SPEC & TEST Check List - ows2.tpv-tech.comows2.tpv-tech.com/e_mp/uploadfile/specification/201511/T0000058600/... · 深圳市麦捷微电子科技有限公司地址：深圳市宝安区观澜镇高尔夫大道裕兴路

深圳市麦捷微电子科技有限公司

地址：深圳市宝安区观澜镇高尔夫大道裕兴路

电话(Tel)：0755-28085000 传真(Fax)：0755-28085605 邮编(Postcode)：518110

No. Check List--具体请参照Transformer 管控重點 & Safety spec YES/NO/NA？

1 SPEC封面是否正确，TPV料号，供应商型号，供应商工厂名称等信息完整 YES2 版本记录是否完整，正确 YES3 外形尺寸标识位置，尺寸编号，PIN号码，误差是否正确（特别注意超薄机种PIN长） YES4 磁芯背胶位置，胶带尺寸，层数，背胶尺寸、磁芯背胶三视图是否标识正确 NA5 外包铜箔尺寸，位置，接PIN脚位、WIRE线径是否正确 NA6 产品净重是否准确标识 YES7 磁芯点胶、中柱点胶的位置、重量是否标识正确 NA8 外形图是否标明绕线方向剪头（based on wire） NA9 PIN脚连锡是否规定 NA10 WIRE绕PIN圈数是否规定 NA11 PIN脚材质成份图示 NA12 底板尺寸，隔片尺寸是否标识正确(for Line Filter) NA13 BOBBIN图纸是否完整，BOBBIN肉厚是否标识准确标出 NA14 Marking内容是否正确，完整 NA15 Marking是否有标明绝缘系统，HI-POT OK (FOR 安规料件 ) NA16 是否有备注绝缘系统，绝缘系统TABLE (FOR 安规料件 ) NA17 工厂产地是否标明 YES18 绝缘胶带标明：Insulation tape ?mmT * ?mmW / Turn back tape ?mmT * ?mmW NA19 含浸工艺要求，含浸效果是否准确定义 YES20 CORE固定胶带是否定义 2TS MIN NA21 外观要干净、无异常是否定义 YES22 剪PIN定义是否正确 NA23 套管长度必须超过档墙是否定义 NA24 套管长度超出BOBBIN开槽处的位置(立式是2/3,卧式是1/2，或其它规格要求)是否定义 NA25 GAP CORE位置是否定义（Top side/Bottom side/Pri.Side,Sec.Side ? ） NA26 工作温度范围，最高耐温，允许温升，存储温度范围，工作频率范围等是否定义 YES27 Schematic：绕线start端，套管PIN脚，套管长度，同极性端是否定义及标明 NA28 Winding construction：绕组编号，胶带层数、宽度，档墙尺寸是否标识正确 NA29 反折胶带位置、反折尺寸，胶带尺寸、层数是否定义正确 NA30 WINDING MODE：绕组编号，线型号/线径/圈数、疏/密绕法，胶带层数，档墙宽度标明 NA31 内铜箔尺寸，位置，接PIN脚位，WIRE线径，铜箔背胶是否定义正确 NA

32WINDING DIRECTION是否定义正确（based on wire，且必须要定义参照物---立式BOBBIN以底部方向標示 , 臥式以priamry 方向標示）

