罗小兵个人简历tpl.energy.hust.edu.cn/local/1/E3/10/5FD487B263F... · 罗小兵个人简历 ___ 武汉市洪山区珞瑜路1037 号， Tel: 86-27-87542418 (Office) 华中科技大学能源与动力工程学院，430074

罗小兵个人简历

__________________________________________________________________________

武汉市洪山区珞瑜路 1037 号， Tel: 86-27-87542418 (Office)

华中科技大学能源与动力工程学院，430074 86-13871300778 (Assistant)

Email: [email protected] Fax: 86-27-87540724

Http://TPL.energy.hust.edu.cn

__________________________________________________________________________

1. 教育

09/98 07/02：清华大学工程力学系，工程热物理，工学博士学位

09/95 07/98：华中理工大学动力工程系，工程热物理，工学硕士学位

09/91 07/95：华中理工大学动力工程系，工程热物理，工学学士学位

2. 研究兴趣

LED 及量子点封装，极端热管理设计及器件，微尺度传热

2. 工作经历

03/2016---目前华中科技大学中欧能源学院中方联席院长，能源与动力工程

学院副院长兼工程热物理系系主任

05/2011---目前华中科技大学能源与动力工程学院副院长兼工程热物理系

系主任 12/2007---目前正教授，博士导师，华中科技大学能源与动力工程学院，武

汉光电国家实验室微光机电系统研究部 09/2005--11/2007 副教授，华中科技大学能源与动力工程学院，武汉光电国家

实验室微光机电系统研究部

08/2002--08/2005 高级研究员, 韩国三星综合技术研究院（韩国总部）

4. 职业主要荣誉和奖励

IEEE ICEPT Outstanding Paper Award, 通讯作者，2017

国家杰出青年基金获得者, 2016

IEEE CPMT Exceptional Technical Achievement Award, 2016

国家技术发明奖二等奖，排名第二，2016

2015 IEEE CPMT Best Paper Award，2016

湖北省自然科学奖一等奖，排名第一，2015

教育部技术发明奖一等奖，排名第二，2015

华中科技大学研究生知心导师奖，2015

华中科技大学三育人奖，2014

华中科技大学《工程传热学》课程责任教授，2014

第七届国家大学生节能减排大赛特等奖指导老师，2014

mailto:[email protected]

http://www.hust-tpl.org/

国家精品资源共享课程《工程传热学》负责人，2013

华中科技大学研究生就业指导良师，2013

华中科技大学十佳青年教工，2012

第二届华中科技大学师表奖，2011

IEEE Cisco Best Student Paper Award, 2011

2010 年南海杯国家半导体照明创新大赛学生创意奖指导老师，2010

IEEE Outstanding Paper Award, 2010

中国物流协会科技发明一等奖，排名第二，2009

中国电子协会科技奖励二等奖，排名第二，2009

第二届国家大学生节能减排大赛特等奖指导老师，2009

IEEE ICEPT NXP Best Paper Award,第一作者，2008

IEEE ICEPT Philips Best Paper Award,第一作者, 2006

Best Researcher Award, Samsung Advanced Institute of Technology, Korea, 2003

5. 学术活动

1) Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing

Technology

2) Associate Editor，ASME Journal of Electronics Packaging

3) Panel chair of Itherm 2016, USA

4) Associate editor of JEP special issue for Interpack papers in 2015

5) Associate Editor, 15th International Conference of Heat Transfer, Japan, 2014

6) 技术委员会成员-光电分会, 2th, 3th, 4th, 5th Electronics System-Integration Technology

Conference in Europe, 2008-2014 （欧洲）

7) 技术委员会成员 -LED 分会 , 1th, 2th, International Conference on Advanced

Electromaterials in Korea, 2011-2013（韩国）

8) 本地组委会主席, 11th International Conference on Power Engineering, Wuhan, China,

2013

9) 国际杂志文章评阅人：Advanced Functional Material, IEEE CPMT, IEEE TDMR,

IEEE PTL, International Journal of Heat and Mass Transfer, International Journal of

Thermal Sciences, Applied Thermal Engineering, Heat Transfer Engineering, ASME

Journal of Electronics Packaging, Scientific Reports, Experimental Heat and Fluid

Science, Energy Conversion and Management, Applied Energy, Microelectronics

Reliability, Journal of Applied Physics, Optics Express, JSOA, Optics Letters, Sensors

and Actuators A, Applied Optics, etc.

10) 项目和基金评阅人：美国能源部项目，荷兰科技转化基金，中国国家自然科学基

金，广东，浙江，江苏，北京等地基金或者科技项目和奖励

11) 公司咨询：美国艾默生公司，中国欧普照明，香港应用科学研究院等

6. 授权发明专利及其他

[1] X.B.Luo, H. J. Cho, Micro accelerometer，美国专利: US 7,080,553, 韩国专利:

KR 552480

[2] X. B. Luo, H.J. Cho, J.Y. Lee, S.K.Kang, Apparatus for measuring methanol

concentration, 美国专利: US 7,353,696, 韩国专利: KR 601977, 中国发明专

利: ZL 200510128862.3，日本专利：JP4563303

[3] X. B. Luo, S.K.Kang, D.Y.Seung. Liquid-gas separator for direct liquid feed fuel

cell, 韩国专利: KR 696526, 美国专利: US 7700213, 中国发明专利: ZL

200610077192.1

[4] H.J. Cho, X. B. Luo, Fuel supply device for direct methanol fuel cells, 韩国专利:

KR 0528337, 欧洲专利: EP1513210 , 美国专利: US 7121308 B2，日本专

利: JP 4060298

[5] H.J. Cho, X. B. Luo, Z.Y. Zhou, X.Yang, X.Y.Ye, Diaphragm Air-Pump, 韩国

专利: KR 594802, 欧洲专利: EP1515043 ，日本专利: JP 4057001, 美国专

利: US 7,553,135,中国发明专利: ZL 03157069.0

[6] H.J. Cho, X. B. Luo, H. Chang, Fuel supply device for direct methanol fuel cells，

美国专利: US 7,695,842，韩国专利: KR 0519773, 日本专利: JP 4060296，欧

洲专利：EP1513211

[7] H. J. Cho, X.B.Luo, Valveless Micro Air Delivery Device，韩国专利: KR

519970，日本专利: JP4118859，美国专利：7,841,843

[8] S.K.Kang, X. B. Luo, H.K.Kim, D.K.Sohn. Liquid-gas separator for direct liquid

feed fuel cell, 美国专利: US 7,621,982，韩国专利: KR 670348

[9] H.J. Cho, D.K.Song, X. B. Luo, Liquid fuel mixing apparatus and direct liquid

