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5/24/2018 Lg 55la6200-Da Chassis Lt33b
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Printed in KoreaP/NO : MFL67686912 (1302-REV00)
CHASSIS : LT33B
MODEL : 55LA6200 55LA6200-DA
CAUTIONBEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TV
SERVICE MANUAL
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 17
BLOCK DIAGRAM.................................................................................. 25
EXPLODED VIEW .................................................................................. 35
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current checkon the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 Mand 5.2 M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONSon page 3 of this publication.NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as anti-static can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as thebrushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf-
cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir-cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec sheet is applied all of the 32,42,47,55,60, 65LED TV with LT33B chassis
2. Test conditionEach part is tested as below without special notice.
1) Temperature : 25 C 5 C, CST : 40 C5 C
2) Relative Humidity: 65 % 10 %
3) Power VoltageStandard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
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4. General Specification
No Item Specication Remark1. Display Screen Device 32 wide Color Display Module Resolution: 1366*768 (32LN570)
32 wide Color Display Module Resolution: 1920*1080
39 wide Color Display Module Resolution: 1920*1080
42 wide Color Display Module Resolution: 1920*1080
47 wide Color Display Module Resolution: 1920*1080
50 wide Color Display Module Resolution: 1920*1080
55 wide Color Display Module Resolution: 1920*1080
60 wide Color Display Module Resolution: 1920*1080
2. Aspect Ratio 16:9 All
3. LCD Module 32" TFT WUXGA LCD
32" TFT WXGA LCD Only 32LN570B
42" TFT WUXGA LCD
47 TFT WUXGA LCD
50 TFT WUXGA LCD
55 TFT WUXGA LCD
60 TFT WUXGA LCD
4. Operating Environment TFT 1) Temp. : 0 ~ 40 deg
2) Humidity : 0 ~ 85%
LGE SPEC
5. Storage Environment TFT 1) Temp. : -20 ~ 60 deg
2) Humidity : 10 ~ 90%
6. Input Voltage AC100 ~ 240V, 50/60Hz
7. Power Consumption(Max) =
LCD(Module) + Backlight(LED)
FHD
T240Hz
POLA
60 TBD W FPR : LC600DUK-SEF1 [60LA7450/LA6200-DA]
FHD
T120Hz
POLA
55 TBD W FPR : LC550EUJ-SEK1 [55LA6200-DA]
FHD
60Hz POLA
55 TBD W Normal : LC550EUJ-SEE1 [55LN5700-DC]
FHD
T120Hz
CINEMA
42 56.4 W FPR: LC420EUG-KFF1 [42LA65/66/68/6900-DA]
47 62.4 W FPR: LC470EUG-KFF1 [47LA66/68 6900-DA]
55 74.3 W FPR: LC550EUG-KFF1 [55LA66/68/6900-DA]
FHDT120Hz
Edge
42 57 W FPR: LC420EUN-SFF2 [42LA6400-DA]47 68 W FPR: LC470EUN-SFF2 [47LA6400-DA]
50 76 W FPR: LC500EUN-SFF1 [50LA6400-DA]
55 88 W FPR: LC550EUN-SFF1 [55LA6400-DA]
FHD
T120Hz
Direct
42 77 W FPR : LC420DUE-SFU1 [42LA6200-DA]
77 W Normal : LC420DUE-SFR1 [42LN5700]
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8. LCD Module Size Maker Inch (H) (V) (D)
32 TBD LC320EUA-KFF1 [32LA6900-DA]
947.7 x 546.65 x 9.7 LC420EUG-KFF1 [42LA6600 / 6900-DA]
42 958 x 559.1 x 9.9 LC420EUN-SFF2 [42LA6400-DA]
956.4 x 555.0 x 37.4 LC420DUE-SFU1 [42LA6200-DA]
958.2 x 555.8 x 35.0 LC420DUE-SFR1 [42LN5700]
47 1059.5 x 609.5 x 9.7 LC470EUG-KFF1 [47LA66/68/6900-DA]
1070.6 x 622.0 x 9.9 LC470EUN-SFF2 [47LA6400-DA]
1068.0 x 617.8 x 38.8 LC470DUE-SFU1 [47LA6200-DA]
1067.6 x 617.4 x 36.5 LC470DUE-SFR1 [47LN5700-DH]
50 1121.6 x 644.3 x 10.8 LC500EUN-SFF1 [50LA6400-DA]
1123.0 x 648.2 x 40.3 LC500DUE-SFU1 [50LA6200-DA]
55 1229.4 x 706.3 x 13.2 LC550EUG-KFF1 [55LA66/68/6900-DA]
1244.6 x 720.9 x 9.9 LC550EUN-SFF1 [55LA6400-DA]
1232.0 x 704.0 x 1.94 LC550EUJ-SEK1 [55LA6200-DA]
1232.0 x 704.0 x 1.94 LC550EUJ-SEE1 [55LN5700-DC]
60 1333.0 x 758.94 x 1.42 LC600DUK-SEF1 [60LA6200-DA]
Pixel Pitch Maker Inch (H) (V) (D)
32 TBD LC320EUA-KFF1 [32LA6900-DA]
170.25 x 510.75 LC320DUE-SFR1 [32LN570B]
42 483.3 x 483.3 LC420EUG-KFF1 [42LA6600 / 6900-DA]
483.3 x 483.3 LC420EUN-SFF2 [42LA6400-DA]
483.3 x 483.3 LC420DUE-SFU1 [42LA6200-DA]
483.3 x 483.3 LC420DUE-SFR1 [42LN56/5700-DA]
47 541.5 x 541.5 LC470EUG-KFF1 [47LA66/68/6900-DA]541.5 x 541.5 LC470EUN-SFF2 [47LA6400-DA]
541.5 x 541.5 LC470DUE-SFU1 [47LA6200-DA]
541.5 x 541.5 LC470DUE-SFR1 [47LN5700]
50 570.75 x 570.75 LC500EUN-SFF1 [50LA6400-DA]
570.75 x 570.75 LC500DUE-SFU1 [50LA6200-DA]
55 630 x 630 LC550EUG-KFF1 [55LA66/68/6900-DA]
630 x 630 LC550EUN-SFF1 [55LA6400-DA]
630 x 630 LC550EUJ-SEK1 [55LA6200-DA]
630 x 630 LC550EUJ-SEE1 [55LM5700-DC]
60 687 x 687 LC600DUK-SEF1 [60LA6200-DA]
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8. Back Light Maker Inch TYPE Module Name
LGD 32 CINEMA FPR : LC320EUA-KFF1 [32LA6900-DA]
42 FPR: LC420EUG-KFF1 [42LA6600 /
6900-DA]
47 FPR: LC470EUG-KFF1 [47LA6600 /
6900-DA]
55 FPR: LC550EUG-KFF1 [47LA6600 /
6900-DA]
42 Edge FPR: LC420EUN-SFF2 [42LA6400-DA]
47 FPR: LC470EUN-SFF2 [47LA6400-DA]
50 FPR: LC500EUN-SFF1 [50LA6400-DA]
55 FPR: LC550EUN-SFF1 [55LA6400-DA]
55 POLA FPR: LC550EUJ-SEK1 [55LA6200-DA]
60 FPR: LC600DUK-SEF1 [60LA6200-DA]
32 Direct LC320DXE-SFR1 [32LN570B-DH]
42 FPR : LC420DUE-SFU1 [42LA6200-DA]
Normal : LC420DUE-SFR1 [42LN 5700]
47 FPR : LC470DUE-SFU1 [47LA6200-DA]
Normal : LC470DUE-SFR1 [47LN5700-DH]
50 FPR : LC500DUE-SFU1 [50LA6200-DA]
Display Colors 1.06 B (10-bit) Except FHD 60Hz models
16.7 M (8-bit) FHD/HD 60Hz models
Coating 3H(Hard coating), Anti-glare
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5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.00 SDTV 480P
5. 720*576 15.625 50* 13.5 SDTV 576I
6. 720*576 31.25 50* 13.5 SDTV 576P
7. 1280*720 37.5 50* 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1929*1080 28.125 50* 74.25 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.25 50* 148.5 HDTV 1080P
14. 1920*1080 67.50 60 148.50 HDTV 1080P15. 1920*1080 67.432 59.94 148.352 HDTV 1080P
16. 1920*1080 27.00 24.00 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.00 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P
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5.2.2. PC mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remarks
1 640*350 31.468 70.09 25.17 EGA
2 720*400 31.469 70.09 28.32 DOS
3 640*480 31.469 59.94 25.17 VESA(VGA)
4 800*600 37.879 60.31 40 VESA(SVGA)
5 1024*768 48.363 60.00 65 VESA(XGA)
6 1152*864 54.348 60.053 80.002 VESA(VGA)
7 1360*768 47.712 60.015 84.75 VESA(WXGA)
8 1280*1024 63.981 60.020 109.00 SXGA Only FHD Model (Support to HDMI-PC)
9 1920*1080 67.5 60 158.40 WUXGA (Reduced Blanking) Only FHD Model
5.2. HDMI : EDID DATA : Refer to adjust specification5.2.1. DTV mode
No Resolution H-freq(kHz) V-freq.(Hz)Pixel
clock(MHz)Proposed Remark
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display
2 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P7 1280*720 44.96 59.94 74.176 HDTV 720P
8 45 60.00 74.25 HDTV 720P
9 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 33.72 59.94 74.176 HDTV 1080I
12 33.75 60.00 74.25 HDTV 1080I
13 26.97 23.976 63.296 HDTV 1080P
14 27.00 24.000 63.36 HDTV 1080P
