MSP430 Platform Overview

Процессорные решения Texas Instruments

Высокопроизводительные ARM9 и Cortex -A8ARM9 и Cortex -A8

Texas Instruments

Agenda

• Performance in single- and multi-core MPUs

• TI single- and multicore processor families

• SITARA SoC product line• INTEGRA SoC product line• INTEGRA SoC product line• DaVinchi SoC product line

• Multi-core SoC product line

• WinCE OS and Software Support

Performance in single- and multi-core MPUs

The Pipeline

Pipeline - Basics• Processor instructions typically require several consecutive activities:

– Fetch program word from memory– Decode (determine from the program word what to do)– Execute the command– Write (store the result in a register or in memory)

• Problem: Each of these acitivities takes at least one cycle (most even more)– Execution of every instruction would take at least four cycles– Idea: Start to execute the next instructions before the current instruction has

completedcompleted

Pipeline Direction

.

Pipeline – Advantages and Disadvantages• Pipeline advantages:

– Big improvement in performance for linear program sequences• Improvement increases with the number of pipeline stages

– Better performance with slow operations• Pipeline stages can be added for slow operations such as memory accesses

• Pipeline disadvantages:– Pipeline must be full to provide the advantages above

• Pipeline latency (time to execute the first instruction) equals the pipeline length• Operations such as branches can result in an empty pipeline• Operations such as branches can result in an empty pipeline

– Pipeline can introduce so-called pipeline hazards• Result of an instruction is needed by the next instruction before it is available• Protected Pipelines automatically wait for the result to be available

– Pipeline protection complexity increases with pipeline length and number of parallel instructions

– Pipeline can result in ressource conflicts• Different stages might try to access the same ressources such as memories etc.

Increasing the Pipeline Length

Increasing the Pipeline Length

• Increasing the processor speed requires longer pipelines– Critical (= slow) operations must be spread out over several stages

• This works only if we are able to separate them into sub-steps

– Pentium pipeline size increased from 5 stages (Pentium 1) to 20 stages (Pentium 4)

• This allowed to raise the clock speed from 233MHz to 3.2GHz

• Large pipeline have disadvantages:– Branch penalty

• Unpredicted branches incur a penalty (latency) close to the size of the pipeline– An unpredicted branch on Pentium 4 equals 18 cycles latency– Remember – a branch happens on average every 10 cycles

• Branch prediction partly alleviates the issue

– Pipeline hazards• Longer pipeline often means more steps between Read and Write• This makes pipeline hazards more likely and harder to control

Multi-Pipeline Architectures

Multi-Pipeline Architectures• Multiple pipelines enable parallel instruction execution

– More than one instruction can be executed at the same time• These instructions belong to the same task - no need for synchronization

– Main challenge is to avoid dependency conflicts between these instructions• This typically limits the maximum number of concurrent instructions

• Two different approaches have evolved:– Variable length instruction sets (C5000, C6000)

• Parallelism is expressed directly in the instruction sequence (look for ||)• Dependency check and parallelization is done by the Compiler• Dependency check and parallelization is done by the Compiler• Simpler architecture

– No need for HW checks• Legacy code might not profit from it

– If your code doesn’t use parallel instructions then they wont be used

– Multi-issue pipelines (Cortex-A8, Cortex-A9)• Multiple instructions are automatically dispatched by the instruction decoder (if possible)• All dependency checks must be done in HW

– This limits the number of parallel instructions (typically two or three)– The checking mechanism is error-prone (OMAP4430)

• All code types benefit from the improvement

Single issue, Multi-issue and VLIW Architectures

Instruction Instruction Instruction Instruction Instruction Instruction

Instruction Instruction

Instruction

Instruction

Instruction

Instruction

Instruction

InstructionInstruction

Scheduler

Pipeline

Pipeline #1

Pipeline #2

Single-issue

Pipeline

(ARM9)

Multi-issue

Pipeline

Instruction Instruction Instruction

Instruction Word

Instruction Word Decoder

Functional

Unit #1

Functional

Unit #2

Instruction Word

Instruction 1 Instruction 2 Instruction 3 Instruction 4

Functional

Unit #3

Functional

Unit #2

Instruction 1 Instruction 2 Instruction 3 Instruction 4

Pipeline #3 Pipeline

(Cortex-A8 / A9)

VLIW

Pipeline

(C5000, C6000)

Multi-core Processors

Multi-core Processors• Multi-core processors execute concurrent tasks on separate processors

– No direct dependencies between these tasks– Simpler architecture – no need to check for pipeline conflicts

• Key challenges– Multi-threaded SW

• If your SW executes one thing at a time then having a multi-core wont help you

– Ressource sharing• Conflicts can occur during memory and peripheral accesses

• Types of multi-core systems:– Homogeneous multi-core

• Several cores of the same type• Multiple ARM cores (Cortex-A9/A15) or multiple DSP cores (C66)• Simpler SW architecture

– Heterogeneous multi-core• Several cores of different type• ARM+DSP (Integra), ARM+Accelerator / ARM+DSP+Accelerator (DaVinci)...• Cores can be optimized for different tasks• More complex programming model

Processors versus Accelerators

• Processors are fully programmable– Flexibility– SW compatibility and reuse

• Accelerators are purpose built– Much higher performance

• With 400MHz you achieve 1080p30 encode on an accelerator• The same frequency gives you only VGA resolution on an ARM…

– Less flexibility• Your accelerator might not support the latest codecs or interfaces

TI single- and multicore processor families

Sitara Integra DaVinchi + DSP inside

TI ARM® investment and innovation

Two ARM Cortex-R4

cores for

automotive

TI Licenses

first ARM core

1995

1st single-chip digital baseband -

DSP/ARM multi-core

2002 2005

*TI first licensee for ARM Cortex™- A8

Introduced DaVinci™ processors for

digital video – ARM9™-based SoCs

2006 2007

TI Licenses

ARM Cortex-A9

2009

TI Acquires Luminary

Micro

Stellaris ®

Fury Class

2008

Stellaris ®

DustDevil Class

StellarisMCUFixed/

Floating-Point ARM9 SoC

1993

DaVinci ™ TMS570MCU

OMAP™

OMAP-L138

2010 2011

Lead Licensee

on Cortex-

M4

Introduce ARM

Cortex-A15

based siliconOMAP™

OMAP 5

* TI licensed in July 2003, but publicly announced Oc t 2005.

