Lecture 7 Mosfet

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    Electronic DevicesKEEE 2224

    Lecture 7

    Metal-Oxide-Semiconductor

    Field Effect Transistor

    Dr. Ghafour Amouzad Mahdiraji

    November 2012

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    Basic MOSFET Operation

    The current in a MOSFET is due to the flow of charge in the inversion layer or

    channel region adjacent to the oxide-semiconductor interface.

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    Basic MOSFET Operation

    Ev

    EcEFiEF

    EF

    Ev

    Ec

    Metal Oxide p-type

    m

    s

    +--

    ++

    --

    m

    s

    Ev

    EcEFi

    EFs

    EFm

    Ev

    Ec

    Metal Oxide p-type

    m< s

    Ev

    Ec

    EFiEF

    EF

    Ev

    Ec

    Metal

    Oxide

    p-type

    m

    s

    ---

    +++

    +++

    ---

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    What VG need to be applied to make

    depletion region ON?

    What VG need to be applied to make

    depletion region OFF?Positive Negative

    Basic MOSFET Operation

    p-type

    +VG

    m>

    s

    p-type

    -VG

    m<

    s

    How we can let the current flow in this device?

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    Basic MOSFET Operation

    p-type

    m> s VG= 0

    p-type

    VG= 0m< s

    ----

    ++++-----

    ++++

    ----

    ++++

    ++++

    ----

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    MOSFET Structures

    There are four basic MOSFET device types:

    n-channel enhancement mode MOSFET

    n-channel depletion mode MOSFET

    p-channel enhancement mode MOSFET

    p-channel depletion mode MOSFET

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    n-Channel MOSFETs

    Depletion-type MOSFET:

    The device is ON at zero gate voltage.

    Enhancement-type MOSFET:

    The device is OFF at zero gate voltage.

    A +tive gate voltage induces the electron

    inversion layer, which then connects the

    n-type source to drain regions.

    Electron inversion layer exist at 0 V and

    can be off with -tive voltage.

    The source terminal is the source of carriers that flow through the channel to drain.

    In n-channel device, electrons flow from the source to the drain through the channel,

    thus, the current directed from drain to source.

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    p-Channel MOSFET

    p-channel depletion mode MOSFET.p-channel enhancement mode MOSFET

    A -tive gate voltage must be applied to

    create an inversion layer of holes that

    will connect the p-type source to drain

    regions.

    Electron inversion layer exist at 0 V and

    can be off with +tive voltage.

    In p-channel device, holes flow from the source to the drain through the channel,

    thus, the current directed from source to drain.

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    Current-Voltage Relationship

    Considering a n-channel enhancement mode MOSFET with a gate-to-

    source (or gate-to-semiconductor) voltage that is less than the threshold

    voltage and with only a very small drain-to-source voltage.

    The source and substrate terminals are held at ground potential.

    With this bias configuration, there is no electron inversion layer, the

    drain-to-substrate pn junction is reverse biased, and the drain current is

    zero (regardless of pn junction leakage current).

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    Current-Voltage Relationship

    n-channel enhancement mode MOSFET with an applied gate voltage VGS>

    VT.

    An electron inversion layer has been created so that when a small drain

    voltage is applied, the electrons in the inversion layer will flow from the

    source to the positive drain terminal. Thus the current is from drain to source.

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    Field Effect on Transistor Current

    For small VDSvalues, the channel region has

    the characteristics of a resistor, so

    The inversion layer charge is a function of the gate voltage; thus, the basic MOS

    transistor action is the modulation of the channel conductance by the gate voltage.

    If VGS< VTno inversion layer ID = 0

    If VGS> VTchannel inversion charge density increases channel conductance

    increaselarger ID.

    DSdD VgI

    where gd is the channel conductance in the limit

    as VDS0.

    The channel conductance is given by

    nnd QL

    Wg '

    where n is the mobility of the electrons in the

    inversion layer and |Q'n| is the magnitude of the

    inversion layer charge per unit area.

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    Voltage (VDS

    ) Effect on Current

    (a): VGS> VTand VDS is small

    The thickness of the inversion channel

    layer in the Fig qualitatively indicates

    the relative charge density, which isconstant along the entire channel .

    (b):VGS> VTand VDS is larger than case (a)

    As the drain voltage increases, the

    voltage drop across the oxide near the

    drain terminal, which means the induced

    inversion charge density near the drain

    also decreases.