15 33.71 29.97 79.120 HDTV 1080P
16 33.75 30.00 79.20 HDTV 1080P
17 56.25 50.00 148.5 HDTV 1080P
18 67.432 59.94 148.350 HDTV 1080P
19 67.5 60.00 148.5 HDTV 1080P
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5.3. 3D mode5.3.1. RF Input
No Resolution Proposed 3D input proposed mode
1 HD 1080I
720P
2D to 3D
Side by Side(Half)
Top & Bottom
2 SD 576P
576I
2D to 3D
5.3.2. RF Input (3D supported mode automatically)
5.3.3. HDMI Input 1.3(3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D
Side by Side(half),
Top & Bottom,Single Frame Sequential
2 1280*720 37.500 50 74.25 HDTV 720P 2D to 3D
Side by Side(half),
Top & Bottom,
Single Frame Sequential
3 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D
Side by Side(half),
Top & Bottom
4 1920*1080 28.125 50.00 74.25 HDTV 1080I 2D to 3D
Side by Side(half),
Top & Bottom
5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D
Side by Side(half),
Top & Bottom,
Checkerboard
6 1920*1080 28.12 25 74.25 HDTV 1080P 2D to 3D
Side by Side(half),
Top & Bottom,
Checkerboard7 1920*1080 33.75 30.00 74.25 HDTV 1080P 2D to 3D
Side by Side(half),
Top & Bottom,
Checkerboard
8 1920*1080 56.25 50 148.5 HDTV 1080P 2D to 3D
Side by Side(half),
No Signal 3D input proposed mode
1 Frame Compatible Side by Side(Half), Top & Bottom
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5.3.4. HDMI Input 1.4b (3D supported mode automatically)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposedmode Proposed
1 640*480 31.469 / 31.5 59.94/ 60 25.175/25.2 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
2 62.938 / 63 59.94/ 60 50.35/50.4 Frame packing
Line alternative
Secondary(SDTV 480P)
(SDTV 480P)
3 31.469 / 31.5 59.94/ 60 50.35/50.4 Side-by-side(Full) (SDTV 480P)
4 720*480 31.25 50 27 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 480P)
Secondary(SDTV 480P)
5 62.5 50 54 Frame packingLine alternative
Secondary(SDTV 480P)(SDTV 480P)
6 31.25 50 54 Side-by-side(Full) (SDTV 480P)
7 720*576
(576p)
720 (1440)*576
(576i)
31.25 50 27 Top-and-Bottom
Side-by-side(half)
Secondary(SDTV 576P)
Secondary(SDTV 576P)
8 62.5 50 54 Frame packing
Line alternative
Secondary(SDTV 576P)
(SDTV 576P)
9 31.25 50 54 Side-by-side(Full) (SDTV 576P)
10 15.625 50 27 Top-and-BottomSide-by-side(half) Secondary(SDTV 576I)Secondary(SDTV 576I)
11 31.25 50 54 Frame packing
Field alternative
Secondary(SDTV 576I)
(SDTV 576I)
12 15.625 50 54 Side-by-side(Full) (SDTV 576I)
13 1280*720 37.5 50 74.25 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
14 75 50 148.5 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
15 37.5 50 148.5 Side-by-side(Full) (HDTV 720P)
16 44.96 / 45 59.94 / 60 74.18/74.25 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 720P)
Primary(HDTV 720P)
17 89.91 / 90 59.94 / 60 148.35/148.5 Frame packing
Line alternative
Primary(HDTV 720P)
(HDTV 720P)
18 44.96 / 45 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 720P)
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No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed
mode
Proposed
19 1920*1080 33.72 / 33.75 59.94 / 60 74.18/74.25 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
20 67.432 / 67.5 59.94 / 60 148.35/148.5 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
21 33.72 / 33.75 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 1080I)
22 28.125 50.00 74.25 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080I)
Primary(HDTV 1080I)
23 56.25 50.00 148.5 Frame packing
Field alternative
Primary(HDTV 1080I)
(HDTV 1080I)
24 28.125 50.00 148.5 Side-by-side(Full) (HDTV 1080I)
25 26.97 / 27 23.97 / 24 74.18/74.25 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Primary(HDTV 1080P)
26 43.94 / 54 23.97 / 24 148.35/148.5 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
27 26.97 / 27 23.97 / 24 148.35/148.5 Side-by-side(Full) (HDTV 1080P)
28 28.12 25 74.25 Top-and-Bottom
Side-by-side(half)
Secondary(HDTV 1080P)
Secondary(HDTV 1080P)
29 56.25 25 148.5 Frame packingLine alternative
Secondary(HDTV 1080P)(HDTV 1080P)
30 28.125 25 148.5 Side-by-side(Full) (HDTV 1080P)
31 33.716 / 33.75 29.976 / 30.00 74.18/74.25 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
32 67.432 / 67.5 29.976 / 30.00 148.35/148.5 Frame packing
Line alternative
Primary(HDTV 1080P)
(HDTV 1080P)
33 33.716 / 33.75 29.976 / 30.00 148.35/148.5 Side-by-side(Full) (HDTV 1080P)
34 56.25 50 148.5 Top-and-BottomSide-by-side(half)
Primary(HDTV 1080P)Secondary(HDTV 1080P)
35 67.43 / 67.5 59.94 / 60 148.35/148.50 Top-and-Bottom
Side-by-side(half)
Primary(HDTV 1080P)
Secondary(HDTV 1080P)
5.3.5. HDMI-PC 3D Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1024*768 48.36 60 65 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 768P
2 1360*768 47.71 60 85.5 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 768P
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5.3.6. Component 3D Input (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1280*720 37.5 50 74.25 2D to 3D,
Side by Side(half),
Top & Bottom
HDTV 720P
2 1280*720 45.00 60.00 74.25 2D to 3D,
Side by Side(half),
Top & Bottom
HDTV 720P
3 1280*720 44.96 59.94 74.176 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 720P
4 1920*1080 33.75 60.00 74.25 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080I
5 1920*1080 33.72 59.94 74.176 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080I
6 1920*1080 28.12 50 74.25 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080I
7 1920*1080 67.500 60 148.50 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
8 1920*1080 67.432 59.94 148.352 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
9 1920*1080 27.000 24.000 74.25 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
10 1920*1080 28.12 25 74.25 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
11 1920*1080 56.25 50 74.25 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
12 1920*1080 26.97 23.976 74.176 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
13 1920*1080 33.75 30.000 74.25 2D to 3D,Side by Side(half)
Top & Bottom
HDTV 1080P
14 1920*1080 33.71 29.97 74.176 2D to 3D,
Side by Side(half)
Top & Bottom
HDTV 1080P
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5.3.7. USB Input (3D) (3D supported mode manually)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1920*1080 33.75 30 74.25 2D to 3D
Side by Side(Half)*,
Top & Bottom*,
Checkerboard*
Row Interleaving,
Column Interleaving
(Photo : side by Side(half),
Top & Bottom)
HDTV 1080P
5.2.8. DLNA Input (3D)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1920*1080 33.75 30 74.25 2D to 3D
Side by Side(Half)*,
Top & Bottom*,
Checkerboard*
Row Interleaving,
Column Interleaving(Photo : side by Side(half), Top
& Bottom)
HDTV 1080P
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ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied all of the LT33B LED TV
models, which produced in manufacture department or similarLG TV factory
2. Specification(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs.
(3) The adjustment must be performed in the circumstance of25 5C of temperature and 6510% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes.
