Upload
lamtu
View
248
Download
0
Embed Size (px)
Citation preview
Chip Beads & Inductors
Chip Ferrite Beads 48
Chip Ferrite Beads Arrays 69
Chip Giga Ferrite Beads 72
Chip Ferrite Inductors 75
Chip Power Inductors 79
www.sam
wha.com
Chip B
eads &
Inductors
48
IntroductionSAMWHA’s CB, CBA, CM, CPI series of chip components consist of compact, high performancebeads and inductors. Their innovative components and case structures mean low DC resistance andoutstanding high frequency characteristics. These series are designed for a variety of applications,facilitating component selection for individual circuit requirements.
Products Guide
Chip Beads & Inductors
Product Name Application Material Part NumberImpedance /
DimensionsInductance Range
CB GA 10~2000Ω
CB GK 10~2000Ω
CB GM 5~1000Ω
CB GV 5~1000Ω
CB PA 5~600Ω
CB PK 5~600Ω
CB PM 5~300Ω
CB UA 5~120Ω
CB UM 5~120Ω
CBA GA 30~1000Ω
CBA GK 30~1000Ω
CBA GM 30~1000Ω
CBA GV 30~1000Ω
Chip FerriteSignal Line Ferrite(F) CM F 0.047~33μH
Inductors
Chip Power Low DCR Use(L) Ferrite + CPI LZ 0.1~4,.7μH
Inductors High Ldc Use(H) Ceramic(Z) CPI HZ 0.1~10μH
1005
1608
2012
3216
General
Frequency(A)
Medium
Frequency(K, J)
High Frequency(M)
Very High
Frequency(V)
A
K, J
M
V
Signal Line
Ultra Power
Signal line(U)
Power
Signal line(P)
Signal line(G)
Chip Ferrite Beads
Chip Ferrite
Beads Array
1608
2012
3216
2012
3216
3216
1608
2012
2016 2520
3216 3225
Chip Beads & Inductors 49
Series Dimension
CB 1608 G A 102 T CM 1608 F R22 K T
CBA 3216 G A 102 N4 E CPI 2520 L Z 4R7 M E
How to Order(Product Identification)
Mark Product Name
CB Chip Ferrite Beads
CBA Chip Ferrite Beads Array
CM Chip Ferrite Inductors
CPI Chip Power Inductors
Mark Dimension Mark Dimension
1005 1.0 mm×0.5 mm 1608 1.6 mm×0.8 mm
2012 2.0 mm×1.25 mm 2016 2.0 mm×1.60 mm
2520 2.5 mm×2.0 mm 3216 3.2 mm×1.6 mm
3225 3.2 mm×2.5 mm
Applications
Mark Applications
G Signal Line
P High Power Line
U Ultra High Power Line
L Low DCR Type
H High Ldc Type
Material Impedance
Mark Material
A General Frequency
K, J Medium Frequency
M High Frequency
V Very High Frequency
F Ferrite
Z Ferrite + Ceramic
Inductance Tolerance
Mark Tolerance
K ±10 %
M ±20 %
N ±30 %
Packaging Code
Mark Packaging
T Tape & Reel Pack
E Embossed Tape Pack
Inductance
300 = 30Ω201 = 200Ω601 = 600Ω102 = 1000Ω
R22 = 0.22μH 2R2 = 2.2μH 4R7 = 4.7μH 100 = 10μH
Number of Circuits
N4 = 4 array
Chip Beads & Inductors
50
FeaturesVarious size(1005~4532)High impedance characteristics Low Rdc, High Current characteristicsGood reliability(Monolithic structure)Magnetically shieldedFast mounting speed RoHS compliant
ApplicationsHigh frequency noise removal of digital equipmentPDP/LCD Monitor, Digital TV/VCR etc.
Chip Ferrite Beads
Size L W T B1005 1.0±0.10 0.5±0.10 0.5±0.10 0.25±0.1
16081.6±0.15 0.8±0.15
0.8±0.150 . 3 0± 0 . 2
1608S 0.6±0.15
2012 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.31.25±0.2
3216 3.2±0.20 1.6±0.20 1.1±0.20 0.50±0.3
4516 4.5±0.25 1.6±0.20 1.3±0.20 0.50±0.3
4532 4.5±0.25 3.2±0.25 1.3±0.20 0.50±0.3
CB 1608 G A 102 T
How to Order(Product Identification)
Temperature Range
Typical Material Characteristics
Series Code
CB : Chip Ferrite Beads
Dimension Code
The first two digits : Length(mm)
The last two digits : Width(mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
(Unit : mm)
Shape & Dimensions
www.sam
wha.com
Chip B
eads &
Inductors
Operating Temp. -55 ~ +125Storage Temp. -55 ~ +125(After Mounting)
Chip Beads & Inductors 51
Specifications
1005 SIZE for Signal Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB1005GA100 10 0.05 1000
CB1005GA200 20 0.10 900
CB1005GA300 30 0.10 900
CB1005GA600 60 0.20 600
CB1005GA121 120 0.25 500
CB1005GA221 220 0.30 500
CB1005GA301 300 0.45 400
CB1005GA601 600 0.60 400
CB1005GA102 1000 1.00 200
CB1005GK300 30 0.10 900
CB1005GK600 60 0.20 600