feed fuel cell system having the same, 美国专利：US 7,622,213, 韩国专利: KR

626089，中国发明专利: ZL 200510128493.8

[10] 罗小兵, 陈剑楠，胡润，刘胜, 用于电子封装器件的微通道热沉系统，中国

发明专利号， ZL 2010.1.0146723.4

[11] 罗小兵，姚家伟，桂许龙，刘胜，一种混合型垂直轴风力发电机，中国发明

专利号：ZL 2010.1.0176426.4

[12] 罗小兵，郑怀，余珊，刘胜，一种反光杯及其在 LED 封装中控制荧光粉层

几何形状的方法，中国发明专利号：ZL 2011.1.0123454.4

[13] 罗小兵，郑怀，付星，刘胜，利用表面改性实现无透镜封装的 LED 封装器

件及其方法，中国发明专利号：ZL 2011.1.0396568.6

[14] 罗小兵，胡润，王凯，刘胜，一种光型可控的双自由曲面透镜设计方法，中

国发明专利：ZL 2012.1.0013686.9

[15] 罗小兵, 付星，胡锦炎，刘胜，利用潜热型功能流体的散热装置及其散热方

法，中国发明专利，ZL 2011.1.0432260.2

[16] 罗小兵，郭庭辉，段斌，一种高可靠性的微型机械泵，中国发明专利：ZL

2012.1.0245632.5

[17] 罗小兵，郑怀，付星，一种基板结构及其用于二极管封装中荧光粉涂覆的方

法，中国发明专利号：ZL 2012.1.0253752.X

[18] 罗小兵，胡润，吴步龙，刘胜，一种自由曲面透镜及其实现保形涂覆的方法，

中国发明专利号：ZL 2012.1.0013674.6

[19] 罗小兵，郑怀，一种用于板上芯片 LED 封装结构及其荧光粉涂覆方法，中

国发明专利号：ZL 2013.1.0244275.5

[20] 罗小兵，郑怀，王依蔓，李岚，一种 LED 封装基板及用于保形涂覆的方法，

中国发明专利号：ZL 2013.1.0139576.1

[21] 罗小兵，郑怀，张可，王立慧，一种 LED 封装基板及用于保形涂覆的方法，

中国发明专利号：ZL 201310136095.5

[22] 罗小兵，李春峰，郑怀，孙连根，许岩，一种实现高空间光色均匀的 LED

涂覆装置及方法，中国发明专利号：ZL 201410090055.6

[23] 罗小兵，胡锦炎，一种基于包芯结构复合相变储热层的动力电池冷却系统，

中国发明专利号：ZL 201510003649.3

[24] 罗小兵，朱永明，郑怀，一种用于汽车前照灯的 LED 的模块的封装方法，

中国发明专利号：ZL 201410275518.6

[25] 罗小兵，郑怀，雷翔，一种荧光粉复合颗粒、其制备方法及应用，中国发明

专利号：ZL 201410477765.4

[26] 罗小兵，袁超，段斌，一种高分子复合散热材料制备方法，中国发明专利号：

ZL 201510547164.0

[27] 罗小兵, 李志信, 过增元, 易明,胡桅林, 合成喷射流角速度计，中国发明专

利，ZL 01 1 29216.4

[28] 罗小兵, 李志信, 杨拥军, 双向合成喷射流陀螺仪, 中国发明专利， ZL 01 1

29222.9

[29] 罗小兵，吴晗，TPL 离心泵设计软件 1.0，中华人民共和国软件著作权，

2017SR158597

[30] 罗小兵，刘发龙，段斌，一种微型水力悬浮机械泵，中国发明专利号：ZL

201611139270.6，PCT 国际专利申请号：PCT/CN2017/071675

[31] 罗小兵，刘发龙，段斌，一种新型机械泵液冷散热系统，中国发明专利号：

ZL 201710208116.8，PCT 国际专利申请号：PCT/CN2017/081642

7. 申请发明专利

[32] 罗小兵，余兴建，郑怀，一种用于荧光粉涂覆的方法，中国发明专利申请号：

201410655196.8

[33] 罗小兵，余兴建，一种荧光粉涂覆方法及其应用，中国发明专利申请号：

201510036205.X

[34] 罗小兵，段斌，罗明清，一种微型旋转机械泵的叶轮固定方法，中国发明专

利申请号：201510162929.9

[35] 罗小兵，余兴建，郑怀，一种沾取转移式荧光粉胶涂覆方法，中国发明专利

申请号：201510313825.3

[36] 罗小兵，余兴建，马预谱，一种远离荧光粉涂覆方法及产品，中国发明专利

申请号：201510698771.7

[37] 罗小兵，余兴建，谢斌，一种用于荧光粉涂覆的装置及其涂覆方法，中国发

明专利申请号：201510884145.7

[38] 罗小兵，谢斌，余兴建，一种白光 LED 及其制备方法，中国发明专利申请

号：201510974567.3

[39] 罗小兵，余兴建，刘发龙，一种 LED 荧光粉涂覆的方法，中国发明专利申

请号：201610015901.7

[40] 罗小兵，余兴建，胡润，一种溶液法荧光粉薄膜涂覆方法、产品及其应用，

中国发明专利申请号：201610375075.7

[41] 罗小兵，黄梦宇，袁超，一种拥有亲、疏水两种润湿特性的铜基板制备方法，

中国发明专利申请号：201610552485.4

[42] 罗小兵，刘发龙，段斌，一种智能液冷服，中国发明专利申请号：

201610596147.0

[43] 罗小兵，余兴建，舒伟程，一种溶液式荧光粉涂覆方法及应用，中国发明专

利申请号：201710148097.4

[44] 罗小兵，谢斌，程焱华，一种低工作温度的量子点白光 LED 及其制备方法，

中国发明专利申请号：201710339524.7

[45] 罗小兵，谢斌，程焱华，一种高发光效率的量子点白光 LED 及其制备方法，

中国发明专利申请号：201710338296.1

[46] 罗小兵，刘发龙，段斌，一种液体动压悬浮机械泵，中国发明专利申请号：

201710228549.X

[47] 罗小兵，吴睿康，段斌，一种刻槽轴承动压悬浮机械泵，中国发明专利申请

号：201710339001.2

[48] 罗小兵，段斌，刘发龙，一种自循环水冷微型泵，中国发明专利申请号：

201710339480.8

8. 专著和章节

[1] Sheng Liu, Xiaobing Luo, LED Packaging for Lighting Applications-Design,

Manufacturing and Testing, John Wiley & Sons, USA, 2011

[2] Xiaobing Luo, Run Hu, Chip Packaging: Encapsulation of nitride LEDs, Chapter

15, Woodhead Publishing, UK, 2014

[3] Xiaobing Luo, Run Hu, Thermal management on LED packaging and

applications, Chapter 9, Annual Review of Heat Transfer: 371-414, USA, 2015

[4] Xiaobing Luo, Qi Chen, Online Testing Method and System for LED Reliability

and Their Applications, Chapter 13, Solid State Lighting Reliability Part 2:

353-380, Springer, Switzerland, 2017

9. 特邀报告和课程讲授

[1] Xiaobing Luo, A micro pump for microfluidics applications, International Fair

of Environment Professional Microtechnology, Invited Speech , Swiss, 2011 (瑞

士)

[2] Xiaobing Luo, Phosphor Geometry Analysis and Control for White LEDs Based

on Microfluidics Theory, Invited Speech, International Conference on

Advanced Electromaterials, Jeju, Korea, 2011 （韩国）

[3] Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo*, A Method to

Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight

with High Distance-Height Ratio, Invited Talk, 13th International Conference on

Electronic Packaging Technology & High Density Packaging, Guilin, China,

PP:1474-1478, 2012 （中国桂林）

[4] Xiaobing Luo, Experimental investigation on the Minichannel cold plate for high

temperature uniformity based on a compact thermal model, Keynote Speaker,

ASME 2013 11th International Conference on Nanochannels, Microchannels, and

Minichannels, Sapporo, Japan, 2013 （日本）

[5] Xiaobing Luo, LED lighting technology and its energy saving, Invited Lecture,

2013 AC 21 International Summer School, Bangkok, Thailand, 31.May to 4.June,

2013 （泰国课程讲授）

[6] Xiaobing Luo, Phosphor coating control Based on Microfluidics Theory for

Phosphor converted white LED. Plenary Speaker, International Workshop on

Solid State Lighting Technologies and Research: LEDs and OLEDs, Istanbul,

Turkey, 19.Aug. to 21.Aug. 2013（土耳其）

[7] Xiaobing Luo, LED lighting and its packaging technology, Invited Lecture,

2013 International Summer School, Shanghai, China, 28.July to 5.Aug. , 2013 （上海课程讲授）

[8] Xiaobing Luo, Heat and Mass Transfer and Its applications on LED Packaging,

Keynote Speaker, 2013 International Workshop on Heat Transfer Advances for

Energy Conversion and Pollution Control, Xi’an, China, 18.Oct. to 21.Oct., 2013

（中国西安）

[9] Xiaobing Luo, An Engineering method to estimate junction temperature of light

emitting diodes in multiple LEDs applications, Keynote Speaker, The 2nd

International Conference on Advanced Electromaterials (ICAE), Jeju, Korea,

Nov. 12-15, 2013. （韩国）

[10] Xiaobing Luo, Thermal packaging of LED, Invited Speaker, The 9th

International Microsystems, Packaging, Assembly, Circuits Technology

Conference and the 16th International Conference on Electronics Materials and

Packaging, Oct. 22-24, Taiwan, China, 2014.(中国台湾)

[11] Xiaobing Luo, Thermal management in LED/IC packaging, Invited Lecture,

Taiwan Thermal Management Association, Taiwan University, Oct. 24, 2014.

