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Vol. 48, No. 2022009. 1
◆特集：マイクロ・ナノの計測技術◆
2009 1 J. HTSJ, Vol. 48, No. 202
Anode Microstructure of Solid Oxide Fuel Cell
Naoki SHIKAZONO (The University of Tokyo)[email protected]
SOFC YSZNi / /
SEM-EDX 2 3NiO YSZ
3
SOFC
AGC
http://www.htsj.or.jp/heat-page.html
SEM-EDX SEM-EDX
Ni YSZ Pore Ni YSZ Pore
SEM-EDX SEM-EDX
Ni YSZ Pore Ni YSZ Pore
Vol.48 2009
No.202 January
················································································ ··············1MEMS····································································· ··············8MEMS······························································· ············ 14
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2008························································· ············ 31
heat-pageSOFC
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Vol. 48 No. 202 January 2009
CONTENTS
Special IssueNano-meter, nano-gram, nano-watto in thermal measurement
Osamu NAKABEPPU (Meiji University) ·····················································································1
Boiling on MEMS heat transfer surfaces
Manabu TANGE (AIST) ··············································································································8
Micro Thermophysical Properties Sensor using Optical MEMS
Yoshihiro TAGUCHI, Yuji NAGASAKA (Keio University) ························································14
Measuring Thermal Property of Nano Materials
Koji TAKAHASHI (Kyushu University), Motoo FUJII (AIST) ···················································20
Project QDevelopment of a Pump-less Water Cooling System
Shigetoshi IPPOUSHI (Mitsubishi Electric co. Ltd.) ···································································26
ReportReport on ‘Kids Energy Symposium, 2008’
Kazuyoshi NAKABE (Chair of the Kids Energy Symp. Committee, Kyoto University) ···············31
Opening-page Gravure: heat-pageAnode Microstructure of Solid Oxide Fuel Cell
Naoki SHIKAZONO (The University of Tokyo) ······················································· Opening Page
Calendar ·······················································································································································37
Announcements ··········································································································································38
2009 1 - 1 - J. HTSJ, Vol. 48, No. 202
MEMS (Micro Electro Mechanical Systems)
SThMSThM Scanning Thermal
Microscope 1 AFM, Atomic Force Microscope
Fig. 1 Basic concept of SThM based on AFM
1990
[1,2]
1
(a)active thermometry. (b) thermal conductivity meas.
Fig. 2 SThM cantilever probes
Nano-meter, nano-gram, nano-watto in thermal measurement
Osamu NAKABEPPU (Meiji University)e-mail: [email protected]
2009 1 - 2 - J. HTSJ, Vol. 48, No. 202
2a
0.1Pa
35
4 mPa29
46
30nm
50Hz
1K
Fig. 3 Topography and thermography of heated Crstrips.
SThM
4Ts Tp
QpsHc=Qps/(Tp-Ts)
Tcrc Rs
s
10nm
(s1)(s2)
[3]
2 11 2
1 2
exp 2s sfilm film s s
s s
R R RR
(1)
rc s1
s2
Rs
film film
Fig. 4 Thermal conductivity measurement method
2009 1 - 3 - J. HTSJ, Vol. 48, No. 202
2b
2a
260
[4]
5 DTA DifferentialThermal Analysis,
DSC Differential Scanning Calorimetry
Fig. 5 DTA (Differential Thermal Analysis)
SThM
MEMS
[5] 6 3DTA SiO2
230 m3 m DTA
PC
DSC
DSC
Long DSC 460 m
(a) DTA type (b) DSC type (c) Long DSC typeFig. 6 Cantilever type nanocalorimeters.
Table 1 Specifications of the DTA cantilever.Thermal time constant [msec] 5.5
Heat capacity of cantilever Cp [ J/K] 1.0Thermal conductance to
ambient G [ W/K] 190
Thermoelectric power ST [ V/K] 29Sensitivity SP=ST/G [V/W] 0.15
Noise in T.C. signal Vnoise [ V] 5Allowable temperature limit Tlimit [°C] >400
Max. heating and cooling rate max [K/sec] 14,000Heat capacity resolution Cmin [nJ/K] 0.22
Enthalpy resolution Hmin [nJ] 180Power resolution Pmin [ W] 33
2009 1 - 4 - J. HTSJ, Vol. 48, No. 202
DTATable 1
Cmin Hminmax
6 DSC 6b20ng DTA
43K/ 7700K/s
DTA
Fig. 7 DTA of Indium of 20 ng with different scanrate.