CB1005GK800 80 0.20 600
CB1005GK121 120 0.30 500
CB1005GK221 220 0.35 500
CB1005GK301 300 0.45 400
CB1005GK471 470 0.55 300
CB1005GK601 600 0.60 300
CB1005GK102 1000 0.95 250
CB1005GM300 30 0.20 600
CB1005GM600 60 0.20 600
CB1005GM121 120 0.30 500
CB1005GV080 8 0.10 500
CB1005GV320 32 0.25 500
CB1005GV470 47 0.30 400
CB1005GV600 60 0.30 400
CB1005GV750 75 0.35 300
CB1005GV121 120 0.55 300
CB1005GV221 220 0.80 200
Chip Ferrite Beads
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Material Code
A : General Frequency
K, J : Medium Frequency
M : High Frequency
V : Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 121 = 120(Ω)
Packaging Code
T : Reel Paper Packaging
E : Reel Embossed Tape Packaging
100
52
Electrical Characteristics
www.sam
wha.com
Chip B
eads &
Inductors
Chip Beads & Inductors 53
Specifications
1608 SIZE for Signal Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)CB1608GA100 10 0.05 1000
CB1608GA180 18 0.05 1000
CB1608GA200 20 0.05 1000
CB1608GA300 30 0.05 1000
CB1608GA600 60 0.10 800
CB1608GA121 120 0.15 600
CB1608GA151 150 0.20 500
CB1608GA221 220 0.30 400
CB1608GA301 300 0.35 400
CB1608GA451 450 0.40 400
CB1608GA471 470 0.40 400
CB1608GA601 600 0.50 300
CB1608GA102 1000 0.70 250
CB1608GJ300 30 0.70 1000
CB1608GJ600 60 0.80 800
CB1608GJ121 120 0.20 500
CB1608GK300 30 0.07 1000
CB1608GK600 60 0.09 800
CB1608GK101 100 0.15 600
CB1608GK121 120 0.15 600
CB1608GK221 220 0.20 500
CB1608GK301 300 0.30 400
CB1608GK471 470 0.40 400
CB1608GK601 600 0.40 400
CB1608GK102 1000 0.50 400
CB1608GK202 2000 1.00 200
CB1608GK252 2500 1.50 150
CB1608GM300 30 0.07 1000
CB1608GM470 47 0.08 900
CB1608GM600 60 0.09 800
CB1608GM800 80 0.10 700
CB1608GM121 120 0.12 500
CB1608GM151 150 0.15 500
CB1608GM221 220 0.20 500
CB1608GM301 300 0.30 400
CB1608GM471 470 0.40 400
CB1608GM601 600 0.50 400
CB1608GM102 1000 0.60 300
CB1608GM222 2200 0.85 200
CB1608GV100 10 0.05 1000
CB1608GV300 30 0.10 700
CB1608GV600 60 0.10 700
CB1608GV121 120 0.25 500
CB1608GV151 150 0.30 400
CB1608GV221 220 0.40 400
Chip Ferrite Beads
100
※Measuring Equipment : Z - HP4291B / E4991A Rdc - HP4338B
54
Electrical Characteristics
www.sam
wha.com
Chip B
eads &
Inductors
Chip Beads & Inductors 55
Electrical Characteristics
Chip Ferrite Beads
56
Specifications
1005 & 1608 SIZE for Power Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB1005PK100 10 0.05 1000
CB1005PA121 120 0.25 800
CB1608PA100 10 0.05 2000
CB1608PA300 30 0.05 2000
CB1608PA600 60 0.08 1500
CB1608PA800 80 0.08 1500
CB1608PA121 120 0.10 800
CB1608PA181 180 0.09 1500
CB1608PA221 220 0.20 1000
CB1608PA301 300 0.30 900
CB1608PA501 500 0.40 600
CB1608PA601 600 0.40 600
CB1608PK100 10 0.05 2000
CB1608PK300 30 0.05 2000
CB1608PK600 60 0.08 1500
CB1608PK100 10 0.05 2000
CB1608PK121 120 0.08 1000
CB1608PK181 180 0.12 1000
CB1608PK221 220 0.20 1000
CB1608PK301 300 0.30 900
CB1608PK501 500 0.25 800
CB1608PK601 600 0.25 800
CB1608PJ300 30 0.05 2000
CB1608PJ600 60 0.10 1500
CB1608PJ121 120 0.12 1000
CB1608PM300 30 0.06 2000
CB1608PM600 60 0.08 1500
CB1608PM121 120 0.12 800
www.sam
wha.com
Chip B
eads &
Inductors
100
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Beads & Inductors 57
Electrical Characteristics
Chip Ferrite Beads
58
www.sam
wha.com
Chip B
eads &
Inductors
Specifications
2012 SIZE for Signal Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB2012GA150 10 0.010 1000
CB2012GA300 30 0.025 1000
CB2012GA500 50 0.06 600
CB2012GA600 60 0.06 600
CB2012GA121 120 0.10 300
CB2012GA151 150 0.10 300
CB2012GA221 220 0.12 200
CB2012GA301 300 0.15 200
CB2012GA471 470 0.15 200
CB2012GA601 600 0.25 200
CB2012GA102 1000 0.30 200
CB2012GA202 2000 0.50 200 40
CB2012GK150 15 0.02 1000
CB2012GK500 50 0.06 600
CB2012GK121 120 0.10 300
CB2012GK151 150 0.10 300
CB2012GK221 220 0.12 300
CB2012GK301 300 0.15 300
CB2012GK471 470 0.25 300
