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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP92A
MODEL : 22LD310 22LD310-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL63284502 (1003-REV00)
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 8
BLOCK DIAGRAM ................................................................................. 12
EXPLODED VIEW .................................................................................. 13
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5 mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
Ω
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10 % (by volume) Acetone and 90 %(by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.
1. Immediately before handling any semiconductor component orsemiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to theunit under test.
2. After removing an electrical assembly equipped with ESdevices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec. sheet is applied to LCD TV used LP92A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %3) Power Voltage
: Standard input voltage(AC 100-240 V~ 50 / 60 Hz)* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followedeach drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
4. Module specification(General)No. Item Specification Measurement Remark
1 Screen Size 55 cm(22 inch) wide Color Display Module Resolution : 1366*768
2 Aspect Ratio 16:9
3 LCD Module 55 cm(22 inch) TFT WXGA LCD
4 Operating Environment Temp.: 0 deg ~ 40 deg
Humidity : 0 % ~ 85 %
5 Storage Environment Temp.: -20 deg ~ 60 deg
Humidity : 0 % ~ 85 %
6 Input Voltage AC 100-240 V~ 50 / 60 Hz
7 Power Consumption ≤ 70 W 55 cm(22 inch) HD
8 LDC Module 55 cm(22 inch) 501(H) x 297(V) x 17.3(D) Outline Dimension, Unit : mm
(Maker : LGD) 116.5 x 349.5 x RGB Pixel Pitch, Unit : mm
2CCFL Backlight Assembly
Coating 3H
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
5. Chroma& Brightness (Optical)(1) LCD Module
The Color Coordinates check condition - 50 cm from the surface, Full White Pattern- Picture mode Vivid
- 7 - LGE Internal Use Only
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 280 350 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 170/155 degree CR > 10
3. Color Coordinates White X Typ 0.285 Typ
Y -0.03 0.293 +0.03
RED X 0.642
Y 0.333
Green X 0.295
Y 0.608
Blue X 0.147
Y 0.063
4. Contrast ratio 700:1 1000:1
5. Luminance Variation 1.3
6. Component Video Input (Y, PB, PR)
No.Specification
ProposedResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50 Hz
7. HDMI Input(DTV)
No.Specification
Proposed RemarksResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 8 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV, LP92Achassis.
2. Specification(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relativehumidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220V~ 50 / 60 Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC604, Mstar ISP Utility)1) Using D/L Jig
(2) Input Tool-Option(3) ADC Calibration - Component(4) Check SW Version.
3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Preset CH information(5) Factoring Option Data input
4. PCB assembly adjustment method4.1. Mstar Main S/W program download
- Using D/L Jig(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config” button and Change speedI2C Speed setting : 350Khz~400Khz
4) Read and write bin file.Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.
1
Filexxx.bin
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below6) Click “(3)Run”.7) After downloading, you can see the “(4)Pass” message.
* If TV is Turn On, Check the updated SW Version andTool Option.
4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process
After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market
(2) Equipment : adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remote control.)(If not changed the option, the input menu can differ themodel spec.)
Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value [Caution]- Don’t Press “IN-STOP” key after completing the function
inspection.- Don’t connect HDMI cable when downloading the EDID.If the cables are connected, Downloading of EDID couldbe failed.
4.3. EDID Data* 22LD310<HDMI : 256 Byte>
(1) EDID D/L method1) Press the In-start key2) Move to the System Control2 and Press the OK( )3) Move to the EDID D/L and press the right direction
key(G)4) After about a few seconds, appear “OK’, then complete.5) Press the OK key( ).6) Press the EXIT key.
4.4. ADC Calibration-Component- Using External pattern(1) Required Equipments
- Remote control for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component mode.2) Input the Component 720P@60 Hz 100 % Color Bar
YPbPr signal into Component(MSPG-925F Model: 217 / Pattern: 65)
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “Auto-RGB” and press OK( ) key.6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
“COMPONENT-OK”
(3) Confirmation1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.2) We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not.3) If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.4) We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”.
- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 - LGE Internal Use Only
4.5. Check SW Version(1) Method
1) Push In-star key on Adjust remote control.2) SW Version check
Check “Main : Vx.xx” - LD310
5. SET assembly adjustment method5.1. Input Area-Option
(1) Profile : Must be changed the Area option value becausebeing different of each Country’s Language andsignal Condition.
(2) Equipment : adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm(Medium data is automatically calibrated by the Cool data)
- Required Equipment1) Remote control for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV(ch : 9)(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
5.2.1. Connecting diagram of equipment for measuring(For Automatic Adjustment)
* LP92A Support I2C Interface For ADC/DDC Adjustment.