After Receive 100% Full white pattern (06CH) then process
Heat-run
(or 8. Test pattern condition of Ez-Adjust status)
How to make set white pattern1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select 8. Test
pattern and, after select White using navigation button,
and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any pattern
generator
* Notice : if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern
-13Ch, or Cross hatch pattern 09Ch) then it can
appear image stick near black level.
3. Adjustment items3.1. PCB Assembly Adjustment
MAC Address / ESN / Widevine Download
EDID (The Extended Display Identification Data)/DDC
(Display Data Channel) download
* If it is necessary, it can adjustment at Manufacture Line
You can see set adjustment status at 1. ADJUST CHECK
of the In-start menu
3.2. Set Assembly Adjustment Color Temperature (White Balance) Adjustment
Using RS-232C
PING Test
Selection Factory output option
4. PCB Assembly Adjustment4.1. MAC Address, ESN Key and Widevine
Key download4.1.1. Equipment & Condition
1) Play file: keydownload.exe
4.1.2. Communication Port connection1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.1.3. Download process
1) Select the download items.2) Mode check: Online Only
3) Check the test process
- DETECT -> MAC_WRITE -> ESN_WRITE -> WIDEVINE_
WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
4.1.4. Communication Port connection1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.1.5. Download1) 13Y LCD TV+MAC+Widevine+ESN Key+ HDCP1.4 and
HDCP2.0
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4.2. LAN PORT INSPECTION(PING TEST)
4.2.1. Equipment setting
1) Play the LAN Port Test PROGRAM.2) Input IP set up for an inspection to Test
Program.
*IP Number : 12.12.2.2.
4.2.2. LAN PORT inspection (PING TEST)1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
4.3. ADC Adjust => No need at Assembly
line because of OPT type* OTP mode
Automatic ADC Calibration. (Internal ADC Calibration) On the
manufacture line, OTP is used
for ADC Calibration automatically.
* External mode
Manual ADC Calibration. When OTP mode is failed, ADC
calibration should be OK by
using External mode.
- If you want re-adjust for ADC. Enter Service Mode by pushing ADJ key,
Enter Internal ADC mode by pushing key at 6. ADC
Calibration
Adjustment protocol
Order Command Set response
(1) Inter the Adjustment mode aa 00 00 a 00 OK00x
(2) Change the Source xb 00 40
xb 00 60
b 00 OK40x (Adjust 480i Comp1 )
(Adjust 1080p Comp1)
b 00 OK60x (Adjust 1080p RGB)
(3) Start Adjustment ad 00 10
(4) Return the Response OKx ( Success condition )
NGx ( Failed condition )
(5) Read Ad justment data ( main)
ad 00 20
( main )
ad 00 30
(main : component1 480i, RGB 1080p)
000000000000000000000000007c007b-
006dx
(main : component1 1080p)000000070000000000000000007c0083
0077x
(6) Confrm Adjustment ad 00 99 NG 03 00x (Failed condition)
NG 03 01x (Failed condition)
NG 03 02x (Failed condition)
OK 03 03x (Success condition)
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5. Factory Adjustment5.1. EDID (The Extended Display Identification
Data)/DDC (Display Data Channel) Download
Summary
It is established in VESA, for communication between PC
and Monitor without order from user for building user
condition. It helps to make easily use realize Plug and Play
function. For EDID data write, we use DDC2B protocol.
Auto Download (No need Writing EDID data in Assembly line)
After Set Tool Option, then TV turn off and on finish auto
download* EDID data for 3DTV (LA62/64/66/68/69/74 Seriese) (Model
name = LG TV ) .
*Rev. 15xxx to confirm that, Rev. up subject to change
- HDMI EDID table
- HDMI-1 EDID table (0xE8, 0xCC)
(1) HDMI 1 Check sum : 0xE8, 0XCC (CEA Block 0x21 :10)
(2) HDMI 2 Check sum : 0xE8, 0XBC (CEA Block 0x21 :20)
(3) HDMI 3 Check sum : 0xE8, 0XAC (CEA Block 0x21 :30)
* EDID data for Non-3DTV (LN56/57 Seriese) (Model name =
LG TV )
*Rev. 15xxx to confirm that, Rev. up subject to change
- HDMI EDID table
- HDMI-1 EDID table (0X43, 0x8A)
(1) HDMI 1 Check sum : 0x43, 0X8A (CEA Block 0x21 :10)
(2) HDMI 2 Check sum : 0x43, 0X7A (CEA Block 0x21 :20)
(3) HDMI 3 Check sum : 0x43, 0X6A (CEA Block 0x21 :30)
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5.2. Adjustment White balance W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (80IRE) LAMPModule
CH14 , Test signal : Inner pattern (80IRE) LED Module
Above 5 minutes H/run in the inner pattern. (power on key of
adjust remote control)
The spec of color temperature and coordinate.
All
Cool (C50) 13,000k K
X=0.269
(0.002)
Y=0.273
(0.002)
- Inner pattern
for W/B adjust
- External white
pattern (80IRE,
204gray)
Medium (0) 9,300k K
X=0.285
(0.002)
Y=0.293
(0.002)
Warm (W50) 6,500k K
X=0.313
(0.002)
Y=0.329
(0.002)
LA6xxx, LA7xxx, LA8xxx, LN5x Series (Normal Line)
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 285 293 313 329
1 0-2 281 287 295 310 320 342
2 3-5 280 285 294 308 319 340
3 6-9 278 284 292 307 317 339
4 10-19 276 281 290 304 315 336
5 20-35 275 277 289 300 314 3326 36-49 274 274 288 297 313 329
7 50-79 273 272 287 295 312 327
8 80-119 272 271 286 294 311 326
9 Over 120 271 270 285 293 310 325
LA6xxx, LA7xxx, LA8xxx, LN5x Series (Aging Chamber)
H/R Time(Min)
Cool Medium Warm
x y x x y x
271 270 285 293 313 329
1 0-5 280 285 294 308 319 340
2 6-10 276 280 290 303 315 335
3 11-20 272 275 286 298 311 330
4 21-30 269 272 283 295 308 327
Connecting picture of the measuring instrument (On Automatic
control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out
Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzers Prove vertically.(80~100).
(3) Aging time
- After aging start, keep the power on (no suspension of power
supply) and heat-run over 5 minutes.
- Using no signal or full white pattern or the others, check the
back light on.
Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance StartWb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
MIN CENTER
(DEFAULT)
MAX
Cool Mid Warm 00 Cool Mid Warm
R Gain Jg ja jd 00 172 192 192 192
G Gain Jh jb je 00 172 192 192 192
B Gain Ji jc jf 192 192 172 192
R Gain 64 64 64 128
G Gain 64 64 64 128
B Gain 64 64 64 128
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Manual W/B process using adjusts Remote control.(TBD)
- Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
- Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
- After enter Service Mode by pushing ADJ key,
- Enter White Balance by pushing key at 8. Whi te
Balance
For manual adjustment, it is also possible by the following
sequence
(1) Set TV in Adj. mode using P-ONLY key on remote controller
and then operate heat run longer than 15 minutes.
(If not executed this step, the condition for W/B may be
different.)
(2) Push Exit key.
(3) Enter White Balance mode by pushing the ADJ key and select
8. White Balance. When KEY () is pressed, 206 Gray
internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(5) Select each items (Red/Green/Blue Gain) using /(CH +/-)
key on R/C..(6) Adjust R/ G/ B Gain using /(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm) -Fix the one of
R/G/B gain and change the others
(8) When adjustment is completed, exit adjustment mode using
EXIT key on R/C.
CASE Cool
- First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
(i) Decrease the R, G.
(2) x, y < target
(i) First decrease the B gain,
(ii) Decrease the one of the others.
(3) x > target , y < target
(i) First decrease B, so make y a little more than the target.
