TABLE OF CONTENTS - EEWorld · 2009-08-05 · Ronghai YU Tsinghua University, China Co-Chairs Jusheng MA Tsinghua University, China，President of Beijing Chapter, IEEE-CPMT Gong

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TABLE OF CONTENTS

1. Friendly Reminder------------------------------------------------------------------------------------------?

温馨提示

2. Conference Organization ----------------------------------------------------------------------------------? 会议组织结构

3. Senior Courses ----------------------------------------------------------------------------------------------? 高级课程

4. Conference Programs --------------------------------------------------------------------------------------?

会议程序 3.1 Overview of Conference Programs-----------------------------------------------------------------? 3.2 Conference Invited Talks----------------------------------------------------------------------------? 3.3 Overview of Oral and Poster Presentation Sessions------------------------------------------------? 3.4 Oral and Poster Presentation Sessions-----------------------------------------------------------------?

5. Transportation -----------------------------------------------------------------------------------------------?

交通指南 6. Main Building Layout --------------------------------------------------------------------------------------?

中央主楼布局图

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Friendly Reminder（温馨提示）

1. Please wear your badge at all time 会议期间参会者请佩戴代表证，并凭此参加各项活动

2. Lunch time and location during the conference 会议期间午餐时间和地点

Time: 12:15 – 13:30, Aug. 11 – Aug. 13, 2009 时间：12:15 – 13: 30，8 月 11 日至 13 日

Location: Zhi Lan Yuan restaurant (shuttle pickup: please take the school shuttle in front of Main Building at Tsinghua University) 地点：芝兰园餐厅（有校车接送，请在主楼前乘车）

3. Dinner time and location (paid attendees only) 晚餐时间和地点（仅限大会负责晚餐的参会人员）

Time: 18:30 – 20:00, Aug. 10 and Aug. 12, 2009 时间：18:30 – 20:00，8 月 10 日和 12 日

Location: second floor of Unisplendour International Center 地点：紫光国际交流中心二楼宴会厅

4. Time and location of Fifteen-Year Celebration 15 年庆典晚会时间和地点

Time: 19:00 – 21:00, Aug. 11, 2009 时间：19:00 – 21:00，8 月 11 日

Location: Friendship Palace of Friendship Hotel (shuttle pickup: please take the school shuttle in front of Main Building) 地点：友谊宾馆友谊宫（有校车接送，请在主楼前乘车）

Activities: award ceremony, banquet, performance 活动：庆典颁奖，晚宴和演出

5. Location of Tea Break: third floor of Main Building at Tsinghua University 茶歇地点：清华大学中央主楼三层

6. For the attendees staying at Jia Suo or Jin Chun Yuan, please refer to the map of Tsinghua University in Page 40 住甲所、近春园的参会者请参看本手册第 40 页的清华交通图

7. For more details, please read the conference programs or contact the conference affairs officers. The conference affairs officers are wearing BLUE T-shirts. 会议期间具体安排情况请查阅会议日程安排或与会务组工作人员联系。(会务组工作人员会

议期间着蓝色衣服 )。

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8. Contact during conference 会议现场联系 Organizing committee: Xingzao HUANG (cell: 13911618261), Zhiting GENG (cell: 13901040526), Jusheng MA (cell: 13501081632) 组织委员会：黄行早（手机：13911618261；会议发票负责人），耿志挺（手机：13901040526），马莒生（手

机： 13501081632）

Technical committee: Jian CAI (cell: 13501114301), Qing LI (cell: 13910774338), Liangliang LI (cell: 13611031016) 技术委员会：蔡坚（手机：13501114301），李清（手机：13910774338），李亮亮（手机：

13611031016） Location: Room 313, third floor of Main Building at Tsinghua University 地点：清华大学中央主楼三层 313 房间

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Conference Organization （会议组织结构）

Directed by 会议指导单位： Chinese Institute of Electronics, China 中国电子学会 Department of Higher Education, Ministry of 中华人民共和国教育部高等教育司 Education, China Department of High and New Technology 中华人民共和国科技部高新技术发展及产业化司 Development and Industrialization, Ministry of Science and Technology, China Department of Telecommunication, 中华人民共和国工业和信息化部电子信息司 Ministry of Industry and Information Technology, China Industry and Information Committee 北京市人民政府工业与信息化委员会 Beijing Municipality, China China International Culture Exchange Center 中国国际文化交流中心 Sponsored by 会议主办单位： China Electronics Packaging Society (CEPS) 中国电子学会生产技术学分会（电子封装专委会） of the Chinese Institute of Electronics, China Tsinghua University, China 中国清华大学 IEEE Component, Packaging, &Manufacturing 国际电气电子工程师学会电子元件 Technology Society (IEEE-CPMT) 封装和生产技术分会 Organized by 会议承办单位： Tsinghua University, China 中国清华大学 Beijing Faith Consulting Co., Ltd. 北京菲尔斯信息咨询有限公司

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CONFERENCE CHAIRS （大会主席）

General Chair Keyun BI Vice Director General of Standing Committee, Chinese Institute of Electronics, China

President of China Electronic Packaging Society, Chinese Institute of Electronics, China President of Packaging Branch, China Semiconductor Industrial Association, China

Co-Chairs

Xu CHEN Vice President of Tsinghua University, China

William CHEN President of IEEE-CPMT, USA

Kouchi ZHANG Manager, Philips LightLabs, the Netherlands

Johan LIU Professor of Shanghai University, China

INTERNATIONAL ADVISORY COMMITTEE（国际顾问委员会）

Shichang ZOU Academician of Chinese Academy of Sciences, China

Jiluan PAN Academician of Chinese Academy of Sciences, China

Zengyuan GUO Academician of Chinese Academy of Sciences, China

Hengde LI Academician of Chinese Academy of Engineering, China

Jing ZHU Academician of Chinese Academy of Sciences, China

Juyan XU Academician of Chinese Academy of Engineering, China

Xi CHEN Vice Minister of Ministry of Education, China

Shouwen YU Former VP of Tsinghua University, China

Rao TUMMALA Pettit Chair Professor and Director of Packaging Research Center, G I T, USA

C. P. WONG Professor of Georgia Institute of Technology, USA

James MORRIS Professor of Portland State University, USA

Michael PECHT Director of CALCE, Professor of University of Maryland, USA

Rolf ASCHENBRENNER Vice President of IEEE-CPMT, Fraunhofer IZM, Germany

John LAU Professor of Hong Kong University of Science and Technology, China

Steve ADAMSON Former President of IMAPS, USA

Tadatomo SUGA Professor of the University of Tokyo, Japan

Yorishige MATSUBA Standing Director of JIEP, Japan

Jin YU Professor of Korea Advanced Institute of Science and Technology, Korea

Tom CHUNG Vice-President of Hong Kong Applied Science & Technology Research Institute, China

Guoqiang DAI Deputy Director of Department of High and New Technology Development and Industrialization, Ministry of Science and Technology, China

Wenwu DING Deputy Director of Department of Telecommunication, Ministry of Industry and Information Technology, China

Tianchun YE Director General of Institute of Microelectronics, CAS, China

Cor CLAEYS Professor, IMEC, Belgium

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Kees BEENAKKER Director of DIMES, Delft University of Technology, the Netherlands

Min WANG Vice President of Shanghai University, China

Simin LI Vice President of Guilin University of Electronic Technology, China

Zhihua BAO Vice President of Nantong University, China

Tong Yan TEE Senior Manager, Amkor, Singapore

CONFERENCE ORGANIZING COMMITTEE （组织委员会）

Chair

Ronghai YU Tsinghua University, China

Co-Chairs

Jusheng MA Tsinghua University, China，President of Beijing Chapter, IEEE-CPMT

Gong ZHANG Tsinghua University, China

Dongkai SHANGGUAN Flextronics International, USA

Ricky S. W. LEE Hong Kong University of Science and Technology (HKUST), China

Sheng LIU Huazhong University of Science and Technology, China

Chunqing WANG Harbin Institute of Technology, China

Xiang WU China Electronic Technology Group Co., Ltd, China

Ming LI Shanghai Jiao Tong University, China

Wayne KOH Pacrim Technology Inc., USA

Shinichi WAKABAYASHI Executive Director IMAPS Asian Chapter, Japan

Zhonghua XU Total China, China Shangtong GAO Hebei Semiconductor Research Institute (HSRI), China

Yufeng JIN Peking University, China

Jianhua ZHANG Shanghai University, China

Xiaochun WU Nantong Fujitsu Microelectronics Co., Ltd, China

Xin ZHOU Huawei Group Co., China

Director of Senior Courses

Yuming WANG Tsinghua University, China

Xuejun FAN Lamar University, USA

Director of Facilities

Zhiting GENG Tsinghua University, China

Xingzao HUANG Beijing Faith Consulting Co., Ltd, China

Director of Website

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Zhen LI China Electronic Packaging Society of the Chinese Institute of Electronics (CIE-CEPS), China

Members

Liangliang LI Tsinghua University, China Xiaohao WANG Tsinghua University, China Yang GAO Tsinghua University, China Yinghui WANG The University of Tokyo, Japan Jian LU The University of Tokyo, Japan

CONFERENCE TECHNICAL COMMITTEE（技术委员会）

Chair Jun XU Tsinghua University, China Co-Chairs Jian CAI Tsinghua University, China

Lixi WAN Institute of Microelectronics, CAS, China

Daniel SHI ASTRI, Hong Kong, China

Xuejun FAN Lamar University, USA

Jie XUE CISCO, USA

Yiping WU Huazhong University of Science and Technology, China

Fei XIAO Fudan University, China

Huimin XIE Tsinghua University, China

Chih-Ming LAI Jiangyin Changdian Advanced Packaging Co., Ltd, China

GENERAL SECRETARY（大会秘书长）

Qing LI China Electronic Packaging Society of the Chinese Institute of Electronics (CIE-CEPS), China

Jusheng MA Tsinghua University, China

President of Beijing Chapter, IEEE-CPMT

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Monday, August 10, 2009

Senior Courses on Electronic Packaging and Assembling（高级课程）

ICEPT-HDP 2009 Courses (August 10, 2009 Morning)

EP09-TC1 Advanced Packaging

(Venue: The 3rd Conference Room in Jia Suo, Tsinghua University)

Time Topic Instructor(s)

8:30-12:30 Enabling Technologies for 3D IC Integration and WLP Dr. John H LAU

EP09-TC2 Packaging and Modeling of Power Electronics

(Venue : The 2nd Conference Room in Jia Suo, Tsinghua University)

8:30-12:30 Trends of Power Electronic Package and Modeling Dr. Yong LIU

ICEPT-HDP 2009 Courses (August 10, 2009 Afternoon)

EP09-TC3 Packaging Materials for Electronics Packaging

(Venue: The 3rd Conference Room in Jia Suo, Tsinghua University)

Time Topic Instructor(s)

Fundamental of polymers for Electronics Packaging-No flow Underfills, etc

Prof. C. P .WONG

Fundamental Understanding and Practical Applications of Conductive Adhesives

Dr. Daniel LU

13:30-17:30

Nanomaterials for Electronics Packaging-Nano-enhanced Lead Free Solders, Nano-Thermal-Interface Materials,

Nano CNT based Bumping and Cooling Systems

Prof. Johan LIU

EP09-TC4 Board Level Reliability

(Venue : The 2nd Conference Room in Jia Suo, Tsinghua University)

13:30-15:25 Drop impact reliability of interconnections in portable

electronics Dr. EeHua WONG

15:35-17:30 Board level thermo-mechanical reliability Dr. Wenhui ZHU

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Overview of Conference Programs

Date Time Lecture Room 08:30 – 09:20 Opening Ceremony 09:20 – 12:00 4 Invited Talks 12:15 – 13:30 Lunch 13:45 – 17:55 8 Invited Talks

Aug. 11

19:00 – 21:00 15-year Celebration (Friendship Hotel)08:30 – 09:40 2 Invited Talks Aug. 12 09:40 – 10:10 Best Student Paper Award

Best Paper Award

Date Time Room 212 Room 213 Room 226A

Room 226B

Room 327A

Room 327B

Oral Session A1

Oral Session B1

Oral Session D1

Oral Session D2

Oral Session E1

Oral Session E2

Poster Session 1

10:30 – 12:15 5 papers (1 keynote)

5 papers (1 keynote)




5 papers (1 keynote) 41 papers

12:30 – 1:30 Lunch

Oral Session G1

Oral Session C1

Oral Session C2

Oral Session F1

Oral Session E3

Oral Session G2

Poster Session 2

13:35 – 15:40 6 papers (1 keynote)




