1ASEKH-Test

資訊人才在封裝測試業之角色

Ming-Cheng ShengASEKH-IT

April 9, 2003

2ASEKH-Test

Agenda

• IT Requirement for Assembly & Testing House– Business Model

• ASEKH-Test IT Systems– CIM/MES– EIT– ERP– B2B

• The Role of IT– Some Lessons from Our OJT

3ASEKH-Test

半導體封裝製造價值鏈

Front Eng Wafer Sort

Product Design Board Assembly

MaterialsFab

WaferFab

WaferBank

WaferDieBank

AssemblyFinalTest Bin

Inventory

BoardInsertion &Assembly

FinishedGoods

Inventory

Board

Testing

Design House

Test IC Design

Program

Wafer Sort Final TestBurn In

Top MarkDrop Ship

Program

Development

Sort

Tape & ReelLead Scan

Warehousing

Laser Repair

Fab Probing

Final TestAssembly

Assembly Final Test B/L Assembly

6ASEKH-Test

• ASSEMBLY HOUSE ( 封裝廠 )• 晶粒切割 (Wafer Saw)• 黏晶 (Die Attach)• 焊線 (Wire bond)• 封膠 (Molding)• 化學處理 ( 電鍍 / 合成 / 酸洗 ..)• 切腳成型 (Trim form)• 印字 (Top Mark)• 檢測 (Inspection)

半導體封裝測試業產品生產流程

7ASEKH-Test

• TESTING HOUSE ( 測試廠 )• 晶圓測試 (Wafer Sort)• 老化實驗 (Burn In)• 最終測試 (Final Test)• 外觀檢測 (V/M Inspection)• B/L ASSEMBLY ( 板子組裝廠 )• 表面粘著 (Surface Mount Technology)• 板子組裝 (PCB Module)• PRODUCTION LINE ( 成品組裝廠 )• 最終產品 (Final Product)

半導體封裝測試業產品生產流程

Process Flow Introduction

Process FlowProcess Flow Wafer SortWafer Sort Final TestFinal Test Burn In (TDBI)Burn In (TDBI) Lead ScanLead Scan T&R (Dry pack)T&R (Dry pack)

Outputs:Outputs: SummarySummary Wafer MapWafer Map Yield ReportYield Report QC DataQC Data

ReceivingReceiving

Incoming materialIncoming materialMES & MES &

SubsystemSubsystem

OutputsOutputsOutputsOutputs

Report & EDIReport & EDI

ProcessProcessProcessProcess

Incoming Material TypeIncoming Material Type::

Wafer from Fab.Wafer from Fab. 70% Package from ASE70% Package from ASE

K.K. 30% Package from othe30% Package from othe

r Assembly House.r Assembly House.

TESTING HOUSE Turn Key Business SolutionTESTING HOUSE Turn Key Business Solution

Wafer Sort• Wafer Incoming InspectionWafer Incoming Inspection• ESD & Grounding ProtectionESD & Grounding Protection• Inkless OperationInkless Operation• Wafer Mapping & Trace FormWafer Mapping & Trace Form

• In-Line Yield SPC ChartIn-Line Yield SPC Chart• Stack Wafer MapStack Wafer Map• Yield Report and Trend ChartYield Report and Trend Chart• Correlation Process ControlCorrelation Process Control

• Wafer Sort Set Up ProcedureWafer Sort Set Up Procedure• In-Process Statistical Process In-Process Statistical Process

Control (SPC)Control (SPC)• Manufacturing Execution Manufacturing Execution

System (MES) Lot Tracking & System (MES) Lot Tracking & ReportingReporting

• Probe Card MaintenanceProbe Card Maintenance Clean & CalibrationClean & Calibration Preventive MaintenancePreventive Maintenance

OperationOperation

Calculation & Calculation & AnalysisAnalysis

Charts & ControlsCharts & Controls

Wafer Sort Process Flow (1)

Circuit ProbingCircuit Probing Prober PM and calibrationProber PM and calibration Set-up procedure and handlingSet-up procedure and handling Yield monitor Yield monitor Probe mark and wafer V/M checkProbe mark and wafer V/M check Data collection procedureData collection procedure

IQAIQAIQAIQA

Incoming Quality GateIncoming Quality Gate Loader/Unloader PMLoader/Unloader PM Microscope handlingMicroscope handling De-pack handling De-pack handling Wafer V/M checkWafer V/M check