Newest DaVinci solution for

flexible, HD video

1st multi-core applications processor,

ARM9-based1st ARM

Cortex-A8 based silicon

TI announces

31 new Stellaris ®

andARM-based

MPUs

Stellaris ®

Sandstorm Class

Stellaris ®

Tempest Class

TMS570FMCU

1st R4F-based floating-point, dual-core auto

MCU

DaVinci ™

OMAP™

OMAP 3

OMAP™

OMAP1510

Introduce ARM Cortex-A9

based silicon

OMAP™

OMAP 4

TI Licenses Cortex-A15

TI has shipped over 6 billion ARM-based products an d continues to invest in a large portfolio of scalable platforms from $1 to >1GHz

TI Embedded Processing Building Blocks

DSP DSPDSP for

IntensiveSignal

Processing

Video Acceleration for Compression

& DecompressionVideo

+

SITARA INTEGRA DAVINCI

One EVM, One EZ SDK – Pin-to-pin compatible

ARM ARM ARM

ARM® forGeneral Purpose

Processing,Rich GUIs & Displays,

Connectivity

+ +

C6-Integra™ProcessorSitara™ C6-Integra™ DaVinci™

SITARA SoC product line

Sitara ™ ARM® microprocessors

ARM Cortex ™-A8

In Development

ARM Cortex-A8ARM9™

Available Now

“AM38x Next” (2012)“AM33x Next” (2012)

AM1810AM1808AM1806AM1802AM1707AM1705

AM3894/2AM3874/2/1AM3715/03AM3517/05AM3359/8/7/6/4/2 New!New!New!New!

High-performance Cortex-A8 with system integration

• Up to 1.5GHz (3000 DMIPS)• Power efficient (down to 12mW

standby, 700mW active)• Integrated graphics for rich user

interface functions• Integrated interfaces of PCIe, USB,

Gigabit Ethernet switch, SD card, Wi-Fi®, CAN, and many others

• 1080p display support• Advanced security features• Enhanced graphics for superior user

interface functions

Low Power ARM9 with flexible peripherals

• Power efficient (down to 37mW standby, 402mW active)

• User configurable interfaces through the programmable real-time unit (PRU)

• Integrated peripherals: PROFIBUS, 10/100 Ethernet, USB, SATA, CAN, UART and many others

Support for Linux, Windows ® Embedded CE, Android, & RTOS

More performanceand value options

AM1707/05 ARM9™ based processorsBenefits

• Multiple connectivity and interface options• Rich, intuitive user interfaces• High system integration = reduced system cost

Sample Applications• Industrial/home automation• Test & measurement• Portable data terminals• Power protection systems

Power• Total Power: 455mW• Standby Power: 62mW

Schedule and packaging

ARM9375/450 MHz

PRUSubsystem

AM1707/05Processors

Connectivity

USB HS w/ PHY

USB OTG w/ PHY

I2C x2

SPI x2 McASPx3

UART x3

Serial Interface

Display

Subsystem

LCD

Controller

(1707)

L3/L4 Interconnect

128K SRAM

16K/16K L1

Schedule and packaging• Production: Now• ZKB:17x17mm BGA,1.00mm pitch, 256-balls (1707)• PTP:26 x 26mm QFP, 0.5mm, 176-pins (1705)• Extended Temperature Grade Options

• Commercial (0C to 90C) • Industrial (-40C to 105C)• Automotive - not Q100(-40C to 125C)

• Pin to pin compatible processor: OMAP-L137

Memory InterfaceEMAC

USB HS w/ PHY

(1707)

I2C x2

GP x1

MMC/SD/SDIO

Timers

NAND/NOR/

SDRAM

WDT x1

UART x3

SDRAMUHPI

eCAP x3

PWM x3

eQEP x2

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only

Benefits• Multiple connectivity and interface options• Rich, intuitive user interfaces• High system integration = reduced system cost

Sample Applications• Industrial/home automation• Test & measurement• Portable data terminals

Power• Total Power: 402mW• Standby Power: 37mW

Schedule and packaging• Production: Now

L3/L4 Interconnect

AM1802Processor

ARM9™300 MHz

128K SRAM

16K/16K L1

Connectivity Serial Interface

AM1802 ARM9™ based processors

• Production: Now• ZWT: 16x16mm BGA, 0.8mm pitch, 361-balls• Extended temp (-40C to 90C) • Pin to pin compatible processor: AM1810, AM1808,

AM1806, OMAP-L138

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only

Memory Interface

Connectivity

10/100 EMAC

USB OTG w/ PHY

GP x3

SDRAM

Timers

SPI x2

MMC/SD/SDIO

WDT x1

McASP

UART x3

LPDDR1/DDR2

UHPI

I2C

AM1808/06 ARM9™ based processorsBenefits

• Multiple connectivity and interface options• Rich, intuitive user interfaces• High system integration = reduced system cost

Sample Applications• Industrial/home automation• Test & measurement• Portable data terminals

Power• Total Power: 402mW• Standby Power: 37mW

Schedule and packaging• Production: Now

L3/L4 Interconnect

PRUSubsystem

Display

Subsystem

LCD

Controller

Video Ports

Input x2

Output x2

AM1808/06Processor

ARM9™375/450 MHz

128K SRAM

16K/16K L1

Connectivity Serial Interface• Production: Now• ZCE: 13x13mm nFBGA, 0.65mm pitch, 361-balls• ZWT: 16x16mm BGA, 0.8mm pitch, 361-balls• Extensive Temperature Grade Options

• Commercial (0C to 90C)• Extended (-40C to 90C)• Industrial (-40C to 105C)

• Pin to pin compatible processor: AM1810, AM1802, OMAP-L138

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only

Memory Interface

Connectivity

10/100 EMAC

(1808)

SATA (1808)

USB FS Host w/

PHY (1808)