6 papers


15:40 – 16: 00 Tea Break

Aug. 12

16:00 – 17:40 5 papers 5 papers 5 papers 5 papers 5 papers 5 papers

42 papers

Oral Session A2

Oral Session C3

Oral Session C4

Oral Session E4

Oral Session E5

Oral Session G3

Poster Session 3

8:30 – 10:15 5 papers (1 keynote)

5 papers



5 papers


10:15 – 10:35 Tea Break 10:35 – 11:55 4 papers 4 papers 4 papers 4 papers 4 papers 4 papers

40 papersAug. 13

12:30 – 1:30 Lunch

*Note:

Session A: Advanced Packaging & System Integration

Session B: High Density Substrate & SMT

Session C: Packaging Design & Modeling

Session D: Emerging Technologies

Session E: Packaging Materials & Processes

Session F: Packaging Equipment & Advanced Manufacturing Technologies

Session G: Quality & Reliability

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Tuesday, August 11, 2009 Opening Ceremony and Invited Talks

8:30 – 12:00, Lecture Room in Main Building at Tsinghua University Chairs: Prof. Xu CHEN, Prof. Kouchi ZHANG and Prof. Ricky S. W. LEE 8:30 – 9:20 Opening Ceremony 9:20 – 9:55 Packaging Engineering between Recession and Recovery

Dr. William CHEN President of IEEE CPMT, USA

9:55 – 10:15 Tea Break 10:15 – 10:50 Emerging Trends in 3-D Systems Packaging Technologies

Prof. Rao TUMMALA Georgia Institute of Technology, USA

10:50 – 11:25 Recent Advances on Nanomaterials for Advanced Electronic and Photonic Packaging Prof. C. P. WONG Georgia Institute of Technology, USA

11:25 – 12:00 Key Requirements of Electronic Packaging Technology for IT Technology Development Prof. Jiluan PAN Tsinghua University, China

12:15 – 13:30 Lunch (Zhi Lan Yuan restaurant, shuttle pickup) 13:45 – 17:55, Lecture Room in Main Building at Tsinghua University Chairs: Prof. Johan LIU and Prof. Xuejun FAN 13:45 – 14:15 A New Paradigm of Electronic Products Assessment

Prof. Michael PECHT University of Maryland, USA

14:15 – 14:45 Interconnect Eco-Design Prof. Tadatomo SUGA Tokyo University, Japan

14:45 – 15:15 Packaging Technologies of Ultra Thin Chips Mr. Rolf ASCHENBRENNER Fraunhofer IZM, Germany

15:15 – 15:45 Challenges and Opportunities in Electronics Assembly Dr. Dongkai SHANGGUAN Flextronics, USA

15:45 – 16:05 Tea Break 16:05 – 16:35 EMC-3D Consortium Activities and Cutting-edge Technologies for TSV

Integration Mr. Bioh KIM EVG, Austria

16:35 – 17:05 Green Technology of Epoxy Molding Compound Dr. Xinyu DU Henkel, Germany

17:05 – 17:30 Micro-Molded Interconnect System (MIS) - Advanced Leadframes Mr. Jimmy CHEW Jiangyin Changdian Advanced Packaging Co., Ltd, China

17:30 – 17:55 Advanced Assembly and Test Technology Development in NFME Mr. Guoliang YU Nantong Fujitsu Microelectronics Co., Ltd, China

17:55 – 19: 00 Bus Transportation to Friendship Hotel（友谊宾馆） Fifteen-year Celebration (19:00 – 21:00, Friendship Palace of Friendship Hotel) Chairs: Prof. Jun XU and Prof. Sheng LIU

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Wednesday, August 12, 2009 Invited Talks

8:30 – 10:30, Lecture Room in Main Building at Tsinghua University Chairs: Dr. Jianglong Han and Prof. Chunqing WANG 8:30 – 9:05 Development of High Performance Packaging through Collaboration in

Highly Outsourced Manufacturing Environment Mr. Mark BRILLHART Cisco, USA

9:05 – 9:40 Disruptive R&D Technologies for Electronic Packaging in China Dr. Tom CHUNG Hong Kong Applied Science & Technology Research Institute, China

9:40 – 10:10 Best Student Paper Award and Best Paper Award 10:10 – 10:30 Tea Break

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Overview of Oral Presentation Sessions（口头报告总览）: Wednesday, August 12, 2009

Meeting Room 212

Meeting Room 213

Meeting Room 226A

Meeting Room 226B

Meeting Room 327A

Meeting Room 327B

Session A1: Advanced

Packaging & System Integration

Session B1: High Density Substrate

& SMT

Session D1: Emerging

Technologies

Session D2: Emerging

Technologies

Session E1: Packaging Materials & Processes


Chair Dr. Andy TSENG Prof. Mingyu LI Dr. Victor LIU Dr. Jie XUE Dr. Daniel LU Prof. Le LUO

10:30 – 10:55 Keynote: A1-01 Keynote: B1-01 Keynote: D1-01 Keynote: D2-01 Keynote: E1-01 Keynote: E2-01 Mor

ning

Ses

sion

s

10:55 – 12:15 A1-02, A1-03, A1-04, A1-05

B1-02, B1-03, B1-04, B1-05

D1-02, D1-03, D1-04, D1-05

D2-02, D2-03, D2-04, D2-05

E1-02, E1-03, E1-04, E1-05

E2-02, E2-03, E2-04, E2-05

Lunch: 12:30 – 13: 30, Zhi Lan Yuan Restaurant, Shuttle pickup

Meeting Room 212

Meeting Room 213

Meeting Room 226A

Meeting Room 226B

Meeting Room 327A

Meeting Room 327B

Session G1:

Quality & Reliability

Session C1: Packaging Design

& Modeling


& Modeling

Session F1: Packaging

Equipment & Advanced

Manufacturing Technologies


Session G2: Quality & Reliability

Chair Prof. Chris

BAILEY & Dr. Xinyu DOU

Dr. Wenhui ZHU & Prof. Xiaobing

LUO

Dr. J.-P. SOMMER & Prof.

Fei QIN

Dr. Paul WANG & Prof. Jianhua

ZHANG

Dr. Klaus-peter GALUSCHIKI & Prof. Mingliang

HUANG

Prof. Fu GUO & Prof. Kailin PAN

13:35 – 14:00 Keynote: G1-01 Keynote: C1-01 Keynote: C2-01 Keynote: F1-01 Keynote: G2-01

14:00 – 15:40 G1-02, G1-03, G1-04, G1-05, G1-06

C1-02, C1-03, C1-04, C1-05, C1-06

C2-02, C4-09, C2-04, C2-05, C2-06

F1-12, F1-03, F1-04, F1-05, F1-06

E3-01, E3-02, E3-03, E3-04, E3-05,

E4-09 G2-02, G2-03, G2-04, G2-05, G2-06

15:40 – 16:00 Tea break

Afte

rnoo

n S

essi

ons

16:00 – 17:40 G1-07, G1-08, G1-09, G1-10, G1-11

C1-07, C1-08, C1-09, C1-10, C1-11

C2-07, C2-08, C2-09, C2-03, C2-11

F2-07, F2-08, F2-09, F2-10, F2-11

E3-07, E3-08, E3-09, E3-10, E3-11

G2-07, G2-08, G2-09, G2-10, G2-11

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Overview of Oral Presentation Sessions（口头报告总览）: Thursday, August 13, 2009

Meeting Room 212

Meeting Room 213

Meeting Room 226A

Meeting Room 226B Meeting Room 327A Meeting Room

327B

Session A2: Advanced

Packaging & System Integration


& Modeling


& Modeling


Session E5: Packaging Materials

& Processes

Session G3: Quality & Reliability

Chair Prof. Lixi WAN & Prof. GS KIM

Dr. Yong LIU & Prof. Fei XIAO

Dr. Jerry LU & Prof. Liqiang CAO

Dr. Changqing LIU & Dr. Yanhong

TIAN

Dr. Dongyan DING & Dr. Hidetaka

HAYASHI

Dr. Dongming HE & Prof.

Fengshun WU

8:30 – 8:55 Keynote: A2-01 Keynote: C4-01 Keynote: E4-01 Keynote: G3-01

8:55 – 10:15 A2-02, A2-03, A2-04, A2-05

C3-01, AP-07, C3-03, C3-04, C3-05 C4-02, C4-03, C4-

04, C4-05 E4-02, E4-03, E4-

04, E4-05

E5-01, E5-02, E5-03, E5-04, E5-05 G3-02, G3-03,

G3-04, G3-05 10:15 – 10:35 Tea break

Mor

ning

Ses

sion

s

10:35 – 11:55 A2-07, A2-08, A2-09, A2-06

C3-06, C3-07, C3-08, C3-09

C2-10, C4-06, C4-07, C4-08

E4-06, E4-07, E4-08, E3-06

E5-06, E5-07, E5-08, E5-09,

G3-06, G3-07, G3-08, G3-09

Overview of Poster Presentation Sessions（论文张贴总览）

Poster Session 1 August 12, 2009 Wednesday 10:00 – 12:15 Chair: Prof. Shuidi WANG

AP-01, AP-02, AP-03, AP-04, BP-01, BP-02, BP-03, BP-04, BP-05 DP-01, DP-02, DP-03, DP-04, DP-05, DP-06, DP-07, DP-08, DP-09, DP-10, DP-11, DP-12 EP-01, EP-02, EP-03, EP-04, EP-05, EP-06, EP-07, EP-08, EP-09, EP-10, EP-11, EP-12, EP-13, EP-14, EP-15, EP-16, EP-17, EP-18, EP-19, EP-20

Poster Session 2 August 12, 2009 Wednesday 15:40 – 17:40 Chair: Prof. Gong ZHANG

CP-01, CP-02, CP-03, CP-04, CP-05, CP-06, CP-07, CP-08, CP-09, CP-10 EP-21, EP-22, EP-23, EP-24, EP-25, EP-26, EP-27, EP-28, EP-29, EP-30 FP-01, FP-02, FP-03, FP-04, FP-05, FP-06, FP-07, FP-08 GP-01, GP-02, GP-03, GP-04, GP-05, GP-06, GP-07, GP-08, GP-09, GP-10, GP-11, GP-12, GP-13, GP-26

Poster Session 3 August 13, 2009 Thursday 10:15 – 11:55 Chair: Prof. Shuidi WANG

AP-05, AP-06, AP-08 CP-11, CP-12, CP-13, CP-14, CP-15, CP-16, CP-17, CP-18, CP-19, CP-20 EP-31, EP-32, EP-33, EP-34, EP-35, EP-36, EP-37, EP-38, EP-39, EP-40, EP-41, EP-42, EP-43, EP-44, EP-45 GP-14, GP-15, GP-16, GP-17, GP-18, GP-19, GP-20, GP-21, GP-22, GP-23, GP-24, GP-25

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Oral and Poster Presentation Sessions （分会场报告）

Session A1: Advanced Packaging & System Integration Date Wednesday, 12 August, 2009 Time 10:30-12:15 Venue Room 212

Dr. Andy Tseng Session Chair Advanced Semiconductor Engineering, Inc., USA

A1-01 Keynote 10:30-10:55Advanced High Density Interconnect Materials and Techniques J. Wei, S. M. L. Nai, X. F. Ang, K. P. Yung Singapore Institute of Manufacturing Technology, Singapore A1-02 10:55-11:15The High Balance Symmetric Balun for WLAN and WiMAX Application Using the Integrated Passive Device (IPD) Technology Sung-Mao Wu, Wang-Yu Lin, Kao-Yi Wang, Chien-Hsiang Huang, Wen-Kuan Yeh University of Kaohsiung, Taiwan, China A1-03 11:15-11:35New packaging technology enabling integration of Magnetics and Semiconductors in one component Abel Pot, Horst Roehm, Rinus v.d. Berg, Tamim P. Sidiki DSM Engineering Plastics, Geleen, the Netherlands; NXP Semiconductors, Hamburg, Germany; DSM Engineering Plastics, Sittard, The Netherlands A1-04 11:35-11:55Parametric Study of Electroplating-based Via-filling Process for TSV Applications K. Y. K. TSUI, S. K. YAU, V. C. K. LEUNG, P. SUN, D. X. Q. SHI Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, China A1-05 11:55-12:15Packaging and Assembly of 12-Channel Parallel Optical Transceiver Module Zhihua Li, Wei Gao, Jian Song, Baoxia Li, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China