（中国台湾）

[12] Xiaobing Luo, Thermal and Optical Performances of Quantum Dot-Based LEDs,

Plenary Speaker, International Lighting and Display Workshop, Tianjin, China,

Sep. 2015. （中国）

[13] Xiaobing Luo, LED packaging: Thermal and Mechanical Challenges and Future

Direction, Panel Moderators, 15th The Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA,

May 31-June 3, 2016（美国）

[14] Xiaobing Luo, Thermal management based on solid-liquid phase change

materials, Keynote Speaker, The 9th International Symposium on Heat Transfer,

Beijing, China, Aug.15-19, 2016 （中国北京）

[15] Xiaobing Luo, Key problems in high performance LEDs packaging, Invited

Speaker, The 16th International Meeting on Information Display, Jeju, Korea,

Aug.23-26, 2016 （韩国）

[16] Xiaobing Luo, LED Phosphor Heating, Modeling and Experimental Test,

Invited Speech, The 13th China International Forum on Solid State Lighting,

Beijing, China, Nov.15-17, 2016 （中国北京）

[17] Xiaobing Luo, Heat and Fluid Flow in LED Packaging and Applications,

Keynote Speaker, 2nd Thermal and Fluids Engineering Conference and 4th

International Workshop on Heat Transfer, Las Vegas, NV, USA, Apr. 2-5, 2017

（美国）

[18] 罗小兵，大功率 LED 封装与应用中流动传热问题及其对工艺的指导，中国

工程热物理学会传热传质年会，分会特邀报告，西安，2011 年（中国）

[19] 罗小兵，大功率 LED 封装中的关键流动传热问题，中国工程热物理学会传

热传质年会，分会特邀报告，大连，2015 年（中国）

[20] 罗小兵，源于工程，馈予工程，第二届传热与多相流青年学术论坛，大会特

邀报告，天津，2017 年 3 月 17-18 日（中国）

[21] 罗小兵，界面热管理，高等学校工程热物理第二十三届全国学术会议手册，

大会特邀报告，四川成都，2017 年 5 月 13-16 日（中国）

10.发表文章

国际杂志文章(*通讯作者)

[1] Xingjian Yu, Bin Xie, Bofeng Shang, Weicheng Shu and Xiaobing Luo*, A

facile approach to fabricate patterned surfaces for enhancing light efficiency of

COB-LEDs, IEEE Transactions on Electron Devices, 2018(In Press)

[2] Bin Xie, Jingjing Zhang, Wei Chen, Junjie Hao, Yanhua Cheng, Run Hu, Dan

Wu, Kai Wang* and Xiaobing Luo*, Realization of wide circadian Variability

by quantum dots-luminescent mesoporous silica-based white light-emitting

diodes, Nanotechnology, 2017(In press)

[3] Jingjing Zhang, Bin Xie, Xingjian Yu, Xiaobing Luo*, Tao Zhang, Shishen Liu,

Zhihua Yu, Li Liu, and Xing Jin, Blue light hazard performance comparison of

phosphor-converted LED sources with red quantum dots and red phosphor,

Journal of Applied Physics 122, 043103, 2017

[4] Jingjing Zhang, Weihong Guo, Bin Xie, Xingjian Yu, Xiaobing Luo*, Tao

Zhang, Zhihua Yu, Hong Wang, Xing Jin, Blue light hazard optimization for

white LED sources with high luminous efficacy of radiation and high color

rendering index, Optics and Laser Technology, Vol.94:193-198, Sep.1, 2017

[5] Xingjian Yu, Weicheng Shu, Run Hu*, Bin Xie, Yupu Ma, Xiaobing Luo*,

Dynamic phosphor sedimentation effect on the optical performance of white

LEDs, IEEE Photonics Technology Letters, Vol.29(14):1195-1198, Jul.15, 2017

[6] Bofeng Shang, Yupu Ma, Run Hu*, Chao Yuan, Jinyan Hu, Xiaobing Luo*,

Passive thermal management system for downhole electronics in harsh thermal

environments, Applied Thermal Engineering, Vol.118:593-599, May 25, 2017

[7] Qi Chen, Run Hu, Xiaobing Luo*, A statistical study to identify the effects of

packaging structures on lumen reliability of LEDs, Microelectronics Reliability,

Vol.71:51-55, Apr., 2017

[8] Jingjing Zhang, Run Hu, Bin Xie, Xingjian Yu, Xiaobing Luo*, Zhihua Yu,

Lijun Zhang, Hong Wang, and Xing Jin, Energy-saving light source spectrum

optimization by considering object’s reflectance, IEEE Photonics Journal,

Vol.9(2):8200311, Apr. 2017

[9] Chao Yuan, Mengyu Huang, Yanhua Cheng and Xiaobing Luo*,

Bonding-induced thermal transport enhancement across hard/soft materials

interface using molecular monolayers, Physical Chemistry Chemical Physics,

Vol.19, 7352-7358, Mar.14, 2017

[10] Yupu Ma, Run Hu, Xingjian Yu, Weicheng Shu, Xiaobing Luo*, A modified

bidirectional thermal resistance model for junction and phosphor temperature

estimation in phosphor-converted LEDs, International Journal of Heat and Mass

Transfer, Vol.106:1-6, Mar. 2017

[11] Qi Chen, Yupu Ma, Xingjian Yu, Run Hu, Xiaobing Luo*, Phosphor

temperature over-estimation in high power LED by thermocouple, IEEE

Transactions on Electron Device, Vol.64(2): 463-466, Feb. 2017

[12] J.J.Zhang, R.Hu, X.J.Yu, B.Xie, X.B.Luo*, Spectral optimization based

simultaneously on color-rendering index and color quality scale for white LED

illumination, Optics & Laser Technology, Vol. 88:161-165, Feb. 2017

[13] Bin Xie, Wei Chen, Junjie Hao, Dan Wu, Xingjian Yu, Yanhua Chen, Run Hu,

Kai Wang, Xiaobing Luo*, Structural optimization for remote white

light-emitting diodes with quantum dots and phosphor: packaging sequence

matters, Optics Express, Vol. 24(26), A1560-A1570, Dec.26, 2016

[14] Run Hu, Shuling Zhou, Weicheng Shu, Bin Xie, Yupu Ma, and Xiaobing

Luo*,Directional heat transport through thermal reflection meta-device, AIP

Advances, 6, 125111, Dec. 2016

[15] Lan Li, Huai Zheng, Chao Yuan, Run Hu & Xiaobing Luo, Study on effective

thermal conductivitiy of silicon/phosphor composite and its size effect by Lattice

Boltzmann method, Heat and Mass Transfer, Vol. 52:2813-2821, Dec. 2016

[16] Chao Yuan, Mengyu Huang, Xingjian Yu, Yupu Ma, Xiaobing Luo*, A simple

approach to fabricate the rose petal-like hierarchical surfaces for droplet

transportation, Applied Surface Science, Vol.385:562-568, Nov.1, 2016

[17] Run Hu, Shuling Zhou, Xinjian Yu and Xiaobing Luo*, Exploring the proper

experimental conditions in 2D thermal cloaking demonstration, Journal of

Physics D:Applied Physics, 49, 415302, Oct.19 2016

[18] Yongming Zhu, Wei Chen, Jinyan Hu, Bin Xie, Junjie Hao, Dan Wu, Xiaobing

Luo* and Kai Wang, Light conversion efficiency enhancement of modified

quantum dot films integrated with micro SiO2 particles, Journal of Display

Technology, Vol.12(10), 1152-1156, Oct. 2016

[19] Xiaobing Luo*, Run Hu, Sheng Liu, Kai Wang, Heat and fluid flow in

high-power LED packaging and applications, Progress in Energy and

Combustion Science, 56, 1-32, Sep.2016

[20] Jinyan Hu, Run Hu, Chao Yuan, Bin Duan, Mengyu Huang, Xiaobing Luo*,

Fabrication and thermal characterization of the modularized thermal storage unit,

IEEE Transactions on Components, Packaging and Manufacturing Technology,

Vol. 6(8):1198-1207, Aug.2016

[21] Ting Cheng, Xingjian Yu, Yupu Ma, Bin Xie, Qi Chen, Run Hu, and Xiaobing

Luo*, Angular color uniformity enhancement of white LEDs by lens wetting

phosphor coating, IEEE Photonics Technology Letters, Vol.

28(4):1589-1592,July, 15, 2016

[22] Xingjian Yu, Bin Xie, Bofeng Shang, Qi Chen, Xiaobing Luo*, A cylindrical

Tuber Encapsulant geometry for enhancing optical performance of Chip-on

Board Packaging LEDs, IEEE Photonics Journal, Vol.8(3):1600709, Jun 2016

[23] Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Xiaobing Luo*. Numerical

and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer

Coating Process of Light-Emitting Diodes Packaging, Journal of Electronic

Packaging, Vol. 138(2): 021002, Jun. 2016.

[24] Bin Xie, Run Hu, Xiaobing Luo*. Quantum Dots-Converted Light-Emitting

Diodes Packaging for Lighting and Display: Status and Perspectives, Journal of

Electronic Packaging, Vol. 138(2): 020803, Jun. 2016.

