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Role of Ultrafast Charge Dynamics in
Photocatalytic Water Oxidation
NanotekNanotekNanotekNanotek, , , , December 2014December 2014December 2014December 2014
Tanja Cuk
Assistant Professor, Chemistry, UCB
Faculty Scientist, CSD, LBNL
Transient Optical, Infrared
SpectroscopyTransient X-Ray Spectroscopy
Heterogeneous CatalystsControlling Charge Flow
CO2 + H2O + hνννν ����FUEL + O2
Fuel
O2
H2O , CO2
Water Oxidation Catalysts: Water Oxidation Catalysts: Water Oxidation Catalysts: Water Oxidation Catalysts:
Transition Metal OxidesTransition Metal OxidesTransition Metal OxidesTransition Metal Oxides
Hydroxilated Surfaces
Bluhm, Salmeron, Nilsson et. al.,
J. Phys. Chem. C (2010)
• Efficient and Sustainable Catalysis on TM Oxide Surfaces
• Hydroxilated surfaces common to TM Oxide Surfaces
Robust Catalysis
Fe2O3
4h+ + 2H2O O2 + 4H+ E0 = 0.6 V vs. Ag/AgCl
Heterogeneous CatalysisHeterogeneous CatalysisHeterogeneous CatalysisHeterogeneous Catalysis
Activation Barrier thru Transient Spectroscopy
Dynamic Catalytic Surface
Suggested First Hole Transfer (t=0):
Helmholtz Double Layer
[h+] + [OH-] [OH*]
Challenges Challenges Challenges Challenges in Applying Ultrafast in Applying Ultrafast in Applying Ultrafast in Applying Ultrafast
Spectroscopy to CatalysisSpectroscopy to CatalysisSpectroscopy to CatalysisSpectroscopy to Catalysis
• Interplay of recombination and interfacial charge transfer
• Sensitivity to the surface
• Studying hetero-junctions (solid-solid, solid-liquid)
• Multi-electron transfer processes and “clocking” the cycle
Strategy and TechniquesStrategy and TechniquesStrategy and TechniquesStrategy and Techniques
Working
electrodeCounter
electrode
Reference
electrode
h+
h+
h+
h+
h+
Catalysts Catalysts Catalysts Catalysts &&&& Devices Under InvestigationDevices Under InvestigationDevices Under InvestigationDevices Under Investigation
n-SrTiO3, High Over-Potential Co3O4 , Low Over-Potential
10 O2/site-s 0.01 O2/site-s
nnnn----type SC/Liquid type SC/Liquid type SC/Liquid type SC/Liquid
SchottkySchottkySchottkySchottky BarrierBarrierBarrierBarrier
nnnn----p GaAs photodiode/Cop GaAs photodiode/Cop GaAs photodiode/Cop GaAs photodiode/Co3333OOOO4444
HeteroHeteroHeteroHetero----junctionjunctionjunctionjunction
PhotoPhotoPhotoPhoto----electrochemistry of nelectrochemistry of nelectrochemistry of nelectrochemistry of n----SrTiOSrTiOSrTiOSrTiO3333
High Quantum Efficiency with 1 kHz Laser (W ∼∼∼∼ αααα)
• Single 150 fs Pulse Triggers Multi-electron Transfer Water Oxidation
• Achieve high quantum efficiency (75%) under laser excitation
-10
0
I (
µΑ
)µ
Α)
µΑ
)µ
Α)
1.0 0.5 0.0 -0.5 -1.0 V (vs. Ag/AgCl)
Dark
0.04 mJ/cm2
, Q.E. = 75%
VRB
VRB
Transient Reflectance of nTransient Reflectance of nTransient Reflectance of nTransient Reflectance of n----SrTiOSrTiOSrTiOSrTiO3333
Width of Electric Field at High Q.E.:
W ∼∼∼∼ 25 nm
Pump Band Gap (300 nm, 4 eV):
αααα = λλλλ/4ππππk ∼∼∼∼ 24 nm
Probe Hole Absorption (800 nm, 1.5 eV):
ααααREFL = λλλλ/4ππππn ∼∼∼∼ 27 nm
Surface Sensitivity Thru Reflectivity
UV-VIS Ellipsometry
Experimental conditions needed
to probe kCT , [h] :
W = ααααPUMP = ααααPROBE
Pump Band Gap, Probe Holes
Interfacial Charge TransferInterfacial Charge TransferInterfacial Charge TransferInterfacial Charge Transfer
Change in kinetics reflects kCT, [h]
SrNb0.001TiO3 (0.1%) SrNb0.007TiO3 (0.7%)
W = 25 nm &&&& ααααpump , ααααprobe ∼∼∼∼24 nm W = 9 nm &&&& ααααpump , ααααprobe ∼∼∼∼24 nm
