Quality System

2015

ChipMOS Quality Policy

ChipMOS IS DEVOTED TO THE FOLLOWING CUSTOMER FOCAL POINTS WITH THE CONSCIOUSNESS OF CONTINUAL IMPROVEMENT AND AGGRESSIVELY FIT CUSTOMER EXPECTATION TO SATISFY CUSTOMER.南茂秉持著持續改善的精神，致力於以下顧客關注事項，積極實現客戶期望，

Q2

ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A COMPETITIVE COST.COMPETITIVE COST.

以達客戶滿意。

產產產產品品品品品品品品質質質質 : 符符符符合合合合客客客客戶戶戶戶需需需需求求求求

產產產產品品品品成成成成本本本本 : 具具具具市市市市場場場場競競競競爭爭爭爭力力力力

產產產產品品品品交交交交期期期期 : 準準準準時時時時服服服服務務務務客客客客戶戶戶戶

QUALITY

COST

DELIVERY

Co

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any

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sin

chu

1997 ~ 2002ChipMOS

2003~2007 2008~2010

Quality Award (CSQ)

ISO17025Certification- Electricity - Temp.- Electrical Test

Milestones of ChipMOS Quality System

SONY GP(Tier 2)Certified

ISO9001TS16949ISO14001Certified

2011~2014

QC080000Certified

ISO17025Certification

- Chemical AnalysisOHSAS18001

CertifiedEICC

ComplianceISO 27001Certified

Q3

Hsi

nch

uTa

inan

CSQ : Chinese Society for QualityCSQ : Chinese Society for QualityCNLA : Chinese National Laboratory Accreditation (I SO 17025)CNLA : Chinese National Laboratory Accreditation (I SO 17025)

Ch

up

ei

ISO9001/ISO14001 Certified (Bumping)

ISO 9001ISO /TS16949

CertifiedISO9002/ISO14001/QS 9000

Certified

ISO9002/ISO14001/QS 9000Certified

ISO14001:2004Certified

SONY GP(Tier 1)Certified

SO14064Greenhouse

Gas

Plan

Proven ChipMOS QualityISO9001:2008ISO/TS 16949:2009 ISO 27001:2013QC-080000:2012

Q4

OHSAS 18001:2007 ISO/IEC 17025ISO 14001:2004GHG

Verification Statement

CU

STO

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US

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ER

RE

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CTAT

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ISFA

CT

ION

CU

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FAC

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NC

US

TOM

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SAT

ISFA

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Corrective & Prevention, Continual Improvement System

Corrective & Prevention, Continual Improvement System

Continuous improvement of the Continuous improvement of the quality management systemquality management system

Continuous improvement of the Continuous improvement of the quality management systemquality management system

ChipMOS develops process-oriented QMS to identify a nd meet customer’s requirements and expectations in an effective and efficient manner to achieve competiti ve advantage.

PA

ChipMOS Quality Management System

Q5

Input

CU

STO

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R R

EQ

UIR

EM

EN

T & E

XP

EC

TATIO

NC

US

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ER

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IRE

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EX

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CTAT

ION

CU

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IRE

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US

TOM

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SAT

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CT

ION

CU

STO

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R S

ATIS

FAC

TIO

NC

US

TOM

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SAT

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ION

OutputCustomer Requirement Process• Market Investigation• Identification of customer needs• Customer order, contract review• Customer Service

(Satisfaction Complaint)

Customer Requirement Process• Market Investigation• Identification of customer needs• Customer order, contract review• Customer Service

(Satisfaction Complaint)

APQP Process• APQP• Process Planning

APQP Process• APQP• Process Planning

Production Planning Process• MRP/CRP/CPS• Resource plan• Material purchasing plan

Production Planning Process• MRP/CRP/CPS• Resource plan• Material purchasing plan

Monitor, Measurement, & Analysis System• Data analysis • Process performance • Internal Audit• Supplier performance• Inspection• Customer satisfaction

Investigation

Monitor, Measurement, & Analysis System• Data analysis • Process performance • Internal Audit• Supplier performance• Inspection• Customer satisfaction

