From Technologies to Market

5G impact on RF Front End Modules & Connectivity for

Cellphones

2018 report

June 2018

Sample

2

Biography & contact

Technology & MarketAnalyst, RF Devices & Technologies

Division Director, Power & Wireless

Claire Troadec is Director, Power and Wireless, at Yole Développement (Yole) where she has been a member of the MEMSmanufacturing team since 2013. Claire graduated from INSA Rennes in France with an engineering degree in microelectronicsand material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer atthe IMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devicesfrom 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in thesemiconductor field.Claire also managed her own distribution company before joiningYoleDéveloppement.

As a Technology & Market Analyst, specialized in RF devices & technologies iwithin the Power & Wireless division at YoleDéveloppement (Yole), Cédric Malaquin is involved in the development of technology & market reports as well as theproduction of custom consulting projects. Prior his mission at Yole, Cédric first served Soitec as a process integration engineerduring 9 years, then as an electrical characterization engineer during 6 years. He deeply contributed to FDSOI and RFSOIproducts characterization. He has also authored or co-authored three patents and five international publications in thesemiconductor field.Cédric graduated from Polytech Lille in France with an engineering degree in microelectronics and materialsciences.

5G impact on RF Front End module and connectivity for cell phones | Sample |

3

TABLE OF CONTENTS

REPORT OBJECTIVES 6

METHODOLOGY 8

EXECUTIVE SUMMARY 14

1 – INTRODUCTION TO 5G 36

2 – GLOBAL MOBILE ECOSYSTEM 55

Smartphones facts and figures 56

RF spectrum 74

RF front-end industry 92

Innovation in RF front-ends 101

Wi-Fi technology landscape 117

3 – MARKET FORECASTS 127

Radio frequency power amplifiers (RF PAs) 130

Radio frequency low-noise amplifiers (RF LNAs) 134

Switches 138

Filters 142

Antenna tuners 146

Millimeter wave FEM 150

All components 153

RFFE module 159

Wafer projections 168

4 – EVOLUTION TRENDS 177

Network performance and technologies 178

Future architecture 187

New RF front-end 204

5 – INDUSTRIAL PLAYERSAND MARKET STRATEGIES 210

RF front-end ecosystem 211

Front-end players capability and plants 214

RF front-end players strategy 219

New entrants 229

CONCLUSIONS AND OUTLOOK 235

RELATED REPORTS 241

APPENDIX – BACK TO BASICS: DESCRIPTION OF THE RFCOMPONENTS IN RFFE MODULES 242

Power amplifiers 246

Low noise amplifiers 261

Filters 267

Switches 285

Antenna tuning 301

Carrier aggregation 305

OFDM 318

5G impact on RF Front End module and connectivity for cell phones | Sample |

4

COMPANIES CITED IN THE REPORT

AIROHA, Akoustis, Alcatel, Alcatel-Lucent, Analog Devices Inc. (Hittite),Amazon, Amkor, Apple, ASE Group, ASUS, AT&T, BLU, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Brocade, Cavendish Kinetics, Cisco, China Mobile, China Telecom,

China Unicom, Coolpad, DelfMEMS, Ericsson, Fujitsu, GLOBALFOUNDRIES, Gartner, Gionee, Google, Facebook, HTC, Huawei (HiSilicon), Infineon, Intel, IPDIA, JCET/STATS ChipPAC, KDDI, KT, Kyocera, Lava, Lenovo, LG, LG U+, MACOM, Marvell, Maxim Integrated, Mediatek, Microsoft, Mitsubishi Electric, Motorola, Murata Manufacturing Company, Nokia, NEC, NTT Docomo, NXP Semiconductors (Freescale), OMMIC, OnePlus, OPPO, Orange, Panasonic, Peregrine Semiconductor/Murata, Primatec, Qorvo