USB OTG w/ PHY

I2C x2

GP x3

SDRAM

Timers

SPI x2

McBSP x2

MMC/SD/SDIO x2

WDT x1

McASP

UART x3

LPDDR1/DDR2uPP

UHPI

eCAP x3

PWM x2

Cortex -A8 – AM3517/05

L3/L4 Interconnect

3D Graphics

Accelerator(AM3517 only)

AM3517/05Processors

Video

Processing

Front End

Video

Input

(16-bit)

Memory InterfaceConnectivity

Display Subsystem

10 bit DAC

10 bit DAC

LCD Controller

Video Encoder

USB OTG w/ PHY DDR2McBSP x5

Serial Interface

ARM®

Cortex ™-A8600 MHz

16K/16K L1

256K L2

64K SRAM

Benefits• 1200 DMIPs for OS’s like Linux, Win CE, RTOS• 10M polygons/second for robust GUIs• Multi window overlay for hardware accelerated user

interface

Sample Applications• Industrial/home automation• Point of service• Single board computers• Digital signage

Power• Total Power: 700mW• Standby Power: 12mW

10/100 EMAC

CAN Controller

USB HS Host x2

USB OTG w/ PHY

I2C x3

WDT x1

DDR2

Timers

MCSPI x4

McBSP x5

MMC/SD/SDIO x3

GP x12

UART w/ IrDA

HDQ/ 1-wire

UART x3

NAND/NORSchedule and packaging

• Production: Now• ZCN: 17x17mm BGA, 0.65mm pitch, 491-ball.

Utilizes Via Channel™ array technology with 0.8mmpitch plus design rules

• ZER: 23x23mm PBGA, 1.0mm pitch, 484-ball

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only

AM3715/03 Cortex ™-A8 based processors

L3/L4 Interconnect

Memory InterfaceConnectivity

USB OTG McBSP x5

Serial Interface

LPDDR1

3D Graphics

Accelerator(AM3715 only)

Video

Processing

Front End

Video

Input

(12-bit)

Display Subsystem

10 bit DAC

10 bit DAC

LCD Controller

Video Encoder

ARM®

Cortex ™-A8800MHz/1 GHz

32K/32K L1

256K L2

64K SRAM

AM3715/03Processors

Benefits• 2000DMIPS for OS’s like Linux, Win CE, RTOS• Up to 30% reduction in power• 20M polygons per second for robust GUIs

Sample Applications• Smart connected devices• Patient monitoring• Single board computers• Low power PC

Power• Dynamic Voltage and Frequency Scaling (DVFS) • Total Power: 735mW (800MHz)• Standby Power: 0.1mW (600MHz)

USB HS Host x3

USB OTG

I2C x3

WDT x2

NAND

Timers

MCSPI x4

McBSP x5

MMC/SD/SDIO x3

GP x12

UART w/ IrDA

HDQ/ 1-wire

UART x3

LPDDR1• Standby Power: 0.1mW (600MHz)

Schedule and packaging• Production: Now• CBP: 12x12mm PBGA, 0.4mm pitch, 515-ball,

Package on Package (PoP)• CBC: 14x14mm PBGA, 0.5mm pitch, 515-ball, PoP• CUS: 16x16mm PBGA, 0.65mm pitch. 423-ball.

Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only

24

AM387x Cortex ™-A8 based processorsDifferentiated Features and Benefits• Gigabit Ethernet Switch with 2x MACS and

IEEE1588 support enables fast and reliable network connectivity

• PCIe gen2 with integrated PHY enables a 5.0GT/s connection to backplanes, FPGAs, or expansion cards like USB 3.0 or 802.11n

• Connect to abundant storage with SATA2.0 support at 3.0Gbps, PHY included

• Video output for two different displays at up to 1080p60 each, and HDMI out

• 2W power consumption for fan-less, heat sink-less, enclosed designs

Software and development tools• Linux, WinCE, and Android drivers direct from TI

ARM®

Cortex-A8800 MHz/1.0 GHz*

L3/L4 Interconnect

Serial

32K/32K L1

512K L2

Display

Display processor

Resizer

Graphics(AM3874 only)

PowerVR

SGX

3D Gfx

Security

AES, 3DES

RNG

HS OSD SD OSD

SD Encoder SD DAC x2

HDMI Xmit

(w/HDCP)HDMI PHY

HD Video I/O x2

64K RAM128KSharedRAM

HD Encoder

• Linux, WinCE, and Android drivers direct from TI• RTOS (QNX, Green Hills, etc) from partners

Schedule and packaging• Samples and Dev. Tools: Now• Production: 4Q’11• Packaging: 23x23, 0.8 mm, 684 ball

Availability of some features, derivatives, or packages may be delayed from initial silicon availability

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only * Initial sampling will be for the XAM3874BCYE at 720 MHz

** Annex D only

Serial Interface System

Memory Interface

Parallel

EDMA x4

Timers x8

WDT

UART x6

SPI x4

I2C x4

McASP x6

CAN x2

MMC/SD/

SDIO x3

GPIO

USB 2.0 + PHY x2

(host & device)

EMAC 2port

10/100/1G

w/1588** &

switch

(GMII, MII, RMII,

RGMII)PCIe (2.0)

McBSP

SPDIF

LPDDR1/DDR2/3 x2SATA (3Gbps)

Async EMIF/NAND

AM3894/2 Cortex ™-A8 based processorsARM®

Cortex-A81.2 GHz/1.5 GHz*

L3/L4 Interconnect

Serial

32K/32K L1

256K L2

Display

Display processor

Resizer

Graphics(AM3894 only)

PowerVR

SGX

3D Gfx

Security

AES, 3DES

RNG

HS OSD SD OSD

SD Encoder SD DAC x3

HD Encoder HD DAC x3

HDMI Xmit

(w/HDCP)HDMI PHY

HD Video I/O x2

64K RAM512KSharedRAM

Benefits• Faster program execution and more simultaneous

applications• Communicate simultaneously over multiple high speed

connections• Reduced BOM parts count

Sample Applications• Networking & Communications (routers, gateways,

switches, servers, NAS)• Single board computers• Interactive kiosks• Multi-display products• Industrial control / HMI