CB2012GK601 600 0.25 300
CB2012GK102 1000 0.30 300
CB2012GK202 2000 0.50 300 40
CB2012GJ300 30 0.02 1000
CB2012GJ600 60 0.06 600
CB2012GM300 30 0.02 1000
CB2012GM600 60 0.06 600
CB2012GM800 80 0.08 500
CB2012GM121 120 0.10 300
CB2012GM151 150 0.10 300
CB2012GM221 220 0.12 300
CB2012GM301 300 0.15 300
CB2012GM601 600 0.25 300
CB2012GM102 1000 0.30 300
CB2012GV080 8 0.05 1000
CB2012GV121 120 0.20 300
CB2012GV221 220 0.30 300
100
100
100
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Beads & Inductors 59
Chip Ferrite Beads
Electrical Characteristics
60
www.sam
wha.com
Chip B
eads &
Inductors
Electrical Characteristics
Chip Beads & Inductors 61
Chip Ferrite Beads
Specifications
2012 SIZE for Power Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB2012PA110 11 0.010 3000
CB2012PA300 30 0.02 3000
CB2012PA500 50 0.03 3000
CB2012PA600 60 0.03 3000
CB2012PA800 80 0.03 3000
CB2012PA101 100 0.05 2500
CB2012PA121 120 0.05 2500
CB2012PA221 220 0.05 2000
CB2012PA301 300 0.1 2000
CB2012PA601 600 0.13 1500
CB2012PK150 15 0.020 3000
CB2012PK260 26 0.02 3000
CB2012PK300 30 0.020 3000
CB2012PK600 60 0.030 3000
CB2012PK800 80 0.03 3000
CB2012PK121 120 0.050 3000
CB2012PK151 150 0.05 3000
CB2012PK181 180 0.05 3000
CB2012PK221 220 0.050 2500
CB2012PK301 300 0.06 3000
CB2012PK501 500 0.06 3000
CB2012PK601 600 0.100 2000
CB2012PK102 1000 0.250 1000
CB2012PK202 2000 0.300 500 70
CB2012PJ601 600 0.100 2000
CB2012PJ102 1000 0.300 800
CB2012PM260 26 0.030 4000
CB2012PM600 60 0.030 4000
CB2012PM121 120 0.050 2500
CB2012PM221 220 0.050 2000
CB2012PM301 300 0.07 2000
CB2012PM601 600 0.130 1500
CB2012PM252 2500 0.400 700 70
100
100
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
62
www.sam
wha.com
Chip B
eads &
Inductors
Electrical Characteristics
Chip Beads & Inductors 63
Chip Ferrite Beads
Specifications
3216 SIZE for Signal Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB3216GA330 33 0.02 600
CB3216GA350 33 0.03 600
CB3216GA500 50 0.03 600
CB3216GA600 60 0.04 600
CB3216GA700 70 0.04 600
CB3216GA101 100 0.05 500
CB3216GA121 120 0.10 300
CB3216GA151 150 0.10 300
CB3216GA201 200 0.15 300
CB3216GA301 300 0.20 250
CB3216GA601 600 0.30 200
CB3216GA102 1000 0.40 200
CB3216GK500 50 0.03 600
CB3216GK121 120 0.05 600
CB3216GK151 150 0.05 600
CB3216GK221 220 0.10 300
CB3216GK301 300 0.12 250
CB3216GK471 470 0.15 200
CB3216GK601 600 0.20 200
CB3216GK102 1000 0.25 200
CB3216GM121 120 0.10 300
CB3216GM151 150 0.10 300
CB3216GM201 200 0.15 300
CB3216GM301 300 0.20 250
CB3216GM601 600 0.30 200
CB3216GM102 1000 0.40 200
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
100
64
www.sam
wha.com
Chip B
eads &
Inductors
Electrical Characteristics
Chip Beads & Inductors 65
Chip Ferrite Beads
Specifications
3216 SIZE for Power Line
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB3216PA310 31 0.03 4000
CB3216PA330 33 0.03 4000
CB3216PA350 35 0.03 4000
CB3216PA500 50 0.03 4000
CB3216PA600 60 0.03 4000
CB3216PA700 70 0.03 4000
CB3216PA900 90 0.03 4000
CB3216PA101 100 0.03 3000
CB3216PA121 120 0.04 3000
CB3216PA151 150 0.05 3000
CB3216PA301 300 0.06 3000
CB3216PA391 390 0.06 3000
CB3216PA501 500 0.06 3000
CB3216PA500 50 0.02 4000
CB3216PA121 120 0.03 4000
CB3216PA301 300 0.06 3000
CB3216PA601 600 0.06 3000
CB3216PK501 500 0.06 3000
CB3216PK601 600 0.06 3000
CB3216PJ601 600 0.06 3000
CB3216PM121 120 0.03 3000
CB3216PM601 600 0.06 3000
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
100
66
www.sam
wha.com
Chip B
eads &
Inductors
Electrical Characteristics
Chip Beads & Inductors 67
Chip Ferrite Beads
Ultra Power Line Series
1608~4532 SIZE
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CB1608UA600 60 0.03 4000
CB1608UA101 100 0.03 4000
CB1608UA121 120 0.050 2000
CB1608UA260 26 0.01 6000
CB1608UA260S 26 0.007 6000
CB1608UK500 50 0.030 4000