[25] Bin Xie, Run Hu, Xingjian Yu, Bofeng Shang, Yupu Ma, Xiaobing Luo*, Effect

of packaging method on performance of light-emitting diodes with quantum dot

phosphor, IEEE Photonics Technology Letters, Vol.28(10):1115-1118, May.15,

2016

[26] Ruikang Wu, Run Hu*, Xiaobing Luo*, First-Principle-based full-dispersion

Monte Carlo simulation of the anistropic phonon transport in the wurtzite GaN

thin film, Journal of Applied Physics, 119,145706, Apr.14, 2016

[27] Run Hu, Jinyan Hu, Ruikang Wu, Bin Xie, Xingjian Yu, Xiaobing Luo*,

Examination of the thermal cloaking effectiveness with layered engineering

materials, Chinese Physics Letters, Vol 33(4), 044401, Apr. 2016

[28] Chao Yuan, Lan Li, Bin Duan, Bin Xie, Yongming Zhu, Xiaobing

Luo*, Locally reinforced polymer-based composites for efficient heat dissipation

of local heat source, International Journal of Thermal Sciences , Vol:102,202-209,

Apr., 2016

[29] Jinlong Ma, Wu Li, Xiaobing Luo*,Intrinsic thermal conductivities and size

effect of alloys of wurtzite AlN, GaN, and InN from first principles, Journal of

Applied Physics, Vol:119(12),125702, Mar. 28, 2016

[30] Jinyan Hu, Run Hu, Yongming Zhu, Xiaobing Luo*, Experimental investigation

on composite phase change material (CPCM) based substrate, Heat Transfer

Engineering, Vol.37(3-4):351-358, Mar. 3, 2016.

[31] Chao Yuan, Bin Xie, Mengyu Huang, Ruikang Wu, Xiaobing Luo*, Thermal

conductivity enhancement of platelets aligned composites with volume fraction

from 10% to 20%, International Journal of Heat and Mass Transfer, Vol.94,

pp:20-28, Mar.1, 2016.

[32] Jinlong Ma, Wu Li, Xiaobing Luo*, Ballistic thermal transport in monolayer

transition-metal dichalcogenides:Role of atomic mass, Applied Physics Letters,

Vol.18(8),082102, Feb.22, 2016

[33] Run Hu, Zhongzhou Du, Ting Cheng, Zhixing Huang, Wenzhong Liu, Xiaobing

Luo*, Noninvasively probing the light-emitting diode temperature by magnetic

nanoparticles, Journal of Applied Physics, 118, 124501,Sep.28. 2015.

[34] Run Hu, Bin Xie, Jinyan Hu, Qi Chen, Xiaobing Luo*, Carpet thermal cloak

realization based on the refraction law of heat flux, EuroPhysics Letter, 111,

54003，Sep. 2015.

[35] XingjianYu, Bin Xie, Qi Chen, Yupu Ma, Ruikang Wu, Xiaobing Luo*, Therma

l remote phosphor coating for phosphor-converted white light-emitting diodes,

IEEE Transactions on Components, Packaging and Manufacturing Technology,

Vol. 5(9): 1253-1257, Sep. 2015

[36] Bin Duan, Minqing Luo, Chao Yuan, Xiaobing Luo*，Multi-objective hydraulic

optimization and analysis in a minipump, Chinese Science Bulletin,

60(17):1517-1526, Sep. 2015

[37] ChaoYuan, Bin Duan,Lan Li, Bin Xie, Mengyu Huang, Xiaobing Luo*, Thermal

Conductivity of Polymer-Based Composites with Magnetic Aligned Hexagonal

Boron Nitride Platelets ， ACS Applied Materials & Interfaces, Vol.7(23),

13000-13006, Jun.17, 2015.

[38] Qi Chen, Run Hu, Bin Xie, Xiaobing Luo*, Effect study of chip offset on the

optical performance of light-emitting diode packaging, IEEE Photonics

Technology Letters, Vol.27(12), 1337-1340, Jun.15,2015.

[39] Bin Xie, Run Hu, Qi Chen, Xingjian Yu, Dan Wu, Kai Wang*, Xiaobing

Luo*, Design of a brightness-enhancement-film-adaptive freeform lens to

enhance overall performance in direct-lit light-emitting diode backlighting,

Applied Optics, Vol:54(17), 5542-5548, Jun.10, 2015.

[40] Xiang Lei, Huai Zheng, Sheng Liu, Xiaobing Luo*, Performance enhancement

of white LEDs through phosphor/silicone composite particles, IEEE Photonics

Technology Letters, Vol.27(10), 1060-1063, May. 15, 2015.

[41] Tinghui Guo, Bofeng Shang, Bin Duan, Xiaobing Luo*, Design and testing of a

liquid cooled garment for hot environments, Journal of Thermal Biology,

Vol.49-50, pp.47-54, Apr.-May, 2015

[42] Chao Yuan, Bin Duan, Lan Li, Bofeng Shang, Xiaobing Luo*, An improved

model for predicting thermal contact resistance at liquid-solid

interface, International Journal of Heat and Mass Transfer, vol. 80, pp. 398-406,

Jan. 2015

[43] Huai Zheng, Lan Li, Xiang Lei, Xingjian Yu, Sheng Liu, and Xiaobing Luo*, Op

tical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding T

iO2/Silicone Encapsulation Layer, IEEE Electron Device Letters, Vol. 35 (10),

pp:1046-1048, Oct. 2014

[44] Run Hu, Xiaobing Luo*, Phosphor distribution optimization to decrease the

junction temperature in white pc-LEDs by genetic algorithm,

International Journal of Heat and Mass Transfer, vol. 77, pp. 891-896, Oct. 2014.

[45] Qi Chen, Quan Chen, and Xiaobing Luo*, Note: An online testing method for

lifetime projection of high power light-emitting diode under accelerated

reliability test, Review of Scientific Instruments, 85, 096111, Sep. 2014

[46] Jinlong Ma, Wu Li, and Xiaobing Luo*, Intrinsic thermal conductivity and its

anisotropy of wurtzite Inn, Appl. Phys. Lett. 105, 082103, Aug.25, 2014

[47] Xiaobing Luo*, and Run Hu, Calculation of phosphor heat generation in phosph

or-converted light-emitting diodes, International Journal of Heat and Mass Transf

er, vol. 75, pp. 213-217, Aug. 2014

[48] Jinlong Ma, Wu Li, and Xiaobing Luo*, Examining the callaway model for

lattice thermal conductivity, Physical Review B, 90, 035203, Jul.14, 2014

[49] Xing Fu, Run Hu and Xiaobing Luo*, An Engineering method to estimate the

junction temperatures of LEDs in Multiple LED application, Journal of the

Korean Physical Society, Vol.65 (2), 176-184, Jul. 2014

[50] Quan Chen, Qi Chen, Sheng Liu, Xiaobing Luo*, A design for in-situ

measurement of optical degradation of high power light-emitting diodes under

accelerated life test, IEEE Transactions on Device and Material Reliability,

Vol.14 (2): 645-650, Jun. 2014.

[51] Run Hu, Xuli Wei, Jinyan Hu, Xiaobing Luo*, Local heating realization by

reverse thermal cloak, Scientific Reports, vol. 4: 3600, Jan. 8, 2014

[52] Bimrew Tamrat Admasu, Xiaobing Luo*, Jiawei Yao, Effects of temperature

non-uniformity over the heat spreader on the outputs of thermoelectric power

generation system, Energy Conversion and Management, vol. 76: 533-540, Dec.

2013.

[53] Huai Zheng, Yiman Wang, Lan Li, Xing Fu, Yong Zou, Xiaobing Luo*,

Dip-transfer phosphor coating on designed substrate structure for high angular

color uniformity of white light emitting diodes with conventional chips, Optics

Express, vol. 21(106): A933-A941, Nov. 4, 2013.

[54] Xing Fu, Xiaobing Luo*, Can thermocouple measure surface temperature of

light emitting diode module accurately? , International Journal of Heat and Mass

Transfer, vol. 65: 199-202, Oct. 2013.

[55] Jinlong Ma, Xinjiang Wang, Baoling Huang, Xiaobing Luo*, Effects of point

defects and dislocations on spectral phonon transport properties of wurtzite GaN,

Journal of Applied Physics, vol. 114(7): 074311, Aug.21, 2013.

[56] Run Hu, Bin Cao, Yong Zou, Yongming Zhu, Sheng Liu, Xiaobing Luo*,

Modeling the Light Extraction Efficiency of Bi-Layer Phosphors in White LEDs,

IEEE Photonics Technology Letters, vol. 25(12): 1141, Jun.15, 2013.

[57] Huai Zheng, Sheng Liu, Xiaobing Luo*, Enhancing Angular Color Uniformity

of Phosphor-Converted White Light-Emitting Diodes by Phosphor Dip-Transfer

Coating, Journal of Lightwave Technology, vol. 31(12): 1987-1993, Jun.15,

2013.

