GLANZOX'Silicon Polish
TGLANZOX
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GLANZOXØftF.ÉN+hÉTypical Physical Properties of GLANZOX
TGLANZOXlVith the increasing integration of semiconductor der,ices and the
larger size of wafers, a damage-, haze- and heavy metal contamination
free, flat, as ¡¡u'ell as nanotopography mirrorìike silicon surface is
essentiâI. Fujimi's GLANZOX series was developed to meet such
requirement. GLANZOX polish consists of colloidal silica dispersed in a
liquid composed of special ingredients. This product results in an
almost perfectly polished surface. In response to the recent demand for
considerable reductions in the metal impulities that affect device
characteristics, higher-grades of polish containing ultra-pure colloidal
siìica have been developed.
-=.-.t----jlëft€ rypeIFE ltem -----=\- HP-20 1 100
ÈFiâ\Main component
#ãffiÉ. ultra-pureSiOzf, tr I I )v (colloidal)
ËËlúÉ ultra-pureSiOzrtrl9), Golloidal)
SiOze:Content of SiOz (%)
17.5 17.5
PH 11 .4 11.5
bLÉ Specific gravity 1.11 1.10
+fi#n+ÆAveraqe particle size (nm) 35 35
E\A¡HrõApplication
1'^, 2'&For First and second polishing
1>k, 2>k.
For First and second oolishino
{+#^äIStandard Net weighl
20kg 20kg
1..'7ÀDrum
220k9
---------------€¡fr8 rypeiFE ltem ------=\ 3900 3900RS 3950 31 00
ÈFJ¿â.Main comoonenl
ËËËlÉË Ultra-pureSiOzrtrlS), Golloidal)
frËËlÉÉ Ultra-pureSiOzf tr I I Jt' (colloidal)
frËËfÉÉ Ultra-pureSiOzrtr19), Golloidal)
ËËË=lÉË Ultra-pureSiOzr tr I I )v (colloidal)
SiOaËContent of SiOz (%)
9.1 9.1 4.5 9.1
PH 10.5 10.5 10.8 10.3
btê Specific qravity 1.05 1.05 1.03 1.05
+Jâ+n+æ.Averaqe particle size (nm) 35 .J3 aà 35
ÆËApplication
FinalÆFor final polishinq
FinalÆFor final oolishino
l-tnalFH
For final oolishinqFinalÆ
For final polishing
++#^äfStandard Net weiqht
10k9,20kg 1 Okg 1 Okg 1 0kg
F'ADrum
200k9 200k9 200k9 200k9
FUJIMI INCOFIPOFIATED
H14 7 1000
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TEL(052)503-91 1 2 F AxßsÐ5æ7734
FUJ¡MI INCORPORATED, Àil^ÁiL^^..^^i ^.,ñ ^i^h¡
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