Investigation

Management/ Strategy Planning Process• Adv. Tech development

• Business plan

• Strategy planning

• Management review

• Organization planning

Management/ Strategy Planning Process• Adv. Tech development

• Business plan

• Strategy planning

• Management review

• Organization planning

Human Resource System• Training

• Qualification

• Empowerment &

Motivation

Human Resource System• Training

• Qualification

• Empowerment &

Motivation

Production Process• Purchasing• Warehouse Mgt• Production• Measurement & Prod EQ Mgt • Nonconformance Prod Mgt • Stock, Shipping

Production Process• Purchasing• Warehouse Mgt• Production• Measurement & Prod EQ Mgt • Nonconformance Prod Mgt • Stock, Shipping

D C

Product

Continuous Improvement (System)

� Calculate with cost category prevention cost, appraisal cost, internal failure cost, external failure cost

� Analysis with cost Index

QualityCost

QualityGoal

� Annual goal setting� Management Commitment on

continuous improvementProductControl

ManagementReview

Management Management CommitteeCommittee

Dept.

Q6

� Quality awareness promotion� ID conference award � Benefit prize for reward

� PIT team up with major process issue

� QC story implementation� QC tools application� PIT conference award

� Analysis with cost Index

IDEABOX

Process

Improvement

Team

Cost

CrossFunction

CompanyWide

Shop-floors

Engineers & Staffs

Dept. Manager

Engineers & Staffs

Dept. Manager

Control Method

QUALITY FEEDBACK

DEFECT MODE

CUSTOMER

FEEDBACK

DEFECT MODE

IN-LINE

QUALITY

DEFECT MODE

PROCESS FMEA

Significant factors defined by D.O.E.

S : Influence of severity

O : Probability of Occurrence

D : Degree of detectionTo estimate the risk priority number through :

S O D RPN

EstimateProcess

Description

Potential

Failure

Mode

Potential

Effect of

Failure

(S)

Prob-

ability

of

Occurr-

ence

(O)

Failure

Detection/

Control

Method

(D)

Control Plan

To define control methods of significant characteristics

Process

Name

Process Flow Control items Control method

Raw

Mat’l

Process Product

Charact.

Process

Parameter

Control

Tool

Sample Size

Frequency

Checking

method

PRODUCTIONQC STORY

1. THEME 2. WHY THEME

• Failure Mode• Influence to Product

• Possible Cause• Detection Method

• Product Characteristics • Process Parameters

100%

PROCESS CAPABILITY

Continuous Improvement (Product)

Q7

CONTROL CHART

X

Process Flow M/C Nr. SPEC

R

Samplingfrequency

UCL

LCL

Characteristic

Date

UCL

CL

LCL

• Data Sheet

• Check Sheet

• SPC Applications

6 SIGMA QUALITY

Zero Defect

DESIGNERQUALITY FUNCTION DEPLOYMENT CHART

CUSTOMER

REQ.

WEIGHT

DESIGNER

REQ.

1.

2.

3.

WEIGHTFUNCTION DEPLOYMENT

1. 2. 3. 4.

FINAL PRODUCT QUALITY CHART

1. 2. 3. 4.

MATERIAL

ASSEMBLY

PROCESS

1. THEME

A P

C D

2. WHY THEME

3. DATA COLLECTION

4. ACTION PLAN

6. REMAIN

PROBLEM

5. RESULT

NO

• Responsibility

• Corrective Action

• OCAP (Out of Control Action Plan)

Cpk >= 1.671.33 <= Cpk <1.67Cpk < 1.33

205010

40300

60200

Target :Cpk >= 2.0(based on customer requirement)

MONTH

100%

YES

• Small Quality Variation• Mean Value to Target

EvaluationEvaluation

RequestRequest

New SuppliersNew SuppliersQualificationQualification

Supplier Quality Assurance

Q8

STCSTC

SPCSPCIQCIQC

RankingRanking

AuditingAuditingWin/Win

QualificationQualification

EvaluationEvaluation

STSSTS

SPCSPC

SuppliersCapability Improvement

SuppliersCapability Maintenance

Supplier Quality Assurance

1. Quality meeting

2. Abnormality handling

3. RMA handling

ChipMOS Supplier

1. Annual audit

2. Ranking (Quarterly)

3. QNR / PNR

4. Spec. / Drawing

Q9

4. Review customer

feedback

1. C of C

2. Monthly report

3. Cpk data

4. Improvement report

5. Regular supplier meeting

(Quality & Technology )