(ii) Adjust x value by decreasing the R
(4) x < target , y > target
RS-232C Command (Commonly apply)
RS-232C COMMANDExplanation
CMD DATA ID
wb 00 00 White Balance adjustment start
Wb 00 10 Start of adjust gain (Inner white pattern)
wb 00 1f End of gain adjust
wb 00 20 Start of offset adjust(Inner white pattern)
wb 00 2f End of offset adjust
wb 00 ff End of White Balance adjust
(Inner pattern disappeared)
wb 00 00: Start Auto-adjustment of white balance.
wb 00 10: Start Gain Adjustment (Inner pattern)
jb 00 c0 :
wb 00 1f: End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-end)
wb 00 ff: End of white balance adjustment (inner pattern
disappear)
Notice) Adjustment Mapping informationRS-232C COMMAND
[CMD ID DATA]
MIN CENTER
(DEFAULT)
MAX
Cool Mid Warm 00 Cool Mid Warm
R Gain Jg ja jd 00 172 192 192 192
G Gain Jh jb je 00 172 192 192 192
B Gain Ji jc jf 192 192 172 192
R Gain 64 64 64 128
G Gain 64 64 64 128
B Gain 64 64 64 128
5.3. Magic Motion remote controller Check5.3.1 Test equipment
- RF-remote controller for check, IR-KEY-CODE remote
controller.
- Check AA battery before test. A recommendation is that a
tester change battery every lots.
5.3.2. Test(1) Make pairing with TV set by pressing Mute (START) key
on RCU.
(2) Check a cursor on screen by pressing ENTER or OK
key of RCU
(3) Stop paring with TV set by pressing VOL+ (STOP) key.
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5.4. 3D pattern test5.4.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4support)
(2) Pattern: HDMI mode (model No. 872, pattern No. 83)
5.4.2. Test method(1) Input 3D test signal as Fig.1.
(2) Press OK key as a 3D input OSD is shown.
(3) Check pattern as Fig2 without 3D glasses. (3D mode
without 3D glasses)
Fig.2 Fig.3
5.5. HDMI ARC Function Inspection5.5.1. Test equipment
- Optic Receiver Speaker- MSHG-600 (SW: 1220 )
- HDMI Cable (for 1.4 version)
5.5.2. Test method(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (Its connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
5.6. Selection of Country optionSelection of country option is allowed only North American
model (Not allowed Korean model). It is selection of Country
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5.7. MHL TestStep 1) Turn on TV
Step 2) Select HDMI4 mode using input Menu.Step 3) Set MHL Zig(M1S0D3617) using MHL input, output
and power code.
Step 4) Connect HDMI cable between MHL Zig and HDMI4
port.
Step 5) Check LED light of Zig and Module of Set
Result) If, The LED light is green and The Module shows
normal stream -> OK
Else -> NG
Caution : Dont push The INSTOP KEY after completing thefunction inspection.
6. GND and HI-POT Testing6.1. GND & HI-POT auto-check preparation
Check the connection between set andpower cord
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester
(3) Controller (GWS103-4) on.(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically
6.3. Check Point(1) Test voltage3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at
100mA
(2) TEST time: 1 second
(3) TEST POINT
3 Poles : GND Test = POWER CORD GND and SIGNAL
CABLE GND.
Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
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7. Default Service option
7.1. ADC-Set R-Gain adjustment Value (default 128)
G-Gain adjustment Value (default 128)
B-Gain adjustment Value (default 128)
R-Offset adjustment Value (default 128)
G-Offset adjustment Value (default 128)
B-Offset adjustment Value (default 128)
7.2. White balance. Value
CENTER (DEFAULT)
C50 0 W50
R Gain 192 192 192
G Gain 192 192 192
B Gain 192 192 192
R Cut 64 64 64
G Cut 64 64 64
B Cut 64 64 64
8. USB DOWNLOAD (*.epk file download)(1) Put the USB Stick to the USB socket
(2) Press Menu key, and move OPTION(3)
(4) Press FAV Press 7 times.
(5) Select download file (epk file)
(6) After download is finished, remove the USB stick.
(7) Press IN-START key of ADJ remote control, check the
S/W version
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BLOCK DIAGRAM
MTKA2
IF(+/-)
USB1
OPTIC
LAN
DDR3
1600X16
(512M
BX2EA)
HDMI1
HDMI2
HDMI3
HDMI
MUX
Air/
Cable
TUNER
(T/C/A)
TUNER
(S2)
DVB-S
DEMOD
(S2)
LNB
USB2
USB3
41P51P
P_TS
50P
50P
X_TAL
27MHz
T
/C/S2WithoutATV
T/C/S2WithoutATV
#EPI&LVDSDiagram
A
B
I2SOut
I2C1
EPI
I2C2
LVDS
USB
I2C5
I2C1
H/P
AV/COMP
Tuner:
I2C6
DVB-S:I2C4
OCP
2.5A
OCP
1A
(HDD)
MHL1A
SIL1292M
HL:I2C4
MHL
REARSIDE SIDE
REAR(H)
AMP
TI
CVBS/YPbPr
CVBS/RGB
SPDIFOUT
ETHERNET
I2C3
I2C1
UARTIR
KEY
USB_WIFI
MTKA2
IF(+/-)
USB1
OPTIC
LAN
DDR3
1600X16
(512M
BX2EA)
HDMI1
HDMI2
HDMI3
HDMI
MUX
Air/
Cable
TUNER
(T/C/A)
TUNER
(S2)
DVB-S
DEMOD
(S2)
LNB
USB2
USB3
41P51P
P_TS
50P
50P
X_TAL
27MHz
T
/C/S2WithoutATV
T/C/S2WithoutATV
#EPI&LVDSDiagram
A
B
I2SOut
I2C1
EPI
I2C2
LVDS
USB
I2C5
I2C1
H/P
AV/COMP
Tuner:
I2C6
DVB-S:I2C4
OCP
2.5A
OCP
1A
(HDD)
MHL1A
SIL1292M
HL:I2C4
MHL
REARSIDE SIDE
REAR(H)
AMP
TI
CVBS/YPbPr
CVBS/RGB
SPDIFOUT
ETHERNET
I2C3
I2C1
UARTIR
KEY
USB_WIFI
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1.2VC
ore
DCDC
6A
3500m
A
3.3VM
ulti
DCDC
4A
2000m
A
1.8
1.2
24V
12V
3.5VST
640mA
AMP
3230mA
5V
USB
DCD
C5A
3000
mA
390mA
WOL/W
400m
MICOM,ETC
15mA
1065mA
730mA
LNBop
LNB
700mA
600mA
1330m
A
PANEL
1500mA
45.6W
3.5W
37.9W
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24V
5V
USB
TP
S5450
5A
30
00mA
OCP
2CH
OCP
OCP
USB1
USB2
USB3
MHL
NetCast4.0
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12V
1.2VCo
re
DCDC6A
5260mA
MTK
Ne
tCast4.0
MHL
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M13
MT539
[CVBS2P]
Tuner
JackSid
e
SoCSid
e
JK501
C
OMP1_Y/AV1_CVBS
C
OMP1_Pb
C
OMP1_Pr
C
OMP1/AV1/DVI_L_IN
C
OMP1/AV1/DVI_R_IN
COMP1_Y/AV1_
CVBS_SOC
COMP1_Pb_SO
C
[PB0P]
[PR0P]
[AIN4_L_AADC]
COMP1_Pb_SO
C
COMP1/AV1/DVI_L_IN_SOC
[AIN4_R_AADC]
COMP1/AV1/DVI_R_IN_SOC
TU_CVBS
TUNER_SIF,IF_P/N
[CVBS1P]
[MPXP,ADCINP_
DEMOD,ADCINN_DEMOD
TU_CVBS
TUNER_SIF,IF_P/N
Pa
rallelTS/ERROR,VAL,SYNC,CLK
ParallelTS/ERROR,VAL,SYNC,CLK
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SPDIF_OUT
IC8101
Au
dioAMP
N
TP7513
COMP1/AV1/DVI_L_IN_SOC
COMP1/AV1/DVI_R_IN_SOC
[ASPDIF0]
Tuner
TRBUF
[MPXP]
AUD_LRCH
HP_LOUT/HP
_ROUT
LPF
[AL0_ADAC]
[AR0_ADAC]
M13
M
T5398
TUNER_SIF
[AOLRCK]
[AOSDATA0]