ID SortingID SortingID SortingID Sorting CPCPCPCP Wafer MapWafer MapWafer MapWafer Map

Wafer SortingWafer Sorting Sorter capabilitySorter capability Sorter PMSorter PM Vacuum pen Vacuum pen

handling handling N2 cabinet N2 cabinet

handlinghandling

Wafer Map Wafer Map control control

Data Data confirmation confirmation

Data transferData transfer

Foundry

Quality GateQuality Gate Loader/Unloader PMLoader/Unloader PM Microscope handlingMicroscope handling Wafer V/M checkWafer V/M check CP data confirmatioCP data confirmatio

n and updaten and update

Outgoing Outgoing shipping gate shipping gate

Packing Packing material check material check

Shipping data Shipping data

InkingInkingInkingInking

Wafer Inking Wafer Inking Prober PM and calibratiProber PM and calibrati

onon Inking operationInking operation Ink related specificatioInk related specificatio

nn Ink check procedureInk check procedure

BakeBakeBakeBake QAQAQAQA PackPackPackPack OQAOQAOQAOQA

Wafer BakingWafer Baking Oven PM and Oven PM and

CalibrationCalibration Cassette transfer Cassette transfer

handlinghandling Temp. and Time Temp. and Time

definitiondefinition Visual InspectionVisual Inspection

Wafer outing packingWafer outing packing Material storageMaterial storage Cassette transfer Cassette transfer

handlinghandling Sorter PM and Sorter PM and

operationoperation Shipping data Shipping data

preparationpreparation Packing procedurePacking procedure

Wafer Sort Process Flow (2)

Laser Trim Laser Trim Laser Trim Laser Trim

Laser RepairLaser Repair Fuse CuttingFuse Cutting ESI-ESI-

9200/93009200/9300

19921992 19951995 19981998 20012001

120

15

20

26

10

5

30

Year

(3) Wafer Thickness (mil)

(mil)

15 milthicknesshandling

1992 1995 1998 2001

120

70

80

90

60

50

45

40

100

Year

(2) In Line Pad Pitch (μ m)

(um)

50 um available

-20

(1) Probing Temperature (℃)

-80℃

+200℃

1992 1995 1998 2001 2004

-80

100

200

025

MilitaryLevel

150 ConsumerLevel

IndustrialLevel

130

150

2000

(4) Probing Wafer Size (inch)

4"

12"

1992 1995 1998 2001 2004

4"

6"

12"

5"

4"~12"are

availableon Q3'00

8"

Wafer Sort Capability

Final Test• IC Incoming InspectionIC Incoming Inspection• ESD & Grounding ProtectionESD & Grounding Protection• In Process Visual Mechanical (V/M) In Process Visual Mechanical (V/M) • MonitoringMonitoring• In Process Yield Monitor & SocketIn Process Yield Monitor & Socket• Cycle Time ControlCycle Time Control

• In-Line VM & Yield Control ChartIn-Line VM & Yield Control Chart• Daily/Weekly/Monthly YieldDaily/Weekly/Monthly Yield• Report and Trend ChartReport and Trend Chart

• Final Test Set Up ProcedureFinal Test Set Up Procedure• MES Lot Tracking & ReportingMES Lot Tracking & Reporting• Load Board MaintenanceLoad Board Maintenance

Clean & CalibrationClean & Calibration Preventive MaintenancePreventive Maintenance

OperationOperation

Calculation & Calculation & AnalysisAnalysis

Charts & ControlsCharts & Controls

Final Test Process Flow (1)

Final TestFinal Test ESD & Grounding ProtectionESD & Grounding Protection In Process V/M SPC ControlIn Process V/M SPC Control Bin Operation ControlBin Operation Control Yield Control ProcedureYield Control Procedure Fast TAT and Cycle Time ControlFast TAT and Cycle Time Control

ASE & Other ASE & Other Assembly HouseAssembly House

IQAIQAIQAIQA

Incoming Quality Incoming Quality GateGate

Lead Scanning Lead Scanning Visual Eye Visual Eye

InspectionInspection Incoming Data Incoming Data

CheckCheck Wafer Inspection Wafer Inspection

CapabilityCapabilityTESTING HOUSE Turn Key Business Solution ProviderTESTING HOUSE Turn Key Business Solution Provider