4. Spec. / Drawing

5. New supplier qualification

1. 8D System

2. QIP

3. SPC

Continuous improvement

Flow

Wafer in

Wafer sorting

Wafer -mount

& dicing

Die & Wire

BondingMolding Marking Plating

Trim &Form

Outgoing Visual & Outgoing

Control

MaterialsSuppliers

Testing

1. Wafer inspection. Optical inspection. Wafer ID

2. Material inspection. Optical inspection . Dimension

IQC gateIQC gate

Assembly Quality Control Flow

Q10

ControlItem

IPQC Monitor- Optical inspection- Moldability (x-ray). Wire sweep. Void

- Parameter check. Temperature

IPQC Monitor- Optical inspection- Plating thickness- Solderability. Sn content. Soldering test

- Contamination

IPQC Gate- Optical inspection- Purity

IPQC Gate- Optical

inspection- Adhesion. die shear test

- Bondability. wire pull test. Ball shear test

IPQC Monitor- Optical inspection- Mark adhesion

IPQC Monitor- Optical inspection- Dimension. Outline. Coplanarity

FQC/OQC Gate- Optical inspection. Marking. Lead . Package

- Packing check- Document check

ShippingFlow

Wafer in

Wafer sorting

Wafer -mount

& dicingILB Potting Marking Testing Outgoing

Visual & Outgoing Control

MaterialsSuppliers

1. Wafer inspection. Optical inspection. Wafer ID

2. Material inspection. Optical inspection . Dimension

IQC gateIQC gate

LCDD Quality Control Flow (TCP/COF)

Q11

ControlItem

IPQC Monitor- Bondability. Total height. Bend height (TCP). Edge gap (COF)

IPQC Monitor-Dimension

FQC/OQC Gate- Optical inspection- Packing check- Document check

IPQC Gate- Optical inspection- Document check

ShippingFlow

Wafer in

Wafer sorting

Wafer -mount

& dicingAOI P/P

Visual & Outgoing Control

MaterialsSuppliers

1. Wafer inspection. Optical inspection. Wafer ID

2. Material inspection. Optical inspection . Dimension

IQC gateIQC gate

LCDD Quality Control Flow (COG)

Q12

QCControl

ItemFQC/OQC Gate- Optical inspection- Packing check- Document check

IPQC Gate- Optical inspection- Document check

OutgoingControl

•PKG :V/M inspection(lead & mark

Customers

• Assembly• Subcontractors

•PKG :Elec. testing

& burn in

Packing Shipping

Flow

Incomingcontrol 1. PKG inspection

. Lead

. Package body

. Marking

2. Consumable material inspection. Appearance . COA

IQC gateIQC gate

FT Quality Control Flow

Q13

PQC gate- Visual inspection. Packing material. Label content. Packing method

- Packing. QC seals

FQC gate- PKG Optical inspection

. Lead

. Package

. Marking

(lead & markScanning)

• Subcontractors• In-house & burn in

( & marking )

OQC gateOQC gate- Document check

Flow

QCControl

Item

Vendors

OutgoingControl•Wafer :

V/M inspection

Customers •Wafer :CP testing

Packing Shipping

Flow

Incomingcontrol

WS Quality Control Flow

IQC gateIQC gate- Wafer inspection. Appearance. Wafer ID

- Consumable material inspection. Appearance . COA

Q14

OQC gate- Label content- Documents check- Packing check

V/M inspection(probing mark

& Ink)

CP testing &

laser repairFlow

QCControl

Item

Vendors

FQC gate- Wafer inspection. Appearance. Document check

WB Quality Control Flow

OutgoingControl•Wafer :

V/M inspection

Customers

•Wafer :

