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Development of μ-PIC at Kyoto
Kentaro Miuchi(Kyoto University, Japan)
2003 March 19th @EVTEK,Espoo,Finland
Contents1. μ-PIC detector
2. Development History3. Current Status4. Future Works
5. Summary
2003 March 19th Kentaro Miuchi
10cm
1. µ-PIC DetectorMicro Pixel Chamber2-D imaging detector for charged particlesmanufactured by the PCB technology
400μm
100μm
10cm×10cm μ-PIC256anode + 256 cathode stripsFine position resolutionHigh gainDischarge damage: small
2003 March 19th Kentaro Miuchi
3cm
2. Development History
Test Piece (3×3cm2)several pieces up to now~$5,000 /pcfor “trials”(material, technology, …)
10cm
Full size detector (10×10cm2)5 detectors up to now ~$30,000/pc
(including the motherboard.)
(History of the fight against the discharges)
2003 March 19th Kentaro Miuchi
Development of the Full size detectorsstarted in 2000Made by Toshiba
-15 µmCu, Ni, Aupolyimideµ-PIC 3-20 µmCu, Nipolyimideµ-PIC 4,5
-25 µmCu, Ni, Aupolyimideµ-PIC 2+10 µmAnode height
W, Ni, AuElectrode
ceramicsSubstrate
µ-PIC 1Detector
ceramics
Ni+Au
WManufacturing: easy (uniform anode electrodes)Ceramics: Catalytic
discharge conductive not for practical use
2003 March 19th Kentaro Miuchi
Development of the Full size detectors
-15 µmCu, Ni, Aupolyimideµ-PIC 3-20 µmCu, Nipolyimideµ-PIC 4,5
-40 µmCu, Ni, Aupolyimideµ-PIC 2+10 µmAnode height
W, Ni, AuElectrode
ceramicsSubstrate
µ-PIC 1Detector
Polyimide base: betterµ-PIC 2: low gain (<3000)µ-PIC 3: higher gain (~7000)Gold plating: scatters around
discharge conductive
polyimide
Ni+Au
Cu
Bad pixel found in µ-PIC 3
2003 March 19th Kentaro Miuchi
Development of the Full size detectors
-15 µmCu, Ni, Aupolyimideµ-PIC 3-20 µmCu, Nipolyimideµ-PIC 4,5
-40 µmCu, Ni, Aupolyimideµ-PIC 2+10 µmAnode height
W, Ni, AuElectrode
ceramicsSubstrate
µ-PIC 1Detector
u-PIC1
u-PIC3
u-PIC4,5G
AS
GA
IN
102
gas gains 104
µ-PIC 4,5: good performancehigh gain (~15000)stable operation(1000 hours with gain 3000)
2003 March 19th Kentaro Miuchi
Development of the Full size detectorsµ-PIC 4,5: problems to be solvedanode electrodes heights are not uniform large vessel for the plating was preparedµ-PIC 6 will be shipped
at the end of March
2003 March 19th Kentaro Miuchi
3. Current Status (µ-PIC 4,5)Spectrometry
energy resolution FWHM30%@5.9keV
1mm slits
position resolution σ=290µm
Imaging
2003 March 19th Kentaro Miuchi
8 cm
cosmic-ray
1.7μsec=8cm
μ-P
ICY[
cm]
10
0
µ-PIC for Micro-TPCdrift enclosure8cm drift length4.7cm/µs drift V
micro-TPCX,Y information : µ-PICZ information: timing
2003 March 19th Kentaro Miuchi
tracking the charged particles@proton synchrotron(gain~3000)
proton(0.8GeV/c) Λ particle?
good tracking abilityfor large dE/dx particles
2003 March 19th Kentaro Miuchi
tracking the charged particles@laboratory (gain~7000)
90Sr (2.2MeV β)
not enough…more gain
2003 March 19th Kentaro Miuchi
MeV gamma-ray imaging
Astronomy
sensitivity gap2006-
-2000
AstronomyMedical useSafety keeping
2003 March 19th Kentaro Miuchi
Compton γ-ray Imaging
γ
γ’
Double Compton Methodc
event cone
3γ⇒ 1 directionNo background rejectionneeds TOF to know UP or DOWN
γ1
γ2
γ3
COMPTEL
Eγ’, x, y, z
Ee, x, y, z
RECONSTRUCTION
γγ
γγ
φE
mE
m1cos
EEE2
e
'
2e
e'
cc+−=
+=
2003 March 19th Kentaro Miuchi
RECONSTRUCTIONSCHEMATICS
Ee, e
POINT
Our method Methodc
α⇒BG rejection
2003 March 19th Kentaro Miuchi
prototype
IT WORKS!!(for the first time in the world)
NaI
133Ba (356keV γ)
typical event
Micro-TPC
γ-ray imaging with micro-TPCelectron track: micro-TPC
+scattered γ: NaI(Tl) scintillator
10°
FULL RECONSTRUCTION
2003 March 19th Kentaro Miuchi
試験結果
reconstructed imagesperformanceangular resolution ~40°
not enough…more gain
source -8cm(Y)Current status of µ-PIC
X-ray: OKmicro-TPCγ-ray imaging
not enough
×10 improvement for minimum ionizing particles
2003 March 19th Kentaro Miuchi
4. Future WorksAmplifier modifications
SONY semi-custom ICASD (amplifier-shaper
-discriminator) chipshaping time 16ns->80ns
Rfeedback100k10k
20mV
8mV
puls
e he
ight now
afterPSpice simulation
test chip is shipped in March 20thpulse height × 2 expected
2003 March 19th Kentaro Miuchi
New plating technology( for µ-PIC 7+, hopefully)
1. Electroless plating 3. Surface etching
基板
anode
2. Via-fill plating 4. Electrode etching
cathode
High and uniform anode electrodes will be made.
2003 March 19th Kentaro Miuchi
Collection efficiency
Near pin
Cathode gap
・・・
・・・
・・・
30%
65%
4%
Drift end points
Geometry studiesSimulation work at Kyoto
(Maxwell + Garfield)μ-PIC4,5Cathode width: 314μmCathode diameter: 260μmAnode height: -20μmAnode diameter: 50μm
2003 March 19th Kentaro Miuchi
High efficiency is expected!!
μ-PIC7 (with new plating technology )Cathode width: 314μmHole diameter: 260μmAnode height: 10μmAnode diameter: 70μm
Collection
Near pin
Gap
・・・
・・・
・・・
97%
2%
<1%
2003 March 19th Kentaro Miuchi
Well type μ-PIC
基板
anode
cathode
3cm test piece with laser machining-->discharge problem
•Technology breakthrough is expected (RIE process?)
•Energy resolutions?
Manufacturing process
AdvantagesNo near pin electronsNo discharge?
2003 March 19th Kentaro Miuchi
5. SummaryDevelopment History
five full-size μ-PICPolyimide base + no gold plating
Current StatusX-ray 2-D imaging detectorMicro-TPCGamma-ray imaging
Future Works new plating technologywell type μ-PIC