Session D2: Emerging Technologies Date Wednesday, 12 August, 2009

Time 10:30-12:15 Venue Room 226B

Dr. Jie Xue Session Chair Cisco Systems Inc., San Jose, USA

D2-01 Keynote 10:30-10:55Emerging Lead-free, High-temperature Die-attach Technology Enabled by Low-temperature Sintering of Nanoscale Silver Pastes Guo-Quan Lu, Meihua Zhao, Guangyin Lei, Jesus N. Calata, Xu Chen, Susan Luo Virginia Tech, Blacksburg, USA; Tianjin University, Tianjin, China; NBE Technologies, USA D2-02 10:55-11:15A Novel Micro Pirani Gauge With Mono-wire Sensing Unit For Microsystem Application Yunsong Qiu, Lei Zhao, Yufeng Jin Peking University, Beijing, China; Nanjing Dajing Hi-tech, Inc., Nanjing, China D2-03 11:15-11:35On-Package Magnetic Materials for Embedded Inductor Applications Liangliang Li, Dok Won Lee, Kyu-Pyung Hwang, Yongki Min, Shan X. Wang Tsinghua University, Beijing, China; Stanford University, CA, USA; Intel Corporation, USA D2-04 11:35-11:55Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Renshi Sawada The University of Tokyo, Japan; Kyushu University, Japan D2-05 11:55-12:15Integration of GaN thin film and dissimilar substrate material by Au-Sn wafer bonding and CMP Shengjun Zhou, Zhaohui Chen, Bin Cao, Zhiyin Gan, Sheng Liu Shanghai Jiao Tong University, Shanghai, China; Huazhong University of Science & Technology, Wuhan, China

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Session B1: High Density Substrate & SMT Date Wednesday, 12 August, 2009 Time 10:30-12:15 Venue Room 213

Prof. Mingyu Li Session Chair Shenzhen Graduate School, Harbin

Institute of Technology, Shenzhen, China

B1-01 Keynote 10:30-10:55Comparison Study of Effective Power Delivery in Advanced Substrate Technologies For High Speed Networking Applications Judy Priest, Real Pomerleau, John Savic, Percy Aria, Jie Xue Cisco Systems Inc., San Jose, USA B1-02 10:55-11:15The Design and Fabrication of Multilayer Chip LC Filter with a Modified Structure by LTCC Technology Yingli Liu, Huaiwu Zhang, Yuanxun Li University of Electronic Science and Technology of China, Chengdu, China B1-03 11:15-11:35The Influence of SO2 Environments on Immersion Silver Finished PCBs by Mixed Flow Gas Testing Shunong Zhang, Anshul Shrivastava, Michael Osterman, Michael Pecht, Rui Kang Beijing University of Aeronautics and Astronautics, Beijing, China; University of Maryland, U.S.A; City University of Hong Kong, Hong Kong, China B1-04 11:35-11:55Study on Reliability of Embedded Passives in Organic Substrate Weiyang Qiu, Kailin Pan, Chaoping Yuan, Jiaopin Wang Guilin University of Electronic Technology, Guilin, China B1-05 11:55-12:15Investigation on PCB Related Failures in High-Density Electronic Assemblies L. N. Lu, H. Z. Huang, X. X. Su, B. Y. Wu, M. Cai University of Electronic Science and Technology of China, Chengdu, China; Flextronics Mobile & Consumer, Zhuhai, China; Guilin University of Electronic Technology, Guilin, China

Session D1: Emerging Technologies Date Wednesday, 12 August, 2009 Time 10:30-12:15 Venue Room 226A

Dr. Victor Liu Session Chair Xi'an Institute of Optics and

Precision Mechanics, Chinese Academy of Sciences, Xi'an, China

D1-01 Keynote 10:30-10:55Modeling of Thermal Phenomena in a High Power Diode Laser Package Ephraim Suhir, Jingwei Wang, Zhenbang Yuan, Xu Chen, Xingsheng Liu University of California, University of Maryland, CA, USA; Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences; Xi'an Focuslight Technologies Co., LTD, Xi'an, China;Tianjin University, Tianjin, China D1-02 10:55-11:15Freeform Lens for Application-Specific LED Packaging Fei Chen, Kai Wang, Zongyuan Liu, Xiaobing Luo, Sheng Liu Wuhan National Laboratory for Optoelectronics, Wuhan, China; Huazhong University of Science and Technology, Wuhan, China D1-03 11:15-11:35High Bright White LED Lens Formation by Vacuum Printing Encapsulation Systems (VPES) and its Packaging Resin Atsushi Okuno, Osamu Tanaka SANYU REC Co.,Ltd., Osaka, Japan D1-04 11:35-11:55250W QCW conduction cooled high power semiconductor laser Jingwei Wang, Zhenbang Yuan, Yanxin Zhang, Entao Zhang, Di Wu, Xingsheng Liu Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an, China; Xi'an Focuslight Technologies Co., LTD, Xi'an, China D1-05 11:55-12:15High Density Indium Bumping Through Pulse Plating Used For Pixel X-Ray Detectors Yingtao Tian, David A. Hutt, Changqing Liu, Bob Stevens Loughborough University, UK; Central Microstructure Facility, Rutherford Appleton Laboratory, UK

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Session E1: Packaging Materials & Processes Date Wednesday, 12 August, 2009 Time 10:30-12:15 Venue Room 327A

Dr. Daniel Lu Session Chair R&D department, Henkel

Corporation, Yantai, China E1-01 Keynote 10:30-10:55Development of Lead-Free Solders with Superior Drop Test Reliability Performance Y. W. Wang, C. R. Kao Taiwan University, Taiwan, China E1-02 10:55-11:15Enhancing the Properties of a Lead-free Solder with the Addition of Ni-coated Carbon Nanotubes S.M.L. Nai, Y.D. Han, H.Y. Jing, K.L. Zhang, C.M. Tan, J. Wei Singapore Institute of Manufacturing Technology, Singapore; Tianjin University, Tianjin, China; Tianjin University of Technology, Tianjin, China; Nanyang Technological University, Singapore E1-03 11:15-11:35A Method to Produce Printed Circuit Boards with Embedded Semiconductors Using Stress Buffer Layers Won Seo, Young-Mo Koo, Se-Hoon Park, Nam-Ki Kang, Gu-Sung Kim Kangnam University, Korea; EPWorks Co., Ltd., ESIP Lab., Korea; Korea Electronics Technology Institute, Korea E1-04 11:35-11:55Study of Tungsten Metallization Surface States for Multilayer Ceramic Wenjuan Zhang, Huajiang Jin Hebei Semiconductor Research Institute, Shijiazhuang, China E1-05 11:55-12:15SOLDER CRACKING MECHANISM CORRELATION TO ALLOY COMPOSITION UNDER THERMAL CYCLING STRESS (Part 1) Shining Chang, Rocky Wang, Yu Xiang, Gibson ChangMitac Computer, ShunDe, China


Date Wednesday, 12 August, 2009 Time 10:30-12:15 Venue Room 327B

Prof. Le Luo Session Chair Shanghai Institute of Microsystem and

Information Technology, Chinese Academy of Sciences, Shanghai, China

E2-01 Keynote 10:30-10:55High reliability Lead-free solder for car-electronics Minoru UESHIMA, Yoshitaka TOYODA, Jun SugimotoSenju Metal Industry Co., Ltd. Japan E2-02 10:55-11:15Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu Under Bump Metallization Kai-Jheng Wang, Jenq-Gong Duh, Su-Yueh Tsai Tsing Hua University, Hsinchu, Taiwan, China E2-03 11:15-11:35Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling H.T. Chen, T. Mattila, J. Li, X.W. Liu, J.K. Kivilahti Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, China; Helsinki University of Technology, Finland E2-04 11:35-11:55Growth Kinetics and Microstructural Evolution of Cu-Sn Intermetallic Compounds on Different Cu Substrates during Thermal Aging Z.Q. Liu, P.J. Shang, D.X. Li, J.K. Shang Shenyang National Laboratory for Materials Science; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China; University of Illinois at Urbana-Champaign, Urbana, USA E2-05 11:55-12:15Assessment of LF Solder Joint Reliability by Four Point Cyclic Bending Jifan Wang, Yuming Ye, Junying Zhao, Sang Liu, Yunhua Tu, Song Li, Zhiwei Song Huawei Technologies Co., Ltd. Shenzhen, China

Session G1: Quality & Reliability Date Wednesday, 12 August, 2009 Time 13:35-17:40 Venue Room 212

Prof. Chris Bailey Session Chairs University of Greenwich,

London, UK

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Dr. Xinyu Dou Tsinghua University, Beijing, China

G1-01 Keynote 13:35-14:00Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-Ray Tubes and NanoCT Zhenhui He, Quan Wen, Xiaojie Huang GE Sensing & Inspection GmbH, Germany G1-02 14:00-14:20Advanced Moisture Diffusion Model and Hygro-Thermo-Mechanical Design for Flip Chip BGA Package Hsiang-Chen Hsu, Ming-Han Tsai I-Shou University, Taiwan, China G1-03 14:20-14:40Analysis the Performance of the Micro-Channels Cooler with Different Inlet Position Xiaojing Wang, Wen Zhang, Hongjun Liu, Ling Chen, Zongshuo Li Shanghai University, Shanghai, China G1-04 14:40-15:00Sn Whisker Concern in IC Packaging for High Reliability Application Jeffrey Chang, Bing Lee IST-Integrated Service Technology, Taiwan, China G1-05 15:00-15:20Investigation of Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating Alongheng Baated, Keun-Soo Kim, Katsuaki Suganuma Osaka University, Osaka, Japan G1-06 15:20-15:40Effects of Thermal Aging on the Electrical Resistance of Sn-3.5Ag Micro SOH Solder Joints Jin Peng, Fengshun Wu, Hui Liu, Longzao Zhou, Qilin Pan Huazhong University of Science and Technology, Wuhan, China Tea Break 15:40-16:00G1-07 16:00-16:20Instability and Failure Analysis of Film-substrate Structure under Electrical Loading Qinghua Wang, Huimin Xie, Jia Liu, Xue Feng, Fulong Dai Tsinghua University, Beijing, China G1-08 16:20-16:40Reliability Study of RFID Flip Chip Assembly by Isotropic Conductive Adhesive through Computer

Simulation Edward K L Chan, Bo Gao, Matthew M F Yuen Hong Kong University of Science and Technology, Hong Kong, China G1-09 16:40-17:00Effect of Thermomigration in Eutectic SnPb Solder Layer Yuan Tao, Lan Ding, Yuhui Yao, Bing An, Fengshun Wu, Yiping Wu Huazhong University of Science and Technology, Wuhan, China G1-10 17:00-17:20Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging Li Xu, Xiuzhen Lu, Johan Liu, Xinyu Du, Yan Zhang, Zhaonian Cheng Shanghai University, Shanghai, China; Henkel Corporation, CA, USA; Chalmers University of Technology, Sweden G1-11 17:20-17:40Effect of Zn Addition on Microstructure of Sn-Bi Joint Q. S. Zhu, H. Y. Song, H. Y. Liu, Z. G. Wang, J. K. Shang Shenyang National Laboratory for Materials Science; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China; University of Illinois at Urbana-Champaign, Urbana, USA

Session C1: Packaging Design & Modeling Date Wednesday, 12 August, 2009 Time 13:35-17:40 Venue Room 213

Dr. Wenhui Zhu United Test and Assembly Center (UTAC) Private Limited, Singapore Prof. Xiaobing Luo

Session Chairs

Huazhong University of Science and Technology, Wuhan, China

C1-01 Keynote 13:35-14:00Managing Transient Thermal Environments During the Underfill Process Steven J Adamson, Dan Ashley, William Hassler, Jared Wilburn, X Q Gao Asymtek,USA C1-02 14:00-14:20