>2000K/s
2K=43K/s
<2000K/s
>2000K/s
8
FFTM* k
f
12 *
kfM m
(2)
Long DSC 100ng9
2009 1 - 5 - J. HTSJ, Vol. 48, No. 202
-0.5
FFT f/f1/1000
1/1000
6.78kHz 2 1.2 ~1.5 g
DTA0.7 g
1.0 g
[6]
TGThermogravimetry
10
40ng90
3FFT1ng [7]
Fig. 8 Auto resonance detection system of acantilever type calorimeter.
Effective mass (m+M*) , ng
Resonancefrequency,Hz
m=1.2~1.5 g
Indium:f=6.78kHz
two particlesone particle
empty
Fig. 9 Calibration curve of mass to resonancefrequency for a long DSC type nanocalorimeter. Massof tiny indium sample was measured to 1.2~1.5 g.
Fig. 10 Mass monitoring in deposition and sub-limation process of l-Menthol under atmosphere withresonance of the long DSC type calorimeter .
100W
155pW/Cell 131
4pW/Cell 10pW/Cell
2009 1 - 6 - J. HTSJ, Vol. 48, No. 202
40~49pW/Cell 20 3pW/Cell0.067 0.01pW/cell
[8]
100nW 100
[9]MEMS
MEMS
[10]11
350
2.2 V/ W
3
Fig. 11 Thermopile sensor and measurement principle
1Hz40dB
400nW
123wt%
0.1mlM-Green Yeast and Mold Broth 0.05ml
301
8
1 280
80~12010
10,000300
400nW 10,0001,000,000
Yeast Grow th w ith MEMS TP Sensor
0.01
0.1
1
10
100
1000
0 5 10 15 20 25 30 35 40Time , h
HeatGeneration
,W
Fig. 12 Growth thermogram of Yeast.
2009 1 - 7 - J. HTSJ, Vol. 48, No. 202
136
10mg 30mg20
33mg11mg
4 20h 34 12h
1
24 70 W
5
70~100 W[11]
Fig. 13 Germination thermogram of Radish
MEMS
21
MEMS
[1] Vol.28 No.1 (2001) p.18-28[2]
(2005),pp.344-351
[3] SThM
72 722 pp.2524-2531[4] 5
(2005) pp.41-88[5]
, Vol.20, No.3 (2006)pp.138-144
[6] Osamu NAKABEPPU, Nanocalorimetry withmicro-cantilever probe, IFHT2008 (2008), CD
[7] MEMSVol.8
pp.79-80 (2008)[8] 5
p.322 (2005)[9]
43(2007) pp.204-205
[10] MEMSThermal Science
& Engineering, Vol.14, No.4, (2006) pp.115-120[11] MEMS
44(2008) p.130
2009 1 - 8 - J. HTSJ, Vol. 48, No. 202
MEMS
[1][2] [3]
MEMS
Fig. 1: A conceptual sketch of an actual boiling heattransfer surface.
1
[4]
[5] Dhir[6]
MEMS
MEMSMEMS
MEMS
2
1Shoji and Takagi[7]
50 m 100 m
2Li and Peterson[8]
MEMSBoiling on MEMS heat transfer surfaces
Manabu TANGE (AIST)e-mail: [email protected]
Flow with
external means
Preceding bubbles
Adjacent bubbles
Cavities
2009 1 - 9 - J. HTSJ, Vol. 48, No. 202
Iida [9]
12
Nakabeppu and Wakasugi[10]
Pt [11][12]
[13] [14]Nakabeppu and
Wakasugi[10] MEMSMEMS
[15]3.1 MEMS
Fig. 2: MEMS heat transfer surface.
2 MEMS MEMS0.5 mm 20 mm
3
1 28 mm
2 2
2 Ni
SiO2
3 2
50 m 7Ni Cr
10 m
Fig. 3: Test section with MEMS heat transfer surface.