[58] Run Hu, Huai Zheng, Jinyan Hu, Xiaobing Luo*, Comprehensive study on the

transmitted and reflected light through the phosphor layer in light-emitting diode

packages, Journal of Display Technology, vol. 9(6): 447-452, Jun., 2013.

[59] Huai Zheng, Xiaobing Luo*, Color consistency enhancement of white

light-emitting diodes through substrate design, IEEE Photonics Technology

Letters, vol.25 (5): 484-487, Mar.1, 2013.

[60] Huai Zheng, Jinlong Ma, Xiaobing Luo*, Conformal Phosphor Distribution for

White Lighting Emitting Diode Packaging by Conventional Dispensing Coating

Method With Structure Control, IEEE Transactions on Components, Packaging

and Manufacturing Technology, vol. 3 (3) : 417-421, Mar., 2013.

[61] Xiaobing Luo*, Xing Fu, Fei Chen, Huai Zheng, Phosphor self-heating in

phosphor converted light emitting diode packaging, International Journal of Heat

and Mass Transfer, vol. 58(1): 276-281, Mar., 2013.

[62] Run Hu, Yiman Wang, Yong Zou, Xing Chen, Sheng Liu, Xiaobing Luo*, Study

on phosphor sedimentation effect in white light-emitting diode packages by

modeling multi-layer phosphors with the modified Kubelka-Munk theory, Journal

of Applied Physics, vol. 113: 063108, Feb.14, 2013.

[63] Run Hu, Shan Yu, Yong Zou, Huai Zheng, Fei Wang, Sheng Liu, Xiaobing

Luo*, Near-/mid-field effect of color mixing for single phosphor-converted

light-emitting diode package, IEEE Photonics Technology Letters, vol. 25(3):

246-249, Feb.1, 2013.

[64] Run Hu, Zhiqiang Gan, Xiaobing Luo*, Huai Zheng, Sheng Liu, Design of

double freeform-surface lens for LED uniform illumination with minimum

Fresnel losses, Optik-International Journal for Light and Electron Optics, vol.

124(19): 3895-3897, 2013.

[65] Chao Yuan, Xiaobing Luo*, A unit cell approach to compute thermal

conductivity of uncured silicone/phosphor composites, International Journal of

Heat and Mass Transfer, vol. 56(1-2): 206-211, Jan.1, 2013.

[66] Run Hu, Xing Fu, Yong Zou, Xiaobing Luo*, A complementary study to

‘Toward scatter-free phosphors in white phosphor-converted light-emitting

diodes’: Comment, Optics express, vol. 21(4): 5071-5073, 2013.

[67] Bulong Wu, Huai Zheng, Xing Fu, Xiaobing Luo*, Effect of gold wire bonding

on optical performance of high power light-emitting diode packaging, Journal of

Ceramic Processing Research, vol. 13: 354, Nov. 2012.

[68] Run Hu, Xiaobing Luo*, A model for calculating the bidirectional scattering

properties of phosphor layer in white light-emitting diodes, Journal of Lightwave

Technology, vol. 30(21): 3376-3380, Nov.1, 2012.

[69] Xiaobing Luo*, Zhangming Mao, Janghui Yang, Sheng Liu, Engineering

method for predicting junction temperatures of high-power light-emitting diodes,

IET Optoelectronics, vol. 6(5): 230-236, Oct. 2012.

[70] Run Hu, Xiaobing Luo*, Huai Zheng, Hotspot location shift in the high-power

phosphor-converted white light-emitting diode packages, Japanese Journal of

Applied Physics, vol. 51(9), Sep., 2012.

[71] Xiaobing Luo*, Zhangming Mao, Thermal modeling and design for

microchannel cold plate with high temperature uniformity subjected to multiple

heat sources, International Communications in Heat and Mass Transfer, vol.

39(6): 781-785, Jul., 2012.

[72] Run Hu, Xiaobing Luo*, Huai Zheng, Zong Qin, Zhiqiang Gan, Bulong Wu,

Sheng Liu, Design of a novel freeform lens for LED uniform illumination and

conformal phosphor coating, Optics Express, vol. 20(13): 13727-13737, Jun.18,

2012.

[73] Run Hu, Xiaobing Luo*, Han Feng, Sheng Liu, Effect of phosphor settling on

the optical performance of phosphor-converted white light-emitting diode,

Journal of Luminescence, vol. 132(5): 1252-1256, May.2012.

[74] Huai Zheng, Xiaobing Luo*, Run Hu, Bin Cao, Xing Fu, Ym Wang, Sheng Liu,

Conformal phosphor coating using capillary microchannel for controlling color

deviation of phosphor-converted white light-emitting diodes, Optics Express, vol.

20(5): 5092-5098, Feb.27, 2012.

[75] Bulong Wu, Xiaobing Luo*, Huai Zheng, Sheng Liu, Effect of gold wire

bonding process on angular correlated color temperature uniformity of white

light-emitting diode, Optics Express, vol. 19(24): 24115-24121, Nov.21, 2011.

[76] Run Hu, Xiaobing Luo*, Sheng Liu, Study on the optical properties of

conformal coating light-emitting diode by Monte Carlo simulation, IEEE

Photonics Technology Letters, vol. 23(22): 1673-1675, Nov.15, 2011.

[77] Xiaobing Luo*, Zhangming Mao, Sheng Liu, Analytical thermal resistances

model for eccentric heat source on rectangular plate with convective cooling at

upper and lower surfaces, International Journal of Thermal Sciences, vol. 50(11):

2198-2204, Nov., 2011.

[78] Yonglu Liu, Xiaobing Luo*, Wei Liu, Experimental research on a honeycomb

microchannel cooling system, IEEE Transactions on Components, Packaging and

Manufacturing Technology, vol. 1(9): 1378-1386, Sep. 2011.

[79] Quan Chen, Xiaobing Luo*, Shengjun Zhou, Sheng Liu, Dynamic junction

temperature measurement for high power light emitting diodes, Review of

Scientific Instruments, vol. 82(8): 084904-084907, Aug.2011.

[80] Xiaobing Luo*, Huai Zheng, Minglu Liu, Sheng Liu, Experimental study on

substrate with hierarchical nested channels for thermal interface resistance control,

Journal of Applied Physics, vol. 109: 103503, May.15, 2011.

[81] Xiaobing Luo*, Zhangming Mao, Jv Liu, Sheng Liu, An analytical thermal

resistance model for calculating mean die temperature of a typical BGA

packaging, Thermochimica Acta, vol. 512(1): 208-216, Jan.10, 2011.

[82] Xiaobing Luo*, Yonglu Liu, Wei Liu, A honeycomb microchannel cooling

system for microelectronics cooling, Heat Transfer Engineering, vol. 32(7-8):

616-623, 2011.

[83] Xiaobing Luo*, Bulong Wu, Sheng Liu, Effects of moist environments on LED

module reliability, IEEE Transactions on Device and Materials Reliability, vol.

10(2): 182-186, Jun. 2010.

[84] Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobing Luo*, A

micro-machined Pirani gauge for vacuum measurement of ultra-small sized

vacuum packaging, Sensors and Actuators A: Physical, vol. 161(1): 108-113, Jun.

2010.

[85] Yanyan Xi, Xiaobing Luo*, Wenming Liu, Mingxiang Chen, Sheng Liu, Study

on localized induction heating for wafer level packaging, Science China

Technological Sciences, vol. 53(3): 800-806, Mar., 2010.

[86] Ting Cheng, Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis and

optimization of multiple LED packaging based on a general analytical solution,

International Journal of Thermal Sciences, vol. 49(1): 196-201, Jan. 2010.

[87] Xiaobing Luo*, Wei Xiong, Ting Cheng, Sheng Liu, Temperature estimation of

high-power light emitting diode street lamp by a multi-chip analytical solution,

IET Optoelectronics, vol. 3(5): 225-232, Oct. 2009.

[88] Sheng Liu, Jianghui Yang, Zhiyin Gan, Xiaobing Luo*, Structural optimization

of a microjet based cooling system for high power LEDs, International Journal of

Thermal Sciences, vol. 47(8): 1086-1095, Aug., 2008.

[89] Xiaobing Luo, Wei Chen, Renxia Sun, Sheng Liu, Experimental and numerical

investigation of a microjet-based cooling system for high power LEDs, Heat

Transfer Engineering, vol. 29(9): 774-781, 2008.

[90] Xiaobing Luo*, Ting Cheng, Wei Xiong, Zhiyin Gan, Sheng Liu, Thermal

analysis of an 80 W light-emitting diode street lamp, IET Optoelectronics, vol.