(RFMD, Triquint), Qualcomm (RF360), Quantenna, RDA, Realtek, Resonant, Samsung, SKT, Skyworks Solutions Inc (RFaxis), SoftBank, Soitec, Sony Semiconductor, Sprint, ST-Microelectronics, Taiyo Yuden Company Ltd., TDK-EPC (EPCOS), TCL, Telefonica, Telia, Telstra, Towerjazz, TPSCO, TSMC, T-Mobile, USI, UMC, Verizon, Verykool, Vivo, Vodafone, Win Semiconductors Corp., Wilocity,

WIPAM, Wisol, WiSpry, Xiaomi, ZTE, and more

5G impact on RF Front End module and connectivity for cell phones | Sample |

5

OBJECTIVES OF THIS REPORT

• Ecosystem identification and analysis:

o Determine market dynamics

o Technical market description

o Economic requirements, bysegment

o Key players, by market and analysis

o Market size and market forecast in $M and Munits

• Analysis and description of market and technologies involved:

o Major players worldwide

o Technology identification for different devices and processes

o Competing technologies

o Main technical challenges

o Future direction

5G impact on RF Front End module and connectivity for cell phones | Sample |

6

SCOPE OF THE REPORT

RF and Wi-Fi Bluetooth components and Front-End modules are considered in this report. Modem, transceivers, antennas, IPDs, … are not covered.

RF components (PA, LNA, filters, switches, antenna tuners)

4G and 5G technologies

Wi-Fi & Bluetooth modules…

Modems, transceivers, baseband processors

Antennas, IPDs, …

Topics NOT included in the report

Focus of the report

5G impact on RF Front End module and connectivity for cell phones | Sample |

7

AIR INTERFACE STANDARD PENETRATION RATE

In 2017, GSM and HSPA together represent 54% of cellular technology in mobile handsets. LTE continuous progression along with the upcoming 5G offering will lead to an inflexion point in between 2018 and 2019.

• HSPA record the strongest decreaseenabling LTE penetration

• Among LTE standards, LTE-A andLTE-A Pro are those that betterpenetrate the mobile market. LTEstart to phase out by 2020

• 5G sub 6 GHz will take off onluxury phone from 2019 withsignificant volume and will then beextended in some of the high endphones explaining fastest adoptionthan those of LTE-A Pro

• 5G millimeter wave phase in shouldstart in 2021 and could come formid tier phone OEM looking fordisruption

5G impact on RF Front End module and connectivity for cell phones | Sample |

88

SMARTPHONE MARKET SHARE IN VALUE

Top 5 handset OEM together capture 74% of the market value. Among the other numerous brand, Xiaomi is the most likely to change this ranking.

• Apple remain the champion of market

value with 31% of smartphone market

value, it achieved a record of 141 $B of

net sales in 2017 for the mobile

segment

• Samsung consolidate its 2nd position

with 22% of global smartphone market,

almost 100 $B generated

• Huawei rank 3rd with 37 $B of revenue

generated in the mobile segment

• Oppo and Vivo complete the top 5,

however Xiaomi competition is even

more intense and Xiaomi is expected

to enter the top 5 in 2018

• Among the other brand, ZTE is under

pressure with the recent ban decided

by US government. Commercial war is

engaged with Chinese government still

blocking NXP acquisition by

Qualcomm

5G impact on RF Front End module and connectivity for cell phones | Sample |

99

CELLULAR MODEM CAPABILITY VS TECHNOLOGY

Gigabit LTE linear evolution with Carrier Aggregation technology scaling in handset augmented by 4x4 MIMO technology. mmW technology could be a disruptive technology for the very next generation of handset.

• Carrier Aggregation (CA) is the driving

technology employed by chip maker for

data rate improvement

• Today downlink speed reached a record

of 1.2 Gbps thanks to the use of 5

component carriers (CC).