2009 1 - 10 - J. HTSJ, Vol. 48, No. 202
MEMS 3PEEK
3.2
Fig. 4: Temperature signal of a single bubblegeneration test; Tsub = 30 K.
Fig. 5: Bubble growth and temperature signal.
4 t=0
5
5 a-b
[16]
12 K2.7 m
4.1
[17]
Microbubble Emission Boiling, MEB
Zvirin [18]
Inada [19] MEB
Kumagai [20]MEB
Suzuki [21]MEB
MEB
[22]
MEB
2009 1 - 11 - J. HTSJ, Vol. 48, No. 202
4.2
Fig. 6: Bubbling pattern map; Tsub = 50 K.
3.1 MEMS
650 K
4
Oscillation
Kuzma-Kichta [23]
No Oscillation
Single Bubble
Oscillation
730 K
Fission 2 MW/m2
135 m SingleBubble 8
9[24]
Fission
MEB
Fig. 7: Successive snapshots of single bubble pattern; q = 1.0 MW/m2, and Tsub = 30 K, tb = 75 ms.
Fig. 8: Successive snapshots of bubble fission on a MEMS heat transfer surface; t' denotes interval from thenucleation; q = MW/m2, Tsub = 50 K, tb = 47.2 ms.
2009 1 - 12 - J. HTSJ, Vol. 48, No. 202
MEMS
MEMS
MEMS
MEMSMEMS
MEMS
16
11038
MEMS
[1] Webb, R. L., Principles of enhanced heat transfer,John Wiley & Sons, Inc., (1994).
[2] A. Ko ar and Yoav Peles, Boiling heat transfer inrectangular microchannels with reentrant cavities,Int. J. Heat Mass Transfer, 48, (2005), pp.4867-4886.
[3] Honda, H., Takamatsu, H., and Wei, J.J.,Enhanced boiling of FC-72 on silicon chips withmicro-pin-fins and submicron-scale roughness,ASME Journal of Heat Transfer, 124, (2002), pp.383–390.
[4] Han, C., and Gri th, P., “The mechanism of heattransfer in nucleate boiling — Part I”, Int. J. ofHeat Mass Transfer, 8, (1965), pp. 887–904.
[5] Son, G., Dhir, V. K., and Ramanujapu, N.,Dynamics and heat transfer associated with asingle bubble during nucleate boiling on ahorizontal surface, ASME Journal of HeatTransfer, 121, (1999), pp. 623-631.
[6] Dhir, V. K., Mechanistic prediction of nucleate
Fig. 9: Successive snapshots of bubble fission on a heated wire at 50 s intervals; q = 2 MW/m2, and Tsub = 40 K.
2009 1 - 13 - J. HTSJ, Vol. 48, No. 202
boiling heat transfer - achievable or hopeless task?,ASME Journal of Heat Transfer, 128, (2006), pp.1-12.
[7] Shoji, M. and Takagi, Y, “Bubbling features froma single artificial cavity”, Int. J. Heat MassTransfer, 44, (2001), pp. 2763–2776.
[8] Li, J., and Peterson, G. P., “Microscaleheterogeneous boiling on smooth surfaces — frombubble nucleation to bubble dynamics”, Int. J.Heat Mass Transfer, 48, (2005), pp. 4316–4332.
[9] Iida, Y., Okuyama, K., and Sakurai, K., Boilingnucleation on a very small film heater subjected toextremely rapid heating, Int. J. Heat MassTransfer, 37, (1994), pp. 2771-2780.
[10]Nakabeppu, O., and Wakasugi, H., “Approach toheat transfer mechanism beneath single boilingbubble with MEMS sensor”, In Proc. of 13thInternational Heat Transfer Conference, (2006),BOI-43 (CD-ROM).
[11]Moghaddam, S., Kiger, K. T., Henriette, J. M.,and Ohadi, M., “Fabrication and testing of a novelmicroelectromechanical device for the study ofboiling bubble dynamics”, In Proc. of ASMEInternational Mechanical Engineering Congress,(2003), pp. 107–114.
[12]Cooper, M. G. and Lloyd, A. J. P. “Miniature thinfilm thermometers with rapid response”, J. ofScientific Instruments, 42, (1965), pp. 791–793.