AUD_LRCK
AUD_SCK
[AOBCK]
[STB_SDA]
[STB_SCL]
I2C_SDA1
I2C_SCL1
IC3000
M
ICOM AM
P_MUTE
[AIN4_L_AADC]
[AIN4_R_AADC]
JK501
AUD_MASTER
_CLK
[AOMCLK]
[OPCTRL4]
AMP_RESET_N
IC61
00
TPA6138
A2PWR
HPA
MPSIDE_HP_MUTE
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HDMI1
HDMI1
HDMI2
HDMI2
HDMI3
HDMI3
REM
MTKA2
DDC_SCL_1_SOC
DDC_SCL_2_JACK
DDC_SDA_2_JACK
DDC_SCL_3_JACK
DDC_SDA_3_JACK
TMDSLink8bits
HDMI_ARC
DDC_SDA_1_SOC
X-tal
32
.768kH
z
TMDSLink8bits
TMDSLink8bits
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P
ANEL_VCC
(+12V)
PMIC
TPS6
5178RSL
Lev
elShift
TPS65198RUYR
EPICH4+/-
EPICH5+/-
EPICH6+/-
VCOM_P
VCOM
_N
VCOM_LOOP
VCOM
EPICH1+/-
EPICH2+/-
EPICH3+/-
VCOM_DYN
VCOMLFB
VCOMRFB
VDD
VCC
VCC1.8
CLK1_I~CLK6_I
GMA4/G
MA5/GAM7/GMA12/GMA14/GMA15
GMA4/GMA5/GAM7/GMA12/GMA14/GMA15
EO
GST
GCLK
MCLK
EPI_L
EPI_LOCK6
H_VDD
TR/
Diode
TR/
Diode
SWP
CTRLP
SWN
CTRLN
VGH
VGL
VGL_I
VGH_EVE
VGH_
6
6
222222
2
2
VST
GIP_RST
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PMIC
TPS65178RSL
BoostConverter
Buck1converter(VCC)
Buck2converter(Vcore)
Buck3converter(HVdd)
Buck4converter(
VCC18)
PositiveChargePum
pController
NegativeChargePum
pController
6-ChGammaBuffer(DACoutput)
Vcomreference&
gain
Reset
P
ANEL_VCC
VC
C18
VC
C
HVdd
Vd
d
VC
OM_P
VC
OM_N
GAM4/5/7/12/14/15
CTRLN
SW
P
SW
N
CTRLP
VC
OM_LOOP
PM
IC_RESET
Vc
ore
TR/
Diode
TR/
Diode
VGL
VGH
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MTKA2
USB1
USB_DP1
USB_DM1
[USB_DP_P2
]
[USB_DM_P2]
USB2
USB_DP2
USB_DM2
[GPIO43
]
[GPIO46
]
OCP
OCP
+5V_USB_1
+5V_USB_2
/USB_OCD1
USB_CTL1
USB_CTL2
/USB_OCD2
USB_W
WIFI_DM
WIFI_DP
MoMo
M_REMOTE_R
X
M_REMOTE_T
X
M_RFModule_RE
SET
[U1R
X]
[U1T
X]
[OPCTRL49]
[OPCTRL
50]
[USB_DM_P3]
[USB_DP_P3
]
RENESASMICOM
[U0TX]
[U0RX]
SOC
_TX
SOC
_RX
USB_DP3
+5V_USB_3
USB_CTL3
/USB_OCD3
[USB_DM_P1]
[USB_DP_P1]
[GPIO42]
[TCON12]
[USB_DM_P0]
[USB_DP_P0]
USB3
USB_DM3
[GPIO44]
[ADIN2_SR
V]
CTS
RTS
[ADIN4_SR
V]
4Pinde
bugging
wafer
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EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A
2
A10
AG1
900
400
540
521
530
910
120
500
501 5
02
123
LV
1
*Set+
Stand
*Stand
Base
+
Body
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5/24/2018 Lg 55la6200-Da Chassis Lt33b
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5/24/2018 Lg 55la6200-Da Chassis Lt33b
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5/24/2018 Lg 55la6200-Da Chassis Lt33b
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5/24/2018 Lg 55la6200-Da Chassis Lt33b
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For Debug
Renesas MICOM
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
WOL/WIFI_POWER_ON
POWER_ON/OFF1
R3005
10K
MICOM_LCD/OLED
R3004
10K
MICOM_GP3_
12/15PIN
I2C_SDA_MICOM
MODEL1_OPT_
5
RUE003N02
Q3001
HDMI_CEC_FET_ROHM
SD
G
+3.5V_ST
R3030
10K
R3014
10K
MICOM_DEBUG
+3.5V_ST
WOL_CT
L
C3003
8pF
P3000
12507WS-04L
MICOM_DEBUG
1
2
3
4
5
SCART_MUTE
CAM_CTL
KEY1
MODEL1_OPT_5
CEC_REMOTE
R3012
10K
MICOM_NON_LOGO_LIGHT
POWER_ON/OFF2_4
C3001
0.47uF
SOC_TX
MODEL1_OPT_3
R3013
10K
MICOM_LOGO_LIGHT
R3008
10K
MICOM_TACT_KEY
EDID_WP
CAM_PWR_ON_CMD
LOGO_LIGHT
MODEL1_OPT_1
RL_ON
MODEL1_OPT_2
R3007-*2
22K
MICOM_OLED_FRC
SOC_
RX
POWER_D
ET
R3007-*1
56K
MICOM_OLED_MAIN
R3001
10K
MICOM_M13
MHL_DET
MICOM_RESET
CAM_CTL
MODEL1_OPT_4
R3031
270K
OPT
R3010
10K
MICOM_TOUCH_KEY
R3021
10K
EDID_WP
LED_R
MODEL1_OPT_2
C3004
0.1uF
16V
R3028
4.7MOPT
POWER_ON/OFF2_4
LED_R
R3007
10K
MICOM_PDP
POWER_ON/OFF2_1
LOGO_LIGHT
MICOM_DEBUG
I2C_SCL_MICOM
R3032
10K
R3033
27K
HDMI_CEC
MODEL1_OPT_1
X3000
32.768KHz
C3002
8pF
+3.5V_ST
PANEL_CTL
MODEL1_OPT_3
MHL_DET
C3000
0.1uF
POWER_ON/OFF2_2
AMP_MUTE
R3034
120K
KEY2
CAM_PWR_ON_CMD
IR
SCART_MUTE
D3000
BAT54_SUZHO
POWER_ON/OFF2_3
SI1012CR-T1-GE3
Q3001-*1
HDMI_CEC_FET_VISHAYSD
G
SW3000
JTP-1127WEM
MICOM_RESET_SW
12
4 3
R3002
10K
MICOM_GED
MODEL1_OPT_0
MICOM_DEBUG
MODEL1_OPT_4
R3029
22
MICOM_RESET_
22OHM
INV_CT
L
+3.5V_ST
SOC_RESE
T
MODEL1_OPT_0
MICOM_RESET
R3016
1K
+3.5V_ST
GND
SIDE_HP_MUTE
R3003
10K
MICOM_H13
HDMI_CEC
R3000
10K
MICOM_NON_GED
R3006
10K
MICOM_NC4_
8PIN
R3029-*1 33MICOM_RESET_33OHM
ST_BY_DET_CAMST_BY_DET_CAM
+3.5V_ST
WOL/ETH_POWER_O
N
IC3000
R5F100GEAFB
MICOM_LEAD_Au
1P60/SCLA0
2P61/SDAA0
3P62
4P63
5P31/TI03/TO03/INTP4
6P75/KR5/INTP9/SCK01/SCL01
7P74/KR4/INTP8/SI01/SDA01
8P73/KR3/SO01
9P72/KR2/SO21
10P71/KR1/SI21/SDA21
11P70/KR0/SCK21/SCL21
12P30/INTP3/RTC1HZ/SCK11/SCL11
13
P5
0/INTP
1/SI
11/SDA
11
14
P5
1/INTP
2/SO
11
15
P17
/TI
02/TO
02
16
P16/TI
01/TO
01/INT
P5
17
P15
/PCLBUZ
1/SCK
20/SCL
20
18
P14
/RXD
2/SI
20/SDA
20
19
P13/TXD
2/SO
20
20
P12/SO
00/TXD
0/TOOLT
XD
21
P11/SI
00/RXD
0/TOOLRXD
/SDA
00
22
P10/SCK
00/SCL
00
23
P1
46
24
P147
/ANI
18
25 P27/ANI7
26 P26/ANI6
27 P25/ANI5
28 P24/ANI4
29 P23/ANI3
30 P22/ANI2
31 P21/ANI1/AVREFM
32 P20/ANI0/AVREFP
33 P130
34 P01/TO00/RXD1
35 P00/TI00/TXD1
36 P140/PCLBUZ0/INTP637
P120/ANI
19
38
P4
1/TI
07
/TO
07
39
P4
0/TOOL
0
40
RESET
41
P124
/XT
2/EXCLKS
42
P123/XT
1
43
P137
/INTP
0
44
P122/X
2/EXCLK
45
P121/X
1
46
REGC
47
VSS
48
VDD
IC3000-*1
R5F100GEAFB#30
MICOM_LEAD_Cu
1P60/SCLA0
2P61/SDAA0
3P62
4P63
5P31/TI03/TO03/INTP4
6P75/KR5/INTP9/SCK01/SCL01
7P74/KR4/INTP8/SI01/SDA01
8P73/KR3/SO01
9P72/KR2/SO21
10P71/KR1/SI21/SDA21
11P70/KR0/SCK21/SCL21
12P30/INTP3/RTC1HZ/SCK11/SCL11
13
P50/INTP1/SI11/SDA11
14
P51/INTP2/SO11
15
P17/TI02/TO02
16
P16/TI01/TO01/INTP5
17
P15/PCLBUZ1/SCK20/SCL20
18
P14/RXD2/SI20/SDA20
19
P13/TXD2/SO20
20
P12/SO00/TXD0/TOOLTXD
21
P11/SI00/RXD0/TOOLRXD/SDA00
22
P10/SCK00/SCL00
23
P146
24
P147/ANI18
25 P27/ANI7
26 P26/ANI6
27 P25/ANI5
28 P24/ANI4
29 P23/ANI3
30 P22/ANI2
31 P21/ANI1/AVREFM
32 P20/ANI0/AVREFP
33 P130
34 P01/TO00/RXD1
35 P00/TI00/TXD1
36 P140/PCLBUZ0/INTP637
P120/ANI19
38
P41/TI07/TO07
39
P40/TOOL0
40
RESET
41
P124/XT2/EXCLKS
42
P123/XT1
43
P137/INTP0
44
P122/X2/EXCLK
45
P121/X1
46
REGC
47
VSS
48
VDD
EYE_SCL
EYE_SDA
R3035
3.3K
EYE_Q_
10P
R3036
3.3K
EYE_Q_
10P
+3.5V_ST
MICOM 30
2012.02.22
For CEC
HDMI_WAUP:HDMI_INIT
NON_GED
Commercial
POWER_ON/OFF2_4
LCD
MICOM MODEL OPTION
/ OLED
Ready for sample set
PDP
0
H13
TACT_KEY
IR_wafer(12/15)
GP4 High/MID Power SEQUENCE
Ready for sample set
1
POWER_ON/OFF2_3
MODEL_OPT_3
M13MODEL_OPT_4
POWER_ON/OFF!