CB1608UK600 60 0.030 4000
CB2012UA300 30 0.08 5000
CB2012UA600 60 0.015 5000
CB2012UA101 100 0.020 4000
CB2012UA121 120 0.030 5000
CB2012UK400 40 0.02 5000
CB2012UK121 120 0.030 4000
CB2012UJ121 120 0.030 4000
CB2012UM121 120 0.030 4000
CB3216UA300 30 0.02 6000
CB3216UA350 35 0.02 6000
CB3216UA121 120 0.020 6000
CB3216UM600 60 0.010 6000
CB3216UM121 120 0.200 6000
CB4516UM600 60 0.010 6000
CB4532UK121 120 0.02 6000
CB4532UK401 400 0.04 4000
100
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
68
www.sam
wha.com
Chip B
eads &
Inductors
Electrical Characteristics
Chip Beads & Inductors 69
FeaturesGood reliability (Monolithic structure)
Magnetically shielded
Fast mounting speed
RoHS compliant
ApplicationsCD-ROM, DVD, MD Lines
Digital TVs and VTRs
Chip Ferrite Beads Arrays
Shape & Dimensions
Size L W T
3.2±0.2 1.6±0.2 0.9±0.2
3216 B D E
0.3±0.2 0.4±0.15 0.8±0.1
CBA 3216 G A 102 N4 E
How to Order(Product Identification)
Series Code
CBA : Chip Ferrite Beads Array
Dimension Code
The first two digits : Length(mm)
The last two digits : Width(mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
(Unit : mm)
Chip Ferrite Beads Arrays
Temperature Range
Typical Material Characteristics
Operating Temp. -55 ~ +125Storage Temp. -10 ~ +40
70
Specifications
3216 SIZE
Part No. Impedance(Ω)±25% DC Resistance(Ω) Max. Rated Current(mA) Max. Test Frequency(MHz)
CBA3216GA300N4 30 0.10 200
CBA3216GA600N4 60 0.25 200
CBA3216GA121N4 120 0.30 300
CBA3216GA221N4 220 0.35 150
CBA3216GA301N4 300 0.40 100
CBA3216GA471N4 470 0.45 100
CBA3216GA601N4 601 0.50 100
CBA3216GA102N4 100 0.70 50
CBA3216GK600N4 60 0.25 400
CBA3216GK121N4 120 0.30 350
CBA3216GK221N4 220 0.35 250
CBA3216GK301N4 300 0.40 250
CBA3216GK471N4 470 0.50 200
CBA3216GK601N4 600 0.60 200
CBA3216GK102N4 1000 0.75 150
CBA3216GM300N4 30 0.10 200
CBA3216GM600N4 60 0.12 200
CBA3216GM121N4 120 0.20 100
CBA3216GM301N4 300 0.45 100
CBA3216GM471N4 470 0.45 100
CBA3216GM601N4 600 0.50 100
www.sam
wha.com
Chip B
eads &
Inductors
100
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Material Code
A : General Frequency
K, J : Medium Frequency
M : High Frequency
V : Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 121 = 120(Ω)
Number of Circuits
N4 : 4 array
Packaging Code
E : Reel Embossed Tape Packaging
Chip Beads & Inductors 71
Electrical Characteristics
Chip Ferrite Beads Arrays
72
www.sam
wha.com
Chip B
eads &
Inductors
FeaturesHigh impedance characteristics at GHz band
Good reliability (Monolithic structure)
Magnetically shielded
Fast mounting speed
RoHS compliant
ApplicationsPDP/LCD Monitor, DSC, DVC, Set Top Box
Mobile phone
Chip Giga Ferrite Beads
Dimensions
GB 2012 G A 601 T
How to Order(Product Identification)
Series Code
GB : Giga Ferrite Beads
Dimension Code
The first two digits : length(mm)
The last two digits : width(mm)
Application Code
G : Signal Line
P : High Current Line
Material Code Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 601 = 600 (Ω)Package Code
T : Reel paper packaging
E : Reel embossed tape packaging
Size L W T B
1005 1.0±0.1 0.5±0.05 0.5±0.05 0.25±0.1
1608 1.6±0.15 0.8±0.15 0.8±0.15 0.4±0.2
(Unit : mm)
Temperature Range Operating Temp. -55 ~ +125Storage Temp. -55 ~ +125(After mounting)
Chip Beads & Inductors 73
Chip Giga Ferrite Beads
Specifications
1005 SIZE
Part No.Impedance(Ω)±25% Impedance(Ω)±40% DC Resistance(Ω) Rated Current(mA)
@100MHz @1GHz Max. Max.
GB1005GA221 220 420 0.7 200
GB1005GA301 300 560 0.8 200
GB1005GA471 470 1000 1.0 100
GB1005GA102 1000 1700 1.6 100
GB1005GM471 470 1100 0.8 300
GB1005GM601 600 1400 0.85 300
Electrical Characteristics
74
www.sam
wha.com
Chip B
eads &
Inductors
Specifications
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
1608 SIZE
Part No.Impedance(Ω)±25% DC Resistance(Ω)+-40% DC Resistance(Ω) Rated Current(mA)
@100MHz @1GHz Max. Max.