[13]Zhang, L., and Shoji, M., Nucleation siteinteraction in pool boiling on the artificial surface,Int. J. of Heat Mass Transfer, 46, (2003), pp.513-522.
[14]Kenning, D. B. R., and Yan, Y., “Pool boiling heattransfer on a thin plate: features revealed by liquidcrystal thermography”, Int. J. Heat Mass Transfer,15, (1996), pp. 3117–3137.
[15]Tange, M., Takagi, S., Takemura, F., and Shoji,M., Bubble growth and fission on MEMS heattransfer surfaces under subcooled boilingconditions, Trans. of JSME B, (submitted).
[16]Carey, V. P., Liquid-vapor phase-changephenomena, Taylor & Francis, (1992).
[17]Tange, M., Yuasa, M., Takagi, S., and Shoji, M.,“Microbubble Emission Boiling in aMicrochannel and Minichannel”, Thermal Scienceand Engineering, 12-6, (2004), pp. 23–29.
[18]Zvirin, Y., Hewitt, G. F., and Kenning, D. B. R.,Experimental study of drag and heat transferduring boiling on free falling spheres, Heat andTechnology, 7-3-4, (1989), pp. 13-23.
[19] Inada, S., Miyasaka, Y., Sakumoto, S., andChandratilleke, G. R., “Liquid-solid contact statein subcooled pool transition boiling system”,ASME Journal of Heat Transfer, 108, (1986), pp.219–221.
[20]Kumagai, S., Uhara, T., Nakata, T., and Izumi, M.,Liquid-solid contact in microbubble emissionboiling through void signals, Trans. of JSME B,67, (2001), pp. 2304-2310.
[21]Suzuki K., Torikai, K., Satoh, H., Ishimaru, J.,and Tanaka, Y., “Boiling heat transfer ofsubcooled water in a horizontal rectangularchannel (observation of MEB and MEBgeneration)”, Trans. of JSME B, 65, (1999), pp.3097–3104.
[22]Shoji, M. and Yoshihara, M., Observation ofmicrobubble emission boiling, J. visualizationsociety of Japan, 11, (1991), pp. 143-148.
[23]Kuzma-Kichta, Y., Ustinov, A. K., Ustinov, A. A.,and Kholpanov, L., Investigation of interfaceoscillations during boiling, In proc. of the thirdinternational conference on transport phenomenain multiphase systems, (2002), pp. 45-52.
[24]Shoji, M., Tange, M., Watanabe, M., Kamoshida,J., Sasaki, K., “Subcooled pool boiling on aheated wire with microbubble emission”, In Proc.of EECI International Conference on Boiling HeatTransfer, (2006), paper no. 30 (CD-ROM).
2009 1 - 14 - J. HTSJ, Vol. 48, No. 202
[1]
100 nm[2]
MEMS Microelectromechanical Systems
1
MEMS [3, 4][5]
[6-8]McCormick
3 in vivo[7] Ra
2
[8] MEMS
MEMS
[2]MEMS
MOVSMicro Optical Viscosity Sensor
MODS Micro Optical DiffusionSensor
MEMSMicro Thermophysical Properties Sensor using Optical MEMS
Yoshihiro TAGUCHI (Keio University), Yuji NAGASAKA (Keio University)e-mail: [email protected]
1
2009 1 - 15 - J. HTSJ, Vol. 48, No. 202
[9]
2
Micro Optical ViscositySensor: MOVS [10, 11]
2 MOVS MOVS12.6 mm 6 mm 0.8 mm
1/1000 3
PCF 2
CLF
0.5 mSOI Silicon-on-Insulator
SiMOVS
4 PCFCLF
2PCF 4 m
3.96 m
2
3
42 PCF CLF
0.5 m
2009 1 - 16 - J. HTSJ, Vol. 48, No. 202
