Challenge & Opportunity for future device

안현옥

ahoa@sk.com

New Applications, new systems , new challenges

Smart Devices at the Heart of Our Lives

Mobility is Reshaping Behavior

Memory is more important than everBut the market drivers are changingg g

Mobile Device Market Continue to Grow

Mobile comes with different requirements

B d idth P C t C itBandwidth Power Cost Capacity

Mobile ●● ●●● ●● ●●Mobile ●● ●●● ●● ●●

Consumer ● ●● ●●● ●

PC/Server ●●● ●● ● ●●●

Networking ●●● ● ● ●

Therefore interface technology is changing fastgy g g

Non- monolithic integration on the way

Today’s memory market Characteristics

● Accelerating – faster adoption● Fragmenting more new standards● Fragmenting – more new standards● Multiplying – multiple types in systems

LPDDR

DDR●

●

UFS

3D

●

●

HS NAND●

SSD●

Low Power DRAM Bandwidth Roadmap

Power Efficiency[mW/GB/s] is more important than Chip size.

That’s consensus of Mobile Industry!

51.2

Bandwidth[GB/s] WIO2

x512x512

Futuresolution

25.6 LP3_4ch

WIO2x256 LP4_4ch

solution

LP3_2chLP3E_2ch

WIO_SDR x512

12 8

17.1

3_ c

LP2_1ch LP2_2ch

LP2_4ch12.8

Power500 1000 1500 2000 Power[mW]

<출처 Mobile Forum 2013>

Changes in the form of Business

- 기존 OEM biz.중심 → 향후 SoC 협업 중심으로 변화

LPDDR2/3/4Wid I/O WIO2

Heat SlugPoP

Discrete

Wide I/OUFS

WIO2UFS

g

ControllerWIO2 / high stack

Multiple SourceOEM

CollaborationSingle Source

SoC Collaboration

Mobile Device, Today & Tomorrow

Tremendous growth driving demand for Low-power DRAM Solutions

LPDDR & eMMC emerged as a mainstream choice for most mobile device

Multimedia applications continues to drive usage models & memory BW

LPDDR & eMMC emerged as a mainstream choice for most mobile device

- LPDDR4 natural migration from LPDDDR2/3- UFS is target as a replacement for eMMC

So, Mobile Revolution needs Storage like

Past, Present & Future for NAND

Flash storage has been improved with managed concept

Why UFS?

• Fast Communication Speed. UFS communication speed is fast enough to access host memory from device; which is up to 5.8 Gbps for a single lane.

• Rich Features. . Full duplex. . SCSI compliant commands. M lti l t t di. Multiple outstanding.

• Cost-Sensitive Mobile Devices. SSD for PC hich has eno gh de iceSSD for PC; which has enough device-integrated RAM as working memory

What is UFS?

• High performance • Mobile usages friendlyg p• Serial interface• Command queuing

• Mobile usages friendly• Flash memory oriented• Low power

Universal Flash Storage• Embedded & Removable devices• 300MB/s with future scalability 300MB/s with future scalability• Employ a multi-device chain topology• Flexible protocol• Leverage existing standards or works

UFS, Small SSD for Smartphone !!

UFS = virtues of eMMC+ virtues of SSD + Low Power consumption + Mobile Centricp

eMMC vs UFS

Single-threaded vs. Concurrent and out-of-order executing

Standardization 협의체 (JEDEC)

JEDECJEDEC

JC-42Solid State Memories

JC-64Embedded/Removable

Memory

JC-11Mechanical (Package)

Non-Volatile Memory Device (42.4)ONFI JEDEC TG

eMMC Elec.& Mech. TG (64.1& 64.2)

Memory

ONFI-JEDEC TG

UFS Elec.& Mech. TG (64.1&64.2)

SSD TG (64.8)

UFSA (Universal Flash Storage Association)

Summary : Challenges for Future Devices

폭발적인 S t 기기의 성장이 이제 정체되고폭발적인 Smart 기기의 성장이 이제 정체되고

경쟁이 심화되어, 차별화되는 Device가 요구됨.

Four kinds of Challenges

1 High Performance High Density Low Power1. High Performance, High Density , Low Power

- Various Serial interface (PCIe, M-PCIe, MIPI, SCSI..etc)

- Increase # of I/O , Power Count ,

- Upgradable DRAM Speed (4.2G,8G.. )

- Flexible # of Stack

2. Improved Memory Bandwidth (Wide IO / newer LPDDR tech/ UFS)- Fine Pitch(0.3mm이하) , Thermal Response

3. Hardware-enabled Security Scheme

4. Total System Optimization (다양한 반도체 Component)4. Total System Optimization (다양한 반도체 Component)- Optimization (AP + Hardware + Software)된 Reference Hardware 제공