GB1608GA102 1000 1200 ± 40% 1.5 50
GB1608GA152 1200 1000 ± 40% 1.5 50
GB1608GK601 600 1000 (Typ.) 0.8 200
GB1608GK102 1000 1400 (Typ.) 1.0 100
GB1608GM601 600 1200 (Min.) 1.5 100
GB1608GV221 220 1100 ± 40% 0.8 100
GB1608GV471 470 2100 ± 40% 1.2 50
Electrical Characteristics
Chip Beads & Inductors 75
Chip Ferrite Inductors
FeaturesHigh Q, stable inductance in wide frequency
Good reliability(Monolithic structure)
Magnetically shielded
Fast mounting speed
RoHS compliant
ApplicationsComputer and its Peripherals
Hard-disk Drivers
Audio/Visual Equipment
Chip Ferrite Inductors
Shape & Dimensions
CM 1608 F R22 K T
How to Order(Product Identification)
Series Code
CM : Chip Ferrite Inductors
Dimension Code
The first two digits : Length(mm)
The last two digits : Width(mm)
Material Code
F : Ferrite
Inductance Value Code
22n = 22nH 2R2 = 2.2nH
220 = 22μH R22 = 0.22μH
Tolerance Code
K : ±10% M : ±20%
Package Code
T : Reel paper packaging
E : Reel embossed tape packaging
Size L W T B
1005 1.0±0.1 0.5±0.1 0.5±0.1 0.25±0.1
1608 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
2012 2.0±0.2 1.25±0.2 0.85±0.2 0.5±0.31.25±0.2
3216 3.2±0.2 1.6±0.20 1.1±0.2 0.5±0.3
(Unit : mm)
Temperature Range Operating Temp. -40 ~ +85Storage Temp. -10 ~ +40
76
www.sam
wha.com
Chip B
eads &
Inductors
Specifications
1005 SIZE for General Line
0.5±0.1
Part No.Inductance Q Test Frequency SRF(MHz) DC Resistance Ratde Current T
(μH) Tolerance Min. (MHz) Min. (Ω) Max. (mA) Max. (mm)
CM1005FR10 0.10 15 25 190 0.6 25
CM1005FR12 0.12 15 25 180 0.7 25
CM1005FR15 0.15 15 25 165 0.9 25
CM1005FR18 0.18 15 25 150 1.0 25
CM1005FR22 0.22 15 25 135 1.1 25
CM1005FR27 0.27 15 25 120 1.2 25
CM1005FR33 0.33 15 25 105 1.25 25
CM1005FR39 0.39 20 25 85 0.6 15
CM1005FR47 0.47 20 25 80 0.7 15
CM1005FR56 0.56 20 25 75 0.8 15
CM1005FR68 0.68 20 25 70 0.9 15
CM1005FR82 0.82 20 25 65 1.0 15
CM1005F1R0 1.0 20 10 60 1.1 15
CM1005F1R2 1.2 20 10 55 1.25 15
±10%
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Electrical Characteristics
Q Characteristics DC Bias Characteristics
Chip Beads & Inductors 77
Chip Ferrite Inductors
Specifications
1608 SIZE for General Line
0.8±0.15
Part No.Inductance Q Test Frequency SRF(MHz) DC Resistance Ratde Current T
(μH) Tolerance Min. (MHz) Min. (Ω) Max. (mA) Max. (mm)
CM1608FR18 0.18 15 25 165 0.60 50
CM1608FR22 0.22 15 25 150 0.80 50
CM1608FR27 0.27 15 25 136 0.80 50
CM1608FR33 0.33 15 25 125 0.85 35
CM1608FR39 0.39 15 25 110 1.00 35
CM1608FR47 0.47 15 25 105 1.35 35
CM1608FR56 0.56 15 25 95 1.55 35
CM1608FR68 0.68 15 25 80 1.70 35
CM1608FR82 0.82 15 25 75 2.10 35
CM1608F1R0 1.00 35 10 70 0.60 25
CM1608F1R2 1.20 35 10 60 0.80 25
CM1608F1R5 1.50 35 10 55 0.80 25
CM1608F1R8 1.80 35 10 50 0.95 25
CM1608F2R2 2.20 35 10 45 1.15 15
CM1608F2R7 2.70 35 10 40 1.35 15
CM1608F3R3 3.30 35 10 38 1.55 15
CM1608F3R9 3.90 35 10 36 1.70 15
CM1608F4R7 4.70 35 10 33 2.10 15
CM1608F100 10.0 35 2 17 2.55 5
±10%±20%
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
78
www.sam
wha.com
Chip B
eads &
Inductors
Specifications
2012 & 3216 SIZE for General Line
0.85
1.25
±0.2
1.10
±0.2
Part No.Inductance Q Test Frequency SRF(MHz) DC Resistance Ratde Current T
(μH) Tolerance Min. (MHz) Min. (Ω) Max. (mA) Max. (mm)
CM2012FR22 0.22 20 25 170 0.50 250
CM2012FR27 0.27 20 25 150 0.50 250
CM2012FR33 0.33 20 25 145 0.55 250
CM2012FR47 0.47 25 25 125 0.65 200
CM2012FR56 0.56 25 25 115 0.75 150
CM2012FR68 0.68 25 25 105 0.80 150
CM2012FR82 0.82 25 25 100 1.00 150
CM2012F1R0 1.0 45 10 75 0.40 50
CM2012F1R5 1.5 45 10 60 0.50 50
CM2012F1R8 1.8 45 10 55 0.60 50
CM2012F2R2 2.2 45 10 50 0.65 30
CM2012F2R7 2.7 45 10 45 0.75 30
CM2012F3R3 3.3 45 10 41 0.80 30
CM2012F3R9 3.9 45 10 38 0.90 30
CM2012F4R7 4.7 45 10 35 1.00 30
CM2012F5R6 5.6 50 4 32 0.90 15
CM2012F6R8 6.8 50 4 29 1.00 15
CM2012F8R2 8.2 50 4 26 1.10 15
CM2012F100 10 50 2 24 1.15 15
CM2012F120 12 50 2 22 1.25 15
CM2012F150 15 30 1 19 0.80 5
CM2012F220 22 30 1 16 1.10 5
CM3216F1R0 1.0 45 10 75 0.40 100
CM3216F1R5 1.5 45 10 60 0.50 50
CM3216F1R8 1.8 45 10 55 0.50 50
CM3216F2R2 2.2 45 10 50 0.60 50
CM3216F3R3 3.3 45 10 41 0.70 50
CM3216F4R7 4.7 45 10 35 0.80 50
CM3216F5R6 5.6 50 4 32 0.60 25
CM3216F6R8 6.8 50 4 29 0.60 25
CM3216F8R2 8.2 50 4 26 0.90 25
CM3216F100 10 50 2 24 0.70 25
CM3216F120 12 50 2 22 1.05 25
CM3216F150 15 35 1 19 1.10 25
±20%±10%
±10%
※Measuring Equipment : Z : HP4291B / E4991A Rdc : HP4338B
Chip Beads & Inductors 79
Chip Power Inductors
FeaturesLow DC resistance and High DC Biased products in the class.