Software and development tools

Availability of some features, derivatives, or packages may be delayed from initial silicon availability

Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only * Initial sampling will be for the XAM3894 1.0GHz

Serial Interface System

Memory Interface

ParallelEDMA x4

Timers x8

WDT

UART x3

SPI

I2C x2

McASP x3

SD/SDIO

GPIO

USB 2.0

+ PHY x2

(host and device)

EMAC

10/100/1G x2

(GMII, MII)PCIe (2.0)

x2 lanes

McBSP

SPDIF

DDR2/3 x2SATA x2

(3Gbps)

Smart Card x2

Async EMIF/NAND

Software and development tools• Linux, WinCE and drivers direct from TI• Android and RTOS (QNX, Green Hills, etc) from

partners• Full featured and low cost development board options

Schedule and packaging• Samples: Now• Production: 4Q’11• Dev. Tools: Now (DDR2). DDR3 will be available 1Q11.• Packaging: 25x25, 0.65mm via channel array, 1031 ball

AM3358AM3357

AM3359

AM335x - Highly integrated, power-efficient ARM Cortex ™-A8 at ARM9™ prices

Highest ARM DMIPs per dollar today!AM3354

AM3352

AM3356

Lower system cost with support for DDR2/DDR3 memory,

Full function and low cost development platforms fit your evaluation and cost requirements

Lower system cost with support for DDR2/DDR3 memory, integrated GbE, CAN, and PRU

AM335x Cortex ™-A8 based processorsBenefits• High performance Cortex-A8 at ARM9/11 prices• Rich peripheral integration reduces complexity and cost

Sample Applications

Software and development tools• Linux, Android, WinCE and drivers direct from TI• StarterWare enables quick and simple programming of and

migration among TI embedded processors • RTOS (QNX, Wind River, Mentor, etc) from partners

• Home automation• Home networking• Gaming peripherals• Consumer medical appliances• Printers• Building automation• Smart toll systems

• Weighing scales• Educational consoles• Advanced toys• Customer premise equipment• Connected vending machines

ARM®

Cortex-A8up to

720* MHz

L3/L4 Interconnect

Serial Interface

32K/32K L1 w/SED

256K L2 w/ECC

64K RAM

64KSharedRAM

Display

24 bit LCD Ctrl (WXGA)

Touch Scr. Ctrl.**

Security

w/ crypto acc.PRU SS

PRU x2200 MHz

12K RAMw/SED

Peripherals8K P. w/SED

8K D. w/SED

System Parallel

EDMAUART x6 MMC/SD/ USB 2.0 OTG

Graphics

PowerVR

SGX

3D Gfx

• RTOS (QNX, Wind River, Mentor, etc) from partners• Full featured and low cost development board options

Power Estimates• Total Power: 600mW-1000mW• Standby Power: ~25mW• Deep Sleep Power: ~5-7mW

Schedule and packaging• Samples: October 31, 2011; Production: 2Q’12• Dev. Tools: Order open October 31, 2011• Prelim docs: available today• Packaging: 13x13, 0.65mm via channel array

15x15, 0.8mm

Availability of some features, derivatives, or packages may be delayed from initial silicon availability Peripheral limitations may apply among different packagesSome features may require third party supportAll speeds shown are for commercial temperature range only * 720 MHz only available on 15x15 package. 13x13 is planned for 500 MHz.

** Use of TSC will limit available ADC channels. SED: single error detection/parity

Memory Interface

LPDDR1/DDR2/DDR3

NAND/NOR(16b ECC)

EDMA

Timers x8

WDT

RTC

eHRPWM x3

eQEP x3

eCAP x3

JTAG/ETB

ADC (8ch)

12-bit SAR**

UART x6

SPI x2

I2C x3

McASP x2

(4ch)

CAN x2

(2.0B)

MMC/SD/

SDIO x3

GPIO

USB 2.0 OTG

+ PHY x2

EMAC 2port

10/100/1G

w/1588 &

switch

(MII,RMII, RGMII)

AM335x - A scalable platform with 6 pin -pin compatible devices

Graphics PRU

Two – 32 bit RISC

Processer @ 200MHZAM3359

3D graphics

Package Availability

15x15 / 0.8mmRTM: Oct 31st

RTP: 2Q 2012

Industrial I/F 1

M: MasterS: Slave

Many incl EtherCAT(M & S)

600/720

Two – 32 bit RISC

Processer @ 200MHZ 3D graphics

15x15 /0.8mm13x13/0.65mm*

RTM: Oct 31st

RTP: 2Q 2012500/600/720

Two – 32 bit RISC

Processer @ 200MHZ 15x15 / 0.8mm RTP: 2Q 2012Many incl EtherCAT

(M & S)275/600/720

Two – 32 bit RISC 15x15 /0.8mmPin

Com

patib

le Softw

are Com

patible

AM3358

AM3357

AM3356

ARMCortex-A8

(MHz)

Many excl EtherCAT(M & S)

Many excl EtherCAT

Package 15x15mm 13x13mm

ARM speed Up to 720 MHz Up to 500 MHz

USB 2.0 OTG + PHY x2 x1

EMAC 2-port switch Single port

PRU All I/O pins Reduced I/O pins

Two – 32 bit RISC

Processer @ 200MHZ 15x15 /0.8mm13x13/0.65mm*

RTP: 2Q 2012275/500/600/720

3D graphics15x15 /0.8mm13x13/0.65mm*

RTP: 2Q 2012500/600/720

15x15 /0.8mm13x13/0.65mm*

RTP: 2Q 2012500/600/720

Pin

-to-

Pin

Com

patib

le Softw

are Com

patible

AM3356

AM3354

AM3352

Many excl EtherCAT(M & S)

Many incl EtherCAT(M ONLY)

Many incl EtherCAT(M only)

1 TOP protocols supported are:ETherCAT/PROFIBUS (4Q11),

Ethernet_IP/Powerlink/Sercos-III/Profinet (1Q12)

ZCE Package:• 13x13 mm 0.65 pitch via channel

array [0.8 routable] package• VDD_MPU and VDD_CORE rail is

merged

ZCZ Package:• 15x15 0.8 pitch Full Array

Package• VDD_CORE and VDD_MPU rail is

separate allows

Packages

a1

Slide 30

a1 what does "allows" mean? was this statement not finished?a0271824, 24/10/2011

Benefit: The mDDR/DDR2/DDR3 memory controller is used to interface with JESD79-2E/JESD79-3C/JESD209A standard compliant DDR2/3/ mDDR SDRAM devices respectively. Memory types such as DDR1 SDRAM, SDR SDRAM, SBSRAM, and asynchronous memories are not supported. mDDR(Mobile DDR) here refers to LPDDR1 (Low power DDR) memory type.