NA

33 电感量，DCR，重叠电流，Q值等参数是否定义，测试条件是否正确 YES34 LK,电压比是否定义正确（for PFC电感,POWER变压器） NA35 初级LK是否定义（FOR push-pull inverter变压器） NA36 HI-POT（温湿度HI-POT测试），IR，Layer short test 是否正确 NA37 开放电压及放电电压是否定义（FOR Inverter变压器） NA38 信赖性--Strength test是否正确定义 YES39 信赖性--Bending strength是否正确定义 YES40 信赖性--Vibration是否正确定义 YES41 信赖性--High resistance是否正确定义 YES42 信赖性--Cool resistance是否正确定义 YES43 信赖性--Damp heat是否正确定义 YES44 信赖性--Shock是否正确定义 YES45 耐焊接热-Soldering heat test是否正确定义 YES46 可焊性Solder ability test是否正确定义 YES47 BOM表材料型号(与UL卡及绝缘系统对应)，供应商，UL号，阻燃等级，耐温是否正确 NA48 材料的UL FILES是否附上，UL号、供应商名称、材质型号是否用红线Highlight NA49 BOBBIN/CASE/BASE是否附上燃烧报告，球压(ball pressure test)报告 NA50 含浸工艺SOP是否附上 YES51 TAPE资料:厚度，耐电压，耐温，粘力等(accord with ASTM D-1000 and UL510)附上 NA52 包装尺寸，外箱标识，数量是否正确 YES53 TPV环保管理物质保证函是否附上 YES54 原材料调查表(环境管理物质不使用证明书)是否附上 YES55 可焊性、耐焊接热(solder SPEC)是否附上 YES56 HI-POT保证函是否附上(见SPEC可靠性报告) YES57 VOC保证函是否附上 NA58 Noise保证函是否评估OK并附上 NA59 TEST--测试项目管控LIST是否附上 YES60 TEST--TEST SEQUENCE FOR ELECTRICAL COMPONENTS是否附上 YES61 TEST--尺寸，外观及包装，电气测试，信赖性报告是否完整 YES62 TEST--CP/CPK是否推算及评估 YES63 TEST--电感量VS电流/温度/频率数据及曲线图是否附上 YES64 TEST--拆解报告是否正确/清楚 YES

Prepare by: 曾艳锋 Check by: __罗盛滔__________________

� TPV P/N SPEC & TEST Check List ---by supplier

深圳市麦捷微电子科技股份有限公司



目录 CATALOG

规格书版本控制 Component SPEC Version Record……………………………….. 1

磁环磁珠测试项目管控 TEST ITEM CONTROL LIST„„„„„„„„„„„„„„ 2

1 纳入仕样书 SPECIFICATION„„„„„„„„„„„„„„„„„„„„„„„ 3

2 适用范围 Scope．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 4

3 品名构成 Product Identification．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 4

4 形状、尺寸和材料 Appearance, Dimensions and Material．．．．．．．．．．．．．．．． 4

5 测试条件 Testing Conditions．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 5

6 标称值 Rating．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 6

7 电气特性 Electrical Performance．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 7

8 信赖性试验 Reliable Performance．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 8

9 焊接条件 Recommended Soldering Conditions．．．．．．．．．．．．．．．．．．．．．．．．．．． 11

10 清洗条件 Cleaning Conditions．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 12

11 包装 Packaging．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 13

12 装箱清单及标志 Packing documents and marking．．．．．．．．．．．．．．．．．．．．．．．． 15

13 保管 Storage．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 17

14 奥素系难燃剂的使用情况 Usage of Nonflammable Material．．．．．．．．．．．．．．． 18

15 ODS 的使用情况 Usage of ODS．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 18

16 阻燃级别 Flammability Class．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 18

17 注意事项 Note．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 18

APPENDIX A

环境管理物质合格保证书 Guarantee in the substance for safety environment„„„„„„„ 19

材料及材料厂家 Material and the supplier LIST„„„„„„„„„„„„„„„„„„„„ 22

RoHS 零件可焊性/耐焊接热标准 RoHS Component Solderability/Resistance to Soldering Heat SPEC„„„„ 23




COMPONENT SPEC VERSION RECORD

TPV PART NO. MICROGATE

PART NO. MGFI1005AR22KT-LF

VER MINUTE OF CHANGES CHENGES RELEASE

DATE

A CHECKED AND RELEASED. 张海恩 2015-10-21

1/22




CHIP INDUCTOR 测试项目管控 LIST

TEST ITEM CONTROL LIST

Item 测试项目

test item

重点管控

major control

备注

remark

1 电感量

inductance

根据 SPEC要求设定测试频

率及测试电压 enacting the test frequency and

test voltage refer to SPEC

2 Q值

下限

the low limited 根据 SPEC要求设定测试频

率及测试电压 enacting the test frequency and

test voltage refer to SPEC

3 直流电阻

DC Resistance

上限值

the up limited

4 可焊性

Solderability

依 SPEC

refer to SPEC

5

耐焊接热

Heat resistance test

for sodering heat

依 SPEC

refer to SPEC

6 外观

appearance

供应商识别、MARK、无氧化及其它缺陷

supplier identify 、 mark 、

unoxygenation and some other

defects.

