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New technologies & application opportunities promise a bright future to the CMOS image sensors industry TABLETS & AUTOMOTIVE TO BOOST CMOS IMAGE SENSOR SALES AND DRIVE GROWTH OF THE MARKET CMOS image sensor market is expected to grow at an 11% CAGR in revenue in the 2012 - 2017 period, growing from $6.6B in 2012 to $11B in 2017. Many different applications are driving the integration of CMOS image sensors. If mobile handsets accounted for ~ 65% of total shipments in 2011, many new applications are poised to drive the future growth of this industry. Three fast emerging applications of significant size should drive the growth of the market to an expected CAGR over 30%: Tablets, Automotive, and Smart TV. More details are available in the report on each application. Tablets are poised to boost CIS sales in the consumer market; the majority of tablets have one or two cameras, similarly to mobile phones. We forecast that the CIS sales for tablets will represent nearly $1.5B in 2017! From another standpoint, car manufacturers have begun equipping cars with multiple cameras, pushed by upcoming regulations promoting greater safety and driver assistance. The automotive market is expected to reach $400M in 2017, and will drive the need for high-performance sensors with special features, e.g. global shutter, very high dynamic range, and low-light sensitivity. This is completely different from the phone market which is still in the race for higher resolution. The report describes in detail each application in terms of market size, competitive analysis, technical requirements, technology trends and business drivers. NEW BUSINESS MODELS AND NEW STRATEGIES EMERGE FROM A FRAGMENTING SUPPLY CHAIN As volumes increase, a clear duality appears between companies that have adopted a growth strategy by focusing on low-end markets and those opting for a specialization in high-end and higher margin markets to maintain profitability such as STMicro and Aptina. Back in 2009, Omnivison was the only major fabless image sensor manufacturer, but that situation is set to change: the fablight/foundry business models will be more and more successful in the future, fueled by the new business model adopted by players that are not completely integrated up to the system level. STMicroelectronics is about to outsource its backside illumination image sensor production to United Microelectronics Corp. (Taiwan), and Aptina Imaging already outsources its 12-inch production to Taiwan Semiconductor Manufacturing Co. The only companies that are financially sustainable with an IDM model are vertically integrated from leading-edge 300mm CIS manufacturing up to the system level: Samsung, Sony, Panasonic and Toshiba. This report describes in detail market share for each CMOS image sensor vendor and manufacturer, and how the value is distributed along the CIS value chain more information on http://www.i-micronews.com/reports/Status-CMOS-Image-Sensors-Industry/19/341/
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© 2012
Courtesy of Sony Courtesy of Omnivision Courtesy of SystemPlus Courtesy of Dexela Courtesy of Softkinetics
Status of the CMOS Image
Sensors Industry
New technologies & applications promise a bright future to the CMOS image
sensors industry!
© 2012 • 2
Table of Contents (1/2)
• Objectives & Scope of the report…..………7
• Executive Summary ………………..........… 12
1) Introduction & Background ……….........… 20
– CCD versus CMOS sensors
2) Market forecasts & Supply Chain …..……. 29
– 2010 - 2017 CMOS image sensors forecasts p 30
o Shipment forecasts (in Munits)
o Revenue forecasts (in $M)
o Wafer production forecasts (in wafer size eq.)
• 200mm vs 300mm production forecasts
– Global CMOS image sensor p53
o Manufacturing infrastructure
o Supply chain & Value chain
o 2011 market shares
• In shipments (in Munits)
• In revenue (in $M)
• In wafers (in wafer size eq.)