(1) Enter the adjustment mode of DDC- 22Set command delay time : 50 ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance- Release the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warmmode(For LCD)
5.3. Adjustment of White Balance(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85 % white pattern)5) Push the ADJ key -> Enter “0000” (Password)6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others9) When adjustment is completed, Enter “COPY ALL”.10) Exit adjustment mode using EXIT key on R/C.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 - LGE Internal Use Only
* CASEFirst adjust the coordinate far away from the target value(x, y).1) x, y > target
i) Decrease the R, G. 2) x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3) x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4) x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
Coordinate Mode
x y Temp uv∆
Cool 0.285±0.002 0.293±0.002 9,300 K 0.000
Medium 0.295±0.002 0.305±0.002 8,000 K 0.000
Warm 0.313±0.002 0.329±0.002 6,500 K 0.000
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 12 -
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W
Filt
er
SIF
SA
W
Filt
er
RL_
ON
/I-D
IMM
ING
/DIS
P_E
NO
PC
_OU
TC
ON
TR
OL
(P20
0)T
UN
ER
_SC
L/S
DA
AU
DIO
(64K
)
LIP
S
or HD LVDS
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 - LGE Internal Use Only
300
200
540
530
400
800 55
0
900
910
120
122
500
301
LV1
510
200T
A2
A5
A10
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MNT_ROUT
COMP_R
R130
0
HOTEL_OPT
Q103RT1C3904-T112
EBC
CVBS_LIN
D104SD05
Q105RT1C3904-T112
EBC
D10230V
COMP_PB
COMP_Y
SPK_R+_HOTEL
R104
10K
R10112K
COMP_L
D10630V
D103SD05
Q104RT1C3904-T112
E BC
R103
10K
R11875
D10730V
NON_
HOTE
L_OP
T
R121
10K
R1250
CVBS_RIN
ZD102SD05
R11675
MUTE_LINE
ZD103SD05
R131
0
HOTEL_OPT
R12312K
R12412K
Q106RT1C3904-T112
E BC
SPK_R-_HOTEL
ZD101SD05
R10212K
AUDIO_R
MNT_LOUT
R1260
R122
10K
JK101
PPJ228-01
9A [GN]E-LUG
4A [GN]O-SPRING-S
3A [GN]CONTACT-S
9C [RD]E-LUG_1
8C [RD]C-LUG-S
9D [WH]E-LUG
8D [WH]C-LUG-S
9E [RD]E-LUG_2
4E [RD]O-SPRING-S
3E [RD]CONTACT-S
5F[YL]O-SPRING-L
6F[YL]CONTACT-L
7G[WH]C-LUG-L
5H[RD]O-SPRING-L
6H[RD]CONTACT-L
9B [BL]E-LUG
8B [BL]C-LUG-S
CVBS_VIN
D10530V
R11075
COMP_PR
D10830V
NON_
HOTE
L_OP
T
D10130V
R11775
R129
0
HOTEL_OPT
ZD104SD05
MUTE_LINE
R105
75
R106
220
Q102RT1C3904-T112
EB
C
R11268
R114
47
R111470
MNT_VOUT_T
R107
402
READY
Q101ISA1530AC1
E BC
12V_AUDIO
JK102
PPJ200-01
2 [RD]O-SPRING
1 [RD]1P-CAN
3 [RD]CONTACT
4 [WH]1P-CAN
5 [WH]C-LUG-L C10510uF16V
C10410uF16V
R108220K
R120220K
R119220K
R109220K
C108560pF50V
READY
C109560pF50V
READY
C106560pF50V
READY
C107560pF50V
READY
R128
1K
NON_HOTEL_OPT
R127
1K
NON_HOTEL_OPT
C1035.6nF50V
C1025.6nF50V
JP101
JP102
INPUT
INPUT