Features of the EMIF4 include:• Frequency Targets

� mDDR: 200 MHz Clock (400MHz Data Rate)� DDR2: 266 MHz Clock (532 MHz Data Rate) � DDR3: 303 MHz Clock (606 MHz Data Rate)

• 16 bit data bus• 1GB total addressable space

Memory interface (mDDR /DDR2/DDR3 controller)

• 1GB total addressable space • Supported Memory configurations

• 1 part (x16 devices)• 2 parts (x8 devices)• 4 parts (x4 devices)

• Supports a maximum of 4 address loads and 1 data load

Performance Numbers/DDR BW utilization:• 664 MHz.

� DDR2: 200 MHz Clock (400MHz Data Rate)� CortexA8: 500 MHz Clock

Benefit: The DDR2/3/mDDR memory controller is used to interface with JESD79-2E/JESD79-3C/JESD209A standard compliant DDR2/3/mDDR SDRAM devices respectively. Memory types such as DDR1 SDRAM, SDR SDRAM, SBSRAM, and asynchronous memories are not supported. mDDR (Mobile DDR) here refers to LPDDR1 (Low power DDR) memory type.

External memory interface

Features of the GPMC include:- 8-bit and 16-bit wide data bus- Programmable cycle timings for each chip select- Up to 16-bit ECC support for NAND Flash using BCH code (t=4, 8 or 16) or Hamming code for 8-bit or 16-bit NAND-flash- Integrated ELM (Error Locator Module) to provide ECC calculation (up to 16b) for NAND support. Supports 4-bit, 8-bit and 16-bit per 512byte block error location based on BCH algorithms

Features of the MMC/SD include support for:- Multimedia card (MMC v4.3/ SD 2.0 )- Card detect and write protect on on e MMCSD port- Split rail for 3.3V operation while other device I/O is running at 1.8V (MMCSD0 only). This interface uses standard LVCMOS I/Os- 48 MHz I/O clock rate

Supported on all

AM335x variants

Benefit: The EMAC module provides an efficient interface between the ARM processor and the networked community. 2x Port Industrial Gigabit Ethernet (10/100/1000 Mbps) with integrated switch – MII/RMII/RGMII and MDIO interfaces. Supports 1588 time-stamping, AV Sync, Industrial Ethernet protocols

The basic feature set of the EMAC module is:� 10/100/1000 3 port Ethernet switch� Supports standard Media Independent Interface (MII) and Reduced Media Independent Interface (RMII)

& gig Reduced Media Independent Interface (RGMII) to physical layer device (PHY)

EMAC – Ethernet Media Access Controller switch

� Includes MDIO module to communicate with PHY� Eight receive channels with VLAN tag discrimination for receive quality of service (QoS) support� Eight transmit channels with round-robin or fixed priority for transmit quality

of service (QoS) support� Ether-Stats and 802.3-Stats statistics gathering� Transmit CRC generation selectable on a per channel basis� Hardware flow control

Supported on all

AM335x variants

Benefit: 2xOTG controllers with integrated PHYs provide a mechanism that complies with the USB2.0 standard for data transfer between USB devices up to 480 Mbps. Its dual-role feature allows the capability to operate as a host or peripheral.

� Operating as a host, it compiles with USB2.0 standard for high-speed, full-speed and low-speed operation with a peripheral

� Operating as a peripheral, it compiles with USB2.0 standard for high-speed and full-speed operation with a host

� Supports all modes of transfers (control, bulk, interrupt, and isochronous)

Features of the USB include:

USB 2.0 – Universal Serial Bus

� Supports all modes of transfers (control, bulk, interrupt, and isochronous)

� Supports 16 simultaneous Transmit (TX) and 16 Receive (RX) endpoints, in addition to endpoint 0

� Includes a DMA controller that supports 16 TX and 16 RX DMA channels with a max single data transfer size up to 4Mbytes

2-ports supported on ZCZ

• Up to 24-bits data output; 8 bits-per-pixel (RGB)• Up to WXGA resolution• Integrated LCD interface display driver (LIDD) controller• Integrated raster controller• Integrated DMA engine to pull data from the external frame buffer without burdening the processor

The liquid crystal display controller (LCDC) is used to interface to character display panels for text message display or to graphical display panels for image/video display up to WXGA.

Features of LCDC include the following:

LCD controller / TSC

• Integrated DMA engine to pull data from the external frame buffer without burdening the processor via interrupts or a firmware timer.

• 512 word deep internal FIFO• Touchscreen controller is also supported. This information is covered within the ADC section of the

peripheral overview

• 8 GP Timers & 1 watchdog timer– Free-running 32-bit upward counter. Runs off 32KHz or 19.2, 24, 25, 26 MHz system clock.– WDT: MPU Watchdog (runs of 32KHz system clock)

• I2C (3)– 3 I2C ports compliant with Philips I2C specification version 2.1– Support for standard (up to 100K bits/s) and fast (up to 400K bits/s) modes

• General-Purpose I/O (GPIO) Interface (1)– Synchronous interrupt requests in active mode from each channel are processed by interrupt

generation submodule by the microprocessor unit (MPU) subsystems.– Asynchronous wake-up request

Benefit: Support for many interfaces

AM335x has numerous serial peripherals…

– Asynchronous wake-up request• Multichannel Audio Serial Port Interface (2)

– Data Clock 50 MHz , – Two Clock Zones and up to 4 Serial Data Pins per McASP port– Supports TDM, I2S and Similar Formats– Supports DIT mode

• Universal Asynchronous Receiver Transmitters (UART) (6)– 1 UART will support full Modem Control– All UARTs support IrDA, CIR and RTS, CTS flow control.– Supports baud rate up-to 3.6M bits/s.