    Channel conductance at the drain

    decreases, which means the slop of the

    ID versus VDScurve will decrease.

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    Voltage (VDS

    ) Effect on Current

    where VDS(sat) is the drain-to-source voltage producing zero inversion charge density

    at the drain terminal.

    (c): VGS> VTand VDS= VDS(sat) When VDS increases to the point

    where the potential drop across the

    oxide (at the drain terminal voltage is

    equal to VT

    ), the induced inversion

    charge density get zero at the drain

    terminal.

    At this point, the incremental

    conductance at the drain is zero, which

    means that the slope of the ID versusVDScurve is zero.

    TDSGS VVV )sat(

    TGSDS VVV )sat(

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    Voltage (VDS

    ) Effect on Current

    (d):VGS> VTand VDS> VDS(sat)is larger

    than case (a)

    When VDSbecomes larger than

    VDS(sat), the point in the channel atwhich the inversion charge is just zero

    moves toward the source terminal.

    In this case, electrons enter the channel at the source, travel through the channeltoward the drain, and then, at the point where the charge goes to zero, the electrons

    are injected into the space charge region where they are swept by the E-field to the

    drain contact.

    If assuming the change in channel lengthL is small, then the drain current will be a

    constant for VDS> VDS(sat). This region is referred as the saturation region.

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    Family of ID

    versus VDS

    Now, if VGSchanges, the ID versus VDScurve will change.

    Considering following equation, where

    VDS(sat) is a function of VGS.

    A family of curves can be generated for thisn-channel enhancement mode MOSFET.

    TGSDS VVV )sat(

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    ID

    Vrs VDS

    in n-Channel Depletion Mode MOSFET

    In n-channel depletion mode MOSFET, an induced electron inversion layer exist at zero

    gate voltage.

    The current-voltage characteristics in depletion-type is exactly the same as theenhancement-type MOSFET, except that VT is a negative quantity.

    In depletion-type, a -tive gate voltage required to reduce the thickness of the n-channel

    region and also the drain current.

    One basic requirement for this device is that the channel thickness tc

    must be less than

    the maximum induced space charge width in order to be able to turn the device off.

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    MOSFET Transistor Current The operation of a p-channel device is the same as that of the n-channel, except the charge

    carrier is the hole and the conventional current direction & voltage polarities are reversed.

    2)(2

    2 DSDSTGS

    oxnD VVVV

    LCWI

    When the transistor is biased in the

    saturation region, the ideal current-

    voltage relation is given by:

    2)(2

    )sat(TGS

    oxn

    D VVL

    CWI

    2)(2DSDSTGSnD

    VVVVKI

    where Kn

    = (WnCox

    )/2L is called the

    conduction parameter for the n-channel

    MOSFET with units of A/V2.

    2)()sat(TGSnD

    VVKI

    or

    or

    n-channel MOSFET

    In the nonsaturation region

    2)(2

    2 DSDSTGS

    oxpD VVVV

    L

    CWI

    2)(2DSDSTGSpD

    VVVVKI or

    2)(2

    )sat(TGS

    oxp

    D VVL

    CWI

    2)()sat(TGSpD

    VVKI or

    p-channel MOSFET

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    Example Design the width of a MOSFET such that a specified current is induced for a given

    applied bias.

    Consider an ideal n-channel MOSFET with parametersL = 1.25 m, n = 650 cm2/V-

    s, Cox = 6.9 10-8 F/cm2, and VT= 0.65 V. Design the channel width Wsuch that

    ID(sat) = 4 mA for VGS= 5 V.

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    Complementary MOS (or CMOS) Devices

    We have discussed both n-channel and p-channel enhancement MOSFETs.

    When both devices are used in a circuit, they form a Complementary MOS

    (or CMOS).

    CMOS inverter is one of the basis of CMOS digital logic circuits.

    The dc power dissipation in a digital circuit can be reduced to very low

    levels by using a complementary p-channel and n-channel pair.

    Usually, such devices fabricated in one cheep using integrated circuit. It is

    necessary to form electrically isolated p- and n-substrate regions in anintegrated circuit to accommodate the n- and p-channel transistors.

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    Example of CMOS Structures

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    CMOS Inverter

    For small values of the input voltage, VIN, the nMOS transistor is switched off,

    whereas the pMOS transistor is switched on and connects the output mode to VDD.

    For large values of the input voltage, VIN, the pMOS transistor is switched off,

    whereas the nMOS transistor is switched on and connects the output mode to GND= 0V.