Uplink speed reach 300 Mbps (3CC)

• Next generation phone could

theoretically reach 2 Gbps for the

downlink with 5CC

• MIMO 4x4 is now supported by all chip

vendors allowing spectral efficiency

improvement. It is extended through

more supported CC increasing the

possible number of spatial stream (up to

12 today)

• All chip vendors support 256QAM since

the 3rd modem generation

• mmW technology come as a disruptive

technology to traditional CA scaling and

is developed by main modem vendors

for future handset generation

5G impact on RF Front End module and connectivity for cell phones | Sample |

1010

EVOLUTION TO DUAL CONNECTIVITY

Sub 6 NR UHB (ex N78) to be aggregated on LTE bands (ex 1, 3, 7). Mm-Wave bands provide extra capacity for real time upload and download

Control Extra upLink

with 5G mmW

• Sub 6 NR UHB are likely to be impacted by harmonics because

of the wide bandwidth. It could lead to receiver desensing

while LTE transmit. For instance, 2nd harmonic LTE band 3 fall

into NR band N71. It is thus important to design high Q filters. Rx

Tx

N71

B3

B3 2nd harmonic

5G impact on RF Front End module and connectivity for cell phones | Sample |

1111

REGIONAL ALLOCATION FOCUS ON ULTRA HIGH BAND

Ultra high fat band adoption is largely expected worldwide through band N77, N78, N79

Source Qorvo modified by Yole

• Korea and Japan are the

main user of UHB LTE

spectrum. Both countries

consider UHB spectrum

extension through 5G NR

• UHB 5G spectrum

expansion is also expected

in Europe, China, Russia and

India

• FCC have not yet decided

to expand UHB spectrum

in the US

5G impact on RF Front End module and connectivity for cell phones | Sample |

1212

RF FRONT END SEGMENTATION

Module integration and multiplication, plus RF signal multiplexing were the main evolution in RF front end market in 2017

• More OEM are moving for integration this

year with OEM such as Xiaomi starting to

use PA Module while it used to be on a

discrete architecture 1 year ago.

• Fully integrated PA module (PAMiD) still

only are affordable in high end segment.

However Huawei opened up a path with

its P10 using Skyworks PAMiD

• Rx diversity module also made a huge

penetration in the front end with

implementation of more carrier

aggregation (up to 5-6 CC) and MIMO 4x4

• Multiplexer now have entered the market

with quad and quint-plexer also following

carrier aggregation and MIMO 4x4

0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%

Apple - iPhone X - A1902

Apple - iPhone X - A1901

Apple - Watch Series 3

Samsung Galaxy S8 - SM950F

Samsung Galaxy S8 - SM95U1

Huawei P10

Sony Xperia XZs

Asus ZenFone 4 Pro

Xiaomi Mi6

Area Distribution per Function

PAMiD FEMiD RxDM PAM Multiplexer Total

5G impact on RF Front End module and connectivity for cell phones | Sample |

1313

MARKET FORECASTS

5G impact on RF Front End module and connectivity for cell phones | Sample |

1414

ECOSYSTEM ANALYSIS

5G impact on RF Front End module and connectivity for cell phones | Sample |

15

RELATED REPORTS

5G impact on RF Front End module and connectivity for cell phones | Sample |

5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. Indeed, new radio frequency bands, sub-6 GHz, and mm-wave (as defined in 3GPP release 15) pose big challenges for the industry. However, with these challenges comes opportunity to disrupt the market’s leadership.

On the sub-6 GHz side, the current front-end leaders (Broadcom, Qorvo, Skyworks, and Murata) have already begun adapting to these changes. Broadcom prepared for the arrival of 5G ultra-high band by integrating mid and high bands together. And with its FBAR BAW filter technology, Broadcom also owns the main critical building block for the high and ultra-high frequency bands.

Skyworks is positioned on the 5G ultra-high band market with its newly announced Sky5TM platform. Moreover, the company has already earned some design wins in the high-end segment with its SkyOneR LiTE platform, in addition to the low-end segment with its leading position among Chinese OEMs (Huawei, Oppo, Vivo, Xiaomi).

Qorvo has a similar approach, with a broad product portfolio covering the high-end and low-end segments with its RF FusionTM and RF FlexTM platforms, respectively. Another Qorvo strength is its internal test and packaging capability, which enable quick reaction time and continuous improvement. Notably, Qorvo was the first player

to unveil a front-end module for ultra-high band coverage.

