Transcript
Page 1: Internship Presentation_Faridi

KIT – University of the State of Baden-Württemberg and National Large-scale Research Center of the Helmholtz Association

M.Sc. “Optics & Photonics“, November, 2013

www.kit.edu

Laser structuring of glass panel for optimized chip-to-waveguide interconnection

Fraunhofer-Institut für Zuverläsigkeit und Mikrointegration IZM Fahd Rushd Faridi

MSc. “Optics & Photonics”, November, 2014

Page 2: Internship Presentation_Faridi

2 Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 47880 | Fax: +49 (0)721 608 47882

Laser structuring of glass panel for optimized chip-to-waveguide interconnection

  Motivation

  Approach

  Laser Structuring

Process Optimization

Results

  Summary

Page 3: Internship Presentation_Faridi

3

Motivation

Problem

  Ever increasing data rates in information processing systems

  High energy consumption in data centers and server firms

  Integration of electronic circuits is reaching its limit

Solution

  Optical data transmission and optical interconnects

Challenges

  Embedded optical architectures do not exist in data center and network systems

  A lack of photonic system integration in printed circuit boards

  Partially developed basic technologies

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882

Page 4: Internship Presentation_Faridi

4

Approach

  Exploring synergies using novel mix and match linkups

  Prototypes are developed in three hierarchy levels of optical transmission

  1st hierarchy level :

  Facilitate optical transmission on a printed circuit

  Reduce energy consumption by 50%

  Optical transmission on a printed circuit

  Optical chip assembly on glass panel

  Waveguide patterning on glass panel

To assemble optical chips on a waveguide embedded glass panel laser structuring was done.

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882

Page 5: Internship Presentation_Faridi

5

Laser Structuring

  Aim

  Facilitate perfect alignment for the optical chips

  Reduce misalignment losses

  Reduce coupling losses by high quality

facet

  Process:

  Green laser drilling

  CO2 laser cutting by crack propagation

  Breaking

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882

Shape geometry after Green laser Drilling

Shape geometry after CO2 laser cutting

40mm

5mm

Aluminium Markers CO2 Laser cut line

Page 6: Internship Presentation_Faridi

6

Process Optimization

  Green Laser parameter optimization

  Parameters involved

  Laser Current

  Modulation Speed

  Speed

  CO2 Laser parameter optimization

  Parameters involved

  Laser Power

  Cut Speed

  Breaking Tool

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882

(a) (b)

Surface quality after (a) Green (b) CO2 laser parameter optimization

Page 7: Internship Presentation_Faridi

7

Results

  High quality optical interface

  Almost perfect positioning of the cut

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882

568µm

92µm

Page 8: Internship Presentation_Faridi

8

Summary

  Green laser and CO2 laser parameters were successfully optimized

  High quality interface and almost perfect positioning of the cut was achieved

  Some improvements in the breaking process and the breaking tool are still possible

Karlsruhe School of Optics & Photonics (KSOP)

Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882