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FCCL FCCL
2011. 5. 20
Slitting CTE
/
-1/13--1/16-
Cu
,
Drum Speed
,
,
(AOI)
Knife Setting
T.S
-//Lot Tracking
- Distributed Control System
- Real Time Plant Information System
- -Ray, FESEM, EDS
-,
-(AAS, ICP),
1 step
Nucleation
Copper foil
Drum (Shiny side)
Check List
Drum (Shiny side)
2Step
Growth
3Step
Growth
Drum (Shiny side)
Drum (Shiny side)
-2/13--2/16-
Anode : CuSO4
+ 2H+ + 2e Cu + H2SO
4
Cathode : H2O 2H+ + 2e + O
2
Total reation : CuSO4
+ H2O
H2SO
4+ Cu + O
2
Check List
Thickness
Roughness
Tensile strenth
Elongation
Surface (Micro-porosity, Pinhole et al)
Thickness
Roughness
Tensile strenth
Elongation
Surface (Micro-porosity, Pinhole et al)
MechanicalBonding
CorrosionResistance
ChemicalBonding
Heat/ChemicalResistance
-3/13--3/16-
Bonding Resistance BondingResistance
Check ListCheck ListPeel Strength
Roughness
Peel Strength
Roughness
Heat resistance
Chemical-resistance
Heat resistance
Chemical-resistance
Slitting
-4/13--4/16-
Check ListCheck ListPeel Strength
Roughness
Peel Strength
Roughness
Heat resistance
Chemical-resistance
Heat resistance
Chemical-resistance
FCCL (Flexible Copper Clad Laminate) FCCL , , / Pick-up
FCCL / CCL
FCCL CCL1)
FCCL
FCCL
10
PCB3) (Matte)
FPC4) (Matte)
Polyimide
FR-42)
10
CCL
-5/13--5/16-
: Polyimide
:
Barrier :
: Polyimide
Rigid PCB
1) CCL: Copper Clad Laminate, 2) FR-4 : , 3) PCB: Printed Circuit Board, 4) FPC: Flexible Printed Circuit Board
Flexible Flexible PCBPCB
PCB ,
L/S 20 / 20 L/S 30 / 30 L/S 40 / 40 L/S 50 / 50 L/S 60 / 60
Road Map
(Rz, )
3 0
4. 0
5. 0
6. 0
LSU-STN 12
LSU-STN 18
LSU-STN 35
LSB LPV 18
-6/13--6/16- ( )
5 10 15 30 50
2. 0
3. 0 LSB-FXN 12
LSB-FXN 9
LSB-FXN 7
Carrier 3~5
LSB-LPV 18
9~12
LSB-FXU 12
FCCL(Flexible Copper Clad Laminate) (, Polyimide) () LCD COF Flexible PCB Substrate
FCCL
FCCL
i i C CCL
(Flexibility)
3 Rigid PCB
Flexible PCB
CCL
FCCL
3
Width 48 158 Width 250 500
-7/13-
Polymer ()
Copper ()
COF Application FPC Application
Width 48~158 Width 250, 500
, Rigid PCB Flexible,, Fine
Pitch Flexible PCB, 2 Layer Shift
Substrate Trend
Substrate for
Ri id PCBLaminating Thick+ CCL
Copper
Rigid PCBRigid PCBaminating
Substrate for
Flexible PCB
Laminating
Sputtering
C ti
(12~70) Prepreg
+
Polyimide(PI)(75)
FCCL(3 Layer)
+
Adhesive(10~20)
(12~35)
+ FCCL( )
Polyimide
AdhesiveCopper
Prepreg Rigid PCB
Flexible PCB
TCP
-8/13-
PCB : Printed Circuit BoardCCL : Copper Clad LaminateFCCL : Flexible Copper Clad Laminate
ThinCasting
Laminating
+
Polyimide(PI)(25~38)
(2 Layer)
(12~18)
Polyimide
Copper
Prepreg : Glass fiber Epoxy
Main Trend of CCLFlexible, 2 Layer, Environment
Friendly
COF
Flexible PCB
Adhesive Type Adhesiveless Type
3 FCCL2 FCCL
Casting/Laminating Sputtering
C F il
Copper FoilSputtering +
Electroplating
2 FCCL 3 FCCL
PI (Varnish/Film)
Copper Foil
PI Film
Cu Layer
PI Film
Adhesive
PI Film
Cu Layer
PI
(Varnish/Film)
Copper FoilCopper Foil
PI Film
Adhesive
-9/13-
Fine Pitch
GoodGood
GoodGood