Murata mostly covers the low band, but is very well positioned for the growing, diversity module market.

Qualcomm is the new entrant that brings with it an end-to-end solution from modem to antenna. Also, strategic investment in TDK Epcos’ filtering technology has become profitable. The first revenue was generated in the RF front-end segment during 2017. We can expect further revenue to come in the near future. A first mobile phone (i.e. Sony’s XZ2) already adopted Qualcomm’s complete solution.

Along with sub-6 GHz, the mm-wave front-end module will completely disrupt the front-end industry, representing a completely different technology mindset that could create a new path to high data-rate access. While Qualcomm is one of the new entrants clearly positioned for mm-wave technology, all of the top platform providers (i.e. Intel, Samsung, HiSilicon, and Mediatek) are exploring this new business opportunity.

The sub-6 GHz radio band will always be required for radio coverage and link integrity, but complexity could drop in the sub-6 GHz regime with mm-wave technology’s arrival, especially in dense urban areas when the mm-wave network is deployed. The mud fight has already begun.

5G’S IMPACT ON RF FRONT-END MODULE AND CONNECTIVITY FOR CELL PHONES 2018Market & Technology report - July 2018

5G - WHO HAS THE MOST TO WIN (AND LOSE)?

How is 5G enabling new business opportunities despite flat mobile growth?

KEY FEATURES• Market forecast 2017 - 2023,

including revenue, players, and volumes

• Current 5G characteristics and future outlook, including carrier aggregation, MIMO, dual connectivity, and new wave form

• Roadmap for technology evolution and future developments

• RF front-end - industry strategy• Back to basics - a detailed

description of RF device functions and their challenges/key characteristics

WHAT’S NEW• Wi-Fi connectivity market forecast

2017 - 2023• Mm-wave front-end module

market forecast 2017 - 2023

OBJECTIVES OF THE REPORT• Ecosystemidentificationand

analysis:> Determine market dynamics> Technical market description> Economic requirements, by

segment> Key players, by market and

analysis> Market size and market forecast

in $M and Munits• Analysis and description of market

and technologies involved:> Major players worldwide>Technologyidentificationfor

different devices and processes> Competing technologies> Main technical challenges> Future direction

(Yole Développement, July 2018)11

mm-WAVE

SUB 6 GHZCarrier Aggregation

4x4 MIMO

256 QAM

Ma-MIMOBeam formingUHF spectrum

Non exhaustive list of companies 2018 – 2020+

From the lte race to the 5G mud fight

5G’S IMPACT ON RF FRONT-END MODULE AND CONNECTIVITY FOR CELL PHONES 2018

5G OFFERS A BIGGER MARKET OPPORTUNITY TO THE RF FRONT-END INDUSTRY…

The mobile handset RF front-end market, along with the WiFi connectivity sector, is expected to reach $35.2B in 2023 at a CAGR of 14%. LTE evolution clearly is the first growth wave (as we stated in our 2017 report), but most of the market opportunities in the mid-term will come from 5G non-stand-alone (NSA) radio, which became prevalent in late December 2017 (as defined in 3GPP during release 15). The need for dual connectivity (i.e. the 5G new radio (NR) band attachment to the LTE) implies evolution on RF front-end architecture and additional components.

Not all components will exhibit equal market growth. Filters, which represent the RF front-end industry’s biggest market segment, will almost triple from 2017 - 2023. This growth will come mainly from the significant penetration rate of high-quality BAW filters, which will be required for the ultra-high frequency range defined by 5G NR. Another example is co-existence filters for diversity antenna-sharing with Wi-Fi, since rejection band will be critical.

The LNA market is expected to grow at a 16% CAGR with the implementation of the diversity module, along with integration in power amplifier modules for handsets. The switch market will enjoy the same growth due to the addition of a new RF path with 4x4 MIMO implementation, which will lead to more diversity switch needs.

The antenna tuner market is also expected to record significant growth with 4X4 MIMO technology’s penetration. It is worth noting that 4x4 MIMO will be mandatory for 5G.