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
No
rm ∆∆ ∆∆
R/R
1 10 100 1000
Time Delay(ps)
0.1M NaOH
0.2M NaSCN
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
No
rm ∆∆ ∆∆
R/R
1 10 100 1000
Time Delay (ps)
0.1M NaOH, τ = 3 τ = 3 τ = 3 τ = 3 ns
0.2M NaSCN, τ = 1 τ = 1 τ = 1 τ = 1 ns
Manipulating Interfacial Charge TransferManipulating Interfacial Charge TransferManipulating Interfacial Charge TransferManipulating Interfacial Charge Transfer
• Interfacial charge transfer rate increases with increasing oxidative voltages
• Rate changes while current and quantum efficiency constant
SrNb0.001TiO3 (0.1%)
-10
-5
0
5
I (
µΑ
)µ
Α)
µΑ
)µ
Α)
-1.0-0.50.00.51.0
V (vs. Ag/AgCl)
Dark
0.04 mJ/cm2, Q.E.= 75%
-1.0
-0.5
0.0
0.5
No
rm ∆∆ ∆∆
R/R
1 10 100 1000
Time Delay (ps)
-0.92V -0.4V 0V 0.2V 0.7V
-5.0
-4.0
-3.0
-2.0
-1.0
0.0
Lo
g k
-1.0 -0.5 0.0 0.5 1.0 V
log k
fit log k
-1.0
-0.5
0.0
0.5∆∆ ∆∆
R/R
1 10 100 1000
Time (ps)
0.7V fit 0.7V
-1.0
-0.5
0.0
∆∆ ∆∆R
/R
1 10 100 1000 Time (ps)
-0.4V fit -0.4V
-1.0
-0.5
0.0
∆∆ ∆∆R
/R
1 10 100 1000 Time (ps)
0V fit 0V
-1.0
-0.5
0.0
∆∆ ∆∆R
/R
1 10 100 1000 Time (ps)
-0.92V fit -0.92V
-1.0
-0.5
0.0
∆∆ ∆∆R
/R
1 10 100 1000 Time (ps)
0.2V fit 0.2V
Kinetics (Kinetics (Kinetics (Kinetics (VVVV))))
• Kinetics are fit to a single exponential at early time scales
• Rate constant depends exponentially on applied V (Arrhenius Law)
M. Waegele, X. Chen, D. Herlihy, T. Cuk, JACS 2014
Voltage Distribution at the SurfaceVoltage Distribution at the SurfaceVoltage Distribution at the SurfaceVoltage Distribution at the Surface
CH
CSC UFB
UH
USC
U
CSC CH
UH
USC
VB
CB
�
UFB + U = UH + USC
φφφφ��
φφφφ��
=
surface hole potential
• Since the solution potential is invariant, changes in UH are tied to
changes in the valence band edge potential, φφφφ��
• Changes in UH (Helmholtz Voltage) by applied U determined by
capacitances at n-type SC/liquid interface
U = applied voltage
φφφφOH-/OH
UUUUHHHH(V): Changing Surface Hole Potential(V): Changing Surface Hole Potential(V): Changing Surface Hole Potential(V): Changing Surface Hole Potential
(1) U + UFB = UH + USC
(2) UH = (qsc + qphoto) / CH
Brockeris, Bard, Bocarsly
n-SrTiO3 Electrolyte
η(V)
VB
φφφφ��/��
−
UH(0)
UH(V)
φφφφ��(�)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
UH
(V
)
-1.0 -0.5 0.0 0.5 1.0
Uappl (V)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
ηη ηη (V
)
0.045 mJ/cm2
0.065 mJ/cm2
Dark
CH = 21 µµµµF/cm2
UH(0) = 0.65 V give CH = 21 uF/cm2
αe0∆UH(V)
e0UH
OH*h+
e0∆UH(V)
k = k0 exp (∆∆∆∆G*/4kBT)
k = k0exp (αααα FUH / RT)
Activation Barrier of First Hole TransferActivation Barrier of First Hole TransferActivation Barrier of First Hole TransferActivation Barrier of First Hole Transfer
-4.0
-3.0
-2.0
-1.0
log
(k
)
1.21.00.80.6
UH (V)
αααα = 0.24
[h+] + [OH-] [OH*]
α = 0.2 ± 0.05
Quantifies barrier to localizing VB hole onto a molecular O2p bond
k
k0 = 7 x 10-7 ps-1 (µµµµs)
e0φφφφ�� /��∗
φφφφ�� /��∗
= 1 V vs. SCE
[From Photoemission, 1.2 V]
ConclusionsConclusionsConclusionsConclusions
• Quantified interfacial charge transfer at n-type
semiconductor/liquid interface
• Activation barrier (α, k0) for first hole transfer of water
oxidation reaction in n-SrTiO3
• Next step on n-SrTiO3: concomitant intermediates using
ultrafast infrared spectroscopy
• Investigate lower over-potential catalysts, and other n-
type semiconductors stable in aqueous solutions (e.g.
