- 1 -
FLIP-CHIP
HEAT SPREADER
: ()
:
- 2 -
2001 (TBI) FLIP-CHIP
HEAT SPREADER .
: 10.
2002. 11 . 30
: ( )
: ()
- 3 -
FLIP-CHIP HEAT SPREADER
.
2002. 11. 30
:
:
- 4 -
():2000.11. 7(400)
(/// ): 1,. 2
( ):
270 (20, 60)
TEBGAHeat spreader 1 : Amkor, Texax
Instruments
Flip-Chip Heat spreader 2 , 2
: 2 1 2
( test)
(Air Shower Room ) Hand
Press Press
() : 115,017
Heat spreader : 46,521
/
: (: 2001-23296)
: Texas Instruments Qualification
: ()
- 5 -
I.
1. Heat spreader
2. FLIP CHIP BGA Heat spreader
II.
1.
1.1 Heat spreader
1.2
1.3
1.4 Heat spreader
1.5 Heat spreader
2.
2.1
2.2
3.
4.
4.1
4.2
5.
5.1 Package
5.2
6.
6.1
6.2
- 6 -
III.
1.
2. 3
2.1 ( : 2002 . 01 ~ 2002 . 11 )
2.2
3.
3.1
3.2
IV.
1.
2.
V.
1. Qualification Report (Texas Instruments)
- 7 -
- 8 -
I .
1. Heat spreader
/
Heat spreader , Heat
spreader BGA package , ,
, CDBGA(Cavity Down Ball grid Array)
TEBGA(Thermal Enhanced
Ball Grid Array) FCBGA(Flip Chip Ball Grid Array)
CDBGA BGA packaging
FCBGA .
2. FLIP CHIP BGA Heat spreader
FCBGA Heat spreader
Chipset
Impedence . FCBGA CPU
Chipset FCBGA Heat spreader
.
- 9 -
II.
1.
1.1 Heat spreader
Heat spreader
,
,
. Heat spreader
, Substrate
. Heat spreader
, Heat spreader
. Heat spreader
,
1.2
Fig 1. Flip chip BGA Heat
spreader 18MH
Fig 2. Flip chip BGA Heat
spreader 18BD(forging)
Fig 3. Flip chip BGA Heat
spreader 25BD
Fig 2. Flip chip BGA Heat
spreader 40BD(2 piece)
- 10 -
1.3
/
18MH 18BD / C1100 FCBGA Degreasing
Halfcut 25BD / C1100-H FCBGA Barrel-Ni Barrel
Lid FC 18BD / A5052-H0 FCBGA Black Anodizing A5052
2-piece 40BD / C1100-1/2H CDBGA Black Oxide
35CP 35BD / C1220 TEBGA Matt-Ni
1.4 Heat spreader
TEBGA Heat spreader
Substrate (die) die Heat
spreader , Heat spreader
die .
CDBGA Heat spreader
Die Heat spreader Cavity
.
- 11 -
FCBGA Heat spreader
Substrate Solder bumping die Epoxy
.
- 12 -
1.5 Heat spreader
Heat spreader CFD Simulation
Fig 5. Bare model
Fig 6. Heat spreader model
- 13 -
Heat spreader
IC IC
(die)
EMI shielding
2.
2.1
Fig 7. CPU Fig 8. DSP Chips
2.2
FCBGA Heat spreader 25BD
- 14 -
FCBGA Heat spreader 40BD(2 piece)
FCBGA Heat spreader 18BD(Inner mold type)
3.
Heat spreader Progressive pattern design, Stamping
Plating() .
Progressive pattern design
Heat spreader
Tool .
- 15 -
Stamping
Progressive pattern
.
Plating
Stamping Molding
.
- 16 -
4.
4.1
4.2
( : USD)
(H) (S)
(/Kunits) 420 370 320
- 17 -
5.
5.1 Package
Texas Instrumens Package test
: Charateristics Measurement All pass .
- 18 -
5.2
: ()
.
- 19 -
6.
6.1
Heat spreader
(2ton )
.
Test .
6.2
Heat spreader
, Prototype etching sample Test
.
III.
1.
2000. 09. :
2000. 11. : (110111-2105834)
2000. 11. : ( 215-86-00061)
2001. 02. : Factory World
2001. 03. : ATT
2001. 04. : (2)
2001. 08. : Wavetech Philippines Inc.
2001. 12. : (TBI)
2001. 12. : ()
2001. 12. : (4)
2002. 01. : Texas Instrument Heat spreader 1 Qualify (18mm FCBGA)
2002. 06. : Texas Instrument Heat spreader 1 Qualify (23mm FCBGA)
2002. 06. : ()
- 20 -
2. 3
2.1 ( : 2002. 01 ~ 2002 . 11)
Package Package house 1~2
.
2002 10 TIPI
2.2.
(1~3)Test
Package Project
2003 .
- 21 -
3.
3.1
,
,
.
3.2
Heat spreader
Packaging house ,
, Audit .
.
.
- 22 -
IV.
1.
Heat spreader
, ,
Heat spreader
.
Heat spreader Stamping tool
, Plating. Stamping .
2.
Heat spreader
.
V.
1. Qualification Report (Texas Instruments)
- 23 -
Qualification Report
( Texas Instruments )
- 24 -
ASSEMBLY OPERATIONS
- 25 -
- 26 -
- 27 -
- 28 -
- 29 -
.
I . 1. Heat spreader 2. FLIP CHIP BGA Heat spreader
II. 1. 1.1 Heat spreader 1.2 1.3 1.4 Heat spreader 1.5 Heat spreader
2. 2.1 2.2
3. 4. 4.1 4.2
5. 5.1 Package 5.2
6. 6.1 6.2
III. 1. 2. 3 2.1 ( : 2002. 01 ~ 2002 . 11)2.2.
3. 3.1 3.2
IV. 1. 2.
V. 1. Qualification Report (Texas Instruments)