Power amplifier (PA) will be the sole market to remain almost flat over this period. High-end LTE PA market growth, especially in high and ultra-high band, will compensate for the 2G/3G market’s shrinkage (currently, this market is handled by multi-mode multi band (MMMB) PA).

2017-2023 market outlook

(Yole Développement, July 2018)

Total RF components & FEM/PAMiD module manufacturersFiltersAntenna tunersSwitchesPAsLNAsmmW FEM

$22,5BCAGR +19%

$7BCAGR +7%

$1BCAGR +15%

$3BCAGR +15%

$35B

$8B

$5B

$463M

$1B

$15B2017

2023

$423Mmm-Wave

$246M

$602MCAGR +16%

CAGR +14%

…BUT COMPLEXITY FOR THE RF FRONT-END SHOULD BE EXPECTED TOO

LTE evolution has led to complex architecture in today’s mobile phones, mostly due to carrier aggregation. Meanwhile, RF’s board area and available antenna space have been reduced, leading to a densification trend with more handset OEMs adopting power amplifier modules and implementing new technics, i.e. antenna-sharing between LTE and WiFi. In the low-frequency band, the inclusion of the 600 MHz band (for which T-Mobile recently acquired licenses) will

pose new challenges for low-band antenna design and antenna tuners.

5G will add even more complexity, with new radio bands released in ultra-high frequencies (N77, N78, N79). This first field is being addressed by Skyworks and Qorvo via a new product release, as explained in this flyer’s first section. Band re-farming (early bands are N41, N71, N28, N66, with more to come) with dual connectivity will also contribute to increasing constraint for the front-end. More densification in front-end modules will be required to enable new band integration, which is the approach followed by Broadcom with its innovative mid/high band module.

Another new 5G requirement will be 4x4 MIMO implementation, which will turn from a “nice to have” luxury on LTE high-end mobile phones to a “must-have” for every 5G handset. This will add a significant amount of RF streams in the handset, and combined with carrier aggregation requirements will lead to more complex specifications for antenna tuners and multiplexers.

Last but not least is the implementation of the mm-wave module into the handset - a topic that poses many challenges, ranging from antenna array integration (taking into account radiating efficiency and hand-blockage effects) to power amplifier efficiency, since antenna gain cannot be too high given the low number of antenna array elements allowable in the handset format. While still at the R&D level, great progress

RF front-end evolution from 2017 to 2020+

(Yole Développement, July 2018)

HB module

MB module

LB module

UHB module

HB+MB module

LB module

> 3 GHz

> 2 GHz

> 1.5 GHz

UHB module

HB+MB module

LB module

2017 2018 2019

< 6GHz

> 700 MHz

NR band dualconnectivity

600 MHzinclusion

More CABand refarming

Densification

> 2020

UHB module

HB+MB module

LB module

mmWmmW module

Band refarming

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)AIROHA, Akoustis, Alcatel, Alcatel-Lucent, Analog Devices Inc. (Hittite), Amazon, Amkor, Apple, ASE Group, ASUS, AT&T, BLU, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Brocade, Cavendish Kinetics, Cisco, China Mobile, China Telecom, China Unicom, Coolpad, DelfMEMS, Ericsson, Fujitsu, GLOBALFOUNDRIES, Gartner, Gionee, Google, Facebook, HTC, Huawei (HiSilicon), Infineon, Intel, IPDIA, JCET/STATS ChipPAC, KDDI, KT, Kyocera, Lava, Lenovo, LG, LG U+, MACOM, Marvell, Maxim Integrated, Mediatek, Microsoft, Mitsubishi Electric, Motorola, Murata Manufacturing Company, Nokia, NEC, NTT Docomo, NXP Semiconductors (Freescale), OMMIC, OnePlus, OPPO, Orange, Panasonic, Peregrine Semiconductor/Murata, Primatec, Qorvo (RFMD, Triquint), Qualcomm (RF360), Quantenna, RDA, Realtek, Resonant, Samsung, SKT, Skyworks Solutions Inc. (RFaxis), SoftBank, Soitec, Sony Semiconductor, Sprint, STMicroelectronics, Taiyo Yuden Company Ltd., TDK-EPC (EPCOS), TCL, Telefonica, Telia, Telstra, Towerjazz, TPSCO, TSMC, T-Mobile, USI, UMC, Verizon, Verykool, Vivo, Vodafone, Win Semiconductors Corp., Wilocity, WIPAM, Wisol, WiSpry, Xiaomi, ZTE, and more

