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  • 25 2, 2007 4 133

    31

    Recent Advances on Conductive Adhesives in Electronic Packaging

    Jong-Min Kim

    0

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    7 8 9

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    .

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    C

    1980 1985 1990 1995

    Broad bandInternet

    3-D Device

    Opto-electronicsDevice

    DIP QFP

    PGA

    BGA

    CSP

    FC-BGA

    Personal computer Note type computer

    Digital camera

    Portable phone

    Palm

    SOP

    0

    1 2 3

    4 5 6

    7 8 9

    =

    +

    -

    */=

    .

    C

    0

    1 2 3

    4 5 6

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    =

    +

    -

    */=

    .

    C

    0

    1 2 3

    4 5 6

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    =

    +

    -

    */=C

    0

    1 2 3

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    =

    +

    -

    */=C

    2000 2005

    Small, Light, High performance

    High integration, High density3

    -

    High speed, Large capacity

    DIP QFP

    PGA

    BGA

    CSP

    FC-

    Personal computer Note type computer

    Palm

    SOP

    Fig. 1 Evolution of electronic packaging technology

    1.

    (electronic packaging)

    IC IC

    ,

    , , , ,

    . 21

    (Information Technology)

    .

    , , ,

    . LSI

    Fig. 1 DIP(Dual In-line Package)

    QFP(Quad

    Flat Package), SOP (Small Outline Package)

    ,

    .

    / BGA(Ball Grid Array),

    CSP(Chip Scale Package), FC(Flip Chip), 3-D

    package

    1).

    2) Sn-37Pb

    . , Sn-37Pb

    ,

    .

    3)

    (Electrically Conductive Adhesive :

    ECA) 4) .

    Sn/Ag

    Sn/Ag/Cu . ,

    (Sn/Ag: 217, Sn/Ag/Cu: 221)

    .

    (polymer)

    (filler) .

    1)

    ( ), 2) (,

    ), 3) (,

    ), 4)

    , 5) 6)

    5)

    . ,

    ,

    6,7)

    .

    .

    2.

    : 3

  • 134 Journal of KWJS, Vol. 25, No. 2, April, 2007

    32

    Chip

    Substrate

    Pad s ICA

    Silver flakeChip

    Substrate

    Pad s ICA

    Silver flakeChip

    Substrate

    Pads ICA

    Silver flake

    (a) ICA

    Bump

    Electrode padSubstrate

    Chip

    Conductive particle

    Polymer matrix

    Electrode padSubstrate

    Polymer

    (b) ACA

    Electrode padSubstrate

    Polymer

    Substrate

    Bump

    Electrode pad

    Chip Bump

    Electrode pad

    Chip

    Polymer matrix

    (c) NCA

    Fig. 2 Schematics of ECA flip-chip bonding

    SubstrateStensil Chip

    Substrate

    Substrate

    ChipICA

    Squeegee

    PadSubstrateStensil Chip

    Substrate

    Substrate

    ChipICA

    Squeegee

    PadSubstrate

    Chip

    Pad

    Stensil

    Squeegee

    Substrate

    Substrate

    ChipICA

    Fig. 3 Schematics of surface mount interconnection

    Chipor substrateBump

    Underfill

    ICA

    Chip or substrate

    Underfill

    ICA

    Chipor substrateBump

    Underfill

    ICA

    Chip or substrate

    Underfill

    ICA

    Chipor substrateBump

    Underfill

    ICA

    Chip or substrate

    Underfill

    ICA

    Fig. 4 A schematic of Flip-chip bonding process with

    ICA

    (die) 70

    . Fig. 2

    (Isotropic Conductive Adhesives : ICAs)

    z

    (Anisotropic Conductive Adhesives : ACAs)

    . ,

    (Non-Conductive Adhesives)

    .

    3. (ICAs)

    ICAs (polymer)

    (filler) .

    (phenolic epoxy) (polyimide)

    (thermoplastics)

    (epoxy), (silicone),

    (polyurethane)

    (thermosets) .

    m-m .

    (flake) .

    8) /

    ,

    30-40 vol% .

    ICAs Fig. 3

    ICAs

    (Stensil Printing)

    ,

    (Surface-mount technology: SMT)

    .

    ,

    .

    Fig. 4

    9) . ICA

    .