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Thermal Analysis And Testing Of Multi Layer Ceramic-Metal Packaged LED Peng Jin, Qifeng Zhou, Na Wu, Qun Zhong The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, Shenzhen, China C1-03 14:20-14:40Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model Yan Zhang, Jing-yu Fan, Johan Liu Shanghai University, Shanghai, China; SMIT Center & Bionano Systems Laboratory, Sweden C1-04 14:40-15:00Finite Element Thermal Analysis for High Power Multi-chip Light Emitting Diode Longzao Zhou, Hongtao Chen, Bing An, Fengshun Wu, Yiping Wu Huazhong University of Science and Technology, Wuhan, China C1-05 15:00-15:20A Design of an Optical Transceiver SiP Wei Gao, Lixi Wan, Baoxia Li, Jian Song, Xu Zhang Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China C1-06 15:20-15:40Power Supply Analysis in Package and SiP Design Wenliang Dai Cadence Design Systems, Inc., Shanghai, China Tea Break 15:40-16:00C1-07 16:00-16:20Effect of Fluid Dynamics and Device Mechanism on Biofluid Behaviour in Microchannel Systems: Modelling Biofluids in a Microchannel Biochip Separator Xiangdong Xue, Mayur K Patel, Maïwenn Kersaudy-Kerhoas, Chris Bailey, Marc P.Y. Desmulliez, David Topham University of Greenwich, London, UK; Heriot-Watt University, Edinburgh, UK; Brunel University, Uxbridge, Middlesex, UK C1-08 16:20-16:40Modeling of Manufacturing Processes of High Power Light Emitting Diodes: Wire Bonding Process Zhaohui Chen, Yong Liu, Sheng Liu Shanghai Jiao Tong University, Shanghai, China; Huazhong University of Science & Technology, Wuhan, China;

Fairchild Semiconductor Corp., South Portland C1-09 16:40-17:00Advanced Package Design for Electronic and MEMS Applications Supported by FE Analyses and Deformation Measurements Sommer, J.-P., Michel, B., Kugler, A., Rank, H. Fraunhofer Research Institution for Electronic Nano Systems (ENAS), Chemnitz;Micro Materials Center Berlin/Chemnitz, Germany; Robert Bosch GmbH, Stuttgart C1-10 17:00-17:20A Novel Wafer Level Package Strategy for RF MEMS Zheng Wang, Zewen Liu Tsinghua University, Beijing, China C1-11 17:20-17:40Design and Simulation of a Package Solution for Millimeter wave MEMS Switch Wencai Yu, Xiaoping Liao Southeast University, Nanjing, China

Session C2: Packaging Design & Modeling Date Wednesday, 12 August, 2009 Time 13:35-17:40 Venue Room 226A

Dr. J.-P. Sommer Fraunhofer Research Institution for Electronic Nano Systems (ENAS), Germany Prof. Fei Qin

Session Chairs

Beijing University of Technology, Beijing, China

C2-01 Keynote 13:35-14:00Packaging of Light Emitting Diodes for Display Backlights: Need for Multi-Disciplinary Design Tools Yek Bing Lee, Nadia Strusevich, Chris Bailey, Chun-Yan Yin, Colin Cartwright University of Greenwich, London, UK C2-02 14:00-14:20A simplified computational model for solder joints under drop impact loadings Tong AN, Fei QIN Beijing University of Technology, Beijing, China C4-09 14:20-14:40Superfilling of Deep Trenches with Copper by Catalyst-Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment and Its Modeling

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Do-Seon LEE, Chang-Gyu Kim, Young-Ho Kim, Won-Jong LEE KAIST, Daejeon, Korea C2-04 14:40-15:00Moiré Method for Nanoprecision Wafer-to-Wafer Alignment: Theory, Simulation and Application Chenxi Wang, Tadatomo Suga The University of Tokyo, Japan C2-05 15:00-15:20Localized Induction Heating for Wafer Level Packaging Mingxiang Chen, Wenming Liu, Yanyan Xi, Changyong Lin, Sheng Liu Wuhan National Laboratory for Optoelectronics, Wuhan, China; Huazhong University of Science and Technology, Wuhan, China C2-06 15:20-15:40Molecular Dynamics of Nanofluids with Time-dependent Thermal Conductivity in Heat Sink Dissipation Xiaojing Wang, Hongjun Liu, Wen Zhang, Zongshuo Li, Ling Chen Shanghai University, Shanghai, China Tea Break

15:40-16:00

C2-07 16:00-16:20Hydrophobic Self-Assembly Monolayer Structure for Reduction of Interfacial Moisture Diffusion H. B. FAN, Cell K.Y. Wong, Matthew M.F. Yuen Hong Kong University of Science and Technology, Hong Kong, China C2-08 16:20-16:40Thermal Numerical Simulation for Advanced Package Development Guohua Gao, HongHui Wang, GuoJi Yang, HaiQing Zhu Nantong Fujitsu Microelectronics Co., Ltd., Nantong, China C2-09 16:40-17:00FE simulation of size effects on interface fracture characteristics of microscale lead-free solder interconnects Bin LI, Li-meng YIN, Yan YANG, Xin-ping ZHANG South China University of Technology, Guangzhou, China C2-03 17:00-17:20Design of Miniaturized Bandpass Filters for GSM and GPS Applications Using Embedded Capacitor Material

Yunfeng Wang, Lei Li, Lixi Wan Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences/The Chinese University of Hong Kong, Shenzhen, China; Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China C2-11 17:20-17:40A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink Shun Wang, Yan Zhang, Yifeng Fu, Johan Liu, Xiaojing Wang, Zhaonian Cheng Shanghai University, Shanghai, China; Chalmers University of Technology, Sweden

Session F1: Packaging Equipment & Advanced Manufacturing Technologies Date Wednesday, 12 August,

2009 Time 13:35-17:40 Venue Room 226B

Dr. Paul Wang Mitac Computer, ShunDe, China Prof. Jianhua Zhang

Session Chairs

Shanghai University, Shanghai, China

F1-01 Keynote 13:35-14:00Wafer level Camera: an example of TSV Applications Gong Li Suss MicroTec (Shanghai) Ltd F1-12 14:00-14:203in1 Inspection and Direct-Writing Technology Fangxin Zhang Advantools (China) Co. Ltd. F1-03 14:20-14:40From Thin Cores to Outer Layers: Filling through Holes and Blind Micro Vias with Copper by Reverse Pulse Plating Stephen Kenny, Bernd Roelfs Atotech, Berlin, Germany F1-04 14:40-15:00Investigation of Thin Small Outline Package (TSOP) Solder Joint Crack after Accelerated Thermal Cycling Testing L. N. Lu, H. Z. Huang, B. Y. Wu, Q. Zhou, X.X. Su, M. Cai University of Electronic Science and Technology of China, Chengdu, China;

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Guilin University of Electronic Technology, Guilin, China; Flextronics Mobile Consumer, Zhuhai, China F1-05 15:00-15:20On Variable Frequency Microwave Processing of Heterogeneous Chip-on-Board Assemblies T. Tilford, S. Pavuluri, C. Bailey, M. P. Y. Desmulliez University of Greenwich, London, UK; Heriot-Watt University, Edinburgh, UK F1-06 15:20-15:40Science Creates the Best; Innovation Inspires the Future — New technology on µBGA Pb-free Sn Ball Manufacturing Mengxi WANG Dafeng Zhouxin Electronics Co., Ltd. Tea Break 15:40-16:00F1-07 16:00-16:20Advanced Chip to Wafer Bonding: A Flip Chip to Wafer Bonding Technology for High Volume 3DIC Production Providing Lowest Cost of Ownership A. Sigl, S. Pargfrieder, C. Pichler, C. Scheiring, P. Kettner EV Group, Austria; Datacon Technology GmbH, Austria F1-08 16:20-16:40The Effect of Plasma Etching Process on Rigid Flex Substrate for Electronic Packaging Application K. C. Yung, H. M. Liem, H. S. Choy, H. F. Zheng, Tao Feng, T. M. Yue The Hong Kong Polytechnic University, Hong Kong, China; The Linde Group, Shanghai, China F1-09 16:40-17:00A Study on the Characterization of Quasi-Three-Dimensional PN Junction Capacitor Huijuan Wang, Yao Lv, Wei Gao, Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China F1-10 17:00-17:20Effect of PIII on the Adhesion Behavior of Epoxy Molding Compound-Nickel Interface Lilong Liu, Qian Lu, Yipeng Wang, Weifeng Dai, Xin Zhang, Yuesheng Li, Xiaojing Wu Fudan University, Shanghai, China F1-11 17:20-17:40Improving Board Assembly Yield through PBGA Warpage Reduction Li Li, Ken Hubbard, Jie Xue Cisco Systems Inc., San Jose, USA

Session E3: Packaging Materials & Processes Date Wednesday, 12 August, 2009 Time 13:35-17:40 Venue Room 327A

Dr. Klaus-peter Galuschiki SMT Technology & Material, Corporate Technology, Siemens Ltd., China Prof. Mingliang Huang

Session Chairs

Dalian University of Technology, Dalian, China

E3-01 13:35-13:55A Warpage of Wafer Level Bonding for CIS (CMOS Image Sensor) Device Using Polymer Adhesive Jae-Hyun Park, Ji-Young Lee, Min-Kyo Cho, Jae-June Kim, Gu-Sung Kim Kangnam University, Korea; EPWorks Co.,Ltd., ESIP Lab., Korea E3-02 13:55-14:15Improved Thermal Performance of High-Power LED by Using Low-temperature Sintered Chip Attachment T. Wang, G. Lei, X. Chen, L. Guido, Khai Ngo, G-Q. Lu Tianjin University, Tianjin, China; Virginia Tech, USA E3-03 14:15-14:35Fundamental Studies on Whisker Growth in Sn-based Solders Mengke Zhao, Hu Hao, Guangchen Xu, Jia Sun, Yaowu Shi, Fu Guo Beijing University of Technology, Beijing, China E3-04 14:35-14:55Micro-structural and Interfacial Effects on the Dielectric Properties of High-k Aluminum/Epoxy Composites for Embedded Capacitors Chong Chen, Shuhui Yu, Rong Sun, Suibin Luo, Lvqian Weng, Ruxu Du Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences, Shenzhen, China; Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, China E3-05 14:55-15:15Comparative Study of Interfacial Reactions of High-Sn Lead-free Solders on Single Crystal Cu and on Polycrystalline Cu

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Yipeng Cui, Mingliang Huang Dalian University of Technology, Dalian, China E4-09 15:15-15:35Solderability of Tinned FeNi Under Bump MaterialCai Chen, Lei Zhang, J. K. Shang Shenyang National Laboratory for Materials Science; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China; University of Illinois at Urbana-Champaign, Urbana, USA Tea Break 15:40-16:00E3-07 16:00-16:20Microstructural Characterization of Electroplating Sn on Lead-frame Alloys Yiqing Wang, Dongyan Ding, Klaus-Peter Galuschki, Yu Hu, Angela Gong, Shuo Bai, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China E3-08 16:20-16:40The Fabrication of Composite Solder by Addition of Copper Nano Powder into Sn 3.5Ag Solder Aemi Nadia University of Malaya, Malaysia E3-09 16:40-17:00Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations Rong An, Chunqing Wang, Yanhong Tian Harbin Institute of Technology, Harbin, China E3-10 17:00-17:20Microstructural Evolution of Sn-3.5Ag Solder with Lanthanum Addition Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih, Che-wei Hsu Cheng-Kung University, Taiwan, China; Pingtung University of Science and Technology, Pingtung, Taiwan E3-11 17:20-17:40Optimal Packing Research of Spherical Silica Fillers Used in Epoxy Molding Compound Hujie Mei, Xinyu Du, Lanxia Li, Wei Tan Henkel Huawei Electronics Co. Ltd. (HHE), Lianyungang, China

Session G2: Quality & Reliability Date Wednesday, 12 August, 2009 Time 13:35-17:40 Venue Room 327B

Prof. Fu Guo Session Chairs Beijing University of Technology,

Beijing, China

Prof. Kailin Pan Guilin University of Electronic Technology, Guilin, China

G2-01 Keynote 13:35-14:00Interfacial Reaction between Sn solder and Cu-xZn UBM after Reflow and Thermal Aging Chi-Yang Yu, Jenq-Gong Duh Tsing Hua University, Hsinchu, Taiwan, China G2-02 14:00-14:20Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging Xiuzhen Lu, Li Xu, Huaxiang Lai, Xinyu Du, Johan Liu, Zhaonian Cheng Shanghai University, Shanghai, China; Henkel Corporation, CA, USA; Chalmers University of Technology, Sweden G2-03 14:20-14:40The Effects of Bonding Parameters on the Reliability Performance of Flexible RFID Tag Inlays Packaged by Anisotropic Conductive Adhesive Xiong-hui Cai, Xian-cai Chen, Bing An, Feng-shun Wu, Yi-ping Wu Huazhong University of Science and Technology, Wuhan, China G2-04 14:40-15:00Effects of Design, Structure and Material on Thermal-Mechanical Reliability of Large Array Wafer Level Packages Bhavesh Varia, Xuejun Fan, Qiang Han Lamar University, USA; South China University of Technology, Guangzhou, China G2-05 15:00-15:20Development of High Speed Cold Ball Pull as a Quick Turn Monitor for Solder Joint Reliability Yu Wang, Liqiang Cao Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China G2-06 15:20-15:40Influencing Factors and Solutions for Ball Short During Wire Bonding Zhong Meng, Yusheng Feng, Sunggug Lee Samsung Electronics (Suzhou) Semiconductor Co.,Ltd.(SESS), Suzhou, China Tea Break 15:40-16:00G2-07 16:00-16:20Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