7 出货检验报告

Output inspect record

电气参数测试，材质报告

electric parameter test

material report

8 尺寸

dimension

2/22




1．纳入仕样书 Specification

CUSTOMER：冠捷日期 DATE: 2015-10-21

产品名称 PRODUCT NAME: 片式电感 Multilayer Chip Inductor

贵司料号 YOUR PART NO.:

敝司料号 OUR PART NO.: MGFI1005AR22KT-LF

仕样书编号 QW-QA-341 REV1.0 MG2002

MANUFACTURING NAME


SHENZHEN MICROGATE TECHNOLOGY CO。，LTD

TEL：86-755-28085000

FAX：86-755-28085605

接受 RECEPTION

THE SPECIFICATION HAS BEEN ACCEPTED.

该纳入仕样书已被我司接受日期:

DATE：公司：

COMPANY：

批准

CFMD

审核

CHKD

接收

RCVD

CFMD.

批准

CHKD.

审核

DSGD.

担当

张照前胡潞乐曾艳锋

3/22




2 适用范围 Scope

本纳入仕样书适用于 MGFI 系列片式电感。

This specification applies to the MGFI series of multiplayer chip inductors.

3 品名构成 Product Identification

MGFI 1005 A R22 K T -LF

① ② ③ ④ ⑤ ⑥ ⑦

① 产品系列 Product Symbol

② 产品尺寸 Dimensions（见 3）

③ 基本材料代码 Material Code（铁氧体材料,按磁导率从小到大依次为 A;B;C;D;E;R 等）

④ 电感量 Inductance Value (R22:0.22uH)

⑤ 允许容差 Inductance Tolerance (J:±5%；K:±10%)

⑥ 包装方式（B：散装；T：盘装）Packaging Style (B:; Bulk; T: Tape & Reel)

⑦ 无铅 Lead Free

4 形状、尺寸和材料 Appearance, Dimensions and Material

Type Dimensions in mm

L W T a1, a2 |a1-a2|

MGFI1005 1.O±0.15 0.5±0.15 0.5±0.15 0.25±0.1 ≤0.1

MGFI1608 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 ≤0.1

MGFI2012 2.0+0.3/-

0.1 1.25±0.2

0.85±0.2

1.25±0.2 0.5±0.3 ≤0.1

MGFI3216 3.2±0.2 1.6±0.2 1.1±0.3 0.5±0.3 ≤0.1

4/22




构成

Composition

材料

Material

材料比例(%)

Material content

供应商

Supplier

1 基本材料

Base Material

铁氧体

Ferrite N/A

日本

Japan

2

内导体

Internal

Conductor

银

Ag N/A

日本

Japan

3

端电极

Terminal

Electrode

银

Ag 100%

日本

Japan

4

端电极

Terminal

Electrode

镍-锡

Ni-Sn Ni(100%)-Sn(100%)

香港

HK

5 测试条件 Testing Conditions

除非另有规定，否则在以下条件下测试 <Unless otherwise specified>

温度 Temperature : Ordinary Temperature ( 5 to 35℃)

湿度 Humidity : Ordinary Humidity (25 to 85% RH)

当对测量结果有疑问时<In case of doubt>

温度 Temperature : 20±2℃

湿度 Humidity : 60 to 75% RH

大气压强 Atmospheric Pressure : 86 to 106 KPa

5/22




6 标称值 Rating

使用温度范围操作温度范围 Operating Temperature Range : -25 to +125℃

CUST. Part No. Microgate Part No.

Product’s

Thickness(mm)/

weight

(g)

Inductance

(μH) Q

min

Test

Freq.

(MHz)

SRF

(MHz)

min

RDC (Ω)

max

IR (mA)

max

MGFI1005AR22KT-LF 0.50/0.0011 0.22±10% 15 25 110 1.20 25

6/22




7 电气特性 Electrical Performance

7.1 电感量 Inductance

按表 1所列条件测量时，电感量应符合条款 5。

Impedance shall meet item 5 when measured on the condition of Table 1.