1(5): 191-196, Oct.2007.

[91] Xiaobing Luo, Sheng Liu, A microjet array cooling system for thermal

management of high-brightness LEDs, IEEE Transactions on Advanced

Packaging, vol. 30(3): 475-484, Aug., 2007.

[92] Xiaobing Luo, Sheng Liu, Xiaoping Jiang, Ting Cheng, Experimental and

numerical study on a micro jet cooling solution for high power LEDs, Science in

China Series E: Technological Sciences, vol. 50(4): 478-489, Aug., 2007.

[93] Xiaobing Luo*, Hyejung Cho, Valveless small gas pump, Nanoscale and

Microscale Thermophysical Engineering, vol. 10(2): 83-94, Apr.-Jun., 2006.

[94] Xiaobing Luo, Zhixin Li, Zengyuan Guo, Yongjun Yang, Study on linearity of a

micromachined convective accelerometer, Microelectronic Engineering, vol.

65(1): 87-101, Jan. 2003.

[95] Xiaobing Luo, Zhixin Li, Zengyuan Guo, Yongjun Yang, Thermal optimization

on micromachined convective accelerometer, Heat and Mass Transfer, vol.

38(7-8): 705-712, Aug. 2002.

[96] Xiaobing Luo, Yongjun Yang, Feng Zheng, Zhixin Li, Zengyuan Guo, An

optimized micromachined convective accelerometer with no proof mass, Journal

of Micromechanics and Microengineering, vol. 11(5): 504, Sep., 2001.

国内杂志文章(*通讯作者)

[97] 余兴建，舒伟程，胡润，谢斌，罗小兵*，高出光品质 LED 封装：现状及进

展，中国科学：科学技术，2017,47 （综述）

[98] 朱永明，谢斌，罗小兵*，量子点 LED 封装的进展和展望，科学通报，62（7）：

659-673，2017（综述）

[99] 陈奇，陈全，罗小兵*，高温下荧光粉层的位置对 LED 光效衰减的影响，科

学通报，vol. 62(12):1302-1306, 2017

[100] 马预谱,胡锦炎,陈奇,罗小兵*,金属材料增强的石蜡储热性能研究,工程热

物理学报,vol.37(10):2196-2201, 2016.

[101] 陈程，朱永明，谢斌，罗小兵*，紧凑型液冷散热器的实验研究，工程热

物理学报，vol.37(9):1956-1960, 2016.

[102] 袁超, 段斌, 李岚，罗小兵*. 热界面材料热导率和接触热阻的测试,化工

学报, Vol. 66(S1), pp:349-353, 2015.

[103] 商博锋, 郭庭辉, 罗小兵*. 液冷服性能参数的数值模拟研究,工程热物理

学报, Vol.36(8), pp:1760-1763, 2015.

[104] 余兴建，郑怀，李岚，罗小兵*，高功率 LED 荧光粉胶涂覆流动铺展的

实验研究，工程热物理学报，Vol.36(5), pp:1096-1100, 2015.

[105] 陈奇，陈全，罗小兵*，加速可靠性试验中 LED 寿命的快速评估，工程

热物理学报，Vol.35(3), pp:554-556, 2014

[106] 李岚，郑怀，罗小兵*，大功率 LED 荧光粉硅胶点涂工艺的三维 LBM 模

拟，应用数学和力学学报，Vol.35(3), pp:264-271, 2014

[107] 郭庭辉，段斌，罗小兵*，微型泵的三维数值模拟与实验研究，工程热物

理学报，Vol.34 (12), pp:2355-2358, 2013

[108] 胡锦炎，付星，罗小兵*，石蜡/膨胀石墨储热基板的实验研究，工程热

物理学报，Vol.34(8), pp:1511-1514, 2013

[109] 袁超, 付星, 罗小兵*. 含有热界面材料的界面热阻模型, 工程热物理学

报, Vol.34(4), pp: 746-750, 2013

[110] 陈剑楠，邹颙，罗小兵*，基于 CMY 模型改进的界面热阻模型及其应用，

工程热物理学报，Vol.33,No.3,509-512, 2012

[111] 刘川，汪学方，罗小兵*，基于热学理论的微型真空检测器件的研究，工

程热物理学报，Vol.32 (9):1553-1556, 2011

[112] 胡润，朱晓磊，郭庭辉，罗小兵*，小型平板蒸汽腔的实验研究，工程热

物理学报，Vol.32 (4):637-640, 2011

[113] 毛章明, 罗小兵*, 刘菊, 刘胜. 一种用于计算典型塑料 DIP 芯片平均温

度的热阻网络模型. 工程热物理学报，Vol. 32（2）：303-307，2011

[114] 罗小兵*，杨江辉，刘胜，温度和湿度对 LED 可靠性的影响及其机制分

析，半导体光电，Vol. 30 (3): 366-370，2009

[115] 罗小兵*，杨江辉，甘志银，刘胜，高功率 LED 用微喷冷却系统的分析

和优化，工程热物理学报，Vol. 29 (11): 1909-1914，2008

[116] 陈伟，罗小兵*，程婷，黄素逸，刘胜, 用于大功率 LED 散热的封闭微

喷射流冷却系统的实验研究, 半导体光电 , vol. 28 (4): 478-481, 2007

[117] 程婷，罗小兵*，黄素逸，刘胜，基于一种微通道散热器的散热实验研

究，半导体光电，vol.28 (6): 822-824，2007

国际会议文章（*通讯作者）

[118] Y.P. Ma, B.F. Shang, R. Hu and X.B. Luo*, Thermal management of

downhole electronics cooling in oil & gas well logging at high temperature, The

17th International Conference on Electronic Packaging Technology (2016), pp:

623-627

[119] X.J. Yu, F.L. Liu, Y.P. Ma, M.Y. Huang and X.B. Luo*, A remote phosphor

coating by lens wetting for phosphor-converted white light-emitting diodes, The

17th International Conference on Electronic Packaging Technology (2016), pp:

628-631

[120] M.Y. Huang, C. Yuan, X.J. Yu, R.K. Wu and X.B. Luo*, Simulation of

droplet spreading process on heterogeneous striped surface by lattice Boltzmann

method, The 17th International Conference on Electronic Packaging Technology

(2016), pp: 632-635

[121] Q. Chen, R. Hu, J.Y. Hu, B. Xie, X.J. Yu and X.B. Luo*, Experimental study

of measuring LED's temperatures via thermocouple, The 17th International

Conference on Electronic Packaging Technology (2016), pp: 880-883

[122] Chao Yuan, Mengyu Huang, Yupu Ma, Xiaobing Luo*, Locally reinforced

polymer-based composites for efficient heat dissipation of multiple heat sources,

2016 China Semiconductor Technology International Conference (CSTIC), 2016:

1-3, DOI:10.1109/CSTIC.2016.7463964

[123] Qi Chen, Run Hu, Bin Xie, Xingjian Yu, Jingjing Cheng and Xiaobing Luo*,

Effect study of silicone amount on the lumen maintenance of high power LED

under accelerated stress test, 15th IEEE ITHERM Conference, Las Vegas, USA,

pp:836-840, 2016

[124] Run Hu, Bin Xie, Qi Chen, Jingjing Cheng and Xiaobing Luo*, Carpet

Thermal Cloak Realization with layered thermal metamaterials: Theory and

Experiment, 15th IEEE ITHERM Conference, Las Vegas, USA,

pp:1122-1125,2016

[125] Cheng Chen, Run Hu, Xiaobing Luo*, Experimental and numerical study of

a water-stirring radiator, 15th IEEE ITHERM Conference, Las Vegas, USA,

pp:610-613,2016

[126] Bin Duan, Tinghui Guo,Mingqing Luo, Xiaobing Luo*, Design, fabrication

and Characterization of a Mechanical Micropump，InterPACKICNMM 2015, San

Francisco, InterPACKICNMM2015-48017,2015

[127] Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo*, Intrinsic Thermal

Conductivity of Wurtzite AlxGa1-xN, InxGa1-xN and InxAl1-xN from

first-principles calculation, InterPACKICNMM2015, San Francisco,

InterPACKICNMM2015-48032,2015

[128] Qi Chen, Run Hu, Yiman Wang, Huai Zheng, Xiaobing Luo*, A Method to

Eliminate the Effect of Phosphor Sedimentation on LED's Angular Color Unifor

mity, InterPACKICNMM2015, San Francisco, InterPACKICNMM2015-48023,

2015

[129] M.Y. Huang, L. Li, C. Yuan, B. Xie, X.J. Yu and X.B. Luo*, "Simulation of

Stamp-printed Coating Process in Light-emitting Diodes Packaging by Lattice

Boltzmann Method", The 16th International Conference on Electronic Packaging

Technology (2015),pp:1066-1069

[130] B.F. Shang, B. Xie, X.J. Yu, Q. Chen and X.B. Luo*, "An Improved

Substrate Structure for High Angular Color Uniformity of White Light-emitting

diodes with Conventional Chips", The 16th International Conference on

Electronic Packaging Technology (2015), pp:1094-1097

[131] Y.M. Zhu, J.Y. Hu, R. Hu, B. Duan and X.B. Luo*, "Thermal Model of

Phosphor Self-Heating in Phosphor-Converted Light-Emitting Diodes", The 16th

International Conference on Electronic Packaging Technology (2015), pp:

