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ChipMOS Quality Policy
ChipMOS IS DEVOTED TO THE FOLLOWING CUSTOMER FOCAL POINTS WITH THE CONSCIOUSNESS OF CONTINUAL IMPROVEMENT AND AGGRESSIVELY FIT CUSTOMER EXPECTATION TO SATISFY CUSTOMER.南茂秉持著持續改善的精神,致力於以下顧客關注事項,積極實現客戶期望,
Q2
ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A COMPETITIVE COST.COMPETITIVE COST.
以達客戶滿意。
產產產產品品品品品品品品質質質質 : 符符符符合合合合客客客客戶戶戶戶需需需需求求求求
產產產產品品品品成成成成本本本本 : 具具具具市市市市場場場場競競競競爭爭爭爭力力力力
產產產產品品品品交交交交期期期期 : 準準準準時時時時服服服服務務務務客客客客戶戶戶戶
QUALITY
COST
DELIVERY
Co
mp
any
wid
eH
sin
chu
1997 ~ 2002ChipMOS
2003~2007 2008~2010
Quality Award (CSQ)
ISO17025Certification- Electricity - Temp.- Electrical Test
Milestones of ChipMOS Quality System
SONY GP(Tier 2)Certified
ISO9001TS16949ISO14001Certified
2011~2014
QC080000Certified
ISO17025Certification
- Chemical AnalysisOHSAS18001
CertifiedEICC
ComplianceISO 27001Certified
Q3
Hsi
nch
uTa
inan
CSQ : Chinese Society for QualityCSQ : Chinese Society for QualityCNLA : Chinese National Laboratory Accreditation (I SO 17025)CNLA : Chinese National Laboratory Accreditation (I SO 17025)
Ch
up
ei
ISO9001/ISO14001 Certified (Bumping)
ISO 9001ISO /TS16949
CertifiedISO9002/ISO14001/QS 9000
Certified
ISO9002/ISO14001/QS 9000Certified
ISO14001:2004Certified
SONY GP(Tier 1)Certified
SO14064Greenhouse
Gas
Plan
Proven ChipMOS QualityISO9001:2008ISO/TS 16949:2009 ISO 27001:2013QC-080000:2012
Q4
OHSAS 18001:2007 ISO/IEC 17025ISO 14001:2004GHG
Verification Statement
CU
STO
ME
R R
EQ
UIR
EM
EN
T & E
XP
EC
TATIO
NC
US
TOM
ER
RE
QU
IRE
ME
NT &
EX
PE
CTAT
ION
CU
STO
ME
R R
EQ
UIR
EM
EN
T & E
XP
EC
TATIO
NC
US
TOM
ER
RE
QU
IRE
ME
NT &
EX
PE
CTAT
ION
CU
STO
ME
R S
ATIS
FAC
TIO
NC
US
TOM
ER
SAT
ISFA
CT
ION
CU
STO
ME
R S
ATIS
FAC
TIO
NC
US
TOM
ER
SAT
ISFA
CT
ION
Corrective & Prevention, Continual Improvement System
Corrective & Prevention, Continual Improvement System
Continuous improvement of the Continuous improvement of the quality management systemquality management system
Continuous improvement of the Continuous improvement of the quality management systemquality management system
ChipMOS develops process-oriented QMS to identify a nd meet customer’s requirements and expectations in an effective and efficient manner to achieve competiti ve advantage.