MODEL_OPT_2
MODEL_OPT_0 For LOGO LIGHT
Need to Assign ADC port
MODEL_OPT_5
LOGO
SOC_RESET
POWER_ON/OFF2_2
GED
IR_wafer(10pin)
MODEL_OPT_1
Dont remove R3014,
not making float P40
MICOM MODEL OPTION
Ready For
NON LOGO
POWER_ON/OFF2_1
TOUCH_KEY
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
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Fi
ber
Opti
c
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPDIF_OUTC3602
0.1uF
16V
R3611
2.7K
OPT JK
3602
JST
1223-
001
1GND
2VCC
3VINPUT
4
FIX_
POLE
+3.3V_NORMAL
R361033
36
JACK HIGH / MID 2011.11.21
SPDIF
SPDIF OUT
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R3700
10K
HP_LOUT
HP_ROUT
+3.3V_NORMAL
HP_DET
JK3700
PEJ034-01
6BT_TERMINAL2
7BB_TERMINAL2
5T_SPRING
4R_SPRING
3E_SPRING
R37011K
37
JACK_COMMON 2011.11.21
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
L4111
BLM18PG121SN1D
WIFI
L4112120-ohmR4117
+3.5V_ST
+3.3V_NORMAL
R4118
+3.5V_ST_WAKE
MAX 0.4A
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED_R
R4107
10K
C4121
0.1uF
M_REMOTE
M_REMOTE_RX
BLM18PG121SN1D
OPT
WOL/ETH_POWER_ON
CTS
R4114100
C41020.1uF
R4117
10K5%
D41045.6V
AMOTECH CO., LTD.
OPT
M_REMOTE_TX
C4110
0.1uF
16V
OPT
R41341K
LOGO_LIGHT
+3.5V_ST
C41000.1uF
+3.5V_ST
R4131
22
LOGO_LIGHT
R413022
OPT
+3.5V_ST
C4111
0.1uF
16V
WIFI
R4132
10K
LOGO_LIGHT
L4113
120-ohmM_REMOTE
Q4100
MMBT3904(NXP)
LOGO_LIGHT
E
B
C
D41015.6V
AMOTECH CO., LTD.
OPT
R4135100
M_REMOTE
C4113
10uF
10V
WIFI
+3.3V_NORMAL
R4133
10K
OPT
WIFI_DP
WIFI_DM
P4101
12507WR-08L
NON_EYE_Q_8P
1GND
2KEY1
3KEY2
4+3.5V_ST
5GND
6LOGO/LED_R
7IR
8GND
9
L4100
BLM18PG121SN1D
M_RFModule_RESET
LOGO_LIGHT
R4113100
AR41001001/16W
M_REMOTE
C41041000pF50V
10K
5%
C4107100pF50V
R 41 25 1 0K
LED_R
C4112
10uF
10V
WIFI
RTS
KEY2
IR
C4120
0.1uF
16V
LOGO_LIGHT
KEY1
D41005.6V
AMOTECH CO., LTD.
OPT
P4100
SMAW200-H12S2
M_REMOTE&WIFI_WAFER
1
2
3
4
5
6
7
8
9
10
11
12
13
R413622
WIFI
WOL/WIFI_POWER_ON
C4125
1000pF
50V
M_REMOTE
C4122
47pF50V
M_REMOTEC4123
47pF50V
M_REMOTE
C4124
47pF50V
OPTC4126
47pF50V
OPT
P4102
12507WR-10L
EYE_Q_10P
1
2
3
4
5
6
7
8
9
10
11
EYE_SCL
EYE_SDA
D4105
ADMC 5M 02 200L
OPT
D4106
ADMC 5M 02 200L
OPT
R4137100
EYE_Q_10P
R4138100
EYE_Q_10P
IR / KEY 2011.11.21
41
Place Near Micom
For EMI
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
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USBDOWNSTREAM
USBDOWNSTREAM
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
USB_CTL2
/USB_OCD2
/USB_OCD3
JK4302
3AU04S-305-ZC-(LG)
1
2
3
4
5
USB_DP3
USB_DP2
USB_DM2
USB_CTL3
R4301
10K
D4302
RCLAMP0502BA
OPT
D4
300
RC
LAMP0502BA
OP
T
+5V_USB_2
R4302
10K
USB3
JK4300
3AU04S-305-ZC-(LG)
USB3
1
2
3
4
5
C4302
0.1uF
16V
+5V_USB_3
USB_DM3
+5V_NORMAL
+5V_USB_2
+3.3V_NORMAL
+5V_USB_3
C4301
10uF
10V
USB3
C4337
10uF
10V
C4322
10uF
10V
C4310
10uF10V
USB3
IC4306
TPS2066CDGNR
3EN1
2IN
4EN2
1GND
5FLT2
6OUT2
7OUT1
8FLT1
9
[EP]GND
43
USB2_USB3 2012.7.11
MAX 1.5A
OCP USB2/3
USB2
MAX 1.5A
USB3
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
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USBDOWNSTREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_USB_1
USB_DP1
D4500
RCLAMP0502BA
OPT
R4500
10KOPT
/USB_OCD1
+5V_USB_1
C4500
0.1uF
16V
JK4500
3AU04S-305-ZC-(LG)
1
2
3
4
5
USB_CTL1
USB_DM1
+3.3V_NORMAL
R450110K
+5V_NORMAL
C4501
10uF
10V
C4502
10uF
10V
IC4500
BD82020FVJ
3IN_2
2IN_1
4EN
1
GND
5OC
6OUT_1
7OUT_2
8
OUT_3
DVR ReadyOCP USB1
USB1
MAX 1.5A
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMP1/AV1/DVI_R_IN
COMP1/AV1/DVI_L_IN
SOC_RX
AV1_CVBS_DET
COMP1_DET
C3800
0.1uF
16V
COMP1_Y/AV1_CVBS
+3.3V_NORMAL
+3.5V_ST
COMP1_Pb
+3.3V_NORMAL
D38005.6V
AV_COMP_ESDD3801
5.6V
AV_COMP_ESD
R381010K
DTV/MNT_V_OUT_SOC
P3800
12507WS-04L
UART_4PIN_STRAIGHT
1
2
3
4
5
COMP1_Pr
D3802
5.6V
AV_COMP_ESD
R380610K
D3803
5.6V
AV_COMP_ESD
SOC_TX
ZD
3804
ADUC
5S
02
0R5L
R3800
751%
TU_DEBUG
JK3800
PPJ245-01
6A
[GN]C-SPRING
7A [GN]E-LUG
4A [GN]CONTACT
5B [BL]C-SPRING
8C [RD1]E-LUG-S
6C [RD1]C-SPRING
4C [RD1]CONTACT
5D [WH]C-SPRING
4E
[RD2]CONTACT
6E
[RD2]C-SPRING
7E
[RD2]E-LUG
R38010
OPT
R38111K
R38121K
JP4117
JP4118
EYE_SCL
EYE_SDA
38
JACK_COMMON 2011.11.21
AV/COMPONENT REAR
DEBUG FOR INTERNAL AMOD.