Report objectives 6

Methodology 8

Executive summary 14

Introduction to 5G 36

Global mobile ecosystem 55> Smartphones - facts and figures > RF spectrum > RF front-end industry > Innovation in RF front-end > WiFi technology

Market forecasts 127> Radio frequency power amplifiers (RF PAs) > Radio frequency low-noise amplifiers (RF LNAs) > Switches > Filters > Antenna tuners > Millimeter wave FEM > All components > RFFE module > Wafer projections

Evolution trends 177> Network performance and technologies > Future architectures > New RF front-end

Industrial players and market strategies 210

> RF front-end - ecosystem > Front-end players - capabilities and plants > RF front-end players - strategy > New entrants

Conclusion and outlook 235

Related reports 241

Appendix - Back to basics: description of RF componenets in RFFE modules 242

> Power amplifiers > Low-noise amplifiers > Filters > Switches > Antenna tuning > Carrier aggregation

> OFDM

TABLE OF CONTENTS (complete content on i-Micronews.com)

AUTHORSAs a Technology & Market Analyst, specialized in RF devices & technologies iwithin the Power & Wireless division at Yole Développement (Yole), Cédric Malaquin is involved in the development of technology & market reports as well as the production of custom consulting projects. PriorhismissionatYole,CédricfirstservedSoitec as a process integration engineer during 9 years, then as an electrical characterization engineer during 6 years. He deeply contributed to FDSOI and RFSOI products characterization. He has also authored or co-authored three patents and five international publications in thesemiconductorfield.Cédric graduated from Polytech Lille in France with an engineering degree in microelectronics and material sciences.

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Claire Troadec is Director, Power and Wireless, at Yole Développement (Yole) where she has been a member of the MEMS manufacturing team since 2013. Claire graduated from INSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXP Semiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authored or co-authored seven US patents and nine international publications in the semiconductor field. Claire also managedher own distribution company before joining Yole Développement.

has been made on these mm-wave front-end silicon-based platforms, demonstrating record power efficiency and noise level improvement. Bulk CMOS is preferred by Qualcomm, with TSMC’s 28nm platform. Other possible platforms include SiGe and RFSOI, for example with GLOBALFOUNDRIES’ capability.

With this new mm-wave connectivity for cell phones, we are entering an exciting new era of technology competition and breakthrough performance. This will seriously impact RF front-end’s bill of materials, and could be useful for reducing overall connectivity cost. Who

then will be the first OEM to implement this technology when it’s ready? Could it be Chinese OEMs like Huawei and Vivo, with their strong market dynamics and appetite for differentiation/competition with market leaders like Apple and Samsung? Or will it be the current leaders, who are always first to innovate?

For this latest chapter, let’s not forget that Samsung has always been very keen to utilize innovative connectivity solutions: for example, they were the first to implement 4x4 MIMO solutions (on the S7 in 2016).

Get ready to place your bets!

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• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.

“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.

“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.

1. SCOPE 1.1 The Contracting Parties undertake to observe the following

general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.

1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.

1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted.

2. MAILING OF THE PRODUCTS 2.1 Products are sent by email to the Buyer:

• within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.

2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.

2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.

2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.

2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .

2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk.

3. PRICE, INVOICING AND PAYMENT 3.1 Prices are given in the orders corresponding to each Product

sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.

3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.

3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587

To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days

from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.

3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.

4. LIABILITIES 4.1 The Buyer or any other individual or legal person acting on

its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.

4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement

4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.

4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.

4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.

4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.

4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.

4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.

5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.