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M. van Soestbergen, A. Mavinkurve, R.T.H Rongen, L.J. Ernst, G.Q. Zhang Materials Innovation Institute, Delft, The Netherlands; NXP Semiconductors, Delft, The Netherlands G2-08 16:20-16:40Microstructure Changes and Compound Growth Dynamic at Lead-free/Cu Interface under Difference Conditions Lihua Qi, Jihua Huang, Jing Niu, Long Yang, Yaorong Feng, Xingke Zhao, Hua Zhang University of Science and Technology Beijing, Beijing, China; Tubular Goods Research Center of CNPC G2-09 16:40-17:00Research of Structural Factors Effects on Drop Reliability Jianhui Wang, Xingming Fu, Xiaoqiang Xie, Jianwei Zhou, Qian Wang, Zaisung Lee Samsung Semiconductor (China) R&D Co. Ltd., Suzhou, China G2-10 17:00-17:20Effect of Stand-off Height on the Reliability of Cu/Sn-4.8Bi-2Ag/Cu Solder Joint Hui Liu, Longzao Zhou, Jun Li, Fengshun Wu, Yiping Wu Wuhan National Laboratory for Optoelectronics, Wuhan, China; Huazhong University of Science and Technology, Wuhan, China G2-11 17:20-17:40Enhancement of TBGA Substrate in Packing Drop Test Kelvin Pun, C Q Cui Compass Technology Co., Ltd., Hong Kong, China

Session A2: Advanced Packaging & System Integration Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 212

Prof. Lixi Wan Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China Prof. GS Kim

Session Chairs

Kangnam University, Korea A2-01 Keynote 08:30-08:55Recent Advances in Laser Assisted Polymer Intermediate Layer Bonding for MEMS Packaging

Changhai Wang, Jun Zeng, Yufei Liu Heriot Watt University, Edinburgh, UK A2-02 08:55-09:15Wafer-Scale Hermetically Packaged MEMS Switches with Liquid Gallium Contacts Qingquan Liu Nanjing University of Information Science and Technology, Nanjing, China A2-03 09:15-09:35Underfill Study for Large Dice Flip Chip Packages Antony Lin, CY Li, Meng-Kai Shih, Yi-Shao Lai, Bernd Appelt, Andy Tseng Advanced Semiconductor Engineering, Inc., Taiwan, China; ASE (US) INC., Santa Clara, California, USA A2-04 09:35-09:55Development of A Novel Cost-Effective Package-on-Package (PoP) Solution P. SUN, V. C. K. LEUNG, D. YANG, D. X. Q. SHI Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, China A2-05 09:55-10:15EcoDesign Technical Committee of JIEP (Japan Institute of Electronics Packaging) and Its Activity Hidetaka Hayashi Eco-Design Technical Committee of JIEP, Japan Tea Break 10:15-10:35A2-07 10:35-10:55A new method to fabricate sidewall insulation of TSV using a parylene protection layer Ming Ji, Yunhui Zhu, Shenglin Ma, Xin Sun, Min Miao, Yufeng Jin Peking University, Beijing, China; National Key Laboratory on Micro/Nano Fabrication, Peking University, Beijing, China; Inst. of Information Microsystem, Beijing Information Science & Technology University, Beijing, China A2-08 10:55-11:15The electrical, mechanical properties of Through-Silicon-Via Insulation Layer for 3D Ics Sang-Woon Seo, Jae-Hyun Park, Min-Seok Seo, Gu-Sung Kim Kangnam University, Korea; EPWorks Co.,Ltd., ESIP Lab., Korea; Hynix Semiconductor Co., Ltd., PKG development team, Korea A2-09 11:15-11:35Through Silicon Via Filling by Copper Electroplating in Acidic Cupric Methanesulfonate Bath

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Qi Li, Huiqin Ling, Haiyong Cao, Zuyang Bian, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China; Sinyang Semiconductor Material Co., Ltd., Shanghai, China A2-06 11:35-11:55Artificial Neural Network Application in Vertical Interconnection Modeling Yuanjun Liang, Lei Li Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences/The Chinese; University of Hong Kong, Shenzhen, China; Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China

Session C3: Packaging Design & Modeling Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 213

Dr. Yong Liu Fairchild Semiconductor, Suzhou, China Prof. Fei Xiao

Session Chairs

Fudan University, Shanghai, China

C3-01 08:30-08:50Fracture Simulation of Solder Joint Interface by Cohesive Zone Model Tong AN, Fei QIN Beijing University of Technology, Beijing, China AP-07 08:50-09:10A PCB-based Package Structure Na Wang, Jian Cai, Weikang Yang, Xinyu Dou Tsinghua University, Beijing, China C3-03 09:10-09:30Lifetime Prediction of an IGBT Power Electronics Module Under Cyclic Temperature Loading Conditions Hua Lu, Chris Bailey University of Greenwich, London, UK C3-04 09:30-09:50An In-Depth Numerical Investigation Into Packaging Design of Multi-Finger GaInP/GaAs Collector-Up HBTs H. C. Tseng, J. Y. Chen Kun Shan University, Taiwan, China C3-05 09:50-10:10A study of Power Delivery Network in a GPS SiP

Jun Li, Lixi Wan, Cheng Liao Southwest Jiaotong University, Chengdu, China; Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China Tea Break 10:15-10:35C3-06 10:35-10:55Modeling thermal fatigue in anisotropic Sn-Ag-Cu/Cu solder joints Shihua Yang, Yanhong Tian, Chunqing Wang, Tengfei Huang Harbin Institute of Technology, Harbin, China C3-07 10:55-11:15Numerical Analysis of Response of Indium Micro-joint to Low-temperature Cycling X. Cheng, C. Liu, V.V. Silberschmidt Loughborough University, UK C3-08 11:15-11:35A Thermal Model for Calculating Thermal Resistance of Eccentric Heat Source on Rectangular Plate with Convective Cooling Existing at Upper and Lower Surfaces Xiaobing Luo, Zhangming Mao, Sheng Liu Huazhong University of Science and Technology, Wuhan, China C3-09 11:35-11:55Modeling of Heat Transfer Performance for an Array of Micro Jets Impinging upon Dimpled Surface Tian-yi Geng, Jing-yu Fan, Yan Zhang, Shun Wang Shanghai University, Shanghai, China

Session C4: Packaging Design & Modeling Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 226A

Dr. Jerry Lu Intel Corporation, USA Prof. Liqiang Cao

Session Chairs

Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China

C4-01 Keynote 08:30-08:55Full Thermal Parametric Model for Power WL-CSP Design Zhongfa Yuan, Yong Liu, Steve Martin, Luke England, Byoungok Lee Fairchild Semiconductor, Suzhou, China C4-02 08:55-09:15

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An Improved Substructure Method for Prediction of Solder Joint Reliability in Thermal Cycle Fei Liu, Lihua Liang, Yong Liu Zhejiang University of Technology, Hangzhou, China; Fairchild Semiconductor Corp., S.Portland, USA C4-03 09:15-09:35Warpage Prediction of Fine Pitch BGA by Finite Element Analysis and Shadow Moiré Technique Ke Xue, Jingshen Wu, Haibin Chen, Jingbo Gai, Angus Lam Hong Kong University of Science and Technology, Hong Kong, China; Harbin Engineering University, Harbin, China; ASAT Holdings Limited, Dongguan, China C4-04 09:35-09:55Prediction of Die Failure in Copper-Low-k Flip Chip Package with Consideration of Packaging Process-Induced Stresses Mingjun Zhao, D. Yang, Ligang Niu Guilin University of Electronic Technology, Guilin, China C4-05 09:55-10:15Simulation of Fluid Flow and Heat Transfer in Microchannel Cooling for LTCC Electronic Packages J.Zhang, Y.F.Zhang, M.Miao, Y.F.Jin, S.L. Bai, J.Q. chen Peking University, Beijing, China; Beijing Science and Information Technology Institute, Beijing, China Tea Break 10:15-10:35C2-10 10:35-10:55Thermal Design of Power Module to Minimize Peak Transient Temperature Xiao Cao, Khai D. T. Ngo, Guo-Quan Lu Virginia Polytechnic Institute and State University, Blacksburg, USA C4-06 10:55-11:15Research of methodologies to enlarge the isolation in 3D interconnection Liwei Zhao, Long Yang, Xin Sun, Yufeng Jin Peking University, Beijing, China C4-07 11:15-11:35Study on EBG structure combined with decoupling capacitor for suppressing Ground Bounce Noise Wen-long Zhu, Wen-xiang Chen, Lei Li Xiamen University, Xiamen, China; Shenzhen institute of advance technology, Chinese Academy of Sciences/the Chinese University of Hong Kong Shenzhen, China

C4-08 11:35-11:55Parametric Study of Warpage in Package-on-Package Manufacturing Chao REN, Fei QIN Beijing University of Technology, Beijing, China

Session E4: Packaging Materials & Processes Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 226B

Dr. Changqing Liu Loughborough University, UK Dr. Yanhong Tian

Session Chairs

Harbin Institute of Technology, Harbin, China

E4-01 Keynote 08:30-08:55iNEMI HFR-free Program Report Haley Fu, Stephen Tisdale, Martin Rausch, John Davignon, Stephen H. Hall, Robert C. Pfahl iNEMI, China; Intel Corporation, USA; iNEMI, USA E4-02 08:55-09:15Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions Lei Nie, Mingzhi Dong, Jian Cai, Michael Osterman, Michael Pecht Center for Advanced Life Cycle Engineering, University of Maryland, USA; Tsinghua University, Beijing, China E4-03 09:15-09:35Effect of Cu Addition in Sn-Containing Solder Joints on Interfacial Reactions with Au Foils Wei Liu, Chunqing Wang, Lining Sun, Yanhong Tian, Yarong Chen Harbin Institute of Technology, Harbin, China E4-04 09:35-09:55Evolution of Ag3Sn Intermetallic Compounds in Solidification of Eutectic Sn-3.5Ag Solder Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih Cheng-Kung University, Taiwan, China; Pingtung University of Science and Technology, Pingtung, Taiwan E4-05 09:55-10:15Indium Bump Fabricated with Electroplating Method Qiuping Huang, Gaowei Xu, Le luo

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Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China Tea Break 10:15-10:35E4-06 10:35-10:55Effect of aging time on interfacial microstructure of Sn-3.8Ag-0.7Cu solder reinforced with Co nanoparticles S.L. Tay, A.S.M.A. Haseeb, Mohd. Rafie Johan University of Malaya, Malaysia E4-07 10:55-11:15Behaviors of Palladium in Palladium Coated Copper Wire Bonding Process Binhai Zhang, Kaiyou Qian, Ted Wang, Yuqi Cong, Mike Zhao, Xiangquan Fan, Jiaji Wang Fudan University, Shanghai, China; ASE Assembly & Test (Shanghai) Limited, Shanghai, China E4-08 11:15-11:35Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect L. D. Chen, Mingliang Huang Dalian University of Technology, Dalian, China E3-06 11:35-11:55Phase Identification of Intermetallic Compounds Formed During In-48Sn/Cu Soldering Reactions P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang Shenyang National Laboratory for Materials Science; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China; University of Illinois at Urbana-Champaign, Urbana, USA

Session E5: Packaging Materials & Processes Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 327A

Dr. Dongyan Ding Shanghai Jiao Tong University, Shanghai, China Dr. Hidetaka Hayashi

Session Chairs

Eco-Design Technical Committee of JIEP, Japan

E5-01 08:30-08:50Characterize the Microstructure and Reliability of Ultra Fine Pitch BGA Joints Lei Wang, Zhenqing Zhao, Qian Wang, Jaisung Lee Samsung Semiconductor (China) R&D Co. Ltd.,

