however, are based on a microcontroller platform. And of course MCU users would always, if possible, prefer to remain as MCU users rather than migrating to an MPU. The MCU is familiar, it supports the C language for application-code development, and it enables the reuse of legacy systems running on the same platform. In short, the upheaval involved in migrating from an MCU to an MPU can be immense, but is potentially avoidable.

So how closely can a system with an MCU architecture emulate the sophistication and performance of an MPU-based HMI?

Today, STMicroelectronics promises users of its 32-bit STM32F7 MCUs, which are based on an ARM® Cortex®-M7 processor core, that they can support up to an XGA display screen with high-definition 1024 x 768px resolution. The STM32F7x7, STM32F7x8 and STM32F7x9 series all include an on-board TFT display controller and JPEG image codec (see Figure 2). All STM32F7 MCUs also include ST’s Chrom-ART Accelerator™ for graphics, to enable high-speed rendering of graphics without any overhead on the main processor. This graphics accelerator creates content twice as fast as the core alone can do. As well as providing for fast rendering of raw 2D data, the Chrom-ART Accelerator also supports extra functions such as image format conversion and

image blending, providing the MCU user with the capability to implement some sophisticated graphics effects.

On-board Flash memory of up to 2Mbytes and 512kbytes of SRAM provide plenty of capacity for graphics data storage and the scratchpad memory required by the Chrom-ART Accelerator. A MIPI-DSI interface in the STM32F7x9 series MCUs can also be useful in graphics-rich applications, as it provides a direct channel to devices such as image sensors and cameras.

Other MCU manufacturers provide similar levels of graphics and display controller capability in their high-end devices. Microchip’s PIC32 MX3 and MX4 series are intended for embedded applications with a high performance graphics display. They support TFT and OLED display screens up to WVGA (800 x 480px resolution), and integrate Microchip’s touch-sensing control technology.

Microchip offers particularly good development support for graphics applications, providing a free graphics library, and its intuitive and easy to use Graphics Display Designer development tool.

NXP Semiconductor’s LPC5460x and LPC54S60x families of ARM Cortex-M4-based MCUs are also optimized for rich HMI applications. They support a graphics LCD with resolution up to 1024 x 768, and offer options to easily connect and manage external QSPI Flash memories to store large images or pieces of code. NXP also provides a good ecosystem including graphics libraries, such as Segger emWin, provided free of charge.

Cypress Semiconductor also has a long heritage in the field of graphics display control – it is a leader in the market for highly integrated controllers for vehicle instrument clusters, which today often feature 2D or 3D graphics display screens.

For industrial equipment and home appliances, the FM4 family of MCUs offers a wide choice of features and capabilities. In particular, the S6E2D series of ARM Cortex-M4 MCUs, which is part of the FM4 family, is aimed at applications containing a full-color TFT-based graphical display; its graphics engine is derived from that used in the Traveo range of MCUs for instrument clusters.

Offering 512kbytes of video RAM as well as the graphics engine, the S6E2D supports complex image overlap, mirroring, scaling and image movement with minimal overhead on the Cortex-M4 core. It can implement sophisticated and impressive graphics at much lower price points then competing solutions.

New System Requirements in Move to Graphics DisplaysThe good news, then, is that many MCU manufacturers offer existing users a migration path up to their high-end devices through which they can implement very sophisticated, full-color graphics displays, even supporting some moving content, and providing high resolution up to Full HD. Extremely sophisticated display-based HMIs which meet the needs of millennial users can now be implemented without requiring a wholesale move to an MPU-based architecture and a full-featured operating system.

But designers implementing a sophisticated graphics display for the first time will find that:

� The complexity of their system increases dramatically � Timing windows shorten and scheduling creates considerable

challenges � The memory requirement scales up hugely, resulting in a

need for memory management



There is no question that an embedded application with a sophisticated HMI therefore requires the use of a real-time OS (RTOS) to provide a framework for scheduling and prioritization, and to implement memory management. A wide choice of RTOS options is available, and a system such as FreeRTOS™ is – as its name suggests – free to use, and benefits from board support from most MCU manufacturers.

Designers will also need to take advantage of the support that MCU manufacturers provide for third-party graphics design tools. Segger’s emWin design and simulation tool, for instance, is provided free by ST and NXP to users of its MCUs.

It is also worth taking note of the trend to enhance the HMI not only with advanced graphics capabilities but also with gesture control and with improved ability to use audio inputs and outputs. Microchip provides interesting capabilities in gesture control with its GestIC® technology (see Figure 3). And in audio user interfaces, XMOS in particular has been doing pioneering work in far-field microphone management implemented in its xCORE-VOICE™ processors, offering a means to provide voice control of electronic equipment in all environments.

Figure 3. Microchip’s 3DTouchPad demonstrates its GestIC gesture-recognition technology. (Image credit: Microchip)

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Application Spotlight on: Industrial Automationmedia.futureelectronics.com/doc/FTMAsia2017_0809_view.pdf · Multi-pin connectors for harsh applications carry up to 7.5A per contact