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大氣電漿於織物之表面處理應用
馗鼎奈米科技股份有限公司 王亮鈞
Tel: 06-2323927
2013.08.23
Plasma Cleaning Principles
Physical sputter
and/or
Chemical etching can be chosen
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電漿的作用-清潔
Scan 3次 Before plasma treatment Scan 10次
PET treatment
Air, 6M/min
粗糙度變大
電漿的作用-表面粗化
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Before plasma treatment
Surface analysis - ESCA
C1s spectrum of PMMA
COOH C=O
C-C
C-O
O-C=O
-[CH2-C-]-
CH3
C=O
O
CH3
|
|
|
|
C-N
電漿的作用-表面改質
After plasma treatment
Ions generated in plasma can be accelerated toward the substrate to physically bombard away the atoms of contaminants.
The physical sputtering rate increases as the plasma density, acceleration voltage or the mass of bombardment atoms increases. Physical sputtering is also enhanced by lowering the pressure to increase the ion energy.
Therefore, a high cathode bias will enhance the sputtering rate . H+ or H2+ will have little physical sputtering effect. Ar+ will have strong sputtering effect.
Physical sputtering by high energy ions
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Advantages: Highly efficient cleaning effect can be achieved. Gas consumption
rate can be very low. Disadvantages:
Non - selective etching by physical sputtering may induce over – etching problems. The products sputtered out may be highly unstable and tend to deposit again downstream, inducing the redeposition problem.
Operation: The effect of physical sputtering is increased as the pressure
decreases or as the cathode bias and Ar concentration increase.
Physical sputtering by high energy ions
e- + H 2 2H•
e- + O 2 2O• O•+ O2 O 3
Highly reactive free radicals generated in plasma may react with the hydrocarbon contaminants or surface oxide.
Both H• and O• can react with grease or oil on surface to form volatile hydrocarbons.
H• (g) + CnH2n+2(s) CH4(g)
O• (g) + CnH2n+2(s) CO(g) + CHxOy (g) + H2O (g)
O• is more reactive than H•. But O• may also react with surface metal to form oxide, deteriorating the material properties. And, H• can also reduce metal oxide back to metal.
H• + MeO Me + H2O
O• + Me MeO
Chemical reactions by free radicals
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Advantages:
Stable gas products are formed. There is no redeposition problem. High etching selectivity can be obtained.
Disadvantages:
Higher concentration of H2 or O2 is required to ensure an appropriate etching rate. H2 safety or O2 strong oxidation ability needs to be monitored.
Operation:
The effect of chemical reactions is increased as the pressure increases.
Chemical reactions by free radicals
Applications of Plasma
產業 應用
LCD 面板驅動IC貼合前 各水洗製程前、後
IC、LED wire bond前清潔 molding前清潔 die attach前清潔
PCB、FCCL 進溼式清洗槽前、後 Laser鑽孔後之膠渣去除
IC、LED、Wafer
殘餘光阻去餘
車產業 車門邊緣O-ring黏著前 車燈黏合上膠前 鈑金上烤漆前
其他 光學塑膠鍍膜印刷前 特殊薄膜塗佈前 各式基板表面需清潔、活化、改質
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常見的常壓電漿
Corona Partial discharge
High voltage, low power density
Arc Torch Low voltage, high current discharge
High gas temperature
Point source
3-D treatment
Dielectric Barrier Discharge Need dielectric layer
Filamentary discharge
2-D treatment
Atmospheric Pressure Glow Discharge Low voltage glow discharge
Low plasma temperature
Need inert gas (He or Ar)
2-D or 3-D treatment
常壓電漿在LCD業界的應用(一)
Module段
提昇ACF與面板端子間的附著力
COG COF
Plasma清潔 ACF黏貼 IC組裝
IC
Glass
端子
IC
ACF
Arc Torch
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常壓電漿在LCD業界的應用(二)
Array段
素玻璃清潔
去除玻璃表面光阻剝離後的有機殘留物
濕蝕刻前的基板表面親水性提昇
鍍膜前清除玻璃表面的有機物
提昇光阻與玻璃之間的附著力
去除乾蝕刻後的變性光阻
常壓電漿在LCD業界的應用(三)
Color Filter段 ITO濺鍍前的基板清潔
提昇色阻及over coat與基板間的附著力
Over Coat
Glass
Glass
ITO Film
Plasma
Glass
Resist
Plasma
CF(RGB)
Glass
Over Coat
Glass
Plasma
Plasma
Glass
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常壓電漿在LCD業界的應用(四)
Cell段
PI塗佈前的基板清潔
常壓電漿清潔
提昇表面潤濕性 水洗
常壓電漿清潔
去除殘留有機物 PI塗布
Plasma在LED的應用
一、支架
二、封裝製程
固晶/
黏晶
銲線/
打線
封膠
烘烤
切割
測試分類
包裝
Die
attached
Wire
bonding Molding
Plasma Plasma
Plasma
沖壓
支架電鍍
射出成型
Plasma
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應用實例:Touch Panel
應用實例:FCCL 出貨前清潔
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應用實例:FCCL -PI出貨前清潔
應用實例:PCB軟板
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4mm
設備運作示意圖
Plasma
HV
HV
Roller
Roll to Roll Plasma System
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常壓電漿在塑膠業的應用
增加塑膠布潤濕性 電池隔膜處理 PI鍍銅前處理
增加附著力 雙色射出 鞋底黏合 鍍膜前處理
粗化表面並提高表面能 表面清潔,去除吸附層(油污或水氣)
印刷前處理 比火焰法溫度低 PP, PTFE等材質亦可有效處理
家電業的應用
設計產品時可以使用新材料組合,以增加產品價值
利用電漿活化表面,射出成型時可將不同材料直接在模具內結合,增加產品的質感,減少射出後的加工步驟
可以使用水性顏料來印刷
減少工廠內的有機溶劑污染
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包裝業的應用
取代火焰處理 電漿可使被處理物表面能高於60 dyne/cm,所以,可以用水性墨水來印刷
活化塑膠表面以利水性墨水印刷
軟性包材之抗透氣處理
紙盒包裝 活化表面,減少膠合時的膠水用量
提高附著力:可以用低溫壓合,以節省能源成本
鋁箔前處理:去油脂,改善印刷與壓合作業性
醫藥業的應用
增加附著力 針筒組裝前處理
殺菌 藥液瓶封口前殺菌
醫療器具低溫殺菌
基材表面處理 親水處理:濾膜
活化處理:接枝
分解醫療廢棄物 利用高溫電弧分解廢棄物
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plasma
PECVD
PVD
DLC
TiN
Diamond
Plasma cleaner
Plasma desmear
Plasma asher
PECVD coater
AP plasma
Plasma jet
DBD N2 analyzer
Contact angle
電漿的應用
Thanks!
!