EAX61462901 2009/08/20
1 7
POP NOISE
AV Audio Out
POP NOISE
Component/AV In
GAIN X 4
AV Video Out
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXCE0-
TXCE1+
TXCE2+
TXCLKE+
TXCLKE-
TXCE0-
TXCE0+
TXCE1+
TXCE1-
TXCE0+
TXCE2-
TXCE3+
TXCLKE-
TXCE2+
TXCE2-
TXCLKE+
TXCE3-
TXCE1-
TXCE3-
TXCE3+
Q202KST3906-MTFE
B
C
LED_B
L202BG2012B080TF
8OHM
L203MBW3216-501TF
500-ohm
KEY1
R206
4.7K
L206
8OHM
LED_R
L201BG2012B080TF
8OHM
R209
0
READY
L205
8OHM
ST_5V
KEY2
3.3V_M
ZD2005.6B
READY
IR
ZD2045.6B
READY
L204
8OHM
L200BG2012B080TF
8OHM
KEY1
R208
4.7K
ZD2035.6B
READY
3.3V_M
R2200
VESA
R2214.7K
JEIDA
R224 0
OPC_ENABLE
5V_12V_LCD
E_DIM
5V_12V_LCD
OPC_OUT
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-
C206100pF50V
C211100pF50V
C20547pF50V
C209100pF50V
C208100pF50V
C210100pF50V
C204100pF50V
P200SMAW200-03
1
2
3
C2030.1uF50V
READY
C2020.1uF50V
READY
C2010.1uF50V
READY
C2070.1uF50V
C212100pF50V
L207
8OHMKEY2
ZD2055.6B
READY
R222 0
OPC_ENABLE
P203
FF10001-3026_32inch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Q201RT1C3904-T112OPC_ENABLE
EB
C R205
1K
OPC_ENABLE
OPC_ENR2020
READY
R201470
OPC_ENABLE
ZD2025.6B
READY
ZD2015.6B
P20112507WS-08L
1KEY1
2KEY2
3GND
4ST_5V
5GND
6IR
7LED_B
8LED_R
9
GND
3.3V_M
R212
10K
ST_3.3V
Q204RT1C3904-T112
E
B
C
R2134.7K
OPC_ENABLE
3.3V_M
R204
4.7K
P204SMAW200-28C219_22inch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
R210 0NON_LGDV5
R211 0NON_LGDV5
MDS61887701
GAS1-*126inch_GASKET
MDS61887701
GAS2-*126inch_GASKET
MDS61887701
GAS3-*126inch_GASKET
MDS61887701
GAS4-*126inch_GASKET
MDS61887706
GAS232inch_GASKET
MDS61887706
GAS332inch_GASKET
MDS61887706
GAS432inch_GASKET
MDS61887706
GAS132inch_GASKET
R20310K
IR & LEDCONTROL
HD(26/32")
External VBR
LVDS/IR
HD(19/22")
OPC_OUTPUT
LVDS/IR
EAX61462901 2009/08/20
2 7
GASKET for ESD Improvement
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
B_TX0+
TXCLK-
HDMI_SCL
HD_5V
5V_M
B_TX0-
G_TX1-
R_TX2+
HPDCTL
HD_5V
G_TX1+
HDMI_5V_DET
HDMI_SCL
DDC_CTL
R_TX2-
Q3012SC3052
E
B
C
TXCLK+
D302ENKMC2838-T112
A1
C
A2
HDMI_SDA
D301
30V
MMBD301LT1G
HDMI_SDA
C3020.1uF50V
P301
KCN-DS-1-00896630TGA004K
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND6
GREEN_GND7
BLUE_GND8
NC9
SYNC_GND10
GND_2
11
DDC_DATA12
H_SYNC13
V_SYNC14
DDC_CLOCK15
SHILED16
DSUB_SCL
DSUB_SDA
D30430V
D30330V
R303 10
R304 10
R323
10K
R30110K
READY R313
10K
R32110K
R3204.7K
R3021K
R324
100
R322
100
R325
100
R3314.7K
R3294.7K
R32710K
R3280
READY
IC301AT24C02BN-10SU-1.8
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
R311 5.6
R308 5.6
R309 5.6
R305 5.6
R310 5.6
R307 5.6
R306 5.6
R312 5.6
JK301QJ41193-CFEE1-7F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
HDMI
HDMI
HDMI/RGB
EAX61462901 2009/08/20
3 7
PC(Control)