3) Application Focus ……………………......… 70
– Mobile phone sensors p 71
o Applications, specifications, markets, players &
supply chain
– Automotive sensors p 80
o Applications, specifications, markets, players &
supply chain
o Night vision: Near Infrared vs Far Infrared cameras
3) Application Focus ……………………..........… 71
– Security & Surveillance sensors p 91
o Applications, specifications, markets & supply chain
– Medical sensors p 112
o Applications, specifications, markets, players & supply
chain
o Endoscopy:
• Cameras pills
• disposable endoscopes
o X-ray imaging:
• Dental imaging: intraoral and 3D extraoral
detectors
• Medical detectors: CMOS X-ray Flat panel
detectors & Single photon counting detectors
– Industrial machine vision sensors p 167
o Applications, specifications, markets & supply chain
4) New & future technologies …….…………... 111
– 3D imaging business emergence p 190
o Applications, specifications, players & supply chain
o Time-of-flight imagng
o Stereoscopic imaging
o Plenoptic cameras
o Structured light cameras
– Next generation of image sensors p 215
o Highly absorptive layer: panchromatic & quantom dot film
o Computational imaging
o Single Photon Counting
Principle, chalelnges and applications
Focus on Single-Photon Avalanche Diodes
© 2012 • 3
Table of Contents (2/2)
5) Manufacturing focus……………………..…... 230
– CMOS Image sensor design innovations p 232
o Technology node reduction
o Transistor-shared design
– Front-end manufacturing innovations p 236
o At FEOL level
o At BEOL level
o At color filter level
– CIS process flow p 256
o At FEOL level
• Deep Trench isolation
• High energy implantation
o At BEOL level
• Without cavity/lightpipe
• With cavity/lightpipe
o At color filter level
– CMOS image sensor testing processes p 273
o Players, supply chain & program flow
– BSI “Backside illumination” technology p 278
o Motivations & applications for BSI sensors
o BSI technology penetration rate & market forecast
o Players & status of commercialization
o Future approach: 3D integrated image sensors
o Technologies for BSI manufacturing
– Status of the WLP / TSV packaging p 343
• Appendix ………..…………………....….. 352
– Yole Developpement presentation
© 2012 • 4
Changes for the 2012 report New content compared to 2010 version
What you will find in a future report
What’s new?
o All the section related to camera
module will be subject of the 2013
report on camera module packaging
o More details in the application section
• New application focus added: mobile phone.
• In depth analysis of the medical market.
• Updated forecasts of all the supply chains
and forecasts.
o Creation of a CMOS image sensor manufacturing
section, including:
• Detailed description of a manufacturing
process flow.
• Update of the BSI section of the 2010 report
with players positioning & roadmaps, BSI
adoption rate forecast, total BSI CIS market
forecast.
• New innovations developped at FEOL, BEOL
and color filter level.
o Creation of a new section dedicated to new
technologies: 3D imaging and potential next
generation of image sensors.
© 2012 • 5
Objectives of the Report
• This is the second report on CMOS image sensor technologies and markets
from Yole Développement.
• The objectives of that second report are the following:
1. To provide market data on key CIS market metrics & dynamics: • CMOS image sensor unit shipments, revenues and wafer production by application.
• Market shares with detailed breakdown for each player.
• Application focus on key areas of growth for CMOS image sensors (mobile handsets, DSC, DSLR,
medical, automotive, security & surveillance, etc …).
2. To provide key technical insight about future technology trends & challenges: • From a manufacturing standpoint: design & front-end innovations.
• A special focus is done on the BSI (Backside illumination) technology, that has been reshaping the
image sensor industry as we predicted in 2009.
3. To provide in-depth understanding of the CIS value chain, infrastructure &
players: • Who are the CMOS image sensor players (IDMs, foundries, design houses) and how are they related
• More generally, who are the key suppliers to watch and how will evolve the CMOS image sensor
industry.
© 2012 • 6
CCD image sensors
CMOS image sensors
Linear image
sensors
Array
image
sensors
Scope of the Study
• There are various kinds of image sensors:
– CMOS versus CCD image sensors. Array versus Linear image sensors
Through this report, we will primarily
focus on Array type of CMOS image sensors
© 2012 • 7
CIS & Camera Module Value Chain in 2012
• In 2012, the CMOS image sensor value chain represented .
• However that value is distributed in a much more complex way among the CIS
industry because numerous business models coexist (see next slide).
Front-end BE / Packaging
Implantation,
metalization, BSI
Camera Module Assembly & Test
Module Assembly
& Final Test Wafer testing/TSV &
WLP /dicing
Optical module (Lenses / IF filters)
Auto-focus
component
~ $3B ~ $1.2B
~ $6.6B industry!