• ADC (8)– 12-bit Successive Approximation Register (SAR) ADC with a sample rate of 100KSPS. ADC

input can be selected from any of the 8 analog inputs multiplexed through an 8:1 analog switch. SAR ADC can be configured to support a 4-wire/5-wire/8-wire resistive touch screen controller (TSC) interface. When configured as TSC, it takes away pins/channels for general purpose ADC use.

• eCAP (3)– Up to Three (3) 32-bit enhanced Capture Modules – configurable has 3 capture inputs or 3

auxiliary PWM outputs• eHRPWM (3)

Benefit: Support for many interfaces

AM335x has numerous serial peripherals (cont.)…

• eHRPWM (3)– Up to Three (3) enhanced High Resolution PWM modules (eHRPWM) – with dedicated 16-bit

time base counter with time and frequency controls. Configurable has 6 Single Ended or 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric outputs

• eQEP (3)– Up to Three (3) 32-bit enhanced Quadrature Pulse Encoder modules

Flexibility and differentiation with Programmable Real-Time Unit

AM18x/AM335x

ARM9Cortex-A8

Peripherals

Extend connectivity and peripheral capability

• Allows implementing additional standard interfaces such (UART & CAN)

• Full programmability allows adding customers proprietary interfaces

Reduce system power consumptionPRU

Peripherals

Reduce system power consumption• Allows switching off the ARM clock -

offloading the ARM

Accelerate system performance

• Efficient in handling system’s real-time events that have tight latency constraints

• Specialized custom data handling to offload the ARM

Leveraging the PRU for real-world applications

Point-of-service & portable data terminals requiring many UARTs

Telematics system requiring CAN

AM18x/AM335x AM18x/AM335x

ARM9ARM9

Screen

LCDScreen

PR

U

PR

U Keypad

LED bank

Printer

RS232 port

CANCANport

ARM9Cortex-A8

UART4UART5UART6UART7

ARM9Cortex-A8

GPS

GSM

USB port

LCDCtrl

USB

UART1

UART2

UART3

Peripherals

GPS

GSM

USB port

LCDCtrl

USB

UART1

UART2

UART3

Peripherals

39

PRU Subsystem (PRUSS) Block Diagram

32-bit Interconnect SCR

Instruction RAM(4 kB)

PRU0CPU Core

Instruction RAM(4 kB)

PRU1CPU Core

32 General-Purpose Outputs30 General-Purpose Inputs

32 General-Purpose Outputs30 General-Purpose Inputs

Master Interface to Chip-Level SCRs

Slave Interface from Chip-Level SCRs

PRU Subsystem (PRUSS)

40

32-bit Interconnect SCR

DataRAM 0(512 B)

InterruptController

(INTC)

To ARM/DSP InterruptsEvents from peripherals and PRUs

DataRAM 1(512 B)

Chip-Level SCRsChip-Level SCRs

Get to market fast with AM335x development tools

AM335x evaluation module

AM335x industrialdevelopment kit

AM335xBeagleBone

• AM3359ZCZ – up to 720MHz• 512MB DDR2• CAN, Motor Control,

Stellaris/Piccolo, Industrialinputs

• SYS/BIOS Software Support• No LCD, WL/BT• Available through TI

eStore and Distribution

• AM3358ZCZ – up to 720MHz• 512MB DDR2• 7” LCD Touchscreen• WL1271 WL/BT Module• TPS65910 Power Mgmt.• Android and Linux SDK • Available through TI eStore

and Distribution

$895

• Newest member of theBeagleBoard family

• AM33589ZCZ – up to 720MHz• 256MB DDR2• Small Form Factor• Expandable• No LCD, WL/BT• Available through

Distribution andbeagleboard.org

$89$995

BeagleBoneEnabling Cortex™ -A8 development at $89

• Size of a credit-card• Extensive hardware connectivity with Linux• Large open source community support• Single cable and 10 -second Linux boot TOP SIDE

AM3358

3.4”

42

BOTTOM SIDE

USB 2.0 Host

MicroSD

256MB DDR2

10/100 Ethernet

5V Power Supply (opt.) LEDs

USB 2.0 Client

TI Power Mgmt

Expansion (3)

• Single cable and 10 -second Linux boot• Order from www.beagleboard.org

On-board emulator

BOTTOM SIDE

TOP SIDE

2.1”

Industrial Fieldbus Engine (ICE) OverviewHost InterfaceUSB JTAG

Temp Sensor

SPI Flash

6 x LEDs

DPRAM

NOR FLASH

Power

MMC

TPS65910

24V I/O 8 x LEDs DDR2 TLK110

70

mm

90mm

Evaluation & development kits

Tool Part Number Price Availability

AM389x EVM TMDXEVM8168 $2495 TI

Development Kit Contents:� Evaluation board and

documentation� Software development kits (SDK)� ARM SW development tools

AM387x EVM TMDXEVM8148 $2249 TI

AM37x EVM TMDSEVM3730 $1495 TI

AM35x EVM TMDSEVM3517 $999 TI

AM18x EVM TMDXEVMWIFI1808L $1150 TI

AM335x EVM TMDXEVM3358 $995 TI

AM17x EVM TMDXEVM1707 $845 TI

AM18x Experimenter Kit

TMDSEXP1808L $445 TI

Zoom AM3517 Experimenter Kit

SDK-XAM3517-10-256512R $199 (subject to change) Logic

Featured community boards & modules

Tool Part Number Price Availability

CraneBoard (AM35x) Crane $199 (subject to change) Community

To Access:Contact TI partners formore information or click link to buy now

CraneBoard (AM35x) Crane $199 (subject to change) Community

BeagleBoard-XM (AM37x)

Beagle-XM $149 (subject to change) Community

BeagleBoard(OMAP35x)

Beagle $125 (subject to change) Community

OMAP35x System on Module

OMAP35x SOM-LV $99 (subject to change) Logic

Overo OMAP35x Computer on Module

Overo $149-$219(subject to change)

Gumstix

KBOC OMAP35x System on Module

KBOC $139 (subject to change) KwikByte

Get started today on AM387x and DM814x development

• A single evaluation module for TI ARM® or DaVinci™ media processor development

– Evaluate processor features on included LCD touch screen within minutes of opening EVM box

– Software and tools required for development included with EVM

– Linux today with Windows® – Linux today with WindowsEmbedded Compact® and Android 2.3 coming soon

– Available for $2,495

• Responsive design support and active online TI E2E community

TMDXEVM8148Available Sept 6 at:

http://focus.ti.com/docs/toolsw/folders/print/tmdxevm8148.

html

Demo in < 10 minutes and development in < 1 hour!