ng
Copper Foil
Pitch
Copper
Foil-
/
- Epoxy
FCCL
Casting, Laminating Fine Pitch ,
Sputtering Fine Pitch
Layer
Casting
Laminatin
PIAdhesive
or TPI
Copper Foil
PI
12~70
12~35
50
Copper Foil
PI Varnish
PI
Adhesive
or TPI
Foil
Roll
: , Resin, Epoxy
-
:
- PI Varnish
: ,
- Casting
-
: Tension
- Laminating
- 12
9 Fine Pitch
- Short
- Fine Pitch
Oven
x x x x
x x x x
3
2
2
-10/13-
Sputtering
Tie Coat
Electro
Plating
PI
2~8
40
40
Copper Foil : Tension
:
- Plasma
- Sputtering
-
- 2
- Fine Pitch
-Bending,
- Driver IC Bonding
PI
Vacuum
Chamber
Target
Drum
+
Anode
(Cu ball)
-
-
-
-
x x x x
2
2 FCCL
Laminating Casting Sputtering
Copper
Layer
Limited, Difficult Limited, Difficult Easy
Thickness () 12, 18 12, 18 8
Surface Defect
Etching Layer Cu layer only Cu layer onlyCu layer +
Sputtered Layer
PI
Layer
Manufacturing
Method
Thermoplastic PI
+ PI 2
Casting
(Varnish Coating+Drying)PI Film
Thickness () 40 40 38 (35)
Total Thickness() 52 52 46
-11/13-
* ILB : Inner Lead Bonding
GoodGood
GoodGood
Fine Pitch
Transparency
Peel Strength
Ion Migration
Price
2 FCCL
2 CCL
LCD
AutoMobile
PDAPMP
HDD
Notebook PC
-12/13-
2 CCL
DVCDSC
DMB
Cellular Phone
Sputter Type FCCL
Sputter Type FCCL PI Tie-coat Cu Seed ,
NiCr Tie-coat Layer( )
Cu Seed Layer
Sputtering
Electroplating Cu Layer (8)
Electroplating
PET Fillm (50)
Polyimide Film (25,38)
(100~300) (0.1~0.3)(8)
Laminating & Slitting
Stiffener (PET Film)
Slitting
: 48, 70, 96, 105, 158, 250
-13/13-
Stiffener
Polyimide
Copper
Polyimide
Copper
Copper
Polyimide
Copper
LCD COF () FPC () FPC ()
Plasma Treatment & Sputtering
( )
Electroplating
()Laminating & Slitting
(Stiffener )
FCCL Sputtering Electroplating
Sputter Type FCCL
PI Film
(PET Film)
-14/13-
PI Film (NiCr/Cu) FCCL (48~250)
PI Film ( )
Tie-coat
: PI Cu
: Cu PI
Cu seed
:
Stiffener ()
FCCL
COF fine pitch FCCL
Fine PitchFine Pitch
-
- Tiecoat Layer
- (PI film )
- Sputter Trouble
-
-15/13-
- PI Film Thermal Damage
-
(Curl, Twist )
-
- Tiecoat , ,
-
- ,
-
Etch FactorFine Pitch
/PI Low Profile
Bottom
Top
Thickness
Etched Lead
PI Film
Etch Factor =2 Thickness
( Bottom Top ) PI Film
- PI Film / Tie-coat Roughness
Tie-coat Material
M t i l (Ni C Ni C All t )Outer Lead
Semi-additive Process
-16/13-
- Material (Ni, Cr, Ni-Cr Alloy etc)
- Composition
- Thickness
Electroplated Cu Layer
- Grain Size & Distribution
- Texture (Crystallographic Orientation)
Outer Lead
Inner Lead
Chip LCD Panel, PCB FCCL
1. 4
2. (Method B)
3. 150 , 30min annealing
(Method C)
4. MD, TD
LSL USL
Potential (Within) C apability
Within
Overall
1. PI Film
: ,
2.
3. Roll to roll Tension
4. ,
-17/13-
0.090.060.03-0.00-0.03-0.06-0.09
C pm *
C p 2.27
C PL 3.57
C PU 0.96
C pk 0.96
C C pk 2.27
Pp 1.67
PPL 2.63
PPU 0.71
Ppk 0.71
O v erall C apability
Surface Morphology
(After Plasma Treatment)
-
Fine Pitch
Normal Surface Damaged Surface
: Plasma (DC, AC, RF), Ion Gun
- ,
: Ar, O2, N2
- Power
- PI film
- Tie-coat
: ,
-
-18/13-
R/W
U/W
Drum
Pretreatment
Target
Pattern
-
- PI Film
-