Design, overheads ,selling, general and admnistrative
~ $2B
CF & µlense processes
Optical layers
~ $0.4B
~ $1.4B ~ $900M ~ $460M
Scope of the report
© 2012 • 8
CMOS Image Sensor applications Migration from HIGH VOLUME to low volume
Automotive
& Transport
Low Volumes
Mobile
Phones
~ 1B units >100M units
<1M units
Notebook & tablets
>10M units
Mobile audio, TV
& Gaming devices
Medical
Systems
High Volumes
Video
Camcorders
>1M units
Machine Vision,
Science &
Space sensors
DSC & SLR
Cameras
Security &
Surveillance
© 2012 • 9
CIS shipment Forecast by Application (in Munits)
• Many different applications are driving the integration of CMOS image sensors. If mobile handsets
accounted for ~ 65% of TOTAL shipments in 2011, many other new applications are set to drive future
growth of this industry such as:
– Tablets: CAGR 2012-2017 =40%
– Automotive: CAGR 2012-2017 =36%
– Smart TV: CAGR 2012-2017 =51%
– Medical disposable endoscopes: CAGR 2012-2017 =30%
0
1 000
2 000
3 000
4 000
5 000
6 000
2010 2011 2012 2013 2014 2015 2016 2017
Ship
me
nts
(M
Un
its)
CMOS image Sensors - Sales Forecast by Application (in MUnits)
Professional & Broadcast cameras
Defense
X-Ray medical imaging
Machine vision sensors
Medical disposable endoscopes
Camera pills
Others
Smart TV
Video camcorder
Automotive / Transport
DSLR / ILCs
Security & Surveillance Cameras
DSC
Game Stations
Retail webcam
Portable Game Stations
PMP / mp3
Tablets
Notebooks
Computer mice
Cell-Phones
Yole Developpement © October 2012
© 2012 • 10
CMOS Image Sensor Manufacturing 2011 wafer fab production estimate (8" wspy eq.)
* Others include TowerJazz, SK Hynix SMIC,
HHNEC/Grace, Powerchip, Vanguard,
Panasonic, Teledyne Dalsa, X-Fab, Lfoundry,
Franhofer, IMEC, CSEM, Sarnoff, IMS-
chip,Hejian, Hamamatsu and Fujitsu.
CMOS image sensors - 2011 wafer
production forecast (8" wspy eq.)
TSMC 571,781 wafers
23%
Samsung 535,382 wafers
21%
Sony 375,765 wafers
15%
Toshiba 204,003 wafers
8%
STMicro 190,882 wafers
7%
Aptina / Micron 151,261 wafers
6%
Canon 145,659 wafers
6%
SMIC 80,683 wafers
3%
Dongbu HiTek 65,132 wafers
3% Others 203,959 wafers
8%
TOT ~2.5 Mwafers
(200mm eq)
Yole Developpement ©
September2012
Rank Company 2011 Share
1 TSMC 571,781 wafers 23%
2 Samsung 535,382 wafers 21%
3 Sony 375,765 wafers 15%
4 Toshiba 204,003 wafers 8%
5 STMicro 190,882 wafers 8%
6 Aptina / Micron 151,261 wafers 6%
7 Canon 145,659 wafers 6%
8 SMIC 80,683 wafers 3%
9 Dongbu HiTek 65,132 wafers 3%
10 Others 203,959 wafers 8%
TOT 2,524,506 wafers
CMOS Image Sensor Manufacturing 2011 wafer fab production estimate (8" wspy eq.)
© 2012 • 11
Detailed analysis of five major applications
© 2012 • 12
Future technologies and
major innovations
© 2012 • 13
Detailed manufacturing process
© 2012 • 14
Past, present and future of
Backside Illumination Technology
© 2012 • 15
Who should be Interested in this report?