Suzhou, China E5-02 08:50-09:10Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding J.J.M. Zaal, W.D. van Driel, G.J.A.M. Verheijden, G.Q. Zhang Delft University of Technology, Delft, the Netherlands; NXP Semiconductors, Nijmegen, the Netherlands; NXP Semiconductors, Leuven, Belgium; NXP Semiconductors, Eindhoven, the Netherlands E5-03 09:10-09:30Super-hydrophobic Nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry Tao Hang, Ming Li, Anmin Hu, Dali Mao Shanghai Jiao Tong University, Shanghai, China E5-04 09:30-09:50Liquid-state Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solders and Cu Substrate Xiaoying Liu, Yanhui Zhao, Mingliang Huang, C.M.L. Wu, Lai Wang Dalian University of Technology, Dalian, China; City University of Hong Kong, Hong Kong, China E5-05 09:50-10:10Cure Kinetics Analysis and Simulation of Silicone Adhesives Qin Zhang, Bin Song, Simin Wang, Ling Xu, Sheng LiuHuazhong University of Science and Technology, Wuhan, China; Wuhan National Laboratory for Optoelectronics Division of MOEMS, Wuhan, China Tea Break 10:15-10:35E5-06 10:35-10:55Growth and Recrystallization of Electroplated Copper Columns Jun Liu, Changqing Liu, Paul P Conway, Jun Zeng, Changhai Wang Loughborough University, UK; Heriot-Watt University, UK E5-07 10:55-11:15Electrochemical Corrosion Behaviour of Sn-8Zn-3Bi-XCr Solder in 3.5% NaCl Jing Hu, Anmin Hu, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China E5-08 11:15-11:35The Influence of Silicon Content on the Thermal Conductivity of Al-Si/ Diamond Composites Yang Zhang, Xitao Wang, Jianhua Wu University of Science and Technology Beijing,

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Beijing, China E5-09 11:35-11:55Study on Microstructure and Properties of Al/SiCp Electronic Packaging Materials Embedded Metal Components Zhiqing Zhang, Hongyu Zheng Hebei Semiconductor Research Institute, Shijiazhuang, China

Session G3: Quality & Reliability Date Thursday, 13 August, 2009 Time 08:30-11:55 Venue Room 327B

Dr. Dongming He Intel Corporation, USA Prof. Fengshun Wu

Session Chairs

Huazhong University of Science and Technology, Wuhan, China

G3-01 Keynote 08:30-08:55Quality and Reliability Challenges for Ultra Mobile Computing and Communication Application Processor Packaging Dongming He, Wonjae Kang Intel Corporation, Folsom, USA G3-02 08:55-09:15Electromigration Analysis and Electro-Thermo-Mechanical Design for Semiconductor Package Hsiang-Chen Hsu, Shen-Wen Ju, Jie-Rong Lu, Hong-Shen Chang, Hong-Hau Wu I-Shou University, Taiwan, China G3-03 09:15-09:35Mechanical Property and Electrochemical Corrosion Behavior of Al-Cu Solder Joint Yingzhuo Huang, Mingliang Huang Dalian University of Technology G3-04 09:35-09:55Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions Chaoran Yang, Yuen Sing Chan, S. W. Ricky Lee, Yuming Ye, Sang Liu Hong Kong University of Science and Technology, Hong Kong, China; Huawei Technologies Co., Ltd., Shenzhen, China G3-05 09:55-10:15Board Level Reliability Assessments of Thru-Mold Via Package on Package (TMV™ PoP) Tae-Kyung Hwang, Dong-Joo Park, Jin-Seong Kim, Jin-Young Kim, Jae-Dong Kim, Choon-Heung Lee

Amkor Technology Korea, Inc, Korea Tea Break

10:15-10:35

G3-06 10:35-10:55Prediction of IMC Dormation in Interfacial Reaction: Application of CALPHAD Approach to Electronic Package Huashan Liu, WenJun Zhu, ZhanPeng Jin Central South University, Changsha, China G3-07 10:55-11:15Establishing Mixed Mode Fracture Properties of EMC-Copper (-oxide) Interfaces at Various Temperatures A. Xiao, G. Schlottig, H. Pape, B. Wunderle, O. van der Sluis, K. M. B. Jansen, L. J. Ernst Delft University of Technology, Delft, the Netherlands; Infineon Technologies AG, Germany; Fraunhofer IZM, Germany G3-08 11:15-11:35Effect of Thermal Cycling on Interfacial IMCs Growth and Fracture Behavior of SnAgCu/Cu Joints Xiaoyan Li, Fenghui Li Beijing University of Technology, Beijing, China G3-09 11:35-11:55Effect of Miniaturization on the Microstructure and Mechanical Property of Solder Joints Bo Wang, Fengshun Wu, Jin Peng, Hui Liu, Yiping Wu, Yuebo Fang Huazhong University of Science and Technology, Wuhan, China; Ningbo Kangqiang Electronics Co., LTD, Ningbo, China

Poster Session 1 Date Wednesday, 12 August, 2009 Time 10:00-12:15

Prof. Shuidi Wang Session Chair Tsinghua University, Beijing,

China AP-01 Package heat dissipation with integrated carbon nanotube micro heat sink Xiaojing Wang, Hongjun Liu, Jia Wang, Wen Zhang, Zongshuo Li Shanghai University, Shanghai, China AP-02 A Novel MEMS Package with Three-Dimensional

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Stacked Modules Gaowei Xu, Qiuping Huang, Wenguo Ning, Zugang Ruan, Le Luo Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China AP-03 Fabrication and Characterization of a Novel Wafer-level Chip Scale Package for MEMS devices Yuhan Cao, Le Luo Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China AP-04 Study on a 3D Packaging Structure with Benzocyclobutene as a Dielectric Layer for Radio Frequency Application Fei Geng, Xiaoyun Ding, Le Luo Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China BP-01 Nanoscale Mechanical Properties and Microstructure of 3D LTCC Substrate Yangfei Zhang, Jiaqi Chen, Shulin Bai, Min Miao, Jing Zhang, Fangqing Mu, Zhengyi Wang, Shaojun Xia, Yufeng Jin Peking University, Beijing, China; Beijing Information Technology Institute, Beijing, China; No.43 Research Institute of China Electronics Technology Corporation, Hefei, China BP-02 Process research of LTCC substrate with 3D micro-channel embedded Fangqing Mu, Zhengyi Wang, Yangfei Zhang No. 43 Research Institute of China Electronics Technology Corporation, Hefei, China; Peking University, Beijing, China BP-03 Study of the Fine Line Process and Signal Integrity for Packaging Substrate Yi Ma, Jing Jiang, Zhiqin Yang, Minfei Lu Shennan Circuits Co., Ltd., Shenzhen, China BP-04 Effects of Nitrogen on the Wettability and Reliability of Lead-free Solder in Reflow Soldering Mingzhi Dong, Yuming Wang, Jian Cai, Tao Feng, Yuanyuan Pu Tsinghua University, Beijing, China; Tsinghua-Flextronics SMT Lab, Beijing, China;

The Linde Group, Linde Gases Division, Shanghai, China BP-05 Solderability of Flash Gold Surface Finish Yuming Wang, Mingzhi Dong, Jian Cai Tsinghua University, Beijing, China DP-01 Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications Zhili Hu, Björn Carlberg, Cong Yue, Xingming Guo, Johan Liu Shanghai University, Shanghai, China; Chalmers University of Technology, Göteborg, Sweden DP-02 Characterization of a Photosensitive Dry Adhesive Film for Wafer Level MEMS Packaging Kun Zhao, Changhai Wang Heriot Watt University, Edinburgh, UK DP-03 Optimization Design on Polybrominated Biphenyls (PBBs) Extraction from Plastics for RoHS DirectiveL. Hua, X. P. Guo, J. K. Yang, H. N. Hou Huazhong University of Science and Technology, Wuhan, China; Hubei University of Education, China, DP-04 The design of a terahertz metamaterial absorber basing on LTCC technology Yunsong Xie, Yuanxun Li, Yingli Liu, Huaiwu Zhang, Qiye Wen University of Electronic Science and Technology of China, Chengdu, China DP-05 Direct-write Techniques for Maskless Production of Microelectronics: A Review of Current State-of-the-art Technologies Yan Zhang, Changqing Liu, David Whalley Loughborough University, UK DP-06 Integrated Inductors on Silicon and Planarized Ceramic Substrates Jianwei Wang, Jian Cai, Xinyu Dou, Shuidi Wang Tsinghua University, Beijing, China DP-07 Nano Resonator simulation fabrication and packaging consideration Wei Zhang, Zewen Liu, Zheng Wang Tsinghua University, Beijing, China

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DP-08 Optimization of silver paste printed passive UHF RFID tags Bo Gao, Matthew M.F. Yuen Hong Kong University of Science and Technology, Hong Kong, China DP-09 Low-temperature Wafer Bonding Using Gold Layers Ying-Hui Wang, Jian Lu, Tadatomo Suga The University of Tokyo, Japan DP-10 Novel pore-sealing of ordered porous silica, SBA-15 for low-k underfill materials Kuo-Yuan Hsu, Kuei-Yue Chen, Ching-Yuan Cheng, Jhih-Jhao Lee, Jihperng Leu Chiao-Tung University, Taiwan, China; Synchrotron Radiation Research Center, Hsinchu, Taiwan DP-11 Study of polyimide as sacrificial layer with O2 plasma releasing for its application in MEMS capacitive FPA fabrication Shenglin Ma, Ying Li, Xin Sun, Yufeng Jin, Xiaomei YuPeking University, Beijing, China DP-12 Fabrication and Hydrogen Sensing Properties of Titania Nanotubes Shuo Bai, Dongyan Ding, Congqin Ning, Rui Qin, Yan Li, Chengkang Chang, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China; Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai, China EP-01 Creep Characterization of Lead Free 80Au-20Sn Solder Fei Su, Haiyan Pan Beijing University of Aeronautics and Astronautics, Beijing, China EP-02 The warpage control method in epoxy molding compound Wei Tan, Fang Zhou, Xingming Cheng, Dong Ding, Juan Wu Henkel Huawei Electronics Co. Ltd. (HHE), Lianyungang, China EP-03 On Reliability of Chips bonded on Flex Substrates Using Thermosonic Flip-Chip Bonding Process with Nonconductive Paste Cheng-Li Chuang, Jong-Ning Aoh, Wei-How Chen

Chung Shan Medical University,Taiwan, China; Chung Cheng University, Taiwan EP-04 Dynamic Constitutive Relation of EMC over a Broad Range of Temperatures and Strain Rates Tong Chen, Xiaoyan Niu, Xuefeng Shu, Jianwen ZhangTaiyuan University of Technology, Taiyuan, China; Hebei University, Hebei, China EP-05 Low K CMOS90 2N Gold Wire Bonding Process Development Ming-chuan Han, Bei-yue Yan Freescale Semiconductor (China) Ltd., Tianjin, China EP-06 Preliminary Study of a New Process to Improve the Strength of Thermo-sonic Ball Solder Joint Zhai Yu, Zhao Wang, Jun Cheng, Hw Tian Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences/The Chinese University of Hong Kong, Shenzhen, China; Southwest Jiao Tong University, Chengdu, China EP-07 Improving the Toughness and Thermal Properties of Epoxy Resin Using for Electronic Packaging by Interpenetrating Polymer Network Bo Chen, Dayong Gui, Jianhong Liu Shenzhen University, Shenzhen, China EP-08 Effects of Service Parameters on Thermomechanical Fatigue Behaviors of New Nano Composite Solder Joints F. Tai, F. Guo, B. Liu, Z.D. Xia, Y.W. Shi Beijing University of Technology, Beijing, China EP-09 Failure Analysis of Halide of Epoxy Molding Compound used for Electronic Packing Jianhai Ye, Shengxiang Bao, Lili Ma, Dechun Lv University of Electronic Science and Technology of China, Chengdu, China EP-10 Characterization, Modelling, and Parameter Sensitivity Study on Electronic Packaging PolymersLigang Niu, D. Yang, G.Q. Zhang Guilin University of Electronic Technology, Guilin, China; Delft University of Technology, Delft, the NetherlandsEP-11 Controlled Synthesis of Ortho-Substitution Ortho-cresol Novolac Resins Xiao-Wei Tian, Zhen-Guo Yang, Jiang-Yan Sun, Zheng Ji, Chuang Jiang