Burn InBurn InBurn InBurn In Final TestFinal TestFinal TestFinal Test QAQAQAQA

Burn In CapabilityBurn In Capability BIB Design & BIB Design &

BuildBuild Auto Load/UnloadAuto Load/Unload Test During Burn Test During Burn

In. In. Burn In Set Up Burn In Set Up

SheetSheet

Electrical QA GateElectrical QA Gate AQL= 0.1%AQL= 0.1% QA Reject Handling QA Reject Handling

Procedure Procedure Quality Report Quality Report

Final Test Process Flow (2)

Bake CapabilityBake Capability Bake Temp: 125 CBake Temp: 125 C Bake Hour: 8 HrsBake Hour: 8 Hrs Window Time: Window Time:

4Hrs 4Hrs Real Time Bake Real Time Bake

Oven Monitoring Oven Monitoring SystemSystem

Pack & Drop Pack & Drop ShipShip

Dry PackDry Pack Pack MTL Pack MTL

DesignDesign Label Design & Label Design &

Data LinkingData Linking Colorful Colorful

Packing Packing SystemSystem

Front End:Front End:W/S, F/T, B/IW/S, F/T, B/I

Top_markTop_markTop_markTop_mark

Top Mark CapabilityTop Mark Capability Ink mark & Laser Ink mark & Laser

markmark Control by Set up Control by Set up

procedure / procedure / SOP/TCM/SOP/TCM/

Package from other Package from other Assembly House.Assembly House.TESTING HOUSE Turn Key Business Solution ProviderTESTING HOUSE Turn Key Business Solution Provider

Lead ScanLead ScanLead ScanLead Scan BakeBakeBakeBake T&RT&RT&RT&R PackPackPackPack

Lead Scan CapabilityLead Scan Capability Copl. & Bend LeadCopl. & Bend Lead Stand Off / SkewStand Off / Skew Ball Quality Inspect. Ball Quality Inspect. Visual InspectionVisual Inspection

Tape & Reel Tape & Reel CapabilityCapability

Multi-Material Multi-Material SourceSource

Kit AvailabilityKit Availability Peel Strength SPC. Peel Strength SPC. Drop Test Drop Test

QualificationQualification

16ASEKH-Test

半導體封裝測試業產品生產流程

• IC 封裝測試業現場生產流程之特色 – 服務性質的製造業 – 特殊的出貨方式（ Drop shipment service ） – 委測產品測試流程的多樣性 – 測試批的 Hold 住現象，造成測試流程相依於測試結果 – 測試機台的跨機問題 – 客戶化之產品生產流程 (Subcon)– 同時上線的 IC 封裝產品形式多，批量多寡不一 – 須提供客戶現場即時生產資訊

17ASEKH-Test

拆批

LOT.1LOT.1

LOT.1LOT.1

Split (for sub-lot)Split (for sub-lot)

LOT.1BLOT.1B

SplitSplit

LOT.1ALOT.1A

SplitSplit

RECP.01RECP.01 RECP.02RECP.02 RECP.03RECP.03 RECP.04RECP.04 RECP.05RECP.05 RECP.06RECP.06

LOT.1LOT.1

LOT.1LOT.1

Test Split (for speed sort)Test Split (for speed sort)

LOT.12LOT.12

SplitSplit

LOT.11LOT.11

SplitSplit SplitSplit

LOT.1RLOT.1R

Manual splittingManual splitting Testing splittingTesting splitting

18ASEKH-Test

Yield Judgment & Handling

Pre-TestPre-TestPre-TestPre-Test

$Yield$YieldGTGT

90%90%

$Yield$YieldGTGT

90%90%

TrueTrue

TestTestTestTest

$Yield$YieldLTLT

90%90%

$Yield$YieldLTLT

90%90%

Pre-TestPre-TestPre-TestPre-Test

TestTestTestTest

Hold InvHold InvHold InvHold Inv

Hold InvHold InvHold InvHold Inv

ELSEELSEELSEELSE

END_IFEND_IFEND_IFEND_IF

IFIF $Yield > 90%$Yield > 90%

$Yield < 90%$Yield < 90%

Burn InBurn InBurn InBurn In

IFIF

Test 2Test 2Test 2Test 2

ELSEELSEELSEELSE

END_IFEND_IFEND_IFEND_IF

FalseFalse

Hold InvHold InvHold InvHold Inv

TrueTrue

Hold InvHold InvHold InvHold Inv

FalseFalse

Test 2Test 2Test 2Test 2

Burn InBurn InBurn InBurn In

19ASEKH-Test

MIS System Architecture

MANAGEMENT

InfrastructureInfrastructure

ERPSD

FI/COPP

MMQM

CRM B2Bi,Virtual Factory(quick respond system),IRS,Standard report,KM

(1)Common Business

Services Infrastructure(virus,firewall)

