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HDI（高密度配線板）用銅箔ロードマップサブトラ工法で Line/Space = 30μm/30μm を量産可能にする三井金属のソリューションMitsui Copper Foil’s Solution for L/S=30/30 in Mass Production by Subtractive Process

～ 50/50 45/45 40/40 30/30

Functionality

Line & Space

WA-3 Rz 1.2μm

MicroThinTM series

WA-3

Surface color

The benefits of WA-3 include:● Nano-Anchor surface enables L/S=30/30 circuit formulation

● Direct laser drilling proceeds without Pre-Surface

　 treatment e.g. B/O is possible

The benefits of MicroThinTM include:● Ultra thin copper thickness of 3um or below eliminates Cu etching down process

● Direct laser drilling proceed without Pre-Surface treatment e.g. B/O is possible

● Very low profile of MicroThinTM offers excellent fine line availability

● Both Subtractive Process & MSAP available

MW-G Rz 4.2μm MLSⓇ-G Rz 3.0μm ComingSoonLower RzCopper

L/S=40/40 Possible

L/S=30/30 Possible

Breakthroughin copper foiltechnology

Etching Property ComparisonL/S=30/30, Circuit Height = 25μm

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MRG700

●スマートフォンなどのモバイル機器 ●Mobile Devices e.g. Smartphone

用途　Applications

特徴　Features

特性　Properties

Halogen Free Thin Dielectricthickness 20μm～ / Dk 3.1

●低誘電率材料　Dk 3.1 @1GHz （SPDR）　でインピーダンスコントロールが容易●ガラスクロスフリーであるMRG700は10層0.5mm厚 HDI 基板実現の有力なソリューション●XY 軸方向の CTE 等方性（X=Y）が極薄基板の反り問題を解決●小径ビア形成が可能になり、品質信頼性の確保及びPCBデザイン設計の自由度が高まる

●Low Dk material Dk 3.1 @1GHz (SPDR) ensures easy impedance control

●Glass Fiber free MRG700 is a prominent solution to achieve 10 layers HDI, 0.5mm in thick

●CTE isotropy in XY(X=Y) axis resolves warpage issue of very thin PCB

●Glass cloth free MRG700 enhances PCB design flexibility by easily formable high reliable fine micro via.

FR-4（#1027）TEST PANEL：10Layer, 0.57t MRG700 TEST PANEL : 10Layer, 0.50t

MRG700 10 層　0.47 t （19mil ）

@260℃ @260℃

Properties

Tg / Td

CTE（α1） / （α2）

Dielectric Constant

Dissipation Factor

Peel strength（CF 18μm）

Unit

℃

ppm/C

-

-

kN/m

MRG700

150 / 378

39 / 110

3.1

0.016

1.0

FR-4 （Reference）

153（DSC）/ 390（TGA）

12（X）/ 15（Y）40 / 225（Z）

3.33（RC75% 50μm 2GHz）

0.013（RC75% 50μm 2GHz）

1.2

Standard

DMA / DTA

IPC-TM650

@1GHzSPDR

JIS C 6481

スマートフォンの薄型化が可能10層 HDI 基板 0.5mm以下を実現Thinner Smart Phone Possibility by.Achieving < 0.5mm Thickness on 10 Layers HDI

FR-4（#1027）

MRG700

Resin side

Copperside

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VSPⓇseries

用途　Applications

特徴　Features

●VSP 密着面側のスムースプロファイル化、プロファイルレス化技術で高周波領域での伝送損失を大幅に低減●VSP 密着面側の最適表面処理技術によりあらゆる樹脂との良好な密着度及び耐熱特性を実現

●VSP’s Low & Smooth profile or Profile Less technology on bonding side reduces Signal Loss during very high frequency operation

●VSP’s enhanced surface treatment development on bonding side is designed for excellent compatibility in bonding strength & thermal resistivity with various resin systems

●ネットワーク機器、基地局、スーパーコンピュータ等 ●Networking equipment, Base station, Super computer etc.

Name

M sideRzCrossSectionImage

M sideSEMX3,000

MLSⓇ-G HS-VSPⓇ HS1-VSPⓇ NP-VSPⓇ WA-VSPⓇ

3.0μm 1.8μm 1.3μm 0.2μm 0.4μm

超高速伝送基板 / 低伝送損失材料用スムースプロファイル銅箔Very Smooth Profile Copper Foil Engineered for Super High Speed Digital Application / Low Loss Material

Low Profile, Nano-anchor Profile, Rz<1.5μm, <2.0μm Roughness Available

-8

-7

-6

-5

-4

-3

-2

-1

00 5 10 15 20

Transm

msion

Loss[dB]

Frequency[GHz]

MLS®-G

HS-VSP®

HS1-VSP®

NP-VSP®

WA-VSP®

Differential STLLine length : 200mmImpedance :100ΩPP : A（Df0.002）

*Before primer resin coating

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FARADFLEX®Embedded Capacitor Material for PCB

* This chart provides typical values for FARADFLEX® product.

Next generation datacom and 4G

Product: Router For telecommunication

Polymer-based diplexerusing FARADFLEX® MC12LD

FARADFLEX® in low ESL chip capacitors

FARADFLEX® in MEMS microphones

FARADFLEX® Products’ Data

Main Applications

Buried Capacitance Material for PDN in Next Generation Datacom and 4G

Embedded Capacitor Material for Discrete Application

MC24M

24

1.2(180)

4.40.015>8

DielectricThickness,μm

Cp@1MHznF/in2(pF/cm2)

Dk@1MHzDF@1MHzPeels,Ibs/in.

PropertiesFARADFLEX®

MC25L

25

1.0(130)

3.90.004>8

MC12TM

12

4.2(650)

10.00.015>5

MC8TM

8

7.1(1100)

10.50.020>5

DielectricThickness,μm

Cp@1MHznF/in2(pF/cm2)

Dk@1MHzDF@1MHzPeels,Ibs/in.

PropertiesFARADFLEX®

MC8T

8

21.5(@1kHz)

30.00.016>4

MC12LD

12

3.8(590)

7.40.0025>3

FARADFLEX® FARADFLEX®

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