Completely lead-free product and support lead-free solders.
Low thickness and high current density products.
Complex products of co-fired ceramic and magnetic materials.
ApplicationsDC-DC converters and power modules used for the following equipments.
Compact electrical instruments such as cellular phones, PDA, DVC, DSC and HDD.
Chip Power Inductors
Size L W T B
1608 1.6±0.15 0.8±0.15 1.0max 0.3±0.2
2012 2.0±0.20 1.25±0.2 1.0max 0.5±0.3
2016 2.0±0.20 1.6±0.2 1.0max 0.5±0.3
2520 2.5±0.20 2.0±0.2 1.0max 0.5±0.3
3216 3.2±0.20 1.6±0.20 0.6max 0.5±0.3
3225 3.2±0.20 2.5±0.20 1.0max 0.5±0.3
(Unit : mm)
CPI 2520 N H L 4R7 M E
How to Order(Product Identification)
Temperature Range Operating Temp. -40 ~ +125Storage Temp. -10 ~ +40
Measurement EquipmentsAgilent 4284A(Precision LCR Meter) Agilent 42841A(Bias Current Source)
Shape & Dimensions
Series CodeCPI : Chip Power Inductors
Dimensions CodeThe First two digits : length (mm)The Last two digits : Width (mm)
Thickness (max.)S : 0.6mm D : 0.8mmN : 1.0mm T : 1.2mm
80
www.sam
wha.com
Chip B
eads &
Inductors
Application CodeL : Low DCR typeH : High Current typeU : Very High Current type
Material Code
Tolerancd CodeK : ±10% M : ±20% N : ±30%
Inductance Value Code2R2 : 2.2μH 4R7 : 4.7μH100 : 10.0μH
Packaging CodeT : Real paper packagingE : Real embossed tape packagingB : BulK packaging
Characteristics - High Current Type
CPI2012NHL Series - High Current Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2012NHL1R0MT 1.0 max 1.0±20% 0.20±30% 1.0
CPI2012NHL1R5MT 1.0 max 1.5±20% 0.23±30% 0.9
CPI2012NHL2R2MT 1.0 max 2.2±20% 0.23±30% 0.9
CPI2012NHL3R3MT 1.0 max 3.3±20% 0.25±30% 0.8
CPI2012NHL4R7MT 1.0 max 4.7±20% 0.30±30% 0.6
CPI2012SHL Series - Low Profile Type (T=0.6 max.)
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2012SHL1R0MT 0.6 max 1.0±20% 0.30±30% 0.60
CPI2012SHL1R5MT 0.6 max 1.5±20% 0.35±30% 0.55
CPI2012SHL2R2MT 0.6 max. 2.2±20% 0.40±30% 0.50
CPI2012SHL3R3MT 0.6 max. 3.3±20% 0.45±30% 0.40
CPI2012SHL4R7MT 0.6 max. 4.7±20% 0.55±30% 0.30
CPI2016NHL Series - High Current Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2016NHL1R0ME 1.0 max 1.0±20% 0.12±30% 1.30
CPI2016NHL1R5ME 1.0 max 1.5±20% 0.12±30% 1.30
CPI2016NHL2R2ME 1.0 max 2.2±20% 0.14±30% 1.20
CPI2016NHL3R3ME 1.0 max 3.3 ±20% 0.18±30% 1.00
CPI2016NHL4R7ME 1.0 max 4.7±20% 0.23±30% 0.90
Chip Beads & Inductors 81
Chip Power Inductors
CPI2520NHL Series - High Current Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2520NHL1R0ME 1.0 max 1.0 ±20% 0.11 ±30% 1.50
CPI2520NHL1R5ME 1.0 max 1.5±20% 0.12±30% 1.40
CPI2520NHL2R2ME 1.0 max 2.2±20% 0.14±30% 1.30
CPI2520NHL3R3ME 1.0 max 3.3±20% 0.18±30% 1.20
CPI2520NHL4R7ME 1.0 max 4.7±20% 0.23±30% 1.00
CPI2520NHL6R8ME 1.0 max 6.8±20% 0.20±30% 1.20
CPI2520NHL100ME 1.0 max 10.0±20% 0.30±30% 0.80
CPI3225NHL Series - High Current Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI3225NHL1R0ME 1.0 max 1.0 ±20% 0.10 ±30% 1.30
CPI3225NHL1R5ME 1.0 max 1.5±20% 0.12±30% 1.30
CPI3225NHL2R2ME 1.0 max 2.2±20% 0.15±30% 1.20
CPI3225NHL3R3ME 1.0 max 3.3±20% 0.17±30% 1.10
CPI3225NHL4R7ME 1.0 max 4.7±20% 0.20±30% 1.00
CPI3225NHL6R8ME 1.0 max 6.8±20% 0.28±30% 0.90
CPI3225NHL100ME 1.0 max 10.0±20% 0.35±30% 0.80
Characteristics - High Current Type
82
www.sam
wha.com
Chip B
eads &
Inductors
CPI1608NLL Series - Low Profile Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI1608NLLR47MT 1.0 max 0.47±20% 0.15±30% 1.10
CPI1608NLLR68MT 1.0 max 0.68±20% 0.17±30% 1.05
CPI1608NLL1R0MT 1.0 max 1.0±20% 0.20±30% 1.00
CPI1608NLL1R5MT 1.0 max 1.5±20% 0.25±30% 0.90
CPI1608NLL2R2MT 1.0 max 2.2±20% 0.30±30% 0.80
CPI2012NLL Series - Low DCR Typeies
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2012NLLR47MT 1.0 max 0.47±20% 0.08±30% 1.30
CPI2012NLL1R0MT 1.0 max 1.0±20% 0.11±30% 1.20
CPI2012NLL1R5MT 1.0 max 1.5±20% 0.14±30% 1.10
CPI2012NLL2R2MT 1.0 max 2.2±20% 0.16±30% 1.00
CPI2012NLL3R3MT 1.0 max 3.3± 20% 0.22±30% 0.80
CPI2012NLL4R7MT 1.0 max 4.7±20% 0.26±30% 0.70
CPI2520NLL Series - Low DCR Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI2520NLL1R0ME 1.0 max 1.0±20% 0.07±30% 1.50
CPI2520NLL1R5ME 1.0 max 1.5±20% 0.07±30% 1.50
CPI2520NLL2R2ME 1.0 max 2.2±20% 0.08±30% 1.30
CPI2520NLL3R3ME 1.0 max 3.3±20% 0.10±30% 1.20
CPI2520NLL4R7ME 1.0 max 4.7±20% 0.12±30% 1.10
CPI3225NLL Series - Low DCR Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
CPI3225NLL4R7ME 1.0 max 4.7±20% 0.10±30% 1.10
CPI3225NLL100ME 1.0 max 10.0±20% 0.23±30% 0.90
Characteristics - Low DC Resistance Yype
Chip Beads & Inductors 83
Chip Power Inductors
EPI2012NLY Series - High Efficiency Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