(2)Messaging

Information DistributionInfrastructure

(EDI,e-mail,FTP,E-FAX)

(3)Multimedia Content

and NetworkPublishing Infrastructure

(HTML,JAVA,WorldWide Web,ASP)

(4)Network Infrastructure(Internet,WAN,LAN

Intranet ExtranetVLAN,ISDN)

(5)Interfacing

Infrastructure(To:databases,customers,andapplications)

CIMPT

SFCEDC/SPC

AlarmFA

PDMDocument Management•Product Data •Product Structure ManagementEC Management

OAWorkflow(HR,QA,CS,ENG)

E-mailFTP

Document centerWeb(intranet/internet)

20ASEKH-Test

CIM Hardware ArchitectureCIM Hardware Architecture

TCP/IP TIB/RV4.2

PROMIS Server

HSJ 50 HSJ 50

(Secondary)Alpha 4100(5/400)-2

2GB RAM

(Primary)

Alpha 4100(5/400)-

1

2GB RAM

MES_CELL_110.12.20.8

ASE110.12.20.2

ASE210.12.20.4

Gateway: Gateway: 10.12.20.25410.12.20.254Mask:255.255.2Mask:255.255.255.055.0

10.12.20.16

S/W Setup Procedure

Server

4.3 GB HD*20(Disk Array)9GB HD *4

18GB HD *2OpenVMS 7.1C, DEC C++

FORTRAN 7.1-1PROMIS 5.5TIB/RV4.2

Report Gateway v2.2

DECNEDECNETT

Report Server

PIII-550*2PIII-550*2NT 4.0CNT 4.0C1GB RAM1GB RAM9.1GB HDD 9.1GB HDD *3*3Oracle 8.0.4Oracle 8.0.4TIB/RV4.2 TIB/RV4.2 TP Server TP Server AlarmsvrAlarmsvrDBsvrDBsvrVGSVGS

CELL Server

(Secondary)Alpha ES40-2

2GB RAM9.1GB*2 local HD(OS)

(Primary)

Alpha ES40-1

2GB RAM

9.1GB*2 local HD

(OS)ASE4

10.12.20.21ASE3

10.12.20.31

9.1 GB HD*12 (Disk Array0+1) ORACLE DB 8.0.5

9.1 GB HD*4 (Disk Array5) INTENCH AP

18 GBHD * 2 DB Backup

MEMORMEMORY Y CHANNECHANNELL

HSZ 80

(Secondary)Alpha ES40-2

1GB RAM 18 GB*2 local HD (OS,ORACLE)

(Primary)

Alpha ES40-1

2GB RAM

18 GB*2 local HD

(OS,ORACLE)ASETRPT110.12.20.7

ASETRPT210.12.20.9

18 GB HD*11 (Disk Array0+1) Oracle Data 8.0.5(Rpt)

9 GB HD* 4 (Mirror) DB Backup

9 GB HD*2 (Mirror) Redo Log & Rollback segment

9 GB HD*2(Mirror) Archive Log

9 GB * 1 (Standalone) Oracle Data (Webdb)

CROSS CROSS ReferenceReference

HSG 8010.12.20.6

TP Server

ASET-AP10.12.15.13

ASET-WS210.12.51.5

P3 Xeon 70P3 Xeon 700Hz / 1MB0Hz / 1MBNetServer LNetServer LT 6000r T 6000r 9.1G 9.1G Hot Swap XHot Swap X33

ASET-WS110.12.51.4

P3 Xeon 7P3 Xeon 700Hz / 1M00Hz / 1MBBNetServer NetServer LT 6000r LT 6000r 9.1G Hot 9.1G Hot Swap X3Swap X3

ASET-AP110.12.15.23

NetServer LC NetServer LC IIIIP II 266Hz P II 266Hz 160M 160M ECC SDRAM ECC SDRAM 18GB X3,Ultr18GB X3,Ultra160 68 pin,1a160 68 pin,10,000RPM0,000RPM

NetServer LC NetServer LC IIIIP II 266Hz P II 266Hz 160M 160M ECC SDRAMECC SDRAM9.1G 9.1G 4.2G4.2G