UART FOR DEBUG
For TU_Debug
Disconnet R374
Apply "AV_COMP_ESD" when your models ESD Test is failed
Eye sensor JIG POINT
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
Eth t Bl k
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49/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D5001
5.5VLAN_ESD
EPHY_TDN
D5003
5.5VLAN_ESD
D5000
5.5V
LAN_ESD
D5002
5.5VLAN_ESD
EPHY_TDP
EPHY_RDN
EPHY_RDP
C5000
0.1uF
16V
C5001
0.01uF
50V
JK5000
RJ45VT-01SN002
NON_LN56
11
22
33
44
55
66
77
88
9
9
50
LAN_VERTICAL 2012.03.08
Ethernet Block
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
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THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R541112
0.1uF
C5413
16V
AMP_MUTE
0.1uF
C5420
50V
R5418
5.1K
R5415
5.1K
+24V_AMP
AUD_LRCH
SPK_R-
R 5 40 3 1 0 0
+24V
R541012
C5416
22000pF
50V
SPK_R-
L5401
BLM18PG121SN1D
0.1uF
C5421
50V
R540712
C5427
1uF
10V
R5400 10K
AMP_MUTE_MICOM
AUD_SCK
+24V_AMP
C54340.47uF50V
R 5 40 2 1 0 0
SPK_L-
0.1uFC5436
50V
+3.3V_NORMAL
SPK_R+
R540912
0.1uF
C5418
50V
AUD_MASTER_CLK
SPK_R+
I2C_SCL1
0.1uF
C5439
50V
0.1uFC5437
50V
R541412
R5405 100
AMP_MUTE_MICOM
R54063.3
OPT
0.1uFC5400
50V
C5425
22000pF
50V
AUD_LRCK
C5430390pF50V
L5400
CIS21J121
R541312
P5400
WAFER-ANGLE
1
2
3
4
C5428
1uF
10V
SPK_L-
C5408
33pF
50V
C5440
0.1uF
16V
OPT
C5414
10uF
10V
C54151000pF
50V
C5406
33pF
50V
C5424
0.01uF
50V
OPT
AMP_RESET_N
C5433
1uF
10V
C5431
390pF50V
C54110.1uF
16V
C5432390pF50V
+24V_AMP
+3.3V_NORMAL
C5426
22000pF
50V
R540110K
AMP_MUTE_MICOM
R540812
0.1uF
C5438
50V
R541212
R5417
5.1K
SPK_L+
C5417
22000pF
50V
0.1uFC5401
50V
I2C_SDA1
0.1uF
C5419
50V
C54350.47uF50V
SPK_L+
Q5400
MMBT3904(NXP)
AMP_MUTE_MICOME
B
C
C5429390pF50V
C5404
1000pF
50V
R5416
5.1K
L5404-*1
NRS6045T100MMGK
Audio_Coil_TAIYO10.0uH
L5405-*1
NRS6045T100MMGK
Audio_Coil_TAIYO10.0uH
L5402-*1
NRS6045T100MMGK
Audio_Coil_TAIYO10.0uH
L5403-*1
NRS6045T100MMGK
Audio_Coil_TAIYO10.0uH
1uFC5412
10V
L5404
LPH6045T-100M
Audio_Coil_ABCO10uH
L5405
LPH6045T-100M
Audio_Coil_ABCO10uH
L5402
LPH6045T-100M
Audio_Coil_ABCO10uH
L5403
LPH6045T-100M
Audio_Coil_ABCO10uH
IC5400
NTP7513
3DGND_PLL2VDD_PLL
4GND
1AGND_PLL
6DVDD
5DGND
7SDATA
8WCK
9BCK
10SDA
11
SCL
12
FAULT
13
MO
NITOR_
0
14
MO
NITOR_
1
15
MO
NITOR_
2
16
BST
2B
17
PGND
2B
18
OUT
2B
19
PVDD
2B
20
PVDD
2A
21 OUT2A
22 PGND2A
23 BST2A
24 VDR2
25 AGND
26 VCC5
27 VDR1
28 BST1B29 PGND1B
30 OUT1B31
PVDD
1B
32
PVDD
1A
33
OUT
1A
34
PGND
1A
35
BST
1A
36
RESET
37
AD
38
CLK_
I
39
GND_
IO
40
VDD_
IO
41
[EP]GND
C5422
10uF
35V
C5423
10uF
35V
R54
19
100
AMP_
MUTE_PWR_DET
POWER_DET
54
AMP_NEO 2011.11.21
SPEAKER_R
SPEAKER_L
0x54
DUAL COMPONENT
Q1801 1ST : 0TRIY80001A 2ND : 0TR387500AA
[AMP_MUTE_PWR_DET]
-->For fixing AC-OFF POP noise 32"POLA/ROW model
-->32"POLA/ROW LPBs 3.5st drop time is very fast
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
51/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R610010K
HP_OUTC61011uF10VHP_OUT
C61001uF10VHP_OUT
+3.3V_NORMAL
C61051uF10V
HP_OUT
R610110K
HP_OUT
HP_LOUT_AMP
HP_LOUT_MAIN
SIDE_HP_MUTE
+3.3V_NORMAL
R610443K
1%
HP_OUT
R6103
33KHP_OUT_MTK
C6102
1uF
10V
HP_OUT
R61054.7K
HP_OUT
C61031uF10V
HP_OUT
HP_ROUT_MAIN
L6100120-ohm
HP_O
UT
BLM18PG121SN1D
C6104
180pF
HP_OUT_MTK
R610643K
1%
HP_OUT
C61070.1uF16V
HP_OUT
C6109
180pF
HP_OUT_MTK
R6102
33KHP_OUT_MTK
HP_ROUT_AMP
C6104-*1
18pF
HP_OUT_H13
C6109-*1
18pF
HP_OUT_H13
C6108
10pF
50V
HP_OUT
C6106
10pF
50V
HP_OUT
IC6100
TPA6138A2
3OUTR
2-INR
4GND_1
1+INR
6VSS
5
MUTE
7CN
8CP
9VDD
10
GND_2
11UVP
12OUTL
13-INL
14+INL
R6103-*143K
1%
HP_OUT_H13 R6102-*143K
1%
HP_OUT_H13
2011.09.29HEADPHONE AMP
61
EARPHONE AMP
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
TU6406
TDSQ-H601F(B)TU6403
TDSN-B601F(B)
TU6401
TDSN-T701F(B)
TU6405
TDSH-G501D(B)
TU6400
TDSS-H501F(B)
5/24/2018 Lg 55la6200-Da Chassis Lt33b
52/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LNB_TX
TU_
GND_
A
R6403
0NON_TU_H
FE_DEMOD1_TS_DATA[6]
TUNER_SIF_TU
FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[7]R64022.2K
TU_N_TW
+1.23V_D_Demod_TU
TU_+1.8V_TU
FE_DEMOD1_TS_SYNC
/S2_RESET_TU
/TU_RESET1_TU
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_ERROR
RF_SWITCH_CTL_TU
FE_LNA_Ctrl1
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_DATA[5]
IF_AGC_TU
CN_RESET_TU
C6405
0.1uF16V
TU_N_TW
FE_LNA_Ctrl2
FE_DEMOD1_TS_DATA[3]
+3.3V_TU
TU_
GND_
A
+3.3V_TU
TU_
GND_
A
+3.3V_TU
I2C_SCL6_TU
I2C_SCL4_TU
I2C_SDA6_TU
TU_
GND_
A
FE_DEMOD1_TS_DATA[4]
TU_
GND_
A
