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WEBINAR:Semiconductor Super Cycle - Market Trends, Drivers and Forecasts
9 November, 2017
Webinar Agenda
• 5:00 – 5:05 pm CET/ 8:00 – 8:05 am PSTIntroduction by Denada Hodaj, Sales Manager SEMI Europe
• 5:05 – 5:35 pm CET/ 8:05 – 8:35 am PST• Presentation by Lara Chamness
Senior Market Analyst Manager, SEMI Industry Research and Statistics
• 5:35 – 5:45 pm CET/ 8:35 – 8:45 am PSTQ&A Session
• 5:45 pmAdditional Resource and Contact Information
Denada HodajSales Manager, SEMI EuropeTel: +33 4 56 52 94 45Mob: +33 6 45 68 34 87Email: [email protected]
Denada HodajSales Manager, SEMI EuropeTel: +33 4 56 52 94 45Mob: +33 6 45 68 34 87Email: [email protected]
Empowering Innovation and Shaping the Value Chain
Attending SEMICON Europa in Munich?
Feel free to request a meeting, contact:
Christian Gregor DieseldorffSenior Analyst, Director of Market ResearchSEMI Industry Research & StatisticsTel: 1.408.943.7949 Email: [email protected]
• Industry Outlook and Forecast for Fab Spending and Capacity 12:05 pm, Tuesday, November 14, 2017 @ 21st Fab Management Forum
• 200mm Fabs Still Flexing Muscles10:05 am, Wednesday, 15 November 2017 @ Market Briefing
• Semiconductor Global Market Forecast and Trends Overview11:45 am, Thursday, 16 November 2017 @ SEMI Global Expositions
WEBINAR:Semiconductor Super Cycle - Market Trends, Drivers and Forecasts
Lara ChamnessSenior Manager Market Analysis
November 9, 2017
Presentation Outline
• About Us
• Industry Overview
• Fabs, Equipment, & Materials
• 200 mm
• China
• Summary
About Us, SEMI
7
SEMI Connects the Electronics Manufacturing Supply Chain for Collaboration
Substrates
Materials
Components
Subassemblies
Equipment IP
Design
Fabless
Device Manufacturing
PackagingTest
System Integration
Applications
Collaboration segmentsAfter January 2018
Special Interest Groups:• Semiconductor Components,
Instruments and Subsystems (SCIS)• Chemcial and Gas Manufacturers
Group (CGMG)• SEMI integrated Packaging,
Assembly and Testing (SiPAT)8
About SEMI Industry Research & Statistics
• The SEMI Industry Research and Statistics group provides market data and market research reports to serve customers in device manