PCB

. PCB 1.1 PCB PCB PCB PCB1.1 1.2 PCB 1.1903Mr. Albert Hanson""(Circuit)PCB 2. 1936Dr Paul EisnerPCBprint-etch(photoimage transfer) 1.3 PCB

PCB 1.3.1 PCB A. a. /PolyimideBT/Epoxy b. Copper-invar-copperceramic B. a. Rigid PCB b. Flexible PCB 1.3 c. Rigid-Flex PCB 1.4 C. a. 1.5 b. 1.6 c. 1.7 D. /////,1.8 BGA. PCB 1.3.2 A. 1.9 B. 1.10 1.11 C. IC

PCB

. 2.1. PCBBare Board

PCB Shop(Assembly)Turn-KeyDrawing, Artwork, SpecificationPCB:1234 ( 5 ) 6Micro-ModifierCAM(Computer Aided Manufacturing)DFM(Design For Manufacturing)output 2.2. A Gerber file PCB CAD1960Gerber ScientificGerber SystemCADOutput DataDrawingFilmGerber Format B. RS-274D Gerber Format EIA STANDARD RS-274D(Electronic Industries Association)1.Function CodeG codes, D codes, M codes 2.Coordinate dataimaging C. RS-274X RS-274DRS-274DCode RS-274X Parametersextended Gerber format D. IPC-350 IPC-350IPCneutral format,PCB CAD/CAM,,PCB SHOP NC Drill Program,Netlist,Laser Plotter. E. Laser Plotter Gerber format IPC 350 format Artwork F. Aperture List and D-Codes 2.3. 2.3.1 PCB SHOPBare Board-. ,

2.3.2 .

A. . B.BOM-Bill of Material BOMLaminatePrepregCopper foilSolder MaskLegendFinish,, OSP

C. , .,CheckECO(Engineering

Change Order) ,. D.

.

30~60%

Layout PCBLayout PANEL

a. b.PANEL c.piece__________ d.. e.

,

2.3.3

A. (Flow Chart) :. B. CAD/CAM a. Gerber Data CAMaperturesshapes PCB CAMIPC-350CAMNC Routing PCB Layout NC Router, . Shapes ,thermal padAperture codeshapes b. Check list check list c. Working Panel PCB Layout

.

30~60%

Layout PCB

Layout PANEL

1. 2.PANEL 3.piece 4.. 5

,

working Panel d. Artwork CAMD-CodeLaser Plotter PCB

.

1. 2. 3. 4.

,RoutingNC Routing e. DFMDesign for manufacturing .Pcb lay-out PCBLay-out PCBPADPAD PCB

PCBLay-out . C. Tooling AOINetlist ..AOICAD referenceAOINet list Fixture 2.4 ,,,PCB,,,, ,, Lay-out , PCB,.,,, .

.

Copper-clad Laminate CCL ,:, ,, ,.3.1 . Resin Glass fiber ( Copper foil ) Composite material . 3.1 3.1.1 Resin 3.1.1.1 , Phenolic Epoxy Polyimide PolytetrafluorethylenePTFE TEFLONB Bismaleimide Triazine BT Thermosetted Plastic Resin 3.1.1.2 Phenolic Resin phenol Formaldehyde Formalin Crosslinkage 3.1 1910 Bakelite Bakelite (NEMA-Nationl Electrical Manufacturers Association) , NEMA

"X" "X" "X" "P" Punchable "C" cold punchable "FR" (Flame Retardent) (Flame resistance) XXXPC FR-225 ,.062in

: A a. XPC Grade UL94XPC Grade HB__________

b. FR-1 GradeXPC GradeXPC Grade VTRUL94FR-1 V-0V-1V-2 V-0 c. FR-2 GradeFR-1 FR-1FR-1FR-2,FR-2 FR-1 B. a.

FR-4PCB . b. FR-4 (Silver Paste) FR-4 b-1 1) XY()Z()

2) FR-4FR-1XPC FR-1XPC . b.-2 1)

2) __________

3)

(Silver Migration) c. (Carbon Through Hole).

PCB . Carbon Paste Key Pad XPC 0.81.01.2mm d. 40Pitch1.78mmIC

e. (Anti-Track)

2.1.2 Epoxy Resin Varnish) A-stage B-stage prepreg ,__________ C-stage 2.1.2.1 Bisphenol A Epichlorohydrin dicy (Flammability test),

Tetrabromo-Bisphenol A FR-4 : --Bisphenol A, Epichlorohydrin () - DicyandiamideDicy (Accelerator)--Benzyl-Dimethylamine ( BDMA ) 2- Methylimidazole ( 2-MI ) --Ethylene glycol monomethyl ether( EGMME ) Dimethyl formamide (DMF) Acetone ,MEK (Additive) -- Tg. A. ( Difunctional Epoxy Resin),3.2.

3.3. NEMA FR-4( NEMA G-10)

B. () Dicy, (latent) , 160 B-stage Dicy (Hygroscopicity) dicy , ,. C. epoxy dicy BDMA 2-MI D. Tg

, FR4 Tg 115-120, , ,, Tg , Tg Tg , a. X Y b. Z c. Tg . , Tg E. FR4

3.1.2.2(Multifunctional Epoxy)

FR4 __________

A. Novolac Novolac , Novolac Epoxy Novolacs3.4. FR4 , Tg , (Smear) PTH B. Tetrafunctional Epoxy FR4 " " (Tetrafunctional Epoxy Resin ). " " ,3.5Tg Novolac Polyclad Novolac 160 2-4 , ,, . ,FR4. 3.1.2.3 Polyimide(PI) A. Bismaleimide Methylene Dianiline ,3.6. B.

FR4 Tg 120 FR4 180-190 260 .PI, FR4 FR4 X Y Z C. : a. UL94 V-0 b.

c. (Hygroscopic), d.(Varnish,,) , e. FR4 2-3 Rigid- Flex MIL-P-13949H, GI. 3.1.2.4 (PTFE) Polyterafluoroethylene ,3.7. PTFE Teflon , (Impedance) (microwave) "GT""GX" "GY" ,type3M : A. PTFE

MILP-55110E 4.8.4.4 (Wicking) B. . C. Tg 19 c, . 3.1.2.5 BT/EPOXY BT(Mitsubishi Gas Chemical Co.)1980 Bismaleimide Trigzine Resin monomer3.8 BT A. a. Tg180BT(peel Strength) (Smear) b. UL94V-0 c. d. e. B. a. COB wire bonding BT/EPOXY b. BGA ,PGA, MCM-Ls CAF(Conductive Anodic Filament),( ) BT/EPOXY 3.1.2.6 Cyanate Ester Resin 1970PCBCiba Geigy3.9 A. a. Tg250 b. (2.5~3.1) B. a. . b. . 3.1.2 3.1.2.1 (Fiberglass)PCB Kelvar(Polyamide)(Quartz)

(Glass)

17Owen-IllinoisCorning Glass Works Owens-Corning Fiberglas Corporation1939 3.1.2.2 (Continuous)(discontinuous)

(Fabric)(Mat)FR4 CEM3 A.

()A CESE

a./

b. c. d. e.

f. PCBE

3.2 (copper foil) ,,3,4mil,( 1 mil),.,Profile. . 3.2.1 3.2.1.1 (Rolled-or Wrought Method)

(3 *4) ,, (Heat treatment or Annealing), A. . a. Ductility,FPC,. b. Low-profile Surface,Microwave. B. . a. . b. . c. ,. 3.2.1.2 (Electrodeposited Method) ED. , 600 ASF (Columnar) (passivated) (Drum) ,

(Drum side ), (Matte side) .: A. a. . b. . B. . a. , b. . 3.2.1.3 , 1.0 Ounce (oz)1 oz (28.35g). 35 (micron)1.35 mil. 1 oz 1/2 oz 1/4 oz,. 3.2.2 3.2.2.1 0.5 oz (17.5 micron ) 3/8 oz (Carrier) ( copper foil), ED ,2.1 mil. ,3 mil.. " " " "(Porosity), .,. ,5 mil, . 3.2.2.2

XY (Stress)ED . ,Grade 2,E-Type high-ductilityGrade 2,E-Type HTE . ED. 3.2.2.3 A EDDrum a. Bonding Stage(Matte Side) """Nodulization" 2000~4000A b. Thermal barrier treatments-(BrassGould JTC)(Zinc YatesTW) Dicy 500~1000A c. Stabilization""(Chromation) ""(passivation)" "(antioxidant) B a. (Double treatment) 20 COST

/ Polyclad DST

b. (Low profile) Tooth Profile () () ( just etch,over-etch) Polyclad DST ""Organic Silane Treatment 3.3.3 IPC-CF-150 TYPE E TYPE W , class 1 class 4 class 5 class 8 .

3.4 PP( Prepreg) "Prepreg""preimpregnated" B-stagePrepreg"Bonding sheet" 3.4.1 3.4.2 Gel time, Resin flow, Resin Content Volatile Dicy

3.4.3 EPOXY53~6 3.3.2prepregData sheet

3.4.4Cruing 3.4 (Driving Force)(Miniaturization)( ) 3.4.1 PDAPC Chip Package -(a)(b)

3.4.2 CPU PCB, DkDf PCB

.