1090-1093

[132] X.J. Yu, B.F. Shang, B. Xie, M.Y. Huang and X.B. Luo*, "Spreading

Behaviors of Silicone Droplet Impact on Flat Solid Surface: Experiments and

VOF Simulations", The 16th International Conference on Electronic Packaging

Technology, pp:1058-1061, 2015

[133] B. Xie, Q. Chen, X.J. Yu, B.F. Shang, M.Y. Huang and X.B. Luo*,

"Experimental Study of Chip Offset on the Packaging Consistency of High Power

Light-Emitting Diodes", The 16th International Conference on Electronic

Packaging Technology, pp:1062-1065, 2015

[134] Lan Li, Huai Zheng, Chao Yuan, Xingjian Yu, Xiaobing Luo*, Three

dimensional simulation of phosphor dispensing process in light emitting diode

packaging by lattice Boltzmann method, the 15th International Heat Transfer

Conference, Kyoto, Japan, August 10-15, 2014.

[135] Chao Yuan, Lan Li, Xiaobing Luo*, Heat conduction optimization of

anisotropic composite material using simulated annealing algorithm, the 15th

International Heat Transfer Conference, Kyoto, Japan, August 10-15, 2014.

[136] Xiang Lei, Huai Zheng, Xiaobing Luo, ShengLiu, Inhibition of phosphor

sedimentation for white light-emitting diodes with a facilely realizable and

economical method, 15th International Proceedings of the Electronic Packaging

Technology Conference, p 1468-1471, October 13, 2014

[137] Yongming Zhu, Run Hu, Jinyan Hu, Xiaobing Luo*, Compact thermal

model of double-layer microchannel heat sink with high temperature uniformity

for multiple LEDs, 15th International Proceedings of the Electronic Packaging

Technology Conference, p 1456-1463, October 13, 2014

[138] Qi Chen, Quan Chen, Run Hu, Xiaobing Luo*, Is thermal management

outside the package enough for higher LED reliability?, 15th International

Proceedings of the Electronic Packaging Technology Conference, p 1068-1070,

October 13, 2014

[139] Lan Li, Chao Yuan, Run Hu, Huai Zheng, Xiaobing Luo*, Study on the

effect of the phosphor distribution on the phosphor layer temperature in light

emitting diodes by lattice Boltzmann method, 15th International Proceedings of

the Electronic Packaging Technology Conference, p 671-675, October 13, 2014

[140] Jinyan Hu, Tinghui Guo, Yongming Zhu, Run Hu, Xiaobing Luo*, Effect of

melting temperature and amount of the phase change material (PCM) on thermal

performance of hybrid heat sinks, Ting Cheng, 15th International Proceedings of

the Electronic Packaging Technology Conference, p 48-52, October 13, 2014

[141] Run Hu, Chao Yuan, Xiaobing Luo*, Ting Cheng, Sheng Liu, Calculation

of effective thermal conductivity of silicone matrix embedded with particulate

phosphors in white led packages by 2D/3D unit cell method, 15th International


October 13, 2014

[142] Huai Zheng, Zhili Zhao, Yiman Wang, Lang Li, Sheng Liu, Xiaobing Luo*,

Effect of patterned substrate on light extraction efficiency of chip-on-board

packaging LEDs, the 64th Electronic Components and Technology

Conference(ECTC), p1876-1879, September 11, 2014

[143] Qi Chen, Quan Chen, Xiaobing Luo*, Fast estimation of LED’s accelerated

lifetime by online test method, the 64th Electronic Components and Technology

Conference(ECTC), p1992-1995, September 11, 2014

[144] Bin Duan, Tinghui Guo, Minqing Luo, Xiaobing Luo*, A mechanical

micropump for electronic cooling, 14th Proceedings of the Intersociety

Conference on Thermomechanical Phenomena in Electronic Systems, p

1038-1042, September 4, 2014

[145] Jinyan Hu, Run Hu, Xiaobing Luo*, Phase change material based heat sinks

and its geometry optimization for heat transfer enhancement, 14th Proceedings of

the Intersociety Conference on Thermomechanical Phenomena in Electronic

Systems, p 876-881, September 4, 2014

[146] Huai Zheng, Yiman Wang, Lan Li, Xiaobing Luo*, Mechanism investigation

on die tilt in die attach process based on minimal free energy theory,

Proceedings of the Intersociety Conference on Thermomechanical Phenomena in

Electronic Systems, p 1251-1255, September 4, 2014

[147] Run Hu, Jinyan Hu, Xiaobing Luo*, Phosphor temperature reduction by

optimizing the phosphor configuration in white light-emitting diode package,

Proceedings of the Intersociety Conference on Thermomechanical Phenomena in

Electronic Systems, p 182-185, September 4, 2014

[148] Xiaobing Luo*, Zhangming Mao, Experimental investigation on the

minichannel cold plate for high temperature uniformity based on a compact

thermal model, ASME 2013 11th International Conference on Nanochannels,

Microchannels and Minichannels, ICNMM 2013

[149] Run Hu, Tinghui Guo, Xiaolei Zhu, Sheng Liu, Xiaobing Luo*, A small

flat-plate vapor chamber fabricated by copper powder sintering and diffusion

bonding for cooling electronic packages, the 63th Electronic Components and

Technology Conference(ECTC), p 2280-2285, 2013

[150] Bimrew Tamrat, Xiaobing Luo*, Jiawei Yao, Tingzhen Ming, Effects of

non-uniform hot junction temperature distribution on the outputs of

thermoelectric power generation system, Applied Mechanics and Materials, v 283,

p 87-97, 2013

[151] Huai Zheng, Yiman Wang, Xing Fu, Xiaobing Luo*, Sheng Liu,

Conformal phosphor coating for phosphor-converted white LEDs on basis of

dispensing process, 14th International Proceedings of the Electronic Packaging

Technology Conference, p 1138-1141, 2013

[152] Xing Fu, Xiaobing Luo*, Junction temperature estimation for multiple light

emitting diodes based on surface point measurement, 14th International


2013

[153] Huai Zheng, Yiman Wang, Xiaobing Luo*, Ling Xu, Sheng Liu, Effect of

die shape on die tilt in die attach process, Proceedings - 2013 14th International

Conference on Electronic Packaging Technology, ICEPT 2013, p 651-655, 2013,

Proceedings - 2013 14th International Conference on Electronic Packaging

Technology, ICEPT 2013

[154] Bimrew Tamrat, Xiaobing Luo*, Effects of thermal contact resistance and

thomson heating on the outputs of solar thermoelectric power generation system,

Proceedings - 2013 14th International Conference on Electronic Packaging

Technology, p 1260-1263, 2013

[155] Run Hu, Yiman Wang, Xiaobing Luo*, Xuebin Zhang, Liang Yang, Light

extraction efficiency enhancement of white LEDs by bi-layer phosphor

configuration, 14th International Proceedings of the Electronic Packaging


[156] Run Hu, Zhiqiang Gan, Xiaobing Luo*, Design of double freeform-surface

lens by distributing the deviation angle for light-emitting diode uniform

illumination, 14th International Proceedings of the Electronic Packaging


[157] Xing Fu, Zhangming Mao, Xiaobing Luo*, System packaging of thousands

watt high power LEDs with heat pipe-fin air cooling system: Design and

manufacturing, 14th International Proceedings of the Electronic Packaging


[158] Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo*, A method

to design freeform lens for uniform illumination in direct-lit led backlight with

high distance-height ratio, 13th International Proceedings of the Electronic

Packaging Technology Conference, p 1474-1478, 2012

[159] Huai Zheng, Xing Fu, Run Hu, Sheng Liu, Xiaobing Luo*, Angular color

uniformity improvement for phosphor-converted white light-emitting diodes by

optimizing remote coating phosphor geometry, 13th International Proceedings of

the Electronic Packaging Technology Conference, p 1483-1486, 2012

[160] Run Hu, Zhili Zhao, Sheng Liu, Xiaobing Luo*, Robustness of point light

source approximation in lens design for light-emitting diode packages, 13th

International Proceedings of the Electronic Packaging Technology Conference, p

1455-1458, 2012

[161] Xing Fu, Huai Zheng, Sheng Liu, Xiaobing Luo*, Optical study of phosphor

converted light emitting diodes with given correlated color temperatures, 13th


1479-1482, 2012

[162] Fu’An Li, Xingguo Cheng, Sheng Liu, Xiaobing Luo*, Air gap design of

current sensor based on closed loop Hall Effect, 14th International Conference on