    (Ag), (Au), (Cu),

    (Ni), (carbon),

    ICAs Ag

    (1.6 cm)

    Ag . /

    . Ni Ag 25%

    Cu

    Ni ICAs

    10). , (carbon nano-tubes;

    CNTs) ICA

    11)

    . (: 30nm) Ag

  • 25 2, 2007 4 135

    33

    Polymer resin

    Component metallization

    Ag

    Substrate metallization

    Low-melting-point alloy

    ICA

    (a) ICA filled with a mixture of a high melting point metal powder

    and a low melting point alloy powder

    Component metallization

    Substrate metallization

    Polymeric resin Conductive particle

    Conduction paths

    ICA

    (b) ICA filled with a low melting point alloy powder

    Fig. 5 Schematics of ICA bonding with low-melting point

    alloy filler

    Chip Bump

    Electrode padSubstrate

    Conductive particle

    Bump

    Electrode pad

    Conductive particle

    Polymer matrix

    Pressure

    & heat

    ACAs

    Chip Bump

    Electrode padSubstrate

    Conductive particle

    Fig. 6 A schematic of flip chip bonding with ACA

    TAB bonding outputFPC / PCB

    TAB bonding inputFPC / LCD

    COG bonding IC / LCD

    AnisoMat FP

    AnisoMat GI

    COB bonding IC / PCB

    AnisoMat FCPNcfMat FCP

    COF bonding IC / FPC

    AnisoMat FCPNcfMat FCP

    AnisoMat FI

    AnisoMat PDP

    Plasma displayFPC / PDP

    Fig. 7 Various applications of ACFs (www.telephus. com)

    ICA12)

    Ag

    (nanowire) ICA 13)

    . ,

    ICA(Fig. 5(a))14), Ag

    (sintering)15),

    (Cu, Zn, Ag, Cd, In, Sn, Au, Pb, Bi )

    (Fig. 5(b)) ICA 16)

    ,

    .

    , Ag Au

    ,

    17)

    .

    4. (ACAs)

    ACAs

    (filler) . ACAs

    ACPs(Anisotropic Conductive Pastes)

    (reel)

    ACFs(Anisotropoic Conductive Films)

    .

    ACAs Z-

    .

    Fig. 6 ACAs

    . , ICAs

    ,

    .

    ACAs

    / .

    ,

    ,

    .

    1) , 2) ,

    3) (board) (bump) , 4)

    .

    ICAs

    5-10 vol% . ACFs

    (Liquid Crystal Displays: LCDs)

    (Flat Panel Displays: FPDs)

    .

    , , ,

    TCP (tape carrier package),

    COG(chip-on-glass), COF(chip-on film)

    18) . Fig. 7 ACFs

  • 136 Journal of KWJS, Vol. 25, No. 2, April, 2007

    34

    Metal/Non-

    Plating layer

    Insulating layer

    Metal/Non-

    Plating layer

    (Ag, Ni, Au, etc.)

    Metal/Non-

    Plating layer

    Insulating layer

    Metal/Non-conductive core

    Plating layer

    Insulating layer

    Metal/Non conductive core

    Plating layer

    (Ag, Ni, Au, etc.)

    Non-fusible filler (Ag, Ni, C, etc.)

    Fig. 8 Schematics of conductive particle structure

    Chip Bump

    Conductive particle

    Pressure& heat

    Electrode padSubstrate

    Adhesive layer

    Chip Bump

    Conductive particle

    Pressure& heat

    Electrode padSubstrate

    Adhesive layer

    (a) Flip chip bonding with double layer ACF

    Chip Bump

    Conductive particle

    Pressure& heat

    Electrode padSubstrate

    Adhesive layer

    Adhesive layer

    Chip Bump

    Conductive particle

    Pressure& heat

    Electrode padSubstrate

    Adhesive layer

    Adhesive layer

    (b) Flip chip bonding with triple layer ACF

    Fig. 9 Schematics of flip chip bonding with multi- layere

    d ACFs

    . TCP ,

    IC TCP glass ACF

    glass

    ITO(indium tin oxide) TCP

    . COG

    , glass panel bare chip

    LCD

    . , LCD

    panel

    IC

    . ,

    50m

    . ACF

    COF . COF

    (polyimide) bare

    TCP ,

    (, , ) TCP

    .

    ACAs

    Fig. 8 1) Ag, Ni, C

    , 2) Au (Ni, titanium

    oxide ) (acrylic rubber, polystyrene

    ) 3)

    . Ag, Ni,

    Au

    .

    Ni, Au, Ni/Au

    . ACAs

    (metallurgical)

    /

    . ,

    .

    .

    ACAs19)

    .

    Sn/52In (Tm=118), Sn/58Bi(Tm=139))

    .

    Fig. 9

    . Figure 9

    (double-layer) ACF20)

    3 ACF21)

    .

    (single-layer) ACF

    ,

    . , Ag

    (sintering) 22)

    . ACA

    (non-

    reactive) 23)(Fig. 10(a)) ,

    (Cu, Zn, Ag, Cd, In, Sn,

    Au, Pb, Bi )

    ACA

    (Fig. 11(b))24)

    . Fig.

    12 (Sn/58Bi) ACF

  • 25 2, 2007 4 137

    35

    Sn -coated bump

    Bi precipitatesSn pad

    Cu/Ni

    Solid solutionSn-coated bump

    Bi precipitatesSn pa


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