MOVS 10 m FWHM
MOVS
CLF1CLF3
5CLF3
PD 200 kHzPID PID
MOVS
500 Hz
6
60
PSF0.7 m
MOVS
MOVS7 Hz 13 m
0.01 wt%7 2
256
S/N 4
MOVS
5
0 10 20 30 40100
150
200
250
0
5
10
15Under controlWithout control
Time , sec
zdisplacem
ent,μm
Ref
lect
edlig
htin
tens
ity,m
V
6
0 1 2 3
0
0.02
0.04
0
0.1
Time, sS
igna
lInt
ensi
ty,m
V
Under Control
Without Control
7
2009 1 - 17 - J. HTSJ, Vol. 48, No. 202
TAS Total Analytical Systems
[12]TAS
MicroOptical Diffusion Sensor: MODS
8
9 MODSITO
a-Si:H
1 1
8
9
10
11
2009 1 - 18 - J. HTSJ, Vol. 48, No. 202
MODS ITOMODS
MEMSMODS 10
11MODS
12
13
1 m
2
14
ITO 10 Vp-p 50kHz
15
10–410–310–210–1 100 101 10210–4
10–3
10–2
Light Intensity, W/cm 2
Con
duct
ivity
,S/m
13
14
1512
2009 1 - 19 - J. HTSJ, Vol. 48, No. 202
MEMS
MEMS
24
S No. 19106004
[1] Taguchi, Y. and Nagasaka, Y., Thermal DiffusivityMeasurement of High-Conductivity Materials byDynamic Grating Radiometry, Int. J. Thermophys.,22 (2001) 289.
[2] Jigami, T., Kobayashi, M., Taguchi, Y. andNagasaka, Y., Development of nanoscaletemperature measurement technique usingnear-field fluorescence, Int. J. Thermophys., 28(2007) 968.
[3] Solgaard, O., Sandejas, F.S.A. and Bloom, D.M.,Deformable grating optical modulator, Opt. Lett.,17 (1992) 688.
[4] Hornbeck, L.J., Current Status of the DigitalMicromirror Device (DMD) for ProjectionTelevision Applications, Tech. Dig. Int. ElectronDevices Meet., (1993) 381.
[5] Bishop, D.J. et al, The Lucent LambdaRouter:MEMS Technology of the Future Here Today,IEEE Communications Magazine, 40 (2002) 75.
[6] Chong, C., Isamoto, K. and Toshiyoshi, H.,Optically Modulated MEMS Scanning Endoscope,IEEE Photo. Tech. Lett., 18 (2006) 133.
[7] McCormick, D.T. et al, A Three DimensionalReal-time MEMS based Optical Biopsy Systemfor In-vivo Clinical Imaging, Proc. 14th Int. Conf.Solid-State Sensors, Actuators and Microsystems,Lyon, (2007) 203.
[8] Ra, H., Piyawattanametha, W., Taguchi, Y., Lee,D., Mandella, M.J., Solgaard, O.,Two-dimensional MEMS scanner for dual-axesconfocal microscopy, J. Microelectromech. Syst.,16 (2007) 969.
[9] Tjong, S.C., Structure, morphology, mechanicaland thermal characteristics of the in situcomposites based on liquid crystalline plymersand thermoplastics, Mater. Sci. Eng. R Rep., 41(2003) 60.
[10]Taguchi, Y., Ebisui, A. and Nagasaka, Y.,Miniaturized optical viscosity sensor based on alaser-induced capillary wave, J. Opt. A Pure Appl.Opt, 10 (2008) 044008.
[11]Nagamachi, R., Taguchi, Y. and Nagasaka, Y.,Development of Miniaturized Optical Viscometerwith Focus Control System for in-situMeasurement, Proc. 18th Europ. Conf.Thermophys. Prop., Pau (2008).
[12]Ebisui, A., Taguchi, Y. and Nagasaka, Y.,Feasibility Study of Micro Optical DiffusionSensor based on Opto-dielectrophoreticManipulation, Proc. 18th Europ. Conf.Thermophys. Prop., Pau (2008).