Table 1

测量设备

Measuring Equipment

阻抗分析仪 HP4291 或其他

Impedance analyzer HP4291 or equivalent

测量频率

Measuring Frequency

见条款 6

(see item 6)

测量信号

Measuring signal level 50mV

7.2 直流电阻 DC Resistance

按表 2所列条件测量时，直流电阻应符合条款 6。

D.C Resistance shall meet item 6 when measured on the condition of Table 2.

Table 2

测量设备

Measuring Equipment

LCR测量表 HP4263A或其他

LCR Meter HP4263A or equivalent

7.3 自谐频率 Self Resonant Frequency (S.R.F)

按表 3所列条件测量时，自谐频率应符合条款 6。

S.R.F. shall meet item 6 when measured on the condition of Table 3.

Table 3

测量设备

Measuring Equipment



7.4 额定电流 Rated current

当施加允许电流（见条款 6）时，电感量变化率在±5%范围内。

Inductance change shall be within ±5% when the allowable current (which is mentioned

in item 6) is applied.

Table 4

测量设备

Measuring Equipment


直流电源 HP6632 和适配器 HP16200


DC power HP6632 and Adapter HP16200

7.5 焊接变化率 Variance after Soldering

当经过焊接条件（235ºC浸锡 5秒）后，电感量变化率≤±10%，Q值变化率≤±30%。 Inductance

change shall be within ±10% and Q factor change shall be within ±30% when the inductor is

dipped into solder for 5 seconds which is 235ºC.

Table 5

测量设备

Measuring Equipment

阻抗分析仪 HP4291 或其他；焊接炉


Solder furnace

7/22




8 信赖性试验 Reliable Performance

NO. Item Specifications Test Methods

8-1

Solder-

Ability

可焊性

More than 90% of

termination should be

covered with new

solder. 端电极焊锡面

均匀、光滑、覆盖率为

90%以上。

Solder composition: Sn 96.5% + Ag 3.0% + Cu 0.5%

soldering fluid: WHITLO GW9810A-6A or YONON 6810.

焊锡成分:锡 96.5%+银 3.0%+铜 0.5%;助焊剂(唯特偶 GW9810A-6A或

优诺 6810型).

Pretreatment: The sample shall be immersed in the soldering

fluid for ＜3 seconds.

预处理:将样品浸入助焊剂中维持＜3秒。

Test: The sample shall be immersed into a solder hot melt of

235±5℃ for ＜3 seconds.

测试:样品浸入锡温为 235±5℃的锡炉中.维持＜3秒取出

Judgement: refer to specifications(8-1),and reserve the test

sample.

判定:见(8-1)specifications栏中要求,同时保留测试样品

8-2

Leaching

Resistance

耐焊性

More than 75% of

termination Should be

covered with new

solder. 端电极焊锡覆

盖率为 75%以上.磁体

表面无裂痕、电气参数

符合定义要求.

Solder composition: Sn 96.5% + Ag 3.0% + Cu 0.5%

soldering fluid: WHITLO GW9810A-6A or YONON 6810.

焊锡成分:锡 96.5%+银 3.0%+铜 0.5%;助焊剂(唯特偶 GW9810A-6A或

优诺 6810型).

Pretreatment: The sample shall be put on the 3 to 5mm top of

the solder of ≥ 260 ℃ ,covered with case ,ensure the

temperature on the about 2 to 3mm top of the sample has reached

180±5℃ in thermometer,then preheated for 120±2 seconds.

预处理:将样品置于锡温≥260℃的焊锡表面上方 3~5mm 处,用箱体

将样品罩住,使用温度计确认箱体内靠近样品本体上方约 2~3mm 处

环境温度达到 180±5℃,维持 120±2秒.

Test: The sample shall be immersed into a solder hot melt of

≥ 260 ℃ for 10 ± 0.5 seconds. The sample shall be

refrigerated for 2 hours at room temperature after put out.The

process including pretreatment and test and refrigeration is

a periods for the same sample. in total 3 periods.