Storage: 18G Hot Swap X4ASET-WS110.12.51.3

21ASEKH-Test

Reporting ServerReporting Server

WS Cell ServerWS Cell ServerVMS ServerVMS ServerMES Database(PROMIS)Lot Information ,Recipe

ReportClient

雷 射 印 表 機

Data Collection .Wafer Map .Bin Summary .SPC Data .UPH

Auto Data Collection System

GUIClient

Transaction .Setup .Track In .Maintenance .Data collected .Track OutReporting

.WIP Data .Yield Data .Cycle Time .Output .Performance

Prober

MES Cell ServerMES Cell ServerPT,Setup,Maintenance,

Configuration Table

Shunt-Box

Wafer Map Raw Data Probe Data

FT Cell ServerFT Cell Server

Test Result,SPC Data,UPH data

Handler

CIM Current System Architecture

22ASEKH-Test

Reporting ServerReporting Server

WS Cell ServerWS Cell ServerVMS ServerVMS ServerMES Database(PROMIS)Lot Information ,Recipe

ReportClient

雷 射 印 表 機

Data Collection .Wafer Map .Bin Summary .SPC Data .UPH

Auto Data Collection System

GUIClient

Transaction .Setup .Track In .Maintenance .Data collected .Track OutReporting

.WIP Data .Yield Data .Cycle Time .Output .Performance

Prober

MES Cell ServerMES Cell ServerPT,Setup,Maintenance,

Configuration Table

Shu

nt-B

ox

Wafer Map Raw Data Probe Data

FT Cell ServerFT Cell Server

Test Result,SPC Data,UPH data

EAP Cell ServerEAP Cell ServerSetup M/C.Recipe download

Data Collection .Engineering data.Equipment data

Handler

Tester

Tester

CIM Future System Architecture

23ASEKH-Test

WS WS File File

ServerServer

WS WS AP AP

ServerServer

EDC EDC ServerServer

Layer 1

Control layer

Automation

(PC/EPQ)

Layer 2Execute

layer

(MES)

Prober Tester Handler

Panel PCLAN

LAN

TTL/GPIB

GPIB

CIMCIMserverserver

Layer 3Planning

layer(ERP/SCM)

Planning data

Shop floor data

Tester Workstation

EDA EDA ServerServer

Summary data

Program download

CIM F/E Framework

SECS

WSOnline

WSOnline

FTOnline

FTOnline

YieldManagement

YieldManagement EMSEMS SPCSPC RMSRMS FAB

ResourceManagement

FABResource

Management

Shunt Box

24ASEKH-Test

SPC SPC File File

ServerServer

SPCSPCDatabaseDatabase

EDC EDC ServerServer

Layer 1

Control layer

Automation

(PC/EPQ)

Layer 2Execute

layer(MES)

Scanner Marking Bake

Panel PC

LAN

LAN

CIM CIM serverserver

Layer 3Planning

layer(ERP/SCM)

Planning data

Shop floor data

CIM B/E Framework

LAN

LAN

FlagFile

FlagFile

RS-232

T&R

LAN

Job download

SPC

summary

UploadJob download

Temp. monitor

SPC

summary

Upload

WSOnline

WSOnline

FTOnline

FTOnline

YieldManagement

YieldManagement EMSEMS SPCSPC RMSRMS FAB

ResourceManagement

FABResource

Management

ASETASET Engineering Information System Relation Engineering Information System Relation DiagramDiagram

ASETASET Engineering Information System Relation Engineering Information System Relation DiagramDiagram

ERP/SCM

B/I Oven

monitor

B/I Oven

monitor

PCSPCS

Setup procedure

Setup procedure

SetupMatrix

SetupMatrix

H/W config.H/W config.

ToolingTooling

Spareboard

Spareboard

Correlation

sample

Correlation

sample

PEDBPEDBMM(BOM)MM(BOM)

ColorPacking

ColorPacking

TEVTEV

APQPAPQP

SpecSpec

F/E B/E

BIMSBIMS

BCSBCS

MES

26ASEKH-Test

Asset Control Diagram

[Testing Engineering Control Center]

TECCCUSTOMER

Verify

IncomingSend Back

[Product Testing Engineer]

PTE

MFG

Control CenterL/B Repair

Room

Repair

PM

Tester

ProductionEngineering Use

27ASEKH-Test

Device Name Lead Count PKG IBM610* 256 BGA

IB-HP1-001-P*IB-HP1-001-P*

Customer Code

Tester Code

Serial#

VersionInsertion Test Program Test Time Hold Yield FT1 tmb610_ft1 1.1 90 QA1 tmb610_qa1 1.1 100

Tooling Info.Bin# Status Remark 1 Good Pass 2 Fail O/S

S/W Bin information

Glance at Setup Procedure

•Matrix•MFG/LB•BCS•Disposition•BI oven•Spare board•Correlation•Tools•PM•Test prgm mgem.•H/W config.