PA
ChipMOS Quality Management System
Q5
Input
CU
STO
ME
R R
EQ
UIR
EM
EN
T & E
XP
EC
TATIO
NC
US
TOM
ER
RE
QU
IRE
ME
NT &
EX
PE
CTAT
ION
CU
STO
ME
R R
EQ
UIR
EM
EN
T & E
XP
EC
TATIO
NC
US
TOM
ER
RE
QU
IRE
ME
NT &
EX
PE
CTAT
ION
CU
STO
ME
R S
ATIS
FAC
TIO
NC
US
TOM
ER
SAT
ISFA
CT
ION
CU
STO
ME
R S
ATIS
FAC
TIO
NC
US
TOM
ER
SAT
ISFA
CT
ION
OutputCustomer Requirement Process• Market Investigation• Identification of customer needs• Customer order, contract review• Customer Service
(Satisfaction Complaint)
Customer Requirement Process• Market Investigation• Identification of customer needs• Customer order, contract review• Customer Service
(Satisfaction Complaint)
APQP Process• APQP• Process Planning
APQP Process• APQP• Process Planning
Production Planning Process• MRP/CRP/CPS• Resource plan• Material purchasing plan
Production Planning Process• MRP/CRP/CPS• Resource plan• Material purchasing plan
Monitor, Measurement, & Analysis System• Data analysis • Process performance • Internal Audit• Supplier performance• Inspection• Customer satisfaction
Investigation
Monitor, Measurement, & Analysis System• Data analysis • Process performance • Internal Audit• Supplier performance• Inspection• Customer satisfaction
Investigation
Management/ Strategy Planning Process• Adv. Tech development
• Business plan
• Strategy planning
• Management review
• Organization planning
Management/ Strategy Planning Process• Adv. Tech development
• Business plan
• Strategy planning
• Management review
• Organization planning
Human Resource System• Training
• Qualification
• Empowerment &
Motivation
Human Resource System• Training
• Qualification
• Empowerment &
Motivation
Production Process• Purchasing• Warehouse Mgt• Production• Measurement & Prod EQ Mgt • Nonconformance Prod Mgt • Stock, Shipping
Production Process• Purchasing• Warehouse Mgt• Production• Measurement & Prod EQ Mgt • Nonconformance Prod Mgt • Stock, Shipping
D C
Product
Continuous Improvement (System)
� Calculate with cost category prevention cost, appraisal cost, internal failure cost, external failure cost
� Analysis with cost Index
QualityCost
QualityGoal
� Annual goal setting� Management Commitment on
continuous improvementProductControl
ManagementReview
Management Management CommitteeCommittee
Dept.
Q6
� Quality awareness promotion� ID conference award � Benefit prize for reward
� PIT team up with major process issue
� QC story implementation� QC tools application� PIT conference award
� Analysis with cost Index
IDEABOX
Process
Improvement
Team
Cost
CrossFunction
CompanyWide
Shop-floors
Engineers & Staffs
Dept. Manager
Engineers & Staffs
Dept. Manager
Control Method
QUALITY FEEDBACK
DEFECT MODE
CUSTOMER
FEEDBACK
DEFECT MODE
IN-LINE
QUALITY
DEFECT MODE
PROCESS FMEA
Significant factors defined by D.O.E.
S : Influence of severity
O : Probability of Occurrence
D : Degree of detectionTo estimate the risk priority number through :
S O D RPN
EstimateProcess
Description
Potential
Failure
Mode
Potential
Effect of
Failure
(S)
Prob-
ability
of
Occurr-
ence
(O)
Failure
Detection/
Control
Method
(D)
Control Plan
To define control methods of significant characteristics
Process
Name
Process Flow Control items Control method
Raw
Mat’l
Process Product
Charact.
Process
Parameter
Control
Tool
Sample Size
Frequency
Checking
method
PRODUCTIONQC STORY
1. THEME 2. WHY THEME
• Failure Mode• Influence to Product
• Possible Cause• Detection Method
• Product Characteristics • Process Parameters
100%
PROCESS CAPABILITY
Continuous Improvement (Product)
Q7
CONTROL CHART
X
Process Flow M/C Nr. SPEC
R
Samplingfrequency
UCL
LCL
Characteristic
Date
UCL
CL
LCL
• Data Sheet
• Check Sheet
• SPC Applications
6 SIGMA QUALITY
Zero Defect
DESIGNERQUALITY FUNCTION DEPLOYMENT CHART
CUSTOMER
REQ.
WEIGHT
DESIGNER
REQ.
1.
2.
3.
WEIGHTFUNCTION DEPLOYMENT
1. 2. 3. 4.
FINAL PRODUCT QUALITY CHART
1. 2. 3. 4.