测试:预热样品浸入锡温为≥260℃的锡炉中,时间为 10±0.5 秒,样

品取出后置室温冷却 2小时;同一样品预热、测试、冷却过程为一个

周期,共进行三个周期.

8/22




Judgement: refer to specifications(8-2),and reserve the test

sample.

判定结果:见(8-2)specifications栏中要求,同时保留测试样品

8-3

Terminal

Strength

端头强度

The terminal and body

should be no damage

端头和磁体不应见损伤

Applied specified pull strength in axial direction

在轴向上施加拉力如下：

Size

Pull

Strength

(N)

Time

(s)

1005 5.0 5±1

1608 5.0 5±1

2012 10.0 5±1

3216 10.0 5±1

8-4

Bending

Strength

弯曲试验

No mechanical damage

should be noticed

不应见机械损伤

When the board curve to 2mm(0.079 inches)

当板弯曲挠度达 2mm时

8-5

Body

Strength

抗压强度

The ferrite body

should not be damaged

铁氧体磁体不应见损伤

Applied specified pull strength in axial

direction

在轴向上施加压力如下：

Size A

(mm)

P

(N)

1005 0.7 4.9

1608 1.0 4.9

2012 1.4 9.8

3216 2.0 9.8

8-6 Drop

跌落

a. No mechanical

damage shall be

noticed.

外观无可见机械损伤

b. Inductance shall

be within ±10% of

Drop 10 times on a concrete floor from a height of

1m.

从距混凝土地面 1m高度自由落下，重复 10次。

8-7 Vibration

振动

频率 Frequency: 10 to 55Hz

振幅 Amplitude: 1.52mm

方向及时间 Direction and time:

X, Y and Z directions for 2 hours each.

A (mm)[inch]

0.5[0.019] (1005)

0.7[0.028] (1608)

1.0[0.039] (2012)

2.0[0.079] (3216)

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../../../../../PRODUCTSIMAGES056.gif

../../../../../PRODUCTSIMAGES057.gif




8-8

Humidity

resistance

耐潮湿

the initial value

电感量变化率≤±10%

c. Q factor shall be

within ± 30% of

the initial value

Q值变化率≤±30%

a. 试验条件 Test condition

温度 Temp.: 55±2℃

湿度 Humidity: 90%~95%

试验时间 Test time: 500+24/-0 h

b. 测量条件 Measurement method:

试验后常温常湿环境中放置（24±2）小时后测量。

The component should be stabilized at normal

condition for (24±2) hours before test.

8-9

High

temperature

resistance

耐高温


施加额定电流 Applied rated current.

温度 Temp.: 85±2℃






8-10

Low

temperature

resistance

耐低温


温度 Temp.: -55±2℃






8-11

Thermal shock

(Temperature

cycle)

热冲击

（温度循环）


1) 温度 Temp.: -40℃, 时间 time: 30±3min

2) 温度 Temp.: +85℃, 时间 time: 30±3min

100 cycles





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9 焊接条件 Recommended Soldering Conditions

产品可用于波峰焊和回流焊

Product can be applied to flow and reflow soldering.

① 焊剂 Flux, Solder

●使用松香基助焊剂，禁止使用卤化物含量起过 0.2wt%的强酸性助焊剂。

Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding

0.2wt% (chlorine conversion value).

●焊锡成分:锡 96.5%+银 3.0%+铜 0.5%. Solder composition: Sn 96.5% + Ag 3.0% + Cu 0.5%

② 波峰焊条件 Flow soldering conditions

●预热时，产品表温与焊料温度的温差最大不允许超出 150℃，焊接完后冷却时，产品表温与

溶剂温度之间的温差最大不允许超出 100℃。预热不足有可能引发产品表面裂纹，导致产品品

质下降。Pre-heating should be in such a way that the temperature difference between

solder and product surface is limited to 150℃ max. Cooling into solvent after

soldering also should be in such a way that temperature difference is limited to 100℃

max. Unenough pre-heating may cause cracks on the product, resulting in the

deterioration of products quality.

●标准波峰焊曲线 Standard soldering profile.