EPI2012NLYR24MT 1.0 max 0.24±20% 0.027±30% 3.2
EPI2012NLYR33MT 1.0 max 0.33±20% 0.032±30% 3.0
EPI2012NLYR47MT 1.0 max 0.47±20% 0.040±30% 2.6
EPI2012NLYR56MT 1.0 max 0.56±20% 0.050±30% 2.2
EPI2016NLY Series - High Efficiency Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
EPI2016NLYR15ME 1.0 max 0.15±20% 0.020±30% 3.5
EPI2016NLYR24ME 1.0 max 0.24±20% 0.025±30% 3.2
EPI2016NLYR33ME 1.0 max 0.33±20% 0.030±30% 3.0
EPI2016NLYR47ME 1.0 max 0.47±20% 0.040±30% 2.6
EPI2016NLYR56ME 1.0 max 0.56±20% 0.045±30% 2.5
EPI2520NLY Series - High Efficiency Type
Part No. Thickness (mm)Inductanceat 1 MHz
DC Resistance(Ω)
Rated Current(A)
EPI2520NLYR47ME 1.0 max 0.47±20% 0.04±30% 3.2
EPI2520NLYR68ME 1.0 max 0.68±20% 0.05±30% 3.0
EPI2520NLY1R0ME 1.0 max 1.00±20% 0.07±30% 2.7
Characteristics - High Efficiency Type
84
www.sam
wha.com
Chip B
eads &
Inductors
Characteristics - High Current Type
Chip Beads & Inductors 85
Chip Power Inductors
Characteristics - High Current Type
86
www.sam
wha.com
Chip B
eads &
Inductors
Characteristics - Low DC Resistance Type
Chip Beads & Inductors 87
Chip Power Inductors
Characteristics - High Efficiency Type
88
www.sam
wha.com
Chip B
eads &
Inductors
Reliability and Test Conditions
Chip Beads & Inductors
Operating Temperature Range
-55~+125 -40~+85
Storage Temperature Range
40 Max., 70% RH Max. at Packing Condition
Solderability More than 90% of the terminal electrode shall be covered withnew solder
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
260±5
- Soldering Time : 10±1sec.
Resistance to Soldering Heat
1. No damage such as cracks should be caused in chip element
2. More than 75% of the terminal electrode shall be covered with new solder
3. Impedance shall not change more than ±30 %
4. Inductance shall not change more than ±10 %
5. Q shall not change more than ±20 %
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 270±10
- Soldering Time : 10±0.5sec.
Reflow Soldering More than 50% of the terminal electrode shall be covered with
new solder
1. No mechanical damage
2. Impedance shall not change more than ±30 %
3. Inductance shall not change more than ±10 %
4. Q shall not change more than ±20 %
- Preheat Temperature : 150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
260±5
- Soldering Time : 10sec. Max.(Reflow Soldering Profile)
High TemperatureResistance
- Temperature : 125±3 85±3
- Time : 500±12hours
- Measurement at room ambient temperature after placing for 24 hours
High Temperature Load Resistance
- Temperature : 125±3 85±3
- Applied Current : Rated Current
- Time : 1000±12hours
- Measurement at room ambienttemperature after placing for 24 hours
Humidity Resistance - Temperature : 40±2
- Humidity : 90±2%RH
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
Chip Beads Chip Inductors
Item Requirements Test Conditions
Chip Beads & Inductors 89
Chip Beads & Inductors
Item Requirements Test Conditions
Humidity Load Resistance
- Temperature : 40±2
- Humidity : 90±2% RH
- Applied Current : Rated Current
- Time : 500±12 hours
- Measurement at room ambienttemperature after placing for 24hours
- Temperature : -55±3
-40±3
- Time : 1000±12 hours
- Measurement at room ambienttemperature after placing for 24hours
1. -55±3 for 30minutes 40±3 for 30minutes
2. 125±3 for 30minutes 85±3 for 30minutes
3. Repeat 100 Cycle
Low TemperatureResistance
Thermal Shock
Drop
Flexure Strength No Mechanical Damage
Drop 10 times on a concrete floorfrom a height of 100cm
- Frequency : 10~55Hz
- Amplitude : 1.5mm
- Direction : X, Y, Z
- Sweep Time : 2hours for each axis
Vibration
Bending Strength
Chip Beads Chip Inductors
1. No mechanical damage
2. Impedance shall not change more than ±30 %
3. Inductance shall not change more than ±10 %
4. Q shall not change more than ±20 %
The terminal electrode shall be neither break off nor the chipdamage
Type 1005 1608 2012 3216 4516 4532A(mm) 0.7 1.0 1.0 1.3 1.5 1.5
B(mm) 0.5 0.8 1.0 1.5 3.6 3.6
C(mm) 0.7 1.3 1.3 3.0 3.0 3.0
W(kgf) 0.7 2.0 4.0 5.0 5.0 5.0
90
www.sam
wha.com
Chip B
eads &
Inductors
Item Requirements Test Conditions
OperatingTemperature Range
at Packing Condition
High TemperatureResistance
- Temperature : 125±3
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
High Temperature Load Resistance
- Temperature : 125±3
- Applied Current : rated Current
- Time : 1000±12hours
- Measurement at room ambienttemperature after placing for 24hours
Humidity Resistance - Temperature : 40±2
- Humidity : 90±2% RH
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
- Preheat Temperature : 150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
- Soldering Time : 10sec. Max.(Reflow Soldering Profile)
