Exploration and Evaluation ofUnderground Resources
National Institute of Advanced Industrial Science and Technology
Ceramics Research InstituteAdvanced Sintering Technology Group
Koji Watari
Role of Various Fields
Production of Ceramics
Industrial Application
Exploration and Evaluation ofUnderground Resources
GeologyMineralogy
CeramicsMaterial ScienceChemistryChemical Engineering
Design ElectronicsDevice
TargetHigh QualityLow cost
High performanceLow cost
High performanceLow costHigh reliability
Big Gap
Topics
• 1. Review of Ceramic Processing• 2. Direction of Ceramic Industries• 3. Today’s Ceramics• 4. Discussion
Ceramic ProcessingRaw powder
Mixing
Shaping
Sintering
Grinding
Products
Good Example !
Can, Turkey, May 24, 2003
Cycle: 3 times in a day ( 1 cycle: 8hrs)Employee: 25 persons x 3 = 75 persons
Ceramic Processing-raw materials/mixing/shaping-
Dry mixing of three kind of raw powders
Mixture
Press
Mixing of powders
Press
Shaping of mixed powders
Powder flow
Die
Ceramic Processing-Sintering-
Temperature:<1000cPeriod: 1day (?)
Use of co-generation systemfor ISO14000
Ceramic Processing-Final Evaluation-
Investigator
Sample direction
Final products
Export
Good one
Bad one
Packaging
How do company select ceramic for Industrial Application ?
1. Market2. Performance 3. Material cost4. Processing cost
Energy
Environmental Information Relation
Recycle
Direction of Ceramic Industries
Market Sample 1Requirement from Human and Times
Electronics:Mobile phoneLaptop computer
CD, MD
Smaller, High Speed Downsize of deviceHigh integration
High thermal conductivity substrate
Difficulty in heat escape from device
High Thermal ConductivityCeramics
Substrates for microelectronics and optical communication.
(Maruwa HP )
Power Modulus substrate with Cu Circuit for very large currentSubstrate for IC package
CD player with AlN substrates for heat dissipation into laser-readingsystem
100
200
100
40
20
6
2
20
40
80100
24
68
10
0
SiC
Si3N4
Al2O3
AlN
( ~573K)(10-6 K-1)
(1 MHz)
(kVcm-1)
(Wm-1℃- -1)
(x 10 MPa)
(MPa m0.5)
200
10
Thermal conductivity
Strength
Fracture toughness
Dielectric strength
Dielectric constant
Thermal expansionR.T.
Requirement (1)High corrosion resistance to CF4 gas.
(2)Suppression of electronic noise and electromagnetic waves.
(3)Low thermal expansion to close that of Si.
(4)Suppression of vapor from ceramic in high temperature range.
(5)Very high heating rate and cooling rate of 400℃/sec in Max.
(6)Homogeneous temperature distribution.
(Thermal Conductivity =100~150Wm-1℃-1)
Requirement from Human and Times
Ceramic component and ceramic Heater for Semi-conductor Processing Equipment
Market Sample 2
Semi-conductor industry: Several billion US$
Corrosion to CF4+O2 Gas for Various Ceramics
0
20
40
60
80
100
120
AlN (A) AlN (B) Al2O3 SiC Si3N4
Etc
hing
rat
e nm
/min
Gas: CF4+30%O2
Pressure: 50mTorrOutput power: 1kWHolding time: 120min.
Flow rate: 50sccm
0
20
40
60
80
100
120
AlN (A) AlN (B) Al2O3 SiC Si3N4
Etc
hing
rat
e nm
/min
Gas: CF4+30%O2
Pressure: 50mTorrOutput power: 1kWHolding time: 120min.
Flow rate: 50sccm
(K.Watari et al. Japan-Korea Ceramics Seminar, 2001)
Components for semi-conductor processing equipment
(J.G.Goela et al. MRS Bull, 2001)
Market Sample 3
Increase of atmospheric pollution by automobile Removal of particles in
exhaust gas and its clean
Ceramic filter
Exhaust gas(HC, CO, NOx)
Inside: Catalyst
Material: 2MgO・2Al2O3 ・5SiO2 (Cordirite) SiC
Requirement property1. High corrosion resistance2. High Thermal shock3. High strength
Honycome structure
Market Sample 4Requirement from Human and Times
Increase of life time in human(Aging society)
Lack of Exercise
Replacement of bone
Bio-Ceramics 1. Ca10(PO4)6(OH)2 (Hydroxy-Apatait)2. Ca3(PO4)2 (TCO)3. CaCO34. CaSO4 2H2O
Improvement of bone strength
Addition of CaCO3 to milk