•Matrix•MFG/LB•BCS•Disposition•BI oven•Spare board•Correlation•Tools•PM•Test prgm mgem.•H/W config.

Yield/SetupYield/Setup

TEVTEV

PEDBPEDBColor packingColor packing SPECSPEC

FT/WS/BIFT/WS/BIsetup proceduresetup procedure

H/WH/WToolingTooling

DispositionDispositionToolingTooling

FT/WS/BIFT/WS/BIsetup proceduresetup procedure BIBI

ovenoven

• SPEC

• EC

• TEV

• FT/WS/BI

Spec

• Routing

PDMPDM

ERP/FRPERP/FRP LogisticMFG

LogisticMFG

SCMSCM

MESMES

RBOMRBOM

MBOMMBOM

RoutingRoutingENGENG

MFGMFG

MMMM

• PCS

• APQP

• PEDB

(BOM/color

packing

EISEIS

29ASEKH-Test

Capability of PDM

• New Version Control• Event Alert• APQP / EC Monitor• Internet Approval Available• Better Turn-key Service• Collaboration Mechanism• Efficiency Manufacturing

ASRS

Packing

PEDB

Label

PTSetup

Procedure

TDRP

Shipping

Price

PO

SAP/FI

GUI

MES

Invoice

MM

AOL Intranet InternetEqu TimeRecord

BonusCost

Spare Parts

Tooling

ExtricityFCST TSMCShip Instr.

MES Menu

Plan

TEVHoldBank

SPECCAR TesterConfig Hold Lot

E-PR

HR E-HR

(Current ERP System Architecture)(Current ERP System Architecture) Notes AP

By ASET

Package

31ASEKH-Test

OperationOperationDistributionDistributionSCMSCM

• Forecast• PC Plan• HR• Bonus• Program Version Control System

• Cust. PO Control• Quotation• Pricing• Shipping Notice• Invoicing• Packing List• Labeling

• Finance• Cost• GUI• Purchase• Inventory Man.• Bond

ERP Applications

32ASEKH-Test

• Flexible PO/Pricing Control to meet Customer requirement• Flexible Shipping Doc to meet Customer req. including : Invoice Packing List Inner box Label Outer box Label• Material Control• Inventory Management• Good AP/Report Version Control

ERP Capability

33ASEKH-Test

PR

Quotation

ERP(SAP)

InventoryControl

Sales/Distribution• Order Entry• Pricing • Service

Sales/Distribution• Order Entry• Pricing • Service

Purchase•Material Control•Purchase

Purchase•Material Control•Purchase

Finance/Costing• GL • AR 　　 • AP

• Asset Management • Budget/Cost Control • Treasury

Finance/Costing• GL • AR 　　 • AP

• Asset Management • Budget/Cost Control • Treasury

Receive CustomerVendor

Quotation

PO

WarehouseManagement Pick / Pack Shipping

Material/FG/Shipping Records

InvoicingValidate

RT

Invoice

發料記錄

PaymentPayment

invoice

Invoice

ASSY

Finish GoodsWafer issue

Wafer Sort Final Test

Production Control

Production Planning• Scheduling• Material Planning

Production Planning• Scheduling• Material Planning

Capacity Planning / Production SchedulingSCM

TIBCOMiddleware

Production Order

invoice

GRP Project Scope

34ASEKH-Test

MM/QM SD FI/CO PP SCM

MES1.Setup Proc.2.PEDB3.Tooling ….

LabelE-PUR

IRS

1. 借機管理2. 機台進出AS/RS

HROther

Notes AP

Future System Architecture

35ASEKH-Test

Data

Data

Data

Data

Report

Report

Report

Report

Report

Report

Report

Data

As-is

Data

Data

Report

Data

Report

To-be

• Utilization• Configure• Auto linkage

• Speed up Cust. Req.• Reduce Manpower

Future Capability

36ASEKH-Test

ASEKH - Test

ExtricityHub

ASE Group

IC IndustrySupply Chain

TXXX

RosettaNet

Extricity Alliance RosettaNet

Coverage- Forecast- Order Management- Engineer Specification- Manufacturing Information- Inventory Management-etc.