Reflow Soldering
-55~+125
Storage Temperature Range
40 Max., 70% RH Max.
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
- Soldering Time : 10±1sec.
Solderability More than 90% of the terminal electrode shall be covered withnew solder
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 270±10
- Soldering Time : 10±0.5 sec.
Resistance toSoldering heat
1. No damage such as cracks should be caused in chip element
2. More than 75% of the terminal electrode shall be coveredwith new solder
3. Impedance shall not change more than ±30 %
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Chip Ferrite Beads Array
More than 50% of the terminal electrode shall be covered withnew solder
Chip Beads & Inductors 91
Chip Beads & Inductors
Item Requirements Test Conditions
Humidity Load Resistance
- Temperature : 40±2
- Humidity : 90±2% RH
- Applied Current : Rated Current
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
- Temperature : -55±3
- Time : 1000±12 hours
- Measurement at room ambienttemperature after placing for 24hours
1. -55±3 for 30minutes
2. 125±3 for 30minutes
3. repeat 100 Cycle
Low TemperatureResistance
Thermal Shock
Drop
Flexure Strength No Mechanical Damage
Drop 10 times on a concrete floorfrom a height of 100cm
- Frequency : 10~55Hz
- Amplitude : 1.5mm
- Direction : X, Y, Z
- Sweep Time : 2hours for each axis
Vibration
Bending strength
1. No mechanical damage
2. Impedance shall not change more than ±30 %
The terminal electrode shall be neither break off nor the chipdamage
Type 4 Array
A(mm) 0.8
B(mm) 0.8
C(mm) 3.0
W(kgf) 0.4
92
www.sam
wha.com
Chip B
eads &
Inductors
Item Requirements Test Conditions
OperatingTemperature Range
at Packing Condition
High TemperatureResistance
- Temperature : 83±2
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
High Temperature Load Resistance
- Temperature : 85±3
- Applied Current : Rated Current
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
Humidity Resistance - Temperature : 40±2
- Humidity : 90±2% RH
- Time : 500±12hours
- Measurement at room ambienttemperature after placing for 24hours
- Preheat Temperature : 150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
- Soldering Time : 10sec. Max.(Reflow Soldering Profile)
Reflow Soldering
-40~+125
Storage Temperature Range
-10~40 Max., 70% RH Max.
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 245±5
- Soldering Time : 10±1sec.
Solderability More than 90% of the terminal electrode shall be covered withnew solder
- Preheat Temperature : 100~150
- Preheat Time : 60sec.
- Solder Temperature : 270±10
- Soldering Time : 10±0.5sec.
Resistance toSoldering heat
1. No damage such as cracks should be caused in chip element
2. More than 75% of the terminal electrode shall be coveredwith new solder
3. Impedance shall not change more than ±20 %
1. No mechanical damage
2. Impedance shall not change more than ±20 %
Chip Power Inductors
More than 50% of the terminal electrode shall be covered withnew solder
Chip Beads & Inductors 93
Chip Beads & Inductors
Item Requirements Test Conditions
Humidity Load Resistance
- Temperature : 40±2
- Humidity : 90±2% RH
- Applied Current : rated Current
- Time : 500±12 hours
- Measurement at room ambienttemperature after placing for 24hours
- Temperature : -40±3
- Time : 1000±12 hours
- Measurement at room ambienttemperature after placing for 24hours
1. -40±3 for 30minutes
2. 85±3 for 30minutes
3. repeat 100 Cycle
Low TemperatureResistance
Thermal Shock
Drop
Flexure Strength No Mechanical Damage
Drop 10 times on a concrete floorfrom a height of 100cm
- Frequency : 10~55Hz
- Amplitude : 1.5mm
- Direction : X, Y, Z
- Sweep Time : 2hours for each axis
Vibration
Bending Strength
1. No mechanical damage
2. Inductance shall not change more than ±20 %
The terminal electrode shall be neither break off nor the chipdamage
Item 1608 2012 2016 2520 3216 3225
A (mm) 0.7 1.1 1.1 1.2 1.2 1.2
B (mm) 0.7 0.6 0.6 1.0 1.7 1.7
C (mm) 1.1 1.6 2.1 2.5 2.1 3.0
W (kgf) 2.0 4.0 4.0 5.0 1.5 5.0
94
www.sam
wha.com
Chip B
eads &
Inductors
Soldering Profile
Reflow Soldering
Flow Soldering
Manual Soldering
Specifications which provide more details for the proper and safe use described product areavailable upon request.All specifications are subject to change without notice.
Soldering Iron : 30W Max.
Diameter of Soldering Iron : 1.2mm Max.