GaN)
Next StepsNext StepsNext StepsNext Steps
Graduate StudentsGraduate StudentsGraduate StudentsGraduate Students
Hoang Doan
Stephanie Choing
Kevin Pollack
David Herlihy
Xihan Chen
Jonathon Radberg
PostdocPostdocPostdocPostdoc
FundingFundingFundingFunding
Aayush Singh (Undergraduate)
Joseph Mosley (Volunteer)
CPIMS Program
AcknowledgementsAcknowledgementsAcknowledgementsAcknowledgements
Matthias Waegele
Facilities/DiscussionsFacilities/DiscussionsFacilities/DiscussionsFacilities/Discussions
Heinz Frei
Steve Leone
Gabor Somorjai
Eli Yablonovitch
Ian Sharp (JCAP)
Joel Ager (JCAP)
Michelle Chang
AFOSR Young Investigator (Co3O4)
Possible Intermediate Species FormedPossible Intermediate Species FormedPossible Intermediate Species FormedPossible Intermediate Species Formed
[h+] + [OH-] [OH*] [-OOH or -OOTi]
• -OOH is a likely intermediate: ms-FTIR (Frei)
• Single rate constant (k1) implies a highly populated –OOH surface?
• Probe nature of OH* (or O*) as surface trap (transient XAS)
k1 k1”
-1.0
-0.5
0.0
0.5
∆∆ ∆∆R
1 10 100 1000
Time Delay (ps)
0.7 V
k1
k1”
-10
-5
0
∆∆ ∆∆ m
OD
8006004002000
Time (ps)
-15
-10
-5
0
2079 cm-1
(SCN)
2202 cm-1
(Free Carriers)
-10
-5
0
∆∆ ∆∆ m
OD
-1.0 1.0
Time (ps)
-15
-10
-5
0
Ultrafast Transient IRRASUltrafast Transient IRRASUltrafast Transient IRRASUltrafast Transient IRRAS
• Small molecule rotations/bindings (-SCN, -NCS)
• Reaction Intermediate Rise Times
• Effects of surface potential/electric field vs. charge transfer
Transient -SCN / -NSC at n-SrTiO3 Decays with n-SrTiO3 Free Carriers
-15
-14
-13
-12
-11
∆
∆
∆
∆ m
OD
2200 2150 2100 2050 2000
Wavenumber (cm-1
)
2 ps
Transient Grating DiffractionTransient Grating DiffractionTransient Grating DiffractionTransient Grating Diffraction
Heterodyne Detection: TG(t), R(t), ϕϕϕϕ (t) determined by varying Ψ, probe-ref phase
∆I/I = R(t)cos(ϕϕϕϕ(t)) + TG(t)cos [Ψ - ϕϕϕϕ (t)]
Recombination (t) = R(t)cos(ϕϕϕϕ(t))
Diffusion (t) = εεεε (t) = TG(t)/R(t) = exp (-Dq2/t)
Catalysts Catalysts Catalysts Catalysts &&&& Devices Under InvestigationDevices Under InvestigationDevices Under InvestigationDevices Under Investigation
n-SrTiO3, High Over-Potential Co3O4 , Low Over-Potential
10 O2/site-s 0.01 O2/site-s
nnnn----type SC/Liquid type SC/Liquid type SC/Liquid type SC/Liquid
SchottkySchottkySchottkySchottky BarrierBarrierBarrierBarrier
nnnn----p GaAs photodiode/Cop GaAs photodiode/Cop GaAs photodiode/Cop GaAs photodiode/Co3333OOOO4444
HeteroHeteroHeteroHetero----junctionjunctionjunctionjunction
Pump From Back, Probe From Front at Open Circuit
e
h
τR
τINJECTh
-
-
-
-
-
-
+
+
+
+
+
+
+
p-G
aA
s
n+
-Ga
As
Co
3O
4
Transient Reflectivity on HeteroTransient Reflectivity on HeteroTransient Reflectivity on HeteroTransient Reflectivity on Hetero----junctions junctions junctions junctions
Probe depth
• Charge separation spatially separated from hole injection into catalyst
• Ultrafast charge injection (∼∼∼∼ 10 ps) unimpeded by slow diffusion kinetics
• Can recombination kinetics in GaAs & hole kinetics in Co3O4 be separated in a transient
reflectivity experiment?