③ 回流焊条件 Reflow soldering conditions

1. 常温至 150℃的升温速率为 1～4℃/sec；

The speed of rising temperature from normal condition rise to 150℃ is 1～4℃/sec；

2. 预热温度 150～180℃，时间约 60 ~ 90sec；

Pre-heating temperature: 150～180℃,Time is about 60～90sec；

3. 220℃以上保持 30sec；峰值温度为 245℃，时间持续为 12～16sec;峰值温度为

260℃，时间持续为 3～4sec；

Keep the temperature over 220℃ for 30sec；Peak value temperature is 245℃,keep

it for 12～16sec；Peak value temperature is 260℃,keep it for 3～4sec；

4. 焊接制程冷却速率为 2～10℃/sec；

预热 Pre-heating 100-120℃,86-100sec.

最高温度 Peak 270℃, 5sec. max

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The speed of reduce temperature on soldering is 2～10℃/sec；

5. 整个回流焊接工艺持续时间约 6Min.

The total time of whole craft on reflow soldering is about 6 minutes.

●标准回流焊曲线 Standard soldering profile.

手工返工 Reworking with soldering iron

当使用电烙铁进行手工焊接时，以下条件必须严格遵守 The following conditions must be

strictly followed when using a soldering iron.

预热 Pre-heating 150℃, 1 minute

尖端温度 Tip temperature 280℃ max

输出功率 Soldering iron output 30w max

电烙铁头尖端尺寸 End of soldering iron φ3mm max

焊接时间 Soldering time 3 seconds max

10 清洗条件 Cleaning Conditions

产品清洗时应遵循以下条件 Products shall be cleaned on the following conditions.

①. 清洗温度最高不超过 60℃。（若是氟化物类和酒精类清洁剂，温度最高不超过 40℃） Cleaning

temperature shall be limited to 60℃ max.(40℃ max for fluoride and alcohol type

cleaner.)

②. 为了避免印刷线路板及其上所安装器件出现共振现象，在进行超声波清洗时，应严格遵循以下

条件 Ultrasonic cleaning shall comply with the following conditions with avoiding the

resonance phenomenon at the mounted products and P.C.B.

功率 Power : 20W/t max;频率 Frequency: 28~40 kHz;时间 Time : 5 minutes max

③. 清洁剂 Cleaner

1. 可选类型 Alternative cleaner

异丙基醇 Isopropyl alcohol (IPA) HCFC-225

2. 含水剂 Aqueous agent

表面活性剂类 Surface Active Agent Type (CLEANTHROUGH 750H)

碳氢化合物类 Hydrocarbon Type (TECHNOCLEANER 335)

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Unit: mm

高分子醇类 Higher Alcohol Type (PINE ALPHA ST-100S)

碱性皂类 Alkali Saponification Type (*AQUACLEANER 240)

④. 清洗后，产品上不应有助焊剂和清洁剂驻留；若使用了含水剂，为了彻底洗去清洁剂，产品应

在去离子水冲洗后完全晾干或烘干。Thee shall be no residual flux and residual cleaner

after cleaning. In the case of using aqueous agent, products shall be dried completely

after rinse with de-ionized water in order to remove the cleaner.

⑤. 其他清洁方式 Other cleaning

请联系我们 Please contact us.

11 包装 Packaging

① 编带尺寸 Dimensions of Tape:

纸带 Paper carrier tape:

Unit: mm

MGFI1005 MGFI1608 MGFI2012 MGFI3216

A 0.8±0.15 1.1±0.15 1.6±0.15 2.0±0.2

B 1.3±0.15 1.9±0.15 2.5±0.2 3.6±0.2

C 8.0±0.3 8.0±0.3 8.0±0.3 8.0±0.3

D 3.5±0.05 3.5±0.05 3.5±0.05 3.5±0.05

E 1.75±0.1 1.75±0.1 1.75±0.1 1.75±0.1

F 2.0±0.05 4.0±0.1 4.0±0.1 4.0±0.1

G 2.0±0.05 2.0±0.05 2.0±0.05 2.0±0.05

H 2.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1

ΦJ 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0

t (max) 0.8±0.05 1.0±0.05 1.1±0.05 1.1±0.05

② 带轮尺寸 Dimensions of Reel

A 178±2

B 60±1

C 13.0±0.5

D 21.0±0.8

E 2.0±0.5

W 10.0±1.0

t 1.20±0.5

R 1.0±0.25

③ 编带抗拉强度 Pulling strength of tapes:

Reel material: PS (Polystyrene)

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载带 Carrier tape 10N or more (1kgf or more)

上盖带 Cover tape 5N or more (1kgf or more)

④ 编带简图及拉伸方向 Taping figure and drawing direction:

⑤盖带的剥离强度 Peeling strength of cover tape:

测试条件 Test condition:

1) 剥离角度 peel angle: 165°~180° vs. carrier tape.

2) 剥离速度 peel speed: 300mm/min±10%.

⑥包装箱盒尺寸 Box and case dimensions

unit: mm

Type L1 L2 L3

Box 180±2 180±2 75±1

Box 180±2 180±2 120±2

Case 400±2 400±2 200±2

a. 6 reels in a box. 10 boxes in a case.

一盒六盘，一箱十盒。

b. 10 reels in a box. 6 boxes in a case.

一盒十盘，一箱六盒。

盖带 Cover tape 0.3~0.7N (30gf~70gf)

编带材料 Tape material:

基带 Base tape: 纸带 cardboard

盖带 Cover tape: 聚乙烯 polyethylene

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⑦包装数量 Packaging quantities:

Type Chip’s thickness

mm Bulk Tape and reel

MGFI1608 0.8±0.15 ---- 4000pcs

MGFI2012 0.85±0.2 ---- 4000pcs

1.25±0.2 ---- 3000pcs

MGFI3216 1.1±0.3 ---- 3000pcs

⑧包装要求 Packaging Requirements

型号

Type

产品尺寸

Dimensions

(mm)

纸箱尺寸(mm)

Carton Size

装箱数量

Packing

Quantity

堆栈层数

Stack

Layer

纸箱抗压

Compressi

ve

Strength

耐破

Bursting

Strength

纸箱材质

Carton

Material

包装后整箱

毛重

Packaged

Weight

1005 0.5±0.15

400³200³400 240KPCS 8 >600Kgf >16Kgf/cm2 K=K 10.2Kg


260³200³200 80KPS 12 >600Kgf >16Kgf/cm2 K=K 3.6Kg

1608 0.8±0.15




2012 0.85±0.20




12 装箱清单及标志 Packing documents and marking

1. 包装文件 Packing documents

Packing include the following:

a. 装箱清单 Packing list.

b. 合格证书 Certificate of compliance.

2. 盘上标记 Marking on reels:

a麦捷料号 MICROGATE Part No.

b生产批号 Lot number

c盘装数量 Quantity per reel

d检验员号 Inspector No.

以上内容必须在标签上注明.All above shall be shown on marking label

麦捷公司标签如下所示：MICROGATE marking label will be as following:

Label

Reel

15/22




生产计划序号 Sequence Number

生产计划月份 Month

生产计划年份 Year

麦捷公司生产编号如下列所示:MICROGATE Lot number will be as per the following example:

生产性质：F：铁氧体料；H：表示陶瓷料；T：表示新产品试产

F: Ferrite H: Ceramic T: New Trial-Production

检验合格后，检验员在标签上盖上合格章。合格章如下所示：The eligible reels will be pressed

a mark onto the surface. The mark will be as following:

3. 内包装盒标记:Marking on inner box

a. 型号 MICROGATE part No.

b. 每盒数量 Quantity per box

c. 包装日期 Date

d. RoHS料件(标示 TPV标准蓝色 RoHS 印章，RoHS 料件见右图)

以上内容必须在标签上注明。Above shall be shown on marking label

4．外包装箱标记 Marking on outer case:

QC

PASSED

01

MG PART NO

MICROGATE

CUSTOMER: P. O. NO

CUSTOMER PART NO: DATE CODE LOT NO

MG PART NO: QUANTITY INSP. NO

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1) 制造商 Manufacturer: “MICROGATE” ①

“中国深圳制造” “Made in Shenzhen²CHINA”②

2) 发运标记 Ship marking:

“向上” “UP”, “小心轻放”“HAND CARE”,

“防潮”“MOISTURE-PROOF”.

