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1 1 Ch11 Metallization Introduction to Semiconductor Processing 2 P-Epi P-Wafer Metal 3 Al•Cu Alloy IMD 3 USG Metal 4 Al•Cu USG Silicon Nitride Al•Cu Alloy N-Well P-Well BPSG n + n + p + p + STI USG W Al•Cu Alloy USG M1 M2 Al•Cu USG W IMD 1 IMD 2 TiSi 2 Ti TiN ARC W Ti/TiN Ti/TiN Sidewall Spacer, USG PMD Barrier Nitride IMD 3 Passivation 1 Passivation 2 PMD CMP PSG, W CMP USG, W CMP USG, W CMP USG W CMP USG

Ch11 Metallization

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Microsoft PowerPoint - Ch11_Metallization.pptAl•Cu USG
W
Metal:
3
5

• _______________
6



1.6 µ⋅cm 1.7 µ⋅cm Gold silver 2.2 µ⋅cm 2.65 µ⋅cm
1970
4
7

Al-Cu (0.5%)

Ar

- V

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t w I L
I V, : R = V/I = ρL/(wt) , L = w, R = ρ/t = Rs Rs: (/ )
7
13

Ti (______)
PSG
RF
, 2 WF6 + 3 Si -> 2 W (s) + 3 SiF4 WF6 + 3 H2 -> W (s) + 6 HF
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FSG Cu