TU_CVBS_TU
IF_P
IF_N
FE_DEMOD1_TS_DATA[0]
I2C_SDA4_TU
TU_GND_A
FE_DEMOD1_TS_VAL
R6404
0NON_TU_H
Power_D_Demod_TU
R64012.2K
TU_N_TW
C6404
0.1uF16V
TU_N_TW
1.2V_MHL
R6400
1
TU_H/N/S_T/US
+3.3V_NORMAL
C6402
0.1uF
16V
TU_H/N/S_T/US C6401
0.1uF
16V
TU_H/N/S_T/US
AR640101/16W
TU_N_CO_T2
R64070
C6406
0.1uF
16VTU_N_BR
C6403
10uF
10VTU_H/N/S_T/US
C6407
0.1uF
16V
OPT
C6408
0.1uF
16V
OPT
R64080
TU_N_CO_T2
R64090
TU_N_CO_T2
R64100
TU_N_CO_T2
R64110
IC6400
AZ1117BH-1.2TRE1
TU_H/N/S_T/US
GND/ADJ
OUTIN
C6409
0.1uF
16V
OPT
TU_Korea_PIP
1+B1[+3.3V_S/P]
2RESET
3
TU_SCL
4TU_SDA
5+B2[3.3V_M]
6S_SIF
7+B3[1.8V_M]
8S_CVBS
9M_IF_AGC
10M_DIF[P]
11M_DIF[N]
12+B4[3.3V_S]
13+B5[1.8V_S]
14NC_1
15GND
16SD_ERROR
17SD_SYNC
18SD_VALID
19SD_MCLK
20SD_SERIAL_D0
21NC_2
22NC_3
23NC_4
24NC_5
25NC_6
26NC_7
27NC_8
28
GND_1
29GND_2
30+B6[1.23V_SD]
31SD_RESET
36
SHIELD
32+B7[3.3V_SD]
33NC_9
34SD_SCL
35SD_SDA
A1A1
B1B1
TU_BR
1RF_S/W_CTL
2RESET_TUNER
3SCL
4SDA
5+B1[3.3V]
6SIF
7+B2[1.8V]
8CVBS
9NC_1
10NC_2
11NC_3
12+B3[3.3V]
13+B4[1.23V]
14RESET_DEMOD
15GND
16ERROR
17SYNC
18VALID
19MCLK
20DATA
21NC_4
22NC_5
23NC_6
24NC_7
25NC_8
26NC_9
27NC_10
28
SHIELD
A1 A1B1B1
Taiwan_high_sensitive
1RF_S/WCTL
2RESET
3SCL
4SDA
5B1[+3.3V]
6SIF
7B2[1.8V]
8CVBS
9IF_AGC
10DIF[P]
11DIF[N]
12NC_1
13NC_2
14NC_3
15GND
16NC_4
17NC_5
18NC_6
19NC_7
20NC_8
21NC_9
22NC_10
23NC_11
24NC_12
25NC_13
26NC_14
27NC_15
A1
59
LNA_CTRL_157
LNA_CTRL_258
A1 B1SHIELD B1
DVB_H/NIM_H
5+B1[3.3V]
11DIF[N]
2RESET
10DIF[P]
4SDA
1NC
9IF_AGC
8CVBS
3
SCL
7+B2[1.8V]
6SIF
A1A1
B1B1
A2
A2
B2
B2
ATSC_H/NIM_H
5+B1[3.3V]
11DIF[N]
2RESET
10DIF[P]
4SDA
1NC_1
9IF_AGC
8NC_3
3
SCL
7+B2[1.8]
6NC_2
12
SHIELD
A1A1
B1X
TU6400-*1
TDSS-G501D(B)
DVB_H/NIM_H
53.3V
11DLIF_[N]
2RESET
10DLIF_[P]
4SDA
1NC_1
9IF_AGC
8NC_3
3 SCL
71.8V
6NC_2
12
SHIELD
A1A1
B1B1
65
TUNER 2012.03.08
33
TUNER MULTI-OPTION
26
30
2
5
21
27
17
19
13
4
GND seperation for ASIS tuner
23
10
9
18
8
16
11
32
20
3
6
1
7
12
35
24
34
22
14
31
25
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
53/97
5/24/2018 Lg 55la6200-Da Chassis Lt33b
54/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R 71 07 3 3
LGD_T-Con_Scanning
R 71 06 3 3
CP_BOX
TXB4N
TXA1P
TXA1N
TXB3P
2D/3D_CTL
TXC2N
TXA2N
TXCCLKP
TXC1P
+3.3V_NORMAL
OPC_EN
TXD4P
R710310K
BIT_SEL_LOW
TXB4P
R 71 05 3 3
CP_BOX
TXBCLKP
R7108 33
OPC_EN
2D/3D_CTL
TXC4N
TXA0N
TXB1N
TXB2N
TXC4P
TXACLKN
TXC1N
TXC0P
TXD0N
TXC0N
TXA3N
C7102
0.1uF
50VOPT
PWM_DIM1
I2C_SDA1
R 7 10 4 3 3
AUO_2D/3D_CTRL
TXB3N
TXA0P
TXC3N
TXB2P
R7101
3.3K
LVDS_SEL_HIGH P7101
FI-RE41S-HF-J-R1500
LVDS_41PIN
1NC
2NC
3NC
4NC
5NC
6NC
7NC
8NC
9GND
10RC0N
11RC0P
12RC1N
13RC1P
14RC2N
15RC2P
16GND
17RCCLKN
18RCCLKP
19GND
20RC3N
21RC3P
22RC4N
23RC4P
24GND
25GND
26RD0N
27RD0P
28RD1N
29RD1P
30RD2N
31RD2P
32GND
33RDCLKN
34RDCLKP
35GND
36RD3N
37RD3P
38RD4N
39RD4P
40GND
41GND
42
GND
TXB1P
R7102
10K
LVDS_SEL_LOW
TXD3P
TXC2P
TXB0P
TXCCLKN
TXD1N
TXDCLKP
TXC3P
C7100
10uF
16VOPT
TXDCLKN
TXBCLKN
TXA4P
R 7 10 0 3 3
LGD_2D/3D_CTRL
TXD2N
TXA3P
L7100
BLM18SG121TN1D
LVDS_51PIN
PANEL_VCC
TXD2P
TXA2P
TXD3N
TXD4N
I2C_SCL1
TXA4N
TXB0N
TXACLKP
TXD1P
P7100
FI-RE51S-HF-J-R1500
LVDS_51PIN
1NC
2NC
3NC
4NC
5NC
6AUO_65_MIRROR
7LVDS_SEL
8NC
9NC
10L/DIM_ENABLE
11GND
12RA0N
13RA0P
14RA1N
15RA1P
16RA2N
17RA2P
18GND
19RACLKN
20
RACLKP
21GND
22RA3N
23RA3P
24RA4N
25RA4P
26GND
27BIT_SEL
28RB0N
29RB0P
30RB1N
31RB1P
32RB2N
33RB2P
34GND
35RBCLKN
36RBCLKP
37GND
38RB3N
39RB3P
40RB4N
41RB4P
42GND
43GND
44GND
45GND
46GND
47NC
48VLCD
49VLCD
50VLCD
51VLCD
52
GND
C7101
1000pF
50VOPT
TXD0P
R71090
OPT
R7110 33
AUO_L/D_EN
71
LVDS_HIGH_MID 2011.08.11
BIT_SEL
LVDS
LVDS_SEL
[41Pin LVDS OUTPUT Connector][51Pin LVDS OUTPUT Connector]
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
55/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L/DIM0_VS_PWR
L/DIM0_SCLK_PWR
R7601
10K
L/DIM_OUT_8P
P7600
12507WR-08L
L/DIM_OUT_8P
1
2
3
4
5
6
7
8
9
L/DIM0_MOSI_PWR
R760233
L/DIM_OUT_8P
R760333
L/DIM_OUT_8PI2C_SCL1
I2C_SDA1
76
LOCAL DIMMING 2011.12.13
[To LED DRIVER]
LOCAL DIMMING
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
56/97
5/24/2018 Lg 55la6200-Da Chassis Lt33b
57/97
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VDDVDD_EPI
C7801
68uF
EPI
C780068uF
EPI
T-Con 77
2011.12.01
Copyright 2013 LG Electronics. Inc. All right reserved.Only for training and service purposes LGE Internal Use Only
5/24/2018 Lg 55la6200-Da Chassis Lt33b
58/97
5/24/2018 Lg 55la6200-Da Chassis Lt3
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