INTEGRA SoC product line

Integra ™ DSP+ARM® processor development made easy

Why DSP+ARM?

DSP

ARM ARM

• DSPs are up to 60% more efficient for signal processing tasks such as FFTs, digital filtering and image analysis

• Frees ARM resources for applications processing

• Increases overall system performance

Vision Processing Algorithm

48

And, TI makes DSP programming easy for ARM developers:

Free tools included in the TI EZ SDK:• TI’s C6EZRun for code porting – Enables developers to easily run ARM code on a

DSP without learning DSP architecture• TI’s C6EZAccel library – Provides a library of hundreds of DSP-optimized signal

processing algorithms with ARM APIs to accelerate development time

DSP + ARM. Do more with less.

• Increases overall system performance

ARM9 Subsystem

DSP Subsystem

ARM926EJ-S

CPU

C674x DSPCore

Video I/O(L1x8 Only)

LCD Controller

uPP(L1x8 Only)L1P 32K

L1D 32KL2 256K

PRU Subsystem

128KB RAM

2x PRU

4K+4K Prog512+512 Data

GP

IOs

ARM9 + DSP - OMAP-L138

Example Applications:

� Portable Test & Measurement� Power Protection Systems� Public Safety and Military

Radio� Portable Medical� Automotive Safety/Vision Benefits:� Longer battery life

49

Switched Central Resource (SCR) / EDMA

Program/Data Storage

I2C(2)

Serial Interfaces

Connectivity

WDTimer

System

PWM(3)

SATA(L1x8 Only )UHPI USB2.0

HS

UART (3)

McASPSPI(2)

MMC/SD (2)

USB 1.1

EMAC

McBSP(L1x8 Only)

AsyncEMIF16-bit

mDDR/ DDR2/

SDRAM16-bit

Peripherals

eCAP

� Longer battery life� Network (wired or Wireless) or USB,

SATA � Interface to FPGA or high speed

ADC/DAC� Display up to VGA� Large on-chip memory� Scalability for software re-use and

algorithm precision� Additional control and protocol

expansion

On-Line Data Sheet and Collateral

DaVinchi SoC product line

DM3730/25 DaVinci TM Digital Media Processor720p30 encode/decode

• Benefits• 2000DMIPS for OS’s like Linux, Win CE, RTOS• 3D graphics w/ up to 20M polygons per second

for robust GUIs• HW and SW compatible with OMAP3530/25

• Sample Applications• Smart connected devices• Patient monitoring• Single board computers• Media Player

• Power• Dynamic Voltage and Frequency Scaling (DVFS)

DM3730/25 Processors

12-bit Video

Input

Video Processing Front

End

Display Subsystem

2 x 10 bit

DAC

LCD

Con-

troller

Display Subsystem

Video

Enc

ARM®

Cortex™-A81 GHz / 800 MHz

C64x+ DSP800 MHz / 660 MHz

Video Accelerator

720p h.264720p mpeg4720p mpeg2

3D Graphics

Accelerator(3730 only)

L1: 32kB I, 32kB D L2: 256kB

64kB SRAM

L1: 32kB I, 80kB D L2: 112 KB

• Dynamic Voltage and Frequency Scaling (DVFS) • Total Power: 735mW (800MHz)• Up to 40% reduction in power versus OMAP35x• Standby Power: 0.1mW (600MHz)

• Schedule and packaging• CBP: 12x12mm PBGA, 0.4mm, 515-ball,

Package on Package (PoP)• CBC: 14x14mm PBGA, 0.5mm, 515-ball, PoP• CUS: 16x16mm PBGA, 0.65mm. 423-ball.

Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules

L3/L4 Interconnect

Memory InterfaceConnectivity

USB HS Host x3

USB OTG

I2C x3

WDT x2

LPDDR1

Timers

MCSPI x4

McBSP x5

MMC/SD/SDIO x3

GP x12

UART w/ IrDA

HDQ/ 1-wire

UART x3

Serial Interface

NAND

WinCE OS and Software Support

Software Highlights Software Block Diagram

DaVinci Kits Available Today

� WinCE® EZ Software Development Kits save time and money

� Include royalty free board support packages, software libraries, and frameworks

� Developed and supported by TI� DSP, ARM, video processing, graphics, and display

subsystems support� Optimized video codecs and imaging libraries � TI’s C6EZRun and C6EZAccel ease DSP code

Software & Kits Overview

Overview

Experimenter Kits

Developer Kits

� TI’s C6EZRun and C6EZAccel ease DSP code development for ARM programmers

� Supported on a variety of hardware platforms from evaluation modules to complete reference designs

� Develop in your preferred environment � Eclipse-based Code Composer Studio� Variety of OS-specific kits� Extended debug capability with TI/commercial

JTAG emulators

� Comprehensive support ecosystem leveraging TI’s E2E and open source development communities available 24/7

Embedded Processors Wiki

SW Support

SW Partner Network

TI Software Support

Reference Designs and Dev Kits

Experimenter Kits

Customers can obtain CE release via BSP download fr om TI

TI Windows Embedded CE BSP: • Drivers, application framework, & graphics package (when applicable)• Does NOT include any third party ARM -based codecs

Development Tools: • Visual Studio and Platform Builder 180-day trial included with EVM as part of Windows

Embedded Developer Acceleration Program (WEDAP)

Microsoft Collaboration: • TI participation in Microsoft WEDAP Program, Compact 7 Advanced Development