6. PROTECTION OF THE SELLER’S IPR 6.1 All the IPR attached to the Products are and remain the

property of the Seller and are protected under French and international copyright law and conventions.

6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including

any local area network); • Use in any timesharing, service bureau, bulletin board or

similar arrangement or public display; • Posting any Product to any other online service (including

bulletin boards or the Internet);• Licensing, leasing, selling, offering for sale or assigning the

Product. 6.3 The Buyer shall be solely responsible towards the Seller of

all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.

6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.

6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.

6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.

7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones

the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.

7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.

8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.

9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and

Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.

9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.

TERMS AND CONDITIONS OF SALES

© 2018

Yole Développement

From Technologies to Market

Source: Wikimedia Commons

2 | About Yole Développement

YOLE DEVELOPPEMENT – 4 DIVISIONS

Life Sciences

& Healthcare o Microfluidic

o BioMEMS

o Inkjet Printing

o Solid-State Medical Imaging& BioPhotonics

o BioTechnologies

Power

& Wireless

o RF Devices&Technology

o Compound Semiconductors& Emerging Materials

o Power Electronics

o Batteries & Energy Management

Semiconductor

& Software o Package &Assembly & Substrates

o SemiconductorManufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting & Display

o MEMS,Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

3 | About Yole Développement

3 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization of

innovative optical systems

• Financial services (due diligence,

M&A with our partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

4 | About Yole Développement

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

5 | About Yole Développement

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

6 | About Yole Développement

ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

7 | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developpers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

8 | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

9 | About Yole Développement

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

10 | About Yole Développement

OUR 2018 REPORTS COLLECTION (1/4)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 – Update

− Silicon Photonics 2018 – Update

− Consumer Biometrics: Hardware & Software 2018 – Update

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Acoustic MEMS and Audio Solutions 2017

− MEMS & Sensors for Automotive Market & Technology Trends 2017

− High End Inertial Sensors 2017

− Magnetic Sensor 2017

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product

Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− MEMS Pressure Sensor 2018 – Market & Technology Report

− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report

− Gas & Particles 2018 – Market & Technology Report

− Gas & Particles Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

− MEMS Packaging 2017 – Market & Technology Report

− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report

RF DEVICES AND TECHNOLOGIES

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018

o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting

− Automotive Radar Comparison 2018

o PATENT ANALYSES – by KnowMade

− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market

& Technology Report – Update

− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report

− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report – Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market & Technology Report – Update

− RF GaN Comparison 2018* – Structure, Process & Cost Report

− RF GaN 2018 – Patent Landscape Analysis

SOFTWAREo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Consumer Biometrics: Sensors & Software 2018 – Update

− Processing Hardware and Software for AI 2018 - Vol. 1 & 2

− From Image Processing to Deep Learning, Introduction to Hardware and Software

Update : 2017 version still available / *To be confirmed

11 | About Yole Développement

OUR 2018 REPORTS COLLECTION (2/4)

IMAGING & OPTOELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the Compact Camera Module and Wafer Level Optics

− Industry 2018 – Update

− 3D Imaging and Sensing 2018 – Update

− Sensors for Robotic Vehicles 2018

− Machine Vision for Industry and Automation 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− Uncooled Infrared Imagers 2017

o PATENT ANALYSES – by KnowMade

− iPhone X Dot Projector – Patent-to-Product Mapping

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -Update

− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report

− CMOS Image Sensors Monitor 2018* – Quaterly Update**

− Camera Module 2017 – Market & Technology Report

− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report

− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology

Report

− LiDAR for Automotive 2018 – Patent Landscape Analysis

ADVANCED PACKAGING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Advanced Packaging Industry 2018 – Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends

− 3D TSV and Monolithic Business Update 2018 – Update

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive Packaging 2018

− Hardware and Software for AI 2018 - Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018