4.1 , (FCC) 198410 "",pcb lay-out """" ,

.. 4.2

A. Print and Etch

B. Post-etch Punch

C. Drill and Panel-plate

,(buried hole),20. ( Post-etch Punch). 4.2.0 BOM

A. - B. - C. - D. - 4.2.1 step

A. a. b. c. d. e. f. g. (__________) h. a. c. f. g. ( ) B. a. (Brush) b. (Pumice) c. (Microetch)

C. ,4.1. 4.1

a. ,

b.

a. b.

a. b. c. D/F d. D. (pumice)

a. b. c.

a. Pumice b. E. () . F.

4.2.2 4.2.2.1 A. ,(Silk Screen Printing) "" (Thick Film)(Hybrid Circuit)(Chip Resist )(Surface Mounting) ,,,, .cover: a. , ( ,) b. c., d. e. f. g.(Peelable ink) ,,__________.. B. (Screen Printing) :,,,,,,,, .

a. (1) (silk),(nylon),(Polyester,),,. . (2) : Plain Weave. (3) (mesh),(thickness),(diameter),(opening)

:4.2 :inchcm : :,Slight(S),Medium(M),Thick(T),Half heavy duty(H),Heavy duty(HD),Super heavy duty(SHD) 4.2. b.(Stencil) (1).(Direct Stencil)

, .,, ., . (2).(Indirect Stencil)

,, ,. c.

(1).. (2).(UV) (3).,,,,,. , , . d. :. , ,. . loading/unloading,, .3/4, loading, Rack. loading/unloading, . , pinningccd. : (1) : ,, .,. (2) Squeege

(Polyure-thanePU) Shore A6080. 7080; ,6070

3/41

(3). pin,(Off Contact Distance)( 2m/m5m/m ), .. , pinningccd., . (4). , ,follow data sheet, modify. ,UV,IR . (5).

. ,.

check list . 4.2.2.2 .. A. (Laminator)0.1mm, B. C. D. Break point 50~70% ,30+_2, auto dosing. 4.2.3 (CaCl2)

& Resist D/FD/F

B C. Etchant PVC (Poly Vinyl chloride)PP (Poly Propylene) (Ti) ,( etching factor4.3)

Cu+

, . a. CuCl2 Cu, Cu++ Cu+__________1 Cu+Cu++2 Cu+ ------------- (1) Cu+Cu++,

b. Cu++ Cu+CuCl2 CuCl HCl Cu + H2CuCl4 + 2HCl 2H2CuCl3 ------------- (2)

H2CuCl4 CuCl2 + 2HCl 2H2CuCl3 CuCl + 2HCl (2)HCl(2)

Cu+ H2CuCl4 2H2CuCl3 + CuCl () ---------- (3) CuCl + 2HCl 2H2CuCl3 () ---------- (4) CuClHCl CuCl HCl HCl 1. (undercut ) etching factor 2. 3. (H2O2)H2O2 c.. CuCl2,Auto dosing, ,: 1. 2. HCl 3. H2O2 4. 5. 4.2.4 pcbstepD/F D/F()D/F NaOHKOH 1~3% A. . B. , BCS

C. K()

4.2.5 4.2.5.1 A. 2.3,(), , 4.4 B. (6)(), M/L 4.2.5.2(post Etch Punch) A. Pin Lam 4Slot 4.5 prepreq 4SLOT SLOT PIN

B. Mass Lam System Multiline""PPS 1.CAM""(Optical Target) pads 4.6 2. 3.Optiline PECCD 4Slot 4.7 4.

4.2.5.2 A. a. check b. Shift B. a.4.8 b.4mil,

c.Resin Curepattern 4.3 AOI() () , (integrity),,,, ,, , ,,., (AOI), ,, AOI,(Leakage), AOI,. , .__

. 5.1. : (Copper Foil),(Prepreg)(Oxidation),. ,,. 5.2. ,5.1: 5.3. 5.3.1 (Black/Brown Oxide Treatment) 5.3.1.1 A. ,(Adhesion). B. , C. (Passivation)(Amine)

5.3.1.2.

( pink ring ) 5.3.1.3. :

,, ,2Cu+[O] Cu2O, CuO,,"", "" 5.3.1.4. ( ), 5.3.1.5 A. Cu2O, ,, , ,,, B. ,PTH(Pink ring), PTH . ,,5.2. C. , ,

(Peel Strength). (Self-Limiting) (Sealer),

5.4,,, 5.3.1.6 ,,, ,,,,: A. - .,,scum B. -PH,,.

C. - (grain structure), 50-70 , D. - , , - , E. -,, , ,, ,,

F. . G. ,,. H. -, ,, 5.3.1.7 , ,,CPVCPP ,,RA