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER_SCL
TUNER_SDA5V_TUNER
0.01uF
C401
50V
0.01uF
C409
50V
TU_CTL_VIF
R429
0
TU_SW_VIF
R4300
NON_TU_SW
R4310
NON_TU_SW
0.01uF
C414
50V
VIF2
VIF1
SIF2
SIF1
TU_AGC
Q4032SC3875S(ALY)TU_SW_VIF
E
B
C
D401 30V
0.01uF
C415
50V
5V_M
R409
0
R408
0
VIF_12V
R411680
5V_M
R428
0
TU_SW_SIF
5V_M
R4010
READY
0.01uFC404
50V
0.01uFC403
50V
C4130.1uF16V
C4170.1uF16V
R418
100
R423 12K
C41147pF50V
C41247pF50V
R415
47
R414
47
R4206.8K
TU_SW_VIF
R4196.8K
TU_SW_VIF
R4226.8K
TU_SW_SIF
R4216.8K
TU_SW_SIF
R4253.3K
TU_SW_VIF
0.01uFC405
50V
C4100.1uF16V
READY
R4050
TU_CTL_SIF
R4163.3K
TU_SW_SIF
Q4022SC3875S(ALY)TU_SW_SIF
E
B
C
5V_M
R417
10K
TU_SW_VIF
R403
10K
TU_SW_SIF
C40610uF10V
C40710uF10V
L403K7257M
ONLY_TA
2SWITCHING_INPUT
1INPUT
5 OUTPUT2
4 OUTPUT1
3 CHIP_CARRIER
D403
35VKDS114E(KEC)
TU_SW_VIF
D402
35VKDS114E(KEC)
TU_SW_SIF
L4042.2uH
READY
L401820nH
5V_TUNER
R4324.7K
R4334.7K
5V_M 5V_M
5V_M
5V_M
L402K9653D
ONLY_TA
2SWITCHING_INPUT
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3 INPUT-GND/CHIP_CARRIER_GND
L402-*1M9370M
ONLY_MA
2INPUT-GND
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3 CHIP_CARRIER-GND
C40247uF25V
R42410K
R43610K
R413
0
L403-*1M3953M
ONLY_MA
2INPUT-GND
1INPUT
5 OUTPUT_2
4 OUTPUT_1
3
CHIP_CARRIER-GND
TU401TDTC-G427D
ONLY_TA
5 SDA
11 AIF
2 B1_5V
10 NC
4 SCL
1 NC
9 NC
8 AS
3 NC
7 NC
6 B2_5V
12 AIF
13
GND
TU401-*1TDVH-H426F
ONLY_MA
5SDA
11NC_3
2B1[+5V]
10NC_2
4SCL
1ANT_PWR
9NC_1
8AS
3NC[RF_AGC]
7NC[VTU]
6B2[+5V]
12AIF
13
SHIELD
Q401BFS17W
E
B
C
R404
0
R410
1.2K
R402
330
R435
330
R4071K
R41222
R42722
READY
R426
0
READY
R4066.8K
C75522pF50V
READY
Near the pin
NTSC
PAL/MULTI
L403 L402
X
O K7257 K9653
TUNER
EAX61462901 2009/08/20
4 7
TUNER
O
X O
X X
O M3953
R429 R430R428 R431
Layout placement Close to Tuner
Close to Mstar ICLayout placement
PAL-BG,DK,I NTSC-M
High LowTU_CTL_VIF
TU_CTL_SIF LowHigh
M9370
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUAMP_SDA
R5374.7K
SW_RESET
C5340.01uF50V
SPK_R+
L503DA-8580
EAP38319001
2S
1S 1F
2F
C5466800pF50V
24V_15V_NTP
MNT_L_AMP
C501100pF50V
SPK_R-_HOTEL
AUDIO_R
C5270.47uF50V
C5430.01uF50V
Q503RT1C3904-T112
E
B
C
C5350.01uF50V
MNT_LOUT
I2S_SDO
12V_AUDIO
R504
10K
R542
5.6K
R50510K
C5251uF25V
R512 100
R506
100
R509 100
12V_AUDIO
MNT_ROUT
C524
22000pF50V
R549
0
HOTEL_OPT
C54933pF50V
12V_AUDIO
MULTI_PW_SW
C51433pF50V
READY
R5466.8K
SPK_L-
MNT_R_AMP
R538
1K
C52622000pF50V
ST_3.3V
AMP_MUTE_HOTEL
R50122K
READY
R514
0
HOTEL_OPT
AUAMP_SCL
C5041000pF50V
Q502RT1C3904-T112
E
B
C
I2S_WS
C51333pF50V
READY
R515
0R510 100
R5476.8K
C512
22000pF50V
1.8V_M
R548
0
HOTEL_OPT
SW_RESET
Q504RT1C3904-T112HOTEL_OPT
E
B
C
IC501
NTP-3100L
1BST1A
2VDR1A
3RESET
4AD
5DVSS_1
6VSS_IO
7CLK_I
8VDD_IO
9DGND_PLL
10AGND_PLL
11LFM
12AVDD_PLL
13DVDD_PLL