• Surface sensitivity of ∆R w/ 400 nm probe
• Strong signal of surface holes with catalyst
• Time delay for hole injection (~10 ps)
Kinetics of Holes in Catalyst OverKinetics of Holes in Catalyst OverKinetics of Holes in Catalyst OverKinetics of Holes in Catalyst Over----layerlayerlayerlayer
• Kinetics vary w/ catalyst type
• Also with deposition technique
• Reproducibility for same batch
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
∆∆ ∆∆R
/R (
%)
1 10 100 1000
Time Delay (ps)
GaAs 800 nm, Bulk Recombination GaAs 400 nm, Surface Holes Co3O4 ALD 400 nm, Surface Holes
x 0.03
Hole
injection
GaAs
Co3O4 ∆∆ ∆∆
R/R
(%
)
1 10 100 1000
Time Delay (ps)
Co3O4 ALD
Co3O4 Sputt
IrO2 PVD
~0.5 mJ/cm2
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0∆∆ ∆∆
R/R
(%
)
100806040200
Time Delay (ps)
Co3O4 ALD
Co3O4 Sputt
• 0.8 THz (& w/ 0.4 THz) signal generated from catalyst over-layer, independent of catalyst type
• Strength and decay of THz signal depends on catalyst type and deposition technique
Hole Carriers as an antenna to THz?Hole Carriers as an antenna to THz?Hole Carriers as an antenna to THz?Hole Carriers as an antenna to THz?2.0
1.5
1.0
0.5
0.0
∆∆ ∆∆R
/R (
%)
100806040200
Time Delay (ps)
IrO2 PVD
τmobile holes
0.87, 0.44 THz0.87 THz
p-GaAs
+
+
+
+
+
-
-
-
-
THz Generation THz Antenna
Free Carriers Injected in Catalyst
Responding to THz field
Plasma frequency of p-dopants
responding to ∆∆∆∆E field
Effects of Electrolyte?