3) 包装标签包括以下内容 Packing label include the following:

a. 型号 MICROGATE Part No

b. 总数量 Total quantity per case

c. 包装日期 Date;

4）RoHS 料件(标示 TPV 标准蓝色 RoHS印章。

RoHS 料件见右下图)

以上内容必须在标签上注明。

All above shall be shown on marking label.

13 保管 Storage

①. 保管期限 Storage period

距麦捷出厂检验时间六个月内，产品可以使用；检验时间可以通过包装外侧标记的检验号确

认；若时间超出六个月，应检查焊接性能后方可使用。Products which inspected in MICROGATE

over 6 months ago should be examined and used, which can be confirmed with inspection

No. marked on the container. Solderability should be checked if this period is exceeded.

②．保存条件 Storage conditions

●存放货物的库房应满足以下条件 Products should be storage in the warehouse on the

following conditions

温度 Temperature: -10 ~+ 40℃

湿度 Humidity : Less than 80% relative and humidity

不允许温、湿度有极剧变化。No rapid change on temperature and humidity

●禁止将产品保管在腐蚀性物质中，例如硫磺、氯气或者酸，否则将引起端头氧化，导致降

低焊接性。Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid,

or it may cause oxidization of electrode, resulting in poor solderability.

●为了避免受潮气、灰尘等物质的影响，产品应保管于货架上。Products should be storaged

CASE

17/22




on the palette for the prevention of the influence from humidity, dust and so on.

●产品保管在库房中时，应避免热冲击，振动以及直接光照等等。Products should be storaged

in the warehouse without heat shock, vibration, direct sunlight and so on.

●产品应密封包装 Products should be storaged under the airtight packaged condition.

14 奥素系难燃剂的使用情况 Usage of Nonflammable Material

对于以下所列物质，我司在生产过程中绝不使用，最终成品中也绝不含用。For these materials

listed below, we don’t use in process.

镉、汞、砷及其化合物，PCB等等。Cd, Hg, As and its compound, PCB, etc.

PBBS, PBBOs, PBDO, PBDE, PBB.

15 ODS 的使用情况 Usage of ODS

对于以下所列的 ODS物质，我司在生产过程中绝不使用，最终成品中也绝不含有。For ODS listed

below, we don’t use in process.

四氧化碳，HCFC 等等。ODS: CCL4, HCFC, etc. ODS。

16 阻燃级别 Flammability Class

UL 94V-1

17 注意事项 Note

①.本纳入仕样书保证我司产品作为一个单体时的质量情况。当我司产品被安装到贵司产品上时，

请保证贵司的产品已根据贵司的规范进行了有效评价和确认。 This product specification

guarantees the quality of our product as a single unit. Please make sure that your product

is evaluated and confirmed against your specifications when our product is mounted to your

product.

②．如果贵司对我司产品的例用已超过了本测试规范所界定的产品功能，那么对于由此引发的失效，

我司将不予保证。 We cannot warrant against failure caused by any use of our product that

deviates from the intended use as described in this product specification.

③．请加盖接受同意章，并在本测试规范提交日后两个月内传回或寄回复印件。如果在以上期限内

未收到复印件，将被默认为已被接受。 Please return our copy of this product specification

in two month after issued date with your signature of receipt. If the copy is not returned

by the date, this product specification will be deemed to have been received.

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Documents

SPEC & TEST Check List - ows2.tpv-tech.comows2.tpv-tech.com/e_mp/uploadfile/specification/201511/T0000058600/... · 深圳市麦捷微电子科技有限公司 地址：深圳市宝安区观澜镇高尔夫大道裕兴路

SPEC & TEST Check List - ows2.tpv-tech.comows2.tpv-tech.com/e_mp/uploadfile/specification/201511/T0000058600/... · 深圳市麦捷微电子科技有限公司地址：深圳市宝安区观澜镇高尔夫大道裕兴路