14TEST0
15DV
SS_2
16DV
DD
17SD
ATA
18WC
K
19BC
K
20SD
A
21SC
L
22MO
NITO
R_0
23MO
NITO
R_1
24MO
NITO
R_2
25FA
ULT
26VD
R2B
27BS
T2B
28PG
ND2B
_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33PVDD2B_2
34PVDD2A_1
35PVDD2A_2
36OUT2A_1
37OUT2A_2
38PGND2A_1
39PGND2A_2
40BST2A
41VDR2A
42NC
43VD
R1B
44BS
T1B
45PG
ND1B
_1
46PG
ND1B
_2
47OU
T1B_
1
48OU
T1B_
2
49PV
DD1B
_1
50PV
DD1B
_2
51PV
DD1A
_1
52PV
DD1A
_2
53OU
T1A_
1
54OU
T1A_
2
55PG
ND1A
_1
56PG
ND1A
_2
R539
1K
R5073.3K
3.3V_M
C5181000pF50V
C54833pF50V
R543
5.6K
R513 100
24V_15V_NTP
AMP_MUTE_HOTEL
C5231uF25V
3.3V_M
IC502
LM324D
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
L504DA-8580
EAP38319001
2S
1S 1F
2F
R54510K
HOTEL_OPT
I2S_SCK
R503
0
READY
C52022000pF50V
C5420.01uF50V
R5364.7K
I2S_MCLK
C5390.47uF50V
C5476800pF50V
R540
200
HOTEL_OPT
C5091uF25V
SPK_R-
SPK_R+_HOTEL
Q501RT1C3904-T112
E
B
C
SPK_L+
R511 100
C5500.01uF50V
24V_15V_NTP
C51710uF35V
C5221000pF50V
C5211000pF50V
C5371000pF50V
C5361000pF50V
D502100V
READY
D501100V
READY
D504100V
READY
D503100V
READY
C53810uF35V
C5101uF10V
L501
120-ohm
L502
120-ohm
R508
100
C5280.1uF50V
C5310.1uF50V
C5450.1uF50V
C5300.1uF50V
C5510.1uF50V
HOTEL_OPT
C5160.1uF50V
C5440.1uF50V
C5110.1uF50V
C5400.1uF50V
C5050.1uF50V
C5080.1uF50V
C5290.1uF50V
C5330.1uF50V
C5060.1uF50V
C5410.1uF50V
C50310uF16V
C50210uF16V
C5071000pF50V
SPK_R+
SPK_R-
SPK_L-
SPK_L+
P50212505WS-09A00
HOTEL_OPT
1
2
3
4
5
6
7
8
9
10
L505MLB-201209-0120P-N2
120-ohm
L506MLB-201209-0120P-N2
120-ohm
L507MLB-201209-0120P-N2
120-ohm
L508MLB-201209-0120P-N2
120-ohm
C5320.1uF50V
READY
C5150.1uF50V
C5520.1uF50V
R5284.7K
R5294.7K
3.3V_M
R5024.7K
READY
3.3V_M
P501
SMAW250-04
1R-SOUND-N
2R-SOUND-P
3L-SOUND-N
4L-SOUND-P
R5333.3
R5323.3
R5233.3
R5223.3
R5204.7K
R5214.7K
R5314.7K
R5304.7K
R51918
R51818
R51718
R51618
R52518
R52718
R52618
R52418
R53518
R53418
R55018
R55118
C5191uF25V
R54112K
NON_HOTEL_OPT
R54412K
NON_HOTEL_OPT
R541-*1 15KHOTEL_OPT
R544-*1 15KHOTEL_OPT
AUDIO
Main AMP
Chinese Hotel Option
AMP:GAIN X 4
AUDIO
EAX61462901 2009/08/20
5 7
HIGH : ACTIVELOW : RESET
LOW : MUTEHIGH : ACTIVE
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXCE3-
TXCE0-
TXCE1-
TXCE3+
TXCE1+
TXCE2-
TXCE2+
TXCLKE+
TXCE0+
TXCLKE-
L605
120-ohm
AVDD_AUSDM
R_TX2-
CVBS_VIN
B_TX0-
TXCE
0+,T
XCE0
-,TX
CE1+
,TXC
E1-,
TXCE
2+,T
XCE2
-,TX
CE3+
,TXC
E3-,
TXCL
KE+,
TXCL
KE-
C619 0.047uF
MAIN_SCL
VIF1
AVDD_VIF
P_24V_SMALL_15V
R6024.7K
MULTI_PW_SW
SW601JTP-1127WEM
1
2 4
3
L602
120-ohm
IC602CAT24WC08W-T
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
AVDD_VIF
Q603RT1C3904-T112
26_32inch
E
B
C
MAIN_SDA
SPI_CZ
5V_M
C6080.1uF16V
AVDD
P1
3.3V_M
P_12V_SMALL_15V
C6030.1uF16V
AVDD_VIF
SPI_CLKFLASH_WP
HPDCTL
I2S_
WS
ST_5V
Q602RT1C3904-T112
E
B
C
TXCLK+
C6150.1uF16V