• Potentially, mobile holes responding to THz in GaAs that decay to surface trapped states
~5 mJ/cm2
ConclusionsConclusionsConclusionsConclusions
• Activation barrier (α, k0) for first hole transfer of water
oxidation reaction in n-SrTiO3
• Next steps n-SrTiO3: (1) concomitant intermediates using
ultrafast infrared spectroscopy, (2) transient diffraction
gratings for interfacial hole diffusion
• Ultrafast photodiode for low over-potential catalysts:
dynamics of charge-separated carriers at electrolyte
interfaces
Graduate StudentsGraduate StudentsGraduate StudentsGraduate Students
Hoang Doan
Stephanie Choing
Kevin Pollack
David Herlihy
Xihan Chen
Jonathon Radberg
PostdocPostdocPostdocPostdoc
FundingFundingFundingFunding
Aayush Singh (Undergraduate)
Joseph Mosley (Volunteer)
CPIMS Program
AcknowledgementsAcknowledgementsAcknowledgementsAcknowledgements
Matthias Waegele
Facilities/DiscussionsFacilities/DiscussionsFacilities/DiscussionsFacilities/Discussions
Heinz Frei
Steve Leone
Gabor Somorjai
Eli Yablonovitch
Ian Sharp (JCAP)
Joel Ager (JCAP)
Michelle Chang
AFOSR Young Investigator (Co3O4)
Reaction via surface hole
(valance band oxygen)
Ti
O
O
O
Ti
Ti
h+ Ti
O
O
O
Ti
Ti
OH-
TiO
O
O
Ti
Ti
O
OH- h+
H
Ti
O
O
O
Ti
Ti
O
(1)
Ti
O
O
O
Ti
Ti
O
h+
OH-
Ti
O
O
O
Ti
Ti
O
OHOH-
h+
Ti
O
O
O
Ti
Ti
+ O2(2)
Ti
O
O
O
Ti
Ti
O
h+
OH-
Ti
O
O
O
Ti
Ti
O
OH
Ti
O
O
O
Ti
Ti
O
+ OH
(3)
Reaction via hot hole
(surface axial oxygen)
Number of surface site calculation
1. SrTiO3 has a lattice constant of a=3.905A
2. (1,0,0) surface for SrTiO3 is cubic, which looks like the graph on the right
3. Each (1,0,0) lattice has 3 surface atoms(1 Ti, 2 O)
4. Therefore, each lattice has area of A=a2=1.525*10^-15 cm2
5. Surface atom density=# of atoms on one lattice surface/lattice surface area
So, surface atom density= 3/1.525*10^-15cm2 = 1.967*10^15 atoms/cm2
Voltage Distribution (Dark, Equilibrium)Voltage Distribution (Dark, Equilibrium)Voltage Distribution (Dark, Equilibrium)Voltage Distribution (Dark, Equilibrium)
Mott-Schottky: UFB = 1.6 V Photo-Voltage: UOC = USC = 0.85 V
• Photo-voltage at open circuit roughly half of UFB
• UH= 0.65 V in the dark, at equilibrium (no applied U)
1.0
0.8
0.6
0.4
0.2
0.0
UO
C (
V)
1086420
Laser (µµµµJ/cm2)
0.1% Nb
0.7% Nb
5x1014
4
3
2
1
0
C-2
(cm
4/F
2)
-1.5 -1.0 -0.5 0.0 0.5 1.0
Uappl (V)
0.1% Nb
0.7% Nb
Ufb = USC + UH
Voltage Distribution (Illumination)Voltage Distribution (Illumination)Voltage Distribution (Illumination)Voltage Distribution (Illumination)
Capacitance Illuminated Junction
• Photo-induced holes at interface create an interfacial p-type layer
• This interfacial “carrier inversion” changes UH, even with no applied U
3
2
1
0
C (
F/c
m2)
x 1
0-3
-1.5 -1.0 -0.5 V (vs. Ag/AgCl)
Dark
0.01 mJ/cm2
0.04 mJ/cm2
VFB
VOC
Turner, Nozik APL 37 (1980)
CB
VB
n-type p-type
Reverse
BiasForward
Bias
qsc qphoto
Double
Layer
10μm 10μm
1μm 10μm
a) b)
c) d)
SEM images a)-d) show damage on 0.1% Nb doped
SrTiO3 under laser and applied bias condition
a) Damaged sample at 1500×magnification
b) Damaged sample at 1500×magnification
c) Damaged sample at 3500×magnification
d) Undamaged sample at 1500×
magnification
1. SEM image shows laser burned holes on sample surface, most of the holes have 5um as diameter while
some big holes have 10um as diameter
2. No damage is observed if only laser is applied to our sample, damage happens when current is running
through the sample and laser is applied.
3. Laser spot size is 500um(FWHM) but the peak is narrow around 10um
4. One possible mechanism for the damage is coulomb explosion where high density of excitons
generated by laser accumulate at sample surface causes explosion
a)
c)
Water Oxidation Water Oxidation Water Oxidation Water Oxidation &&&& OverOverOverOver----PotentialPotentialPotentialPotential
How do the surface dynamics modify the kinetic barriers
and thermodynamics of each intermediate in the cycle?
High over-potential,
Lower kinetic barriers
~10’s O2 /site-sec
Thermodynamic potential,
High kinetic barriers
~ 0.01 O2 /site-sec