MATERIAL
ASSEMBLY
PROCESS
1. THEME
A P
C D
2. WHY THEME
3. DATA COLLECTION
4. ACTION PLAN
6. REMAIN
PROBLEM
5. RESULT
NO
• Responsibility
• Corrective Action
• OCAP (Out of Control Action Plan)
Cpk >= 1.671.33 <= Cpk <1.67Cpk < 1.33
205010
40300
60200
Target :Cpk >= 2.0(based on customer requirement)
MONTH
100%
YES
• Small Quality Variation• Mean Value to Target
EvaluationEvaluation
RequestRequest
New SuppliersNew SuppliersQualificationQualification
Supplier Quality Assurance
Q8
STCSTC
SPCSPCIQCIQC
RankingRanking
AuditingAuditingWin/Win
QualificationQualification
EvaluationEvaluation
STSSTS
SPCSPC
SuppliersCapability Improvement
SuppliersCapability Maintenance
Supplier Quality Assurance
1. Quality meeting
2. Abnormality handling
3. RMA handling
ChipMOS Supplier
1. Annual audit
2. Ranking (Quarterly)
3. QNR / PNR
4. Spec. / Drawing
Q9
4. Review customer
feedback
1. C of C
2. Monthly report
3. Cpk data
4. Improvement report
5. Regular supplier meeting
(Quality & Technology )
4. Spec. / Drawing
5. New supplier qualification
1. 8D System
2. QIP
3. SPC
Continuous improvement
Flow
Wafer in
Wafer sorting
Wafer -mount
& dicing
Die & Wire
BondingMolding Marking Plating
Trim &Form
Outgoing Visual & Outgoing
Control
MaterialsSuppliers
Testing
1. Wafer inspection. Optical inspection. Wafer ID
2. Material inspection. Optical inspection . Dimension
IQC gateIQC gate
Assembly Quality Control Flow
Q10
ControlItem
IPQC Monitor- Optical inspection- Moldability (x-ray). Wire sweep. Void
- Parameter check. Temperature
IPQC Monitor- Optical inspection- Plating thickness- Solderability. Sn content. Soldering test
- Contamination
IPQC Gate- Optical inspection- Purity
IPQC Gate- Optical
inspection- Adhesion. die shear test
- Bondability. wire pull test. Ball shear test
IPQC Monitor- Optical inspection- Mark adhesion
IPQC Monitor- Optical inspection- Dimension. Outline. Coplanarity
FQC/OQC Gate- Optical inspection. Marking. Lead . Package
- Packing check- Document check
ShippingFlow
Wafer in
Wafer sorting
Wafer -mount
& dicingILB Potting Marking Testing Outgoing
Visual & Outgoing Control
MaterialsSuppliers
1. Wafer inspection. Optical inspection. Wafer ID
2. Material inspection. Optical inspection . Dimension
IQC gateIQC gate
LCDD Quality Control Flow (TCP/COF)
Q11
ControlItem
IPQC Monitor- Bondability. Total height. Bend height (TCP). Edge gap (COF)
IPQC Monitor-Dimension
FQC/OQC Gate- Optical inspection- Packing check- Document check
IPQC Gate- Optical inspection- Document check
ShippingFlow
Wafer in
Wafer sorting
Wafer -mount
& dicingAOI P/P
Visual & Outgoing Control
MaterialsSuppliers
1. Wafer inspection. Optical inspection. Wafer ID
2. Material inspection. Optical inspection . Dimension
IQC gateIQC gate
LCDD Quality Control Flow (COG)
Q12
QCControl
ItemFQC/OQC Gate- Optical inspection- Packing check- Document check
IPQC Gate- Optical inspection- Document check
OutgoingControl
•PKG :V/M inspection(lead & mark
Customers
• Assembly• Subcontractors
•PKG :Elec. testing
& burn in
Packing Shipping
Flow
Incomingcontrol 1. PKG inspection
. Lead
. Package body
. Marking
2. Consumable material inspection. Appearance . COA
IQC gateIQC gate
FT Quality Control Flow
Q13
PQC gate- Visual inspection. Packing material. Label content. Packing method
- Packing. QC seals
FQC gate- PKG Optical inspection
. Lead
. Package
. Marking
(lead & markScanning)
• Subcontractors• In-house & burn in
( & marking )
OQC gateOQC gate- Document check
Flow
QCControl
Item
Vendors
OutgoingControl•Wafer :
V/M inspection
Customers •Wafer :CP testing
Packing Shipping