Program and Partner Program

Windows Embedded Compact support

• TI participation in Microsoft WEDAP Program, Compact 7 Advanced Development Program and Partner Program

• TI ARM Cortex™-A8 based CE BSPs included in Microsoft Developer Update Server and Tool Kit

Availability and Support:• Download from TI product folders• Support from TI through TI forums & community

Cost: • BSP source download is free*

*Microsoft runtime license required for commercial shipments

Windows ® Embedded Compact 7.0 (Compact 7.0)• Windows Embedded Compact 7.0 is the next generation of CE• It helps to:

– Develop rich intuitive user interfaces with the power of Silverlight for Windows Embedded

– Experience immersive browsing (IE7) with updated standards support, tabs, pan, zoom and support for Flash10.1 (Flash10.1 support coming soon)

– Provide seamless connection to Windows 7 via Windows Device – Provide seamless connection to Windows 7 via Windows Device Stage

– Consume rich media with a new media library manager and support for rich HD media streaming

– Leverage HW better with support for ARM v7 (VFP and Neon support) and hardware graphics acceleration

– Deliver quick time to market with a reliable platform and familiar, easy-to-use development kits

• More information and download instruction available at– http://www.windowsembedded.com/compact7

High -level WinCE software availability

WinCE*

6.0 R3 WEC 7.0

AM17x/OMAP-L137

Now

AM18x/OMAP-L138

Now

OMAP35x Now Now

AM37x/DM37x

Now Now

AM35x Now Now

AM389x Now

AM387x Now

AM335x 2012

* WinCE requires runtime royalties to Microsoft TI Owned - No charge

CE 6.0 R3 – Software plan

OMAP35x AM35xAM37x/DM37x

OMAP-L / AM17x/18x

Development Tool Visual Studio 2005Visual Studio

2005Visual Studio

2005Visual Studio

2005

Multimedia or DSP Development

TI DVSDKThird party

multimedia on NEON*

TI DVSDKThird party

multimedia for NEON*

“DSP BIOS Link” for DSP development

(OMAP-L only)

Graphics Development

TI graphics SDK(OMAP3530/15)

TI graphics SDK (AM3517)

TI graphics SDK (AM3715, DM3730)

Not Applicable

Software Schedule

Available Available Available Available

* 3P multimedia need to be licensed directly by customer.

Compact 7.0 – Software plan

OMAP35x AM35x AM335xAM37x/DM37x

AM389x AM387x

Development Tool

Visual Studio2008

Visual Studio2008

Visual Studio2008

Visual Studio2008

Visual Studio2008

Visual Studio2008

Multimedia or DSP

DevelopmentTI DVSDK

Third party multimedia on

NEON*

Third party multimedia on

NEON*

TI DVSDKThird party

multimedia for NEON*

Third party multimedia on NEON*

Third party multimedia on NEON*

TI graphics TI graphics SDK Graphics Development

TI graphics SDK(OMAP3530/15)

TI graphics SDK

(AM3517)

TI graphics SDK (AM335x)

TI graphics SDK (AM3715, DM3730)

TI graphics SDK

TI graphics SDK

Software Schedule

Available Available 2012 Available Available Available

* 3P multimedia need to be licensed directly by customer**Microsoft Public Community Technology Preview (PCTP) download details at: http://www.windowsembedded.com/compact7

No plan to provide Compact 7.0 on ARM 9 based processors.

DaVinci ™ WinCE ® RoadmapRelease Version A8 1.01.00 A8 2.00.00 A8 2.x

Device &

Platform

Supported1

Device Dev Platform Device Dev Platform Device Dev Platform

DM37x DM3730 EVM DM37x DM3730 EVM DM37x DM3730 EVM

DM814x TMDXEVM8148

OS Version WinCE 6.0 R3 with Visual Studio 2005

Windows Embedded Compact 7 with Visual

Studio 2008

Windows Embedded Compact 7 with Visual

Studio 2008

New Features BSP + DVSDK changes for

efficient use of 720p codecs.

Unified BSP ported to Compact 7

Base port/A8 support only

Add support for DM814x base port/A8 only

Schedule Available here AM37x A8 support

available here.

Contact Windows

Embedded partner for

multimedia support

1Q12 Eng. Release

Contact Windows

Embedded partner for

multimedia support

1 WinCE BSP is developed and supported on the specified EVM platform More…

Multimedia Codecs

• TI provides complete set of multimedia encoders/dec oders optimized for TI application processors free of cha rge!– Optimal balance of flexibility and hard acceleration– Production hardened and deployed in numerous professional, enterprise

and consumer applications (video surveillance and conferencing, MIDs,.. )– Integrated in gStreamer, OpenMax, Codec Engine frameworks

• Well defined, flexible APIs• OS agnostic implementation• Configurable from multi-channel/low resolutions to single channel/HD• Well documented resource requirements (program and data memory, stack,

DMA channels etc)

• Fully supported by TI– Codec Forum– Codec Wiki

• Free, available for download

Graphics Support

• 3D Graphics SDK is integrated into Windows ® Embedded (CE) SDKs

– Available free to customers/App developers for WinCE

– Utilizes POWERVR SGX 3D H/W accelerator

– Khronos Open API (Open GL ES, Open VG) compliant

– Standard development kits available for WinCE

– Proof-of-concept demonstration and example software with SDK– Proof-of-concept demonstration and example software with SDK

• Neon Accelerated 2D graphics library available for WinCE and Android

– Open Source Acceleration for Android (SKIA)

– TI library for DirectDraw Acceleration for WinCE

– Software as part of TI Android and WinCE deliverables

• Active 3rd party options and application specific s olutions

WinCE® Industry Standard APIs

FrameworkSilverlight/ DirectDraw

OpenGL® ES 1.1

OpenGL ®

ES 2.0OpenVG

™ 1.1

ARM® only support

(ARM9™ and ARM Cortex™-A8)

����

2D graphics acceleration ����

Graphics Support

(NEON™)

����

3D graphics acceleration

(POWERVR™ SGX)

���� ���� ���� ����

Development KitExpression

Blend/ Visual Studio