CVBS_RIN
R601
0
READY
MAIN_SDA
ST_3.3V
AVDD_VIF
R620
100
MNT_VOUT_T
Q601ISA1530AC1
3.3V_M
3.3V_M
I2S_
MCLK
MAIN_SDA
SIF1
TXCLK-
D602KDS181
C634
4.7u
F
AVDDP1
MAIN_SCL
AVDD_MPLL
C626 2.2uF
C6070.1uF16V
R605
0
ST_3.3V
SPI_CZ
AVDDP1
CVBS_LIN
G_TX1+
C625 2.2uF
1.2V_VDDC_M8
R611
100
TU_AGC
AVDDP1
C60147uF25V
R610
100
R609
150
D603KDS181
C6060.1uF16V
C6052.2uF16V
READY
L601120-ohm
SPI_DO
R622
100
AVDD
_ADC
RL_ON R627
0
26_32inch
IC601AT24C64AN-10SU-2.7
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
R6281M
L603
120-ohm
C6040.1uF16V
SPI_DI
I2S_
SCK
VDDC
L604
120-ohm
G_TX1-
COMP_L
ST_5V
R_TX2+
SPI_DI
AVDD_AUSDM
B_TX0+
SPI_CLK
3.3V_M
I2S_
SDO
SPI_DO
SIF2
IC603MX25L1605AM2C-15G
3WP#
2SO
4GND
1CS#
5SI
6SCLK
7HOLD#
8VCC
COMP_R
MAIN_SCL
C627 2.2uF
AVDD_MPLL
C628 2.2uF
AVDDP2
C6114.7uF10V
AVDD_ADC
AVDD_ADC
HWRESET
VDDC
VIF2
C6404.7uF6.3V
D601KDS181
AVDDP1
C6094.7uF10V
READY
PANEL_ON
DISP_EN
AUAMP_SCL
AUAMP_SDA
X60114.31818MHz
C652 0.1uF
C6570.1uF
C660
0.1u
F
C658
0.1u
F
C659
0.1u
F
C656
0.1u
F
C645 0.1uF
C6440.1uF
C661
0.1u
F
C648 0.1uF
C642 0.1uF
C651 0.1uF
C641 0.1uF
C632
0.1u
F
C631
0.1u
F
R6891K
R6901K
READY
R6981K
R6991K
READY
R607
100
R681 100
R682 100
R642 200
E_DI
M
R669
100
R670
100
I_DI
M
VDDC
TU_C
TL_V
IFR6
500
AVDD
P1
AVDD
P1VDDC
MNT_L_AMP
MNT_R_AMP
R673
22DS
UB_S
DA
R675
22DS
UB_S
CL
AVDD
P1
PANE
L_ST
ATUS
R671
100
IR
AVDD
P2
VDDC
ST_3.3V
KEY2
KEY1
HDMI
_SCL
HDMI
_SDA
POWE
R_SW
HWRE
SET
COMP_PB C621 0.047uF
C623 1000pF
C622 0.047uFCOMP_Y
C624 0.047uFCOMP_PR
AVDD_ADC
R631 47READY
C617 0.047uFREADY
C616 0.047uFREADY
C618 0.047uFREADY
C620 0.047uF
C610100pF50V
C646 0.1uF
C6660.1uF
R676
0
R683
0
R686
0
R691
0
READY
C6020.01uF50V
0.01uFC654
50V
0.01uFC663
50V
0.01uFC664
50V
R60810K
R621
100R62433K
R672
4.7K
R668
4.7K
R666
4.7K
R674
4.7K
R6041K
R603
1K
R612
2KR61310K
R626
33K
26_32inch
R62310K
R619
1K
100R651
100R649
3.3V_M
R6874.7K
READY
R6804.7K
R6884.7K
R6794.7K
READY
SW_R
ESET
R657
0
LED_
R
HDMI_5V_DET
DDC_CTL
FLASH_WP
R677 100
R678 100
R652
0
TUNE
R_SD
A
R654
0TU
NER_
SCL
R659
100
R660
100
R615
22
R616
22
R617
22
R618
22
R6964.7K
R6974.7K
C667
0.1u
FRE
ADY
LED_
B
100
R634
100
R635
100R664
OPC_EN
C665
0.1u
F
ST_3.3V
R663
4.7K
ST_3.3V
ST_3.3V
R60610K
19_22inch
TU_C
TL_S
IF
R656
0
C629 0.047uFR640 68
C630 0.047uFR641 68
R633 68
R645
1K
R644
1K
R632 33
R630 33READY
R629 33READY
R639 33
R637 33
R636 33
R638 0
MUTE
_LIN
E
100R661
DDC_CTLR655
100
R6580
READY
R6144.7K
C65010uF10V
C64310uF10V
C64910uF10V
C63810uF10V
C61410uF10V
C633
10uF
R653
0
READY
C6620.1uF16V
C635
1uF
R665
100
R667
100
C612 27pF
C613 27pFR6
8410
0
RL_ON
3.3V_M
C647
0.01
uF
C653
0.01
uF
L606 600
R685 100
R625
5.6K
IC604MARIA8(LGE7871)
1RXA2P
2AVSS_ADC_1
3BIN1
4SOGIN1
5GIN1
6GIN1M
7RIN1
8VSYNC1
9AVDD_ADC_1
10HSYNC0
11BIN0