− Thin-Film Integrated Passive Devices 2018

− Memory Packaging Market and Technology Report 2018 – Update*

o PATENT ANALYSES – by KnowMade

− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

o LINKED REPORTS– by Yole Développement and System Plus Consulting

− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -Update*

− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process

& Cost Report

− Fan-Out Packaging 2018 – Market & Technology Report – Update*

− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report

MANUFACTURING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Wafer Starts for More Than Moore Applications 2018

− Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018

− Laser Technologies for Semiconductor Manufacturing 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Equipment and Materials for 3D TSV Applications 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− Equipment for More than Moore: Technology & Market Trends for

Lithography & Bonding/Debonding 2018 – Market & Technology Report

− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report

Update : 2017 version still available / *To be confirmed

12 | About Yole Développement

OUR 2018 REPORTS COLLECTION (3/4)MEMORY

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market Monitor 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing Monitor 2018 (NAND & DRAM)

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018

o PATENT ANALYSES – by KnowMade

− 3D Non-Volatile Memories – Patent Landscape

COMPOUND SEMICONDUCTORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018

− Bulk GaN Substrate Market 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Power SiC 2018: Materials, Devices, and Applications – Market & Technology

Report – Update

− SiC Transistor Comparison 2018 – Structure, Process & Cost Report

− Power SiC 2018 – Patent Landscape Analysis

− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report – Update

− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023

– Market & Technology Report – Update

− RF GaN – Patent Landscape Analysis

POWER ELECTRONICS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for Electric Vehicles 2018 – Update

− Integrated Passive Devices (IPD) 2018

− Wireless Charging Market Expectations and Technology Trends 2018

− Thermal Management Technology and Market Perspectives in Power

− Electronics and LEDs 2017

− Gate Driver 2017

− Power MOSFET 2017

− IGBT 2017

− Market Opportunities for Thermal Management Components in Smartphones 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting

and KnowMade

− Power Modules Packaging 2018 – Market & Technology Report – Update

− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report

− Power ICs Market Monitor 2018 – Quaterly Update**

− Power ICs Market Comparison 2018* – Structure, Process & Cost Report

BATTERY AND ENERGY MANAGEMENTo MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update

o PATENT ANALYSES – by KnowMade

− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017

o LINKED REPORTS – by Yole Développement and KnowMade

− Solid State Electrolyte Battery 2018 – Market & Technology Report

− Solid-State Batteries 2018 – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

13 | About Yole Développement

OUR 2018 REPORTS COLLECTION (4/4)

SOLID STATE LIGHTING

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update

− Automotive Lighting 2018: Technology, Industry and Market Trends – Update

− UV LEDs 2018: Technology, Industry and Market Trends – Update

− LiFi: Technology, Industry and Market Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− CSP LED Lighting Modules

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Horticultural Lighting 2017

o LINKED REPORTS – by Yole Développement and System Plus Consulting

− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology Report

− VCSELs Comparison 2018 – Structure, Process & Cost Report

DISPLAYS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update

− Displays and Optical Vision Systems for VR/AR/MR 2018

− MicroLED Displays 2018 – Market & Technology Report – Update

o PATENT ANALYSES – by KnowMade

− MicroLED Display – Patent Landscape Analysis

MEDTECH

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical

− Applications 2018 – Update

− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound technologies for Medical, Industrial and Consumer 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy: from Isolation to Downstream Applications 2018

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation

Laboratory Markets 2018*

− Artificial Organ Technology and Market 2017

− Connected Medical Devices Market and Business Models 2017

− Status of the Microfluidics Industry 2017

− Organs-On-Chips 2017

− Solid-State Medical Imaging 2017

− Medical Robotics Market & Technology Analysis 2017

o PATENT ANALYSES – by KnowMade

− Microfluidic IC Cooling – Patent Landscape

− Circulating Tumor Cell Isolation – Patent Landscape

− OCT Medical Imaging – Patent Landscape

− Pumps for Microfluidic Devices – Patent Landscape 2017

− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017

− FLUIDIGM – Patent Portfolio Analysis 2017

− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017

o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade

− Organs-On-Chips 2017 – Market & Technology Report

− Organ-on-a-Chip – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

14 | About Yole Développement

OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).