2009 1 - 20 - J. HTSJ, Vol. 48, No. 202
1
IC
3 [1] [2]
[3]
10,106600W/mK
[4,5]
[6,7]
200W/mK
-
Majumdar[8] [9]
3[10]
3000W/mK[11,12]
Measuring Thermal Property of Nano Materials
Koji TAKAHASHI (Kyushu University), Motoo FUJII (AIST)e-mail: [email protected]
2009 1 - 21 - J. HTSJ, Vol. 48, No. 202
2000W/mK
[13]1
1(b)
TL
1 21
qv
021
112
vqdxxTd (1)
I Vl w
d qv =IV/(lwd) 2
ff
02
2
f
fff dx
xTd (2)
T0Tj
011
02
12111 2
22
Txl
TTlqx
qxT jvv (3)
l
L dxTxTl
T0 0
1(4)
2120
32
31
TTlqll
T jvL (5)
, RR0 (0 )
TL= R/( R0)
qf AhAf
hhff AxTA
xTAq
2
2
1
1 (6)
(3)T1 T2
21
0
2 lllTTlq
AAq jv
f
hf (7)
Sample
Hot Wire
T0
TL
Tj
T0T0
Heat Sink
Hot Wire
TL
T0T0
Heat Sink & Terminal
1 2
(a) (b)1
2009 1 - 22 - J. HTSJ, Vol. 48, No. 202
f
jff l
TTq 0 (8)
(7) (8)
0
21
0
2TTlllTTlq
AlA
j
jv
f
fhf (9)
(5)
ffvLf
vLhfhff AllAllqTlAll
qTAllAll4212
4121
224
/12/12
(10)
TL/qv
2 SiO2
Si
Ti PtTi
5nm Pt SiO2
PtBHF
SiO2
Ti PtKOH
CF4 Si
Pt
Pt
1[14]
SEM
WEBID
TEMSEM
EBID SEM
(2) Electrical beamlithography
Suspended Pt hotfilm
(5) SiO2 etching (6) Si etching
EB resist
Si(100) SiO2
(3) Physical deposition (4) Lift off
(1)EB resist coating
Pt/Ti
(2) Electrical beamlithography
Suspended Pt hotfilm
(5) SiO2 etching (6) Si etching
EB resist
Si(100) SiO2
(3) Physical deposition (4) Lift off
(1)EB resist coating
Pt/Ti
23 SiC
T SEM
2009 1 - 23 - J. HTSJ, Vol. 48, No. 202
W
3
FIB( )W Pt
10-3Pa
Pt
4 [9]4(a)
300K4(b)
SiC [15]SiC
50K340K
[16]
AFM
1Majumdar
UC
100nm
MEMS[8]MEMS
Majumdar
0.5 m
(a)
(b)4
do di
2009 1 - 24 - J. HTSJ, Vol. 48, No. 202
14 m 25 m 22 m 420 m
2
52
3
5(b)
shssb TTGTTGQ 0 (11)
Gs
Gb
[17]
[18]
[19]
[20]
MEMSUC
MembraneSample
Beam
Heat sink
Gs
Gb
Q
Q
V
A
V
A
Th Ts
T0
MembraneSample
Beam
Heat sink
Gs
Gb
Q
Q
VV
AA
VV
AA
Th Ts
T0
(a)
Th Ts T0Gs Gb
Q
Th Ts T0Gs Gb
Q
(b)5 UC MEMS
2009 1 - 25 - J. HTSJ, Vol. 48, No. 202
T
[1] Cahill, D.G., Thermal Conductivity measurementfrom 30-750K: The 3w method, Rev. Sci. Inst.,61-2 (1999) 802.
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[4] ,, , 19-3 (2005) 185
[5] Lukes, J.R. and Zhong, H., Thermal conductivityof individual single-wall carbon nanotubes,ASME J. Heat Transfer, 129 (2007) 705.
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[1] Stenger, F. J., “Experimental Feasibility Study ofWater-Filled Capillary-Pumped Heat-TransferLoops”, NASA TM X-1310, (1966), 1.
[2] Maidanik, Yu. F., Pastukhov, V. G., Fershtater, Yu.G., Smirnov-Vasiliev, K. G., Chernishev, V. F. andDvirniy, V. V., “Development, Analytical andExperimental Investigation of Loop Heat Pipes”,Proc. 7th Int. Heat Pipe Conf., 2 (1988), 539.
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[5] Baer, S. C., “Heat Pipe Condensate Return”, U. S.Patent No. 3561525, (1971).
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2009 1 - 46 - J. HTSJ, Vol. 48, No. 202
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Note from the Editorial Board
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