12GIN0M
13GIN0
14SOGIN0
15RIN0
16VSYNC0
17AVDD_ADC_2
18CVBS3/C1
19CVBS2/Y1
20CVBS1/C0
21CVBS0/Y0
22VCOM0
23CVBSOUT2
24CVBSOUT
25AVSS_ADC_2
26AVDD_MPLL
27XTAL_OUT
28XTAL_IN
29AVSS_MPLL
30AVDD_VIF_1
31AVDD_VIF_2
32AVSS_VIF_1
33VIFIP
34VIFIM
35SIFIM
36SIFIP
37AVSS_VIF_2
38VR27
39AVDD_VIF_3
40TAGC
41AVDD_AUSDM
42LINE_IN_0L
43LINE_IN_0R
44LINE_IN_1L
45LINE_IN_1R
46LINE_IN_2L
47LI
NE_I
N_2R
48AU
COM
49AU
VRM
50AU
VRP
51AU
VAG
52AV
SS
53DA
C_OU
T_L
54DA
C_OU
T_R
55LI
NE_O
UT_L
56LI
NE_O
UT_R
57VD
DC_1
58GN
D_1
59AV
DDP_
1_1
60GP
IOD1
0
61GP
IOD1
1
62GP
IOB1
3
63GP
IOB1
2
64GP
IOB1
1
65GP
IOB1
0
66GP
IOB9
67GP
IOB8
68GP
IOB3
69GP
IOB2
70GP
IOB1
71GP
IOB0
72AV
DDP_
1_2
73GN
D_2
74VD
DC_2
75PW
M1
76PW
M0
77GN
D_3
78AV
DDP_
1_3
79 GPIO_1
80 GPIO_2
81 GPIO_3
82 GPIO_4
83 GPIO_5
84 GPIO/SPI_SIO3
85 GPIO/SPI_SIO2
86 SPI_DO
87 SPI_DI
88 SPI_CZ
89 SPI_CK
90 GPIOD7
91 AUMUTE/GPIOD6
92 GPIOD5
93 GPIOD4
94 TXD1/GPIOD3
95 RXD1/GPIOD2
96 RXD0/GPIOD1
97 TXD0/GPIOD0
98 VDDC_3
99 GND_4
100 AVDDP_1_4
101 LVB3N
102 LVB3P
103 LVBCLKN
104 LVBCLKP
105 LVB2N
106 LVB2P
107 LVB1N
108 LVB1P
109 LVB0N
110 LVB0P
111 AVDDP_1_5
112 GND_5
113 LVA3N
114 LVA3P
115 LVACLKN
116 LVACLKP
117 LVA2N
118 LVA2P
119 LVA1N
120 LVA1P
121 LVA0N
122 LVA0P
123 GND_6
124 AVDDP_1_6
125
DDCA
_CLK
126
DDCA
_DAT
127
INT
128
IRIN
129
SAR2
130
SAR1
131
SAR0
132
AVDD
P_2
133
DDCD
_SCL
134
DDCD
_SDA
135
RESE
T
136
CEC
137
WAKE
UP
138
AUSD
0
139
AUSC
K
140
AUWS
141
AUMC
KO
142
GPIO
M1
143
PWM2
144
PWM3
145
AVDD
P_1_
7
146
GND_
7
147
VDDC
_4
148
RXAC
N
149
RXAC
P
150
RXA0
N
151
RXA0
P
152
AVDD
_ADC
_3
153
RXA1
N
154
RXA1
P
155
HOTP
LUG
156
RXA2
N
R648
4.7K
READ
YR6
4710
0RE
ADY
R662
0
R606-*1
20K
26_32inch
R646
22K
R643
22K
C636
0.01
uF
C637
0.01
uF
MUTE_LINER693 4.7K
3.3V_M
ST_3.3V
R692 4.7KREADY
R6391uF10V
EAX61462901
MARIA8
HDCP EEPROM(A8)
SERIAL FLASH 2M
MAIN(MARIA8)
2009/08/20
6 7
EEPROM(A0)
Seperate with IC ground
Close to IC as close as possible
RESET
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
OPC_OUT
C70447uF25V
0.01uFC708
50V
R73333K
26_32inch
P_5V
5V_M
Q705SI4925BDY
EBK32753101
3S2
2G1
4G2
1S1
5 D2_1
6 D2_2
7 D1_1
8 D1_2
R7040
C70510uF16V
L702
500
P_12V_SMALL_15V
P_24V_SMALL_15V
R711
4.7K
Non Sharp32
P_5V
R715
1K
OPC_DISABLE
5V_12V_LCD
P_5VE_DIM
L70626_32inch
120-ohmP_12V_SMALL_15V
R729
10K
R73422K
R708
0
CMO32
P_12V_SMALL_15V
R7123K
P_5V
R7351.6K
2SC3875SQ702
26_32inch
12
3
C7062.2uF16V
POWER_SW
Q703RT1C3904-T112
E
B
C
R7100
19_22inch/Sharp32
C7120.1uF50V
R733-*1
10K
19_22inch
P_5V
L703
120-ohm
R7230
19_22inch
0.01uFC748
50V
C7310.1uF50V
24V_15V_NTP
0.01uFC737
50V
5V_M
R7210
Sharp32
R706
0
READY
P_5V
L708
120-ohm
MLB-201209-0120P-N2
RL_ON
R7220
Non Sharp32
R713
10K
R73233K
R725
10K
C70368uF35V
R707
0
P_24V_SMALL_15V