Electronic Materials and Packaging, 2012

[163] Huai Zheng, Xing Fu, Bulong Wu, Sheng Liu, Xiaobing Luo*, A method for

geometry control of phosphor layer in high-power white LEDs by package

structure, 14th International Conference on Electronic Materials and Packaging,

2012

[164] Fuan Li, Xiaobing Luo*, Xingguo Cheng, Sheng Liu, Impact of the

winding area of enameled wire on packaging performance of a closed loop Hall

effect current sensor, the 62th Electronic Components and Technology

Conference(ECTC), p 1631-1635, 2012

[165] Run Hu, Zhangming Mao, Huai Zheng, Quan Chen, Sheng Liu, Xiaobing

Luo*, A compact thermal model to predict the junction temperature of high

power light emitting diode package, the 62th Electronic Components and

Technology Conference(ECTC), p 1781-1785, 2012

[166] Huai Zheng, Jinlong Ma, Xiaobing Luo*, Sheng Liu, Precise model of

phosphor geometry formed in dispensing process of LED packaging, 12th


1077-1080, 2011

[167] Zhimin Wan, Ling Xu, Yang Zhang, Xiaobing Luo*, Mingxiang Chen,

Junjie Chen, Sheng Liu, Thermal analysis and improvement of high power

electronic packages, 12th International Proceedings of the Electronic Packaging


[168] Run Hu, Xiaobing Luo*, Sheng Liu, Effect of the amount of phosphor

silicone gel on optical property of white light-emitting diodes packaging, 12th


1081-1084, 2011

[169] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Thermal stress analysis of PBGA

under natural convection using a fluid-solid coupling method, 12th International


2011

[170] Bulong Wu, Xiaobing Luo*, Zhili Zhao, Sheng Liu, Effect investigation of

delamination on optical output of high power LEDs, 12th International


2011

[171] Xiaobing Luo*, Han Feng, Jv Liu, Ming Lu Liu, Sheng Liu, An

experimental investigation on thermal contact resistance across metal contact

interfaces, 12th International Proceedings of the Electronic Packaging Technology

Conference, p 733-738, 2011

[172] Quan Chen, Xiaobing Luo*, Run Chen, Sang Wang, Zhaohui Chen, Sheng

Liu, Junction temperature study during degradation process of high power

light-emitting diodes, 12th International Proceedings of the Electronic Packaging


[173] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Effect of blind hole depth and

shape of solder joint on the reliability of through silicon via (TSV), the 61th

Electronic Components and Technology Conference(ECTC), p 1657-1661, 2011

[174] Zhangming Mao, Xiaobing Luo*, Sheng Liu, Compact thermal model for

microchannel substrate with high temperature uniformity subjected to multiple

heat sources, the 61th Electronic Components and Technology


[175] Bulong Wu, Xiaobing Luo*, Sheng Liu, Effect mechanism of moisture

diffusion on LED reliability, Electronics System Integration Technology

Conference, ESTC 2010

[176] Chuan Liu, Xiaobing Luo*, Zhuo Zhang, Xuefang Wang, Sheng Liu, A hot

platinum thin film anemometer, 11th International Proceedings of the Electronic

Packaging Technology Conference, p 1297-1301, 2010

[177] Zhangming Mao, Xiaobing Luo*, Janghui Yang, Sheng Liu, Moisture

diffusivity analysis of polycarbonate for LED lens, 11th International Proceedings

of the Electronic Packaging Technology Conference, p1080-1087, 2010

[178] Zhimin Wan, Xiaobing Luo*, Sheng Liu, Thermal stress analysis of PBGA

using a fluid-solid coupling method under steady convective heat transfer, 11th


525-529, 2010

[179] Ju Liu, Han Feng, Xiaobing Luo*, Run Hu, Sheng Liu, A simple setup to

test thermal contact resistance between interfaces of two contacted solid materials,

11th International Proceedings of the Electronic Packaging Technology

Conference, p 116-120, 2010

[180] Xiaobing Luo*, Zhangming Mao, Sheng Liu, Thermal design of a 16W LED

bulb based on thermal analysis of a 4W LED bulb, the 60th Electronic

Components and Technology Conference(ECTC), p1906-1911, 2010

[181] Kai Wang, Zhangming Mao, Zongyuan Liu, Fei Chen, Hao Chen, Xiaobing

Luo, Sheng Liu, An application specific LED packaging module integrated with

optical, cooling and powering functions, the 60th Electronic Components and

Technology Conference(ECTC), p686-692, 2010

[182] Xiaobing Luo*, Run Hu, Tinghui Guo, Xiaolei Zhu, Wen Chen, Zhangming

Mao, Sheng Liu, Low thermal resistance LED light source with vapor chamber

coupled fin heat sink, the 60th Electronic Components and Technology


[183] Yonglu Liu, Xiaobing Luo*, Wei Liu, Cooling behavior in a novel heat sink

based on multilayer staggered honeycomb structure, Proceedings of the ASME

Micro/Nanoscale Heat and Mass Transfer International Conference 2009, v 3, p

131-135, 2010

[184] Yonglu Liu, Xiaobing Luo*, Wei Liu, Experimental study on a honeycomb

micro channel cooling system, Proceedings of the 7th International Conference

on Nanochannels, Microchannels, and Minichannels, nPART A, p 267-272, 2009

[185] Yonglu Liu, Xiaobing Luo*, Wei Liu, Zhifeng Huang, Thermal

performance of the multilayered honeycomb microchannel heat sink, 2009

International Conference on Energy and Environment Technology, v 1, p 487-490,

2009

[186] Xiaobing Luo*, Yonglu Liu, Wei Liu, A honeycomb micro channel cooling

system for electronics cooling, Proceedings of the 7th International Conference

on Nanochannels, Microchannels, and Minichannels, n PART A, p 261-265, 2009

[187] Xiaobing Luo*, Zhangming Mao, Sheng Liu, A thermal model for

calculating thermal resistance of eccentric heat source on rectangular plate with

convective cooling existing at upper and lower surfaces, 10th International


2009

[188] Xiaobing Luo*, Wei Xiong, Ting Cheng, Sheng Liu, Design and

optimization of horizontally-located plate fin heat sink for high power LED street

lamps, the 59th Electronic Components and Technology Conference(ECTC), p

854-859, 2009

[189] Ting Cheng, Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis

and optimization of multiple LED packaging based on a general analytical

solution, the 59th Electronic Components and Technology Conference(ECTC), p

1988-1993, 2009

[190] Ting Cheng, Wei Xiong, Xiaobing Luo*, Suyi Huang, Zhiyin Gan, Sheng

Liu, Thermal management of a multi-core master processing unit (MPU) for an

ultrascalable computing platform, 9th International Proceedings of the Electronic

Packaging Technology Conference,2008

[191] Ting Cheng, Xiaobing Luo*, Suyi Huang, Zhiyin Gan, Sheng Liu,

Simulation on thermal characteristics of LED chips for design optimization, 9th

International Proceedings of the Electronic Packaging Technology Conference,

2008

[192] Xiaobing Luo*, Wei Xiong, Sheng Liu, A simplified thermal resistance

network model for high power LED street lamp, 9th International Proceedings of

the Electronic Packaging Technology Conference, 2008

[193] Xiaobing Luo*, Sheng Liu, A closed micro jet cooling system for high

power LEDs, 7th International Proceedings of the Electronic Packaging

Technology Conference, 2006

Documents

罗小兵个人简历tpl.energy.hust.edu.cn/__local/1/E3/10/5FD487B263F... · 罗小兵个人简历 _____ 武汉市洪山区珞瑜路1037 号， Tel: 86-27-87542418 (Office) 华中科技大学能源与动力工程学院，430074

罗小兵个人简历tpl.energy.hust.edu.cn/local/1/E3/10/5FD487B263F... · 罗小兵个人简历 ___ 武汉市洪山区珞瑜路1037 号， Tel: 86-27-87542418 (Office) 华中科技大学能源与动力工程学院，430074