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Fudan University, Shanghai, China EP-12 Electrodeposition of Sn-Cu Solder Alloy for Electronics Interconnection Yi Qin, Abdul Wassay, Changqing Liu, G.D.Wilcox, Kun Zhao, Changhai Wang Loughborough University, UK; Heriot-Watt University, UK EP-13 Study on the Degradation of Sealed Organic Light-emitting Diodes under Constant Current Xiao-Ming Xu, Wen-Qing Zhu, Qiang Wang, Zhi-Lin Zhang, Xue-Yin Jiang Shanghai University, Shanghai, China EP-14 Interfacial Reaction in Cu Pillar/Sn Bump Structure during Current Stressing Myeong-Hyeok Jeong, Jae-Won Kim, Gi-Tae Lim, Byoung-Joon Kim, Kiwook Lee, Jaedong Kim, Young-Chang Joo, Young-Bae Park Andong National University, Andong, Korea; Amkor Technology Korea Inc, Seoul, Korea EP-15 Preparation and Performance of White LED Packaged YAG Phosphor Rongfeng GUAN, Wenqing ZHAO, Shuaimou LI Henan Polytechnic University, Jiaozuo, China EP-16 Nanoindentation Investigation of Copper Bonding Wire and Ball Xiangquan Fan, Kaiyou Qian, Techun Wang, Yuqi Cong, Mike Zhao, Binhai Zhang, Jiaji Wang Fudan University, Shanghai, China; ASE Assembly & Test (Shanghai) Limited, Shanghai, China EP-17 Wetting Behaviour of Lead Free Solder on Electroplated Ni and Ni-W Alloy Barrier Film C. S. Chew, A. S. M. A. Haseeb, M. R. Johan University of Malaya, Malaysia EP-18 Parameter Design of Solder Die Bonding Based on DOE Jun Hu, Xinpeng Xie Guangdong Yuejing High Tech Co., Ltd., Guangzhou, China; South China University of Technology, Guangzhou, China EP-19 Outgassing of Materials Used for Thin Film

Vacuum Packages Q. Li, J.F.L. Goosen, J.T.M. van Beek, F. van Keulen, G.Q. Zhang Materials Innovation Institute, Delft, The Netherlands; Delft University of Technology, Delft, the Netherlands; NXP Semiconductors, Eindhoven, the Netherlands EP-20 Effects of Surface Finishes on the Intermetallic Growth and Micro-structure Evolution of the Sn3.5Ag0.7Cu lead-free Solder Joints Guoyuan Li, Chuan Tang, Xueyou Yan, Xinpeng Xie South China University of Technology, Guangzhou, China; Guangdong University of Finance, Guangzhou, China Poster Session 2 Date Wednesday, 12 August, 2009 Time 15:40-17:40

Prof. Gong Zhang Session Chair Tsinghua University, Beijing,

China CP-01 Computational Modeling and Optimization for Wire Bonding Process on Cu/Low-K Wafers Weidong Huang Freescale Semiconductor (China) Ltd., Tianjin, China CP-02 The Principal Component Analysis of Cu Stud Bump Shaping Process Parameters Wei MU, Zhaohua Wu, Chunyue Huang Guilin University of Electronic Technology, Guilin, China CP-03 EFFECTS OF SHAPE PARAMETERS ON TENSILE STRENGTH OF CU BUMP Huang Chunyue, Liang Ying, Li Tianming Guilin University of Electronic Technology, Guilin, China; Chengdu Aeronautic Vocational and Technical College, Chengdu, China; Guilin College of Aerospace Technology, Guilin, China CP-04 A new embedded helix-type inductor using LTCC technology for high frequency applications Dong Liu, Yingli Liu, Yuanxun Li University of Electronic Science and Technology of China, Chengdu, China CP-05

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Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal EffectXiaoyan Niu, Tong Chen, Zhigang Li, Xuefeng Shu Taiyuan University of Technology, Taiyuan, China; Hebei University, Heibei, China CP-06 Effects of PCB dynamic responses on solder joint stress Tong AN, Fei QIN Beijing University of Technology, Beijing, China CP-07 Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loadings Tong AN, Fei QIN, Jiangang LI Beijing University of Technology, Beijing, China CP-08 Local Plastic Zones of Wirebond Profiles Inspection Base on Curvature Estimation Hongjun Zhou, Lei Han Central South University, Changsha, China CP-09 First-principles calculations of structural, thermodynamic and electronic properties of intermetallic compounds in solder Yang Yang, Hao Lu, Chun Yu, Junmei Chen Shanghai Jiao Tong University, Shanghai, China CP-10 A Core-Shell Structure Viscoelastic Model of Particulate-Filled Electronic Packaging Polymers Dayong Gui, Jianhong Liu, Bo Chen, Xin Miao, Guangfu Zeng, Deyu Tian Shenzhen University, Shenzhen, China EP-21 The Effect of Tape Casting Slurry System for Process Performance of Green Ceramic Tape Used for Electronic Packaging Pengyuan Shi, Caihua Ren, Huajiang Jin, Ling Gao Hebei Semiconductor Research Institute, Shijiazhuang, China EP-22 Studies on Microstructure and Mechanical Properties of Sn-Zn-Bi-Cr Lead-free Solder Tingbi Luo, Anmin Hu, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China EP-23 Solder joints reliability with different Cu plating current density in wafer level chip scale packaging (WLCSP) Kenny Cao, KH Tan, CM Lai, Li Zhang

Jiangyin Changdian Advanced Package Company, Jiangyin, China EP-24 A Novel Research on Micro-ball Placement Machine Used for Wafer Level Package Jinsong LIU Shanghai Athele Automation Equipment Co., Shanghai, China EP-25 Developing on IC Flip Chip Bonder Machine & Process JIAN GUO Shanghai Micson Semiconductor Equipment Co., Shanghai, China EP-26 Effect of Ni Addition on the Sn-0.3Ag-0.7Cu Solder Joints Lingling Wang, Fenglian Sun, Yang Liu, Lifeng Wang Harbin University of Science and Technology, Harbin, China EP-27 Electrically Conductive Adhesives with Sintered Silver Nanowires Zhongxian Zhang, Xiangyan Chen, Haowei Yang, Huiying Fu, Fei Xiao Fudan University, Shanghai, China EP-28 Al/Ni Multilayer Used as a Local Heat Source for Mounting Microelectronic Components Jun Zhang, Feng-shun Wu, Jian Zou, Bing An, Hui LiuHuazhong University of Science and Technology, Wuhan, China EP-29 Dramatic Morphological Change of Interfacial Prism-type Cu6Sn5 in the Sn3.5Ag/Cu Joints Reflowed by Induction Heating Ling Wang, Hongbo Xu, Ming Yang, Mingyu Li, Yonggao Fu Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, China EP-30 Wetting Behavior of Electrolyte in Fine Pitch Cu/Sn Bumping Process by Electroplating Jin Jiang, Jinglin Bi, Zhuo Chen, Ming Li, Dali Mao, Tadatomo Suga Shanghai Jiao Tong University, Shanghai, China;The University of Tokyo, Tokyo, Japan FP-01 A Jetting System for Chip on Glass Package Haili Jia, Zikai Hua, Maoyu Li, Jinsong Zhang, Jianhua Zhang

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Shanghai University, Shanghai, China FP-02 A Mutilayer Low Pass Filter Fabricated by Ferrite and Ceramic Cofiring System Based on LTCC Technology Yuanxun Li, Yingli Liu, Huaiwu Zhang, Likun Han, Zongbao Yang University of Electronic Science and Technology of China, Chengdu, China; Integrated microcircuit company of Anhui Province, Hefei, China FP-03 Research of SMT Product Assembly Quality Management System Based on J2EE Huihuang Zhao, Dejian Zhou, Zhaohua Wu, Xiaoyong Cheng Xidian University, Xi'an, China; Guangxi University of Technology, Liuzhou, China; Guilin University of Electronic Technology, Guilin, China FP-04 Test Scheme of SOC Test with Multi-constrained to Reduce Test Time Chuan-pei Xu, Jing Zhang, Min Zhang Guilin University of Electronic Technology, Guilin, China FP-05 Design and Modeling of Jet Dispenser Based on Giant Magnetostrictive Material Zhiqi Ge, Guiling Deng Central South University, Changsha, China FP-06 Simulation and Experimental Study on Temperature Field of Fluid Jet-dispenser Zhengrong Ding, Hao Hu, Guiling Deng Central South University, Changsha, China FP-07 Automatic plating technology for ceramic packaging Congge Lu, Shengqian Liu, Lei Zhang Hebei Semiconductor Research Institute, Shijiazhuang, China FP-08 Analysis and Compensation of Perpendicularity Error for High Speed and High Precise IC Assembly Equipment Base on Coordinate Transformation Haichen Qin, Jianzhou Quan, Bo Peng, Zhouping Yin Huazhong University of Science and Technology, Wuhan, China

GP-01 Numerical Simulation on Variable Width Multi-Channels Heat Sinks with Non-uniform Heat Source Xiaojing Wang, Wen Zhang, Hongjun Liu, Ling Chen, Zongshuo Li Shanghai University, Shanghai, China GP-02 Characteristic Analysis of Transducer Drive Current in Ultrasonic Wire Bonding Process Shaohua Liu, Fuliang Wang Central South University, Changsha, China GP-03 Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.% NaCl Solution L. C. Tsao Pingtung University of Science & Technology, Taiwan, China GP-04 Shape and Fatigue Life Prediction of Chip Resistor Solder Joints Guanqun Zheng, Chunqing Wang Shenzhen Polytechnic, Shenzhen, China; Harbin Institute of Technology, Harbin, China GP-05 Effect of Bonding Temperature and Power Setting on Transducer Velocity Using Principal Components Analysis in Thermosonic Bonding Ya’nan Zhang, Lei Han Central South University, Changsha, China GP-06 Study of Thermal Fatigue Lifetime of Fan-in Package on Package (FiPoP) by Finite Element Analysis Xueyou Yan, Guoyuan Li South China University of Technology, Guangzhou, China GP-07 Thermal-Mechanical Fatigue Reliability of PbSnAg Solder Layer of Die Attachment for Power Electronic Devices Xinpeng Xie, Xiangdong Bi, Guoyuan Li South China University of Technology, Guangzhou, China; Guangdong Yuejing High Technology Co. Ltd., Guangzhou, China GP-08 Effects of Strain Rate and Temperature on Mechanical Behavior of SACB Solder Alloy Guozheng Yuan, Xuexia Yang, Xuefeng Shu

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Taiyuan University of Technology, Taiyuan, China GP-09 Thermal Stress Analysis and Structural Optimization of Ultra-thin Chip Stacked Package Device Li Li, Xiaosong Ma, Xi Zhou Guilin University of Electronic Technology, Guilin, China GP-10 Prediction of Bending Reliability of BGA Solder Joints on Flexible Printed Circuit (FPC) Jianlin Huang, Quayle Chen, Leon Xu, G. Q. Zhang Guilin University of Electronic Technology, Guilin, China; Nokia Research Center, Beijing, China GP-11 Failure Evaluation of Flexible-Rigid PCBs by Thermo-Mechanical Simulation Luciano Arruda, Quayle Chen, Jairo Quintero Instituto Nokia de Tecnologia, Manaus, Brazil; Nokia Research Center (NRC), Manaus, Brazil; Universidade Estadual do Amazonas, Manaus, Brazil GP-12 Fast Qualification Using Thermal Shock Combined with Moisture Absorption Xiaosong Ma, G.Q.Zhang, K.M.B. Jansen, W.D van Driel, O. van der Sluis, L.J. Ernst, Charles Regard, Christian Gautier, Hélène Frémont Delft University of Technology, Delft, the Netherlands; Guilin University of Electronic Technology, Guilin, China; NXP Semiconductors, The Netherlands; LaMIPS, Université de Caen, France; IMS Bordeaux Université de Bordeaux, France GP-13 Controlling the Morphology and Orientation of Cu6Sn5 through Designing the Orientations of Cu Single Crystals H. F. Zou, H. J. Yang, Z. F. Zhang Shenyang National Laboratory for Materials Science; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China GP-26 Fatigue Evaluation of Power Devices Kazunori Shinohara, Qiang YU Kanagawa Academy of Science and Technology, Japan; Yokohama National University, Japan Poster Session 3

Date Thursday, 13 August, 2009 Time 10:15-11:55

Prof. Shuidi Wang Session ChairTsinghua University, Beijing, China

AP-05 Through-Silicon Via Filling Process Using Pulse Reversal Plating Xinxin Yang, Huiqin Ling, Dongyan Ding, Ming Li, Xianxian Yu, Dali Mao Shanghai Jiao Tong University, Shanghai, China; Shanghai Sinyang Semiconductor Materials Co., Ltd, Shanghai, China AP-06 Low Temperature Cu-Sn Bonding by Isothermal Solidification Technology Yibo Rong, Jian Cai, Shuidi Wang, Songliang Jia Tsinghua University, Beijing, China AP-08 Collaborative Effect Between Additives and Current in TSV Via Filling Process Kaihe Zou, Huiqin Ling, Qi Li, Haiyong Cao, Xianxian Yu, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China; Shanghai Sinyang Semiconductor Materials Co., Ltd, Shanghai, China CP-11 Numerical Simulation on Heat Pipe for High Power LED Multi-chip Module Packaging Dongmei Li, G.Q Zhang, Kailin Pan, Xiaoshong Ma, Lei Liu, Jinxue Cao Guilin University of Electronic Technology, Guilin, China; The Factory of Changxin Electronic, Zhejiang, China CP-12 Board Level Drop Impact Reliability Analysis for Compliant Wafer Level Package through Modeling Approaches Chaoping Yuan, K.L. Pan, Weiyang Qiu, Jing Liu Guilin University of Electronic Technology, Guilin, China CP-13 FEM Study on the Effects of Flip Chip Packaging Induced Stress on MEMS Songsheng Wei, Jieying Tang, Jing Song Southeast University, Nanjing, China CP-14 Modeling and Simulation of SSN on FPGA Products Lingzhi Ke, Peng Zhou, Lei Li