Packing Shipping

Flow

Incomingcontrol - Chemical, Reticle, Target

. Appearance

. COA

IQC gateIQC gate- Wafer inspection. Appearance. Wafer ID

Q15

OQC gate- Label content- Documents check

FQC gate- Wafer inspection

. Appearance

. Document check

V/M inspection(AOI)

•Wafer :Bumping Flow

QCControl

Item

Vendors

Reliability Test (Procedure)

APG (TSOP/BGA/QFP/QFN) LCDD (TCP/COF)

Preconditioning

Samples In Samples In

Q16

Report Issued Report Issued

Reliability Stress

Environment Mechanical

FT or O/S Judgement

Reliability Stress

Environment Mechanical

FT Judgement

Reliability Test (Capability)

Item Description Brand Model Quantity1 IR Reflowing Oven TANGTECK SMD-14-M10H 12 Temperature & Humidity Tester (TH) HITACHI EC-13HHP 43 Temperature Cycle Tester (TCT) HITACHI ES-63LMV 44 Thermal Shock Tester (TST) YOSHIDA TSL-60 15 Temperature Humidity Bias Tester (THB) HITACHI EC-43MHP 26 High Temperature Storage Lift Tester (HT-SLT) ISUZU ESF-220S 27 Low Temperature Storage Lift Tester (LT-SLT) HITACHI EC-33LTHP 28 High Accelerated Stress Tester (HAST) HIRAYAMA PC-422R7 39 Pressure Cooker Tester (PCT) HIRAYAMA PC-242HS-A 2

Q17

9 Pressure Cooker Tester (PCT) HIRAYAMA PC-242HS-A 2

Reflowing

TH

TCT

TST

THB

HT-SLT

LT-SLT HAST

PCT

All testing conditions follow and meet JEDEC, MIL a nd JEITA International Standards

Failure Analysis (Package Level)

Electrical Failure Analysis CapabilityItem Description Brand

1 Open/Short & Leakage Tester KEITHLEY

2 Curve Tracer TEKTRONIX

3 LCR Precision Meter (20Hz~1MHz) HP4284A

Physical Failure Analysis CapabilityItem Description Brand

1 SAT, Scanning Acoustic Tomograph SONIX

2 SEM, Scanning Electron Microscope HITACHI

FE-SEM, Field Emission SEM HITACHI

3 XRM, X-RAY Microscopy Feinfocus

Sample

Open/Short Test

Leakage (Hi/Lo)

Idd Current Test

DC Tester

Open/Shortonly

Curve Tracer

(XRM)

- Sample - Pin Assignment- Socket

XRMXRM

Failure Analysis ProcedureProcedure

PASS

(Cause)

Q18

3 XRM, X-RAY Microscopy Feinfocus

4 Microscope (High Magnification) Nikon

5 Microscope (Measurescope) Nikon

6 Microscope (Stereoscope) Nikon

7 Cutter (low speed) Buehler

8 Grinding unit Buehler

9 Polishing unit Allied tech.

10 Decapsulator NTG

11 Auto-Milling Ultratech

12 Ion Milling System HITACHI

Material Analysis CapabilityItem Description Brand

1 DSC/TGA/DMA, Thermal Analysis Perkin Elmer

2 FT-IR, Fourier Transform Infrared Perkin Elmer

Decapsulation/X-section

SEMSEM

(Ion Miling)

Report

SATSAT(Cause)

(SEM)

(SAT)(Cause)

Chip ProbingChip Probing

(Cause)

Open/Shortonly

Ion Milling

AggressiveAggressive

OperationOperation

Timely Timely

ImplementationImplementation

Effective Effective

ActionAction

24 hrs, 365 days, non-stop operation to carry on customer’s requirement.

In-time, On-time to implement customer’s requirement / specification.

Fix problem or Meet requirement at once by effective action.

Total Customer Satisfaction

Q19

Real Real

InformationInformation

OperationOperation

FullFull--ScaleScale

ConsiderationConsideration

Not only a subcontractor, but customer’s virtual fab. & trustable partner.

From customer’s view point to consider customer’s requirement.

carry on customer’s requirement.