• CMOS image sensor players: – Evaluate market potential of future
technologies and products for new
applicative markets
– Screen potential new suppliers for
introducing new disruptive technologies
such as BSI, new pixel architectures, Wafer
level camera, Auto-focus & image
stabilization for camera modules
– Monitor and benchmark your competitor’s
advancements
• CMOS & Packaging Foundries:
– Spot new opportunities and define
diversification strategies
– Position your company in the moving
CMOS imaging value
• Assembly & Test Service companies:
– Get the list of the Top CMOS image sensor
players
– Understand the impact of new optical
assembly technologies such as wafer level
cameras for your business
• Equipment & Material manufacturers: – Understand the evolution of image sensor
and camera module value chain
– Understand the differentiated value of your
products and technologies in this market
– Identify new business opportunities and
prospects
• Electronic module makers & Original
Equipment Makers: – Evaluate the benefits of using these new
technologies in your end system
– Screen and select new image sensor
suppliers
• Financial & strategic investors: – Understand the potential of new imaging
technologies such as BSI, WLOptics and
Auto-focus
– Get the list of main key players and
emerging start-ups in this industry
© 2012 • 16
Companies cited in this Report
Acti Corp, ADIMEC, Advantest, Advasense, AIE, Alexima, Allied Vision Technology, Anafocus, Anteryon,
Aphesa, Aptina Imaging, Austria Microsystems, Axis Communication, Awaiba, Basler, Bosch security
systems, Brainvision, Brigates, Brookman Technology, BYD, Caeleste, Canon, Carestream Dental,
Carestream Health, Clairpixel, CMOSIS, CMOS Vision, CMT Medical, Cognex, Continental, Crysview, CSEM,
Dahua Technologies, Denso, Delphi, DEXIS, D-Link, Delphi, Dongbu HiTek, DXG, e2v, e-con systems,
ELMOS, EPFL, Excico, Fairchild Imaging, FLIR, Fondazione Bruno Kessler, Forza Silicon, Fotonic, Foveon,
Fraunhofer, Fujitsu, GalaxyCore, Gendex, Given Imaging, Grace Tech, Hamamatsu Photonics, Hella,
Hightec, Hejian, Hikvision, Himax imaging, HHNEC-Grace, HTC, SK Hynix, Instrumentarium, Intromedic,
Invisage, Invision biometrics, Invendo Medical, Invensense, ImageWorksIMEC, IMS-Chips, IO Industries,
ISDI, JAI, Jinshan Group, JSR, JVC/Altasens, Konica Minolta, Kostal, KunShan RuiXin Micro, KYEC,
Lfoundry, LG, Lytro, Mantis Vision, Magna, Magneti Marelli, Medigus, Melexis, MESA Imaging, Micron,
Microsoft, Mobotix, Morita, New Imaging Technologies, Novatek, Odos Imaging, Omnivision, Omron, ON
Semi, Optex, Owandy, Oy Ajat, Panavision Imaging, Panasonic, Pelican Imaging, PerkinElmer, Philips,
Pixart, PixelPlus, Pixim, Pelco, PMD Technologies, Point Grey research, Powerchip, Pyxalis, Rad-icon,
Raytrix, Rutherford Appleton Laboratory, Samsung, Sarnoff, SETi, Sharp, Shick/Sirona, SiliconFile, Soft
Kinetic, SK Hynix, SMIC, SOITEC, Sony, SRI International, STMicro, SuperPix, Teledyne DALSA, Tessera,
Thayer school of engineering Dartmouth, The Imaging source, Tong Hsing, TOK, Toray, Toshiba,
Trixell/Thales, TSMC, Toshiba Teli, TowerJazz, Tridicam, TRW, TU Delph, TYZX, UMC, University of
Edinburg, Valeo, Vanguard, Vatech Humanray, VisEra, Vista Point, Viti, Viimagic, Vision research, Vivitar,
Vivotek, WLCSP, X-counter, X-Fab, XinTec, Ziptronix and more …
© 2012 • 17
About the Authors of this Report
• Paul Danini:
– Paul is in charge of the imaging technologies studies at Yole
Developpement. After a short experience at e2v, he
previously worked in IP strategy at Avenium Consulting. He
holds a master of engineering in instrumental physics &
medical imaging, complemented by a master degree in
Technology and Innovation Management from Grenoble EM
Business School.
Contact: [email protected]
• Jerome Baron:
– Jerome is leading the MEMS & Advanced Packaging market
research at Yole Developpement. He has been involved in the
analysis of the CMOS image sensor industry at the sensor,
packaging, assembly & test levels. He is also involved in the
research linked to new equipment and materials for image
sensor manufacturing. He was granted a Master of Science
degree in Nanotechnologies from the National Institute of
Applied Sciences in Lyon, France
Contact: [email protected]
© 2012 • 18
Available MEMS Reports
Trends in MEMS
Manufacturing &
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MEMS Cosim+
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Cost Simulation Tool
Ferro-Electric
Thin Films MEMS Microphone
Permanent Wafer
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Motion Sensors for
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© 2012 • 19
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