Flow
Incomingcontrol
WS Quality Control Flow
IQC gateIQC gate- Wafer inspection. Appearance. Wafer ID
- Consumable material inspection. Appearance . COA
Q14
OQC gate- Label content- Documents check- Packing check
V/M inspection(probing mark
& Ink)
CP testing &
laser repairFlow
QCControl
Item
Vendors
FQC gate- Wafer inspection. Appearance. Document check
WB Quality Control Flow
OutgoingControl•Wafer :
V/M inspection
Customers
•Wafer :
Packing Shipping
Flow
Incomingcontrol - Chemical, Reticle, Target
. Appearance
. COA
IQC gateIQC gate- Wafer inspection. Appearance. Wafer ID
Q15
OQC gate- Label content- Documents check
FQC gate- Wafer inspection
. Appearance
. Document check
V/M inspection(AOI)
•Wafer :Bumping Flow
QCControl
Item
Vendors
Reliability Test (Procedure)
APG (TSOP/BGA/QFP/QFN) LCDD (TCP/COF)
Preconditioning
Samples In Samples In
Q16
Report Issued Report Issued
Reliability Stress
Environment Mechanical
FT or O/S Judgement
Reliability Stress
Environment Mechanical
FT Judgement
Reliability Test (Capability)
Item Description Brand Model Quantity1 IR Reflowing Oven TANGTECK SMD-14-M10H 12 Temperature & Humidity Tester (TH) HITACHI EC-13HHP 43 Temperature Cycle Tester (TCT) HITACHI ES-63LMV 44 Thermal Shock Tester (TST) YOSHIDA TSL-60 15 Temperature Humidity Bias Tester (THB) HITACHI EC-43MHP 26 High Temperature Storage Lift Tester (HT-SLT) ISUZU ESF-220S 27 Low Temperature Storage Lift Tester (LT-SLT) HITACHI EC-33LTHP 28 High Accelerated Stress Tester (HAST) HIRAYAMA PC-422R7 39 Pressure Cooker Tester (PCT) HIRAYAMA PC-242HS-A 2
Q17
9 Pressure Cooker Tester (PCT) HIRAYAMA PC-242HS-A 2
Reflowing
TH
TCT
TST
THB
HT-SLT
LT-SLT HAST
PCT
All testing conditions follow and meet JEDEC, MIL a nd JEITA International Standards
Failure Analysis (Package Level)
Electrical Failure Analysis CapabilityItem Description Brand
1 Open/Short & Leakage Tester KEITHLEY
2 Curve Tracer TEKTRONIX
3 LCR Precision Meter (20Hz~1MHz) HP4284A
Physical Failure Analysis CapabilityItem Description Brand
1 SAT, Scanning Acoustic Tomograph SONIX
2 SEM, Scanning Electron Microscope HITACHI
FE-SEM, Field Emission SEM HITACHI
3 XRM, X-RAY Microscopy Feinfocus
Sample
Open/Short Test
Leakage (Hi/Lo)
Idd Current Test
DC Tester
Open/Shortonly
Curve Tracer
(XRM)
- Sample - Pin Assignment- Socket
XRMXRM
Failure Analysis ProcedureProcedure
PASS
(Cause)
Q18
3 XRM, X-RAY Microscopy Feinfocus
4 Microscope (High Magnification) Nikon
5 Microscope (Measurescope) Nikon
6 Microscope (Stereoscope) Nikon
7 Cutter (low speed) Buehler
8 Grinding unit Buehler
9 Polishing unit Allied tech.
10 Decapsulator NTG
11 Auto-Milling Ultratech
12 Ion Milling System HITACHI
Material Analysis CapabilityItem Description Brand
1 DSC/TGA/DMA, Thermal Analysis Perkin Elmer
2 FT-IR, Fourier Transform Infrared Perkin Elmer
Decapsulation/X-section
SEMSEM
(Ion Miling)
Report
SATSAT(Cause)
(SEM)
(SAT)(Cause)
Chip ProbingChip Probing
(Cause)
Open/Shortonly
Ion Milling
AggressiveAggressive
OperationOperation
Timely Timely
ImplementationImplementation
Effective Effective
ActionAction
24 hrs, 365 days, non-stop operation to carry on customer’s requirement.
In-time, On-time to implement customer’s requirement / specification.
Fix problem or Meet requirement at once by effective action.
Total Customer Satisfaction
Q19
Real Real
InformationInformation
OperationOperation
FullFull--ScaleScale
ConsiderationConsideration
Not only a subcontractor, but customer’s virtual fab. & trustable partner.
From customer’s view point to consider customer’s requirement.
carry on customer’s requirement.