Public Process

Private Process

Public Process

ASEKH - Assembly

ISE Lab

ASE - Korean

ASE - CL

ASE - Malaysia

ASEKH-Material

CXXX

IXXX

IXXX

WXXX

Extricity Alliance

RosettaNet

Private Process

RosettaNet

ASE B2B Architecture

37ASEKH-Test

PIP Description Supported

PIP 3D8 V01.00 Distribute Work In Process 2001PIP 3B2 V01.00 Notify of Advance Shipment 2001PIP 3A4 V02.00 Request Purchase Order 2001

PIP 3A7 V02.00 Notify of Purchase Order Acknowledgement

2001

PIP 3A8 V01.00 Request Purchase Order Change 2001

PIP 3A9 V01.00 Request Purchase Order Cancellation 2001

PIP 3C3 Notify of Invoice 2002 Q3

PIP 3C4 Notify of Invoice Reject 2002 Q3

PIP 7B5 Notify/Request Work Order 2002 Q4

PIP 7B6 Request Work Order Status 2002 Q4

RosettaNet PIPs SupportedRosettaNet PIPs Supported

38ASEKH-Test

InternetInternet

Business Application

system

Business Application

system

•Purchase order•Forecast•Shipping Instruction•Eng. Spec

•PO confirmation •S.O.D reply•WIP / Inventory•Yield Data, QC data•Shipping documents•Invoice

ASE Test

B2B BUSINESS PROCESS INTEGRATIONB2B BUSINESS PROCESS INTEGRATION

•Shipping documents

End_Customer Customer

Business Application

system

The data interchange would be performed by Extricity, FTP protocol.

39ASEKH-Test

1.FTP (File Transfer Protocol)  2.HTTPS (File upload Web server)  3.B2B (Platform Extricity)   4.E_mail:  5.Web Site

File Transfer Protocol

40ASEKH-Test

Data Format

Txt file (ASCII)Most popular

 XML (DTD)Data Type Definition, easy to de_code

 RosettaNet XML channel Secured system environment

High system availability

 Flat File(Excel File)Easy to use for end user

RosettaNet & XML are our preferred approach

Customer/vendor Customer/VendorCRM

SCM SP

Demand Planning

ForcastingActual order

SCP

Constraint-Based

Production Planning

PP

Scheduling

&

Dispatching

Supply Planning

AMHS

Scheduling

SFS

Customer Order

For Casting

Capacity A Pie

Planning

Data

(capacity order)

Data

Mining

CustomerOrder

Cross Site

Plan

Site Plan

Detail

Plan

W / O

Part

Customer

BOM

Purchase

capacity

forcast

SD

FI/CO

PP

MM

QM

ERP

I R S

K M

FTP Mail QRS(Virtual Factory) Marking Sales Service EDI B2BiWeb-Service

XML Rosentanet

Data

Mining

TDRP

F/G(Shipping/cost data )WIP EQP

status

CIM

FA MESOrder

tracking Management

Quality

Management

F/T & W/S SFC EAP

F/T W/S

SPCDCOP

Semi-Auto

M-Routing

Low Yield Disposition

Purchase Part

Work Flow

business Process

Modeling

PDM

E-BOM->M-BOM

TEV

E-Routing

PEDB

TEV

Setup MatrixSetup Procedure

CIM/ERP/SCM/PDM/CRM Integration CIM/ERP/SCM/PDM/CRM Integration

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The Role of IT

• Service– Passion

• Key on Process Integration– Communication

facilitator– Conceptual

Modeling

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What IT Can Server for You

• 以管理方式主導資訊流通和資訊科技的應用‚來促進部門間的有效溝通– 科技層面

• 開發和應用資訊科技‚來幫助人際溝通– 經濟層面

• 成本低而效率高的方法– 行為層面

• 改善個人‚組織的溝通意願與溝通方式‚來促進人際間的有效溝通

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Our Policy and Challenge

• Win-Win-Win Policy– You Pay Some but Win More– I Pay Some and Win More, Also– Our Customers Win, Our Mission

• Key Success Factors– Best Practices– Effective/Efficient Information Chain– Learning and Improvement

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Q & A

Thanks for your attention.