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Wuhan University of Technology, Wuhan, China; Shenzhen institute of advance technology, Chinese Academy of Sciences/the Chinese University of Hong Kong Shenzhen, China CP-15 Coupled simulation of Anisotropic Conductive Adhesive Bonding Process and Reliability Analysis of the Packaging ZhengJia Wang, ZhouPing Yin, bo Tao, YouLun Xiong Huazhong University of Science and Technology, Wuhan, China CP-16 Miniaturized Printed Wire Antenna in Package for 2.4 GHz Wireless Communications Xiaoli Liu, Yunfeng Wang, Lei Li, Lixi Wan Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences/The Chinese University of Hong Kong, Shenzhen, China; Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China CP-17 Modeling of Copper Wire Bonding Ball Transient Temperature Behavior Techun Wang, QingYi Zheng, Rui Yu, Zhongyun Li ASE Assembly & Test (Shanghai) Limited, Shanghai, China; Mentor Graphics (Shanghai) Electronic Technology Co., Ltd., Shanghai, China CP-18 Power Integrity Simulation for SiP Using GTLE Yunyan Zhou, Lixi Wan, Jun Li Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China CP-19 First-principles Based Modeling for Influence of Epitaxy and Packaging Induced Strains on Emission Properties of III-nitrides LED Chips Han Yan, Zhiyin Gan, Xiaohui Song, Zhaohui Chen, Jingping Xu, Sheng Liu Huazhong University of Science and Technology, Wuhan, China; Wuhan National Laboratory for Optoelectronics, Wuhan, China CP-20 Numerical Study on thermal management of LED packaging by using thermoelectric cooling Nan Wang, Chang-hong Wang, Jun-xi Lei, Dong-sheng Zhu South China University of Technology, Guangzhou, China; Guangdong University of Technology, Guangzhou,

China EP-31 Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA Cong Yue, Yan Zhang, Zhili Hu, Johan Liu, Zhaonian Cheng, Shanghai University, Shanghai, China; Chalmers University of Technology, Sweden EP-32 Synthesis and Characterization of Nano BaTiO3/Epoxy Composites for Embedded Capacitors Suibin Luo, Rong Sun, Jingwei Zhang, Shuhui Yu, Ruxu Du, Zhijun Zhang Shenzhen Institute of Advanced Integration Technology, Chinese Academy of Sciences, Shenzhen, China; Ministry of Education Henan University, Kaifeng, China EP-33 Influence of Leveler Concentration on Copper Electrodeposition for Through Silicon Via Filling Huiqin Ling, Haiyong Cao, Yuliang Guo, Han Yu, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China; Shanghai Sinyang Semiconductor Materials Co., Ltd, Shanghai, China EP-34 Characterization of Ag Nanofilm Metallization on Copper Chip Interconnect and Its Ultrasonic Bondability Yanhong Tian, Shaowei Zhao, Chunqing Wang Harbin Institute of Technology, Harbin, China EP-35 Electroless Plating of Copper Nano-coned Array for High Reliability Packaging Zhongwen Pan, Anmin Hu, Tao Hang, Yingying Duan, Ming Li, Dali Mao Shanghai Jiao Tong University, Shanghai, China EP-36 Research on Self-Constrained Sintering Low-Temperature Cofired Ceramic Yongda Hu, Yuanxun Li, Taohua Liang, Bangchao Yang, Yun Lu University of Electronic Science and Technology of China, Chengdu, China EP-37 Fine Pitch and High Density Sn Bump Fabrication Jinglin Bi, Jin Jiang, Anmin Hu, Ming Li, Dali Mao, Tadatomo Suga Shanghai Jiao Tong University, Shanghai, China;

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The University of Tokyo, Tokyo, Japan EP-38 Effect of [Au]/[Na2SO3] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution Xiangyong Qing, Mingliang Huang, Jianlin Pan Dalian University of Technology, Dalian, China EP-39 Sequential Non-cyanide Electroplating Au/Sn/Au Films for Flip Chip-LED Bumps Yang Liu, Mingliang Huang Dalian University of Technology, Dalian, China EP-40 Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate L. C. Tsao, S. Y. Chang, W. H. Sun, S. F. Yen Pingtung University of Science & Technology, Taiwan, China; Yunlin University of Science & Technology, Taiwan, China; Industrial Technology Research Institute, Taiwan, China EP-41 Study on the Microstructure and the Shear Strength of Sn-0.7Cu-xZn Yan-jun Gao, Zhong-bing Luo, Jie Zhao, Lai Wang Dalian University of Technology, Dalian, China EP-42 Investigation of the Fundamental Interactions among the Ingredients of Flux by the Group Contribution Method Yunxia Jin, Jun Hu, Daniel Lu East China University of Science and Technology, Shanghai, China; Henkel Corporation Electronic Materials EP-43 Study of stencil printing technology for fine pitch flip chip bumping Jin Yang, Jian Cai, Shuidi Wang, Songliang Jia Tsinghua University, Beijing, China EP-44 Processing and Properties of Cu-base and Co-base Amorphous Wires W.B. Liao, Y. Zhang University of Science and Technology Beijing, Beijing, China; SMT Technology & Material, Corporate Technology, Siemens Ltd., China EP-45 Absorption of Ag3Sn on Cu6Sn5 Intermetallic

Compounds at Sn-3.5Ag-xCu/Cu Interfaces Ning Zhao, Lai Wang, Lixi Wan, Liqiang Cao Dalian University of Technology, Dalian, China; Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China GP-14 Thermal-Mechanical Failure and Life Analysis on CBGA Package Used for Great Scale FPGA Chip Wen-chang Li, Xiao-jun Zhang University of Electronic Science and Technology of China, Chengdu, China; Hebei Semiconductor Research Institute, Shijiazhuang, China GP-15 Finite Element Analysis of Sn-Ag-Cu Solder Joint Failure under Impact Test Ganran Tang, Bing An, Yiping Wu, Fengshun Wu Huazhong University of Science and Technology, Wuhan, China; Wuhan National Laboratory for Optoelectronics, Wuhan, China GP-16 Study on Moisture Behavior in Flip Chip BGA Packages and Bake Process Optimization W.Q. Dai, Z.K. Hua, J.H. Dai, E.W.Pang, L.Jiang, C.Y. Li, P. Liao, J.H. Zhang Intel Products (Shanghai) Co., Ltd., Shanghai, China; Shanghai University, Shanghai, China GP-17 Study on Thermo-mechanical Reliability of Embedded Chip during Thermal Cycle Loading Ligang Niu, D. Yang, Mingjun Zhao Guilin University of Electronic Technology, Guilin, China GP-18 The Influence of Plastic-package on the Voltage Shift of Voltage Reference in Analog Circuit Yanfeng Jiang, Jiaxin Ju North China University of Technology, Beijing, China GP-19 Electrical Analysis of Mechanical Stress Induced by Shallow Trench Isolation Yanfeng Jiang, Jiaxin Ju North China University of Technology, Beijing, China GP-20 The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder Si Chen, Zhaonian Cheng, Johan Liu, Yulai Gao, Qijie Zhai Shanghai University, Shanghai, China;

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Chalmers University of Technology, Sweden GP-21 Study of Isothermal Bending Fatigue Test Minyi Lou, Long Wen, Zhengrong Chen, Jianwei Zhou, Qian Wang, Jaisung Lee Samsung Semiconductor (China) R&D Co. Ltd., Suzhou, China GP-22 Testing Failure of Solder-Joints by ESPI on Board-Level Surface Mount Devices Yunxia Gao, Jun Wang Fudan University, Shanghai, China GP-23 Study on Shear Strength and Jc of EMC/Cu Interface with Cu Oxidation and Moisture Absorption Xing FANG, Qiang FANG, Jun WANG, Hongkun YU, Xuefeng SHAO Fudan University, Shanghai, China; Fairchild Semiconductor (Suzhou) Co., Ltd, China GP-24 XPS Study on Epoxy/Ni Interface Li Liu, Wenting Xv Shanghai University, Shanghai, China GP-25 Shock Performance Study of Solder Joints in Wafer Level Packages Amarinder Singh Ranouta, Xuejun Fan, Qiang Han Lamar University, USA; South China University of Technology, Guangzhou, China

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Transportation（交通指南） From/to the airport (机场): Taxi: The approximate cost from the airport to East Gate of Tsinghua University is ~￥100. 出租车：直接从机场打出租车到清华东门，100 元左右 Airport Bus: Take line 5 to the bus terminal “BAOFUSIQIAO” (￥16) and then take a taxi to East Gate of Tsinghua University (￥10). 机场大巴：5 号线至保福寺桥下车(16 元)，下车后打出租车到清华东门(10 元左右)，或者根据地图向北步行 Subway (地铁): 1. Take Airport Express to “SANYUANQIAO” station (￥25)

机场快线至三元桥站下，25 元 2. Take Line 10 heading towards “BAGOU” and get off at “ZHICHUNLU” station (￥2). Then, take Line 13

heading towards “DONGZHIMEN” and get off at “WUDAOKOU” station 换乘地铁 10 号线，巴沟方向，至知春路站下车(2 元)。之后，换乘地铁 13 号线，东直门方向，至五道

口站，无需另行购票

3. Walk to East Gate of Tsinghua University using attached map 可根据地图步行至清华东门

From/to Beijing Railway Station (北京站): Taxi: The cost from Beijing Railway station to East Gate of Tsinghua University is ~￥45. 出租车：45 元左右 Subway (地铁): 1. Take Line 2 heading towards any direction to “XIZHIMEN” station (￥2)

地铁 2 号线，任意方向，至西直门站下，2 元

2. Take Line 13 heading towards “DONGZHIMEN” and get off at “WUDAOKOU” station 换乘地铁 13 号线，东直门方向，至五道口站，无需另行购票

3. Walk to East Gate of Tsinghua University using attached map 可根据地图步行至清华东门

From/to Beijing West Railway Station (北京西站): Taxi: The cost from Beijing West Railway station to East Gate of Tsinghua University is ~￥35. 出租车：35 元左右 Bus: You can take a bus at North Square of Beijing West Railway Station

从北京西站北广场乘坐公交

BUS No.319 (from 5:30 am to 22:00 pm) to “DONGSHENGYUAN” station (walk straight towards north to East Gate of Tsinghua University), or to “QINGHUAYUAN” station (WENJIN Hotel). The ticket costs ￥1.5.

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公交 319 路(5:30-22:00)，到东升园下车(向北直行便可到达紫光国际会议中心及清华东门)，或者在清

华园下车，到达文津国际酒店，票价 1.5 元

BUS No. 320 (from 5:00 am to 23:00 pm) or No. T6 (from 5:30 am to 21:30 pm) to QINGHUAXIMEN station (￥1.5). Then, take the campus bus (￥2) or walk to East Gate of Tsinghua University (40 minutes). 公交 320 路(5:00-23:00)或者特 6 路(5:30-21:30)，到清华西门站下车，票价 1.5 元，入校坐校园公交车

(2 元)，或者步行 40 分钟参观校园，至东门

NOTE: 1. Taxi fares will be raised after 23:00 出租车在 23:00 以后价格会有所提高

2. You can take Subway Line 10 to “ZHICHUNLI” station to reach Jade Palace Hotel 前往翠宫饭店可在地铁 10 号线知春里站下车

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MMaapp ooff TTssiinngghhuuaa UUnniivveerrssiittyy

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MMaaiinn BBuuiillddiinngg LLaayyoouutt（（中中央央主主楼楼布布局局图图））

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TABLE OF CONTENTS - EEWorld · 2009-08-05 · Ronghai YU Tsinghua University, China Co-Chairs Jusheng MA Tsinghua University, China，President of Beijing Chapter, IEEE-CPMT Gong