C7012.2uF16V
READY
R72710K
READY
R702
0
READY
P_24V_SMALL_15V
R714
1K
OPC_ENABLE
ST_5V
R709-*1
1K
DC_DIM
R724
0
0.01uFC709
50V
I_DIM
LD701SAM2333
P703
SMAW200-11
19_22inch
115V
215V
3GND
4GND
55V
65V
7NC
8NC
9Inverter_ON
10PWM_Dim
11A.Dim
R709
100
PWM_DIM
PANEL_ON
C7191uF25V
C7211uF25V
C7020.47uF
Non Sharp32
25V
Q704RT1C3904-T112
E
B
C
R7050
NON_CMO32
R728
10K
C745100uF16V
2SC3875SQ701
12
3
ST_5V
0.01uFC707
50V
L701
120-ohm
L70519_22inch/Sharp32
120-ohm
C71868uF35V
READY
DISP_EN
12V_AUDIO
5V_M
P_12V_SMALL_15V
ST_3.3V
C7141uF25V
READY
IC701AP2121N-3.3TRE1
1
GND
2 VOUT3VINST_5V
1.2V_VDDC_M8
100uFC729
16V
C7230.1uF50V
C7260.1uF16V
R750120
R7393.3
READY
IC705AP1117EG-13
1
ADJ/GND
2 OUT3IN
C7440.1uF50V
C7471uF25V
READY
R75156
C7350.1uF50V
C7461uF25V
READY
R73012K
R740
10K
3.3V_M
C717560pF50V
IC704AZ1085S-3.3TR/E1
1
ADJ/GND
2 OUTPUT3INPUT
R7442K
R7453.3K
1.8V_M
C7252200pF50V
READY
L707
2.2uH
5V_M
R718
0
0.01uFC713
25V
R70110K
R7031.2K
P701FM20020-24
26_32inch
19NC
14 12V
95.2V
4 GND
18 24V
1312V
8 5.2V
3GND
1724V
12 GND
75.2V
2 Power ON
16 GND
11GND
6 GND
1NC
20 Inverter ON
15GND
10 5.2V
5GND
21A.Dim 22 Error Out
23NC 24 PWM Dim
25
C7521uF25V
19_22inch
L710
120-ohm
26_32inchVIF_12V
C7510.1uF50V
19_22inch
R726
0
R738
0
R753
0
R760
0
19_22inch
C71610uF10V
C72710uF10V
C73410uF10V
C73310uF10V
C71510uF10V C728
10uF10V
C74210uF10V
10uFC710
10V
C75410uF16V
READY
0.01uFC711
50V
IC702BD9130EFJ-E2
3ITH
2VCC
4GND
1ADJ
5PGND
6SW
7PVCC
8EN
ST_3.3V
R7166.2K
OPC_DISABLE
R7176.2K
OPC_ENABLE
3.3V_M
R75610K
R75510K
R7610
19_22inch
R75810K
26_32inch
R76210K
READY
PANEL_STATUS
R7192.2K
26_32inch
R763
47K
26_32inch
Q706RT1C3904-T112E
B
C
ST_3.3V
R764
10K
R76510K
R7494.7K
R7474.7K
R7524.7K
IC707AS7812ADTR-E1
19_22inch
2
GND
3 OUTPUT1INPUT
R74810
19_22inch
43KR736
5V_TUNER
D701 50V19_22inch
110R759
C7301uF25VC739
0.47uF50V
R7432K
26_32inch
C753100pF50V
READY
C7490.1uF16V
READY
IC706
AP1117EG-13
1
ADJ/GND
2 OUT3IN
5V_M
5V_M
L704
500
CIC21J501NER731
0
26_32inch
10uFC722
25V
C7380.1uF50V
19_22inch
C7430.1uF16V
C74110uF16V
R74610
5.6KR737C724
560pF50V
READY
C74010uF16V
10uFC720
25V
R757330
10K
R74126_32inch
IC703MP2212DN
3IN
2GND
4BS
1FB
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
C732100uF16V
L709
3.6uHP_12V_SMALL_15V
C7360.1uF50V
R742
0
EAX61462901
5V_M -> 1.2V_VDDC_M8, 3.3V_M, 1.8V_M
MULTI VOLTAGE
Power
**Switch 12V:P12V, P5V -> 5V_12V_LCD
PANEL
Power indicator
**Switch 5V:P5V -> 5V_M
7 7
STAND_BY VOLTAGE
POWER
2009/08/20
MAX 300mA
R2
OUT:1.85V
R2
R1
V0 = 1.25*(1+(R2/R1))
MAX 2A
OUT:3.3V NTP,AUDIO DSP
MAX 3AMAX 1A
OUT:1.27V
R1
V0 = 0.8*(1+(R2/R1))
OUT:6.8V
TUNER VOLTAGE
MAX 3A
V0 = 0.8*(1+(R1/R2))
**DC-DC CONVERTER 12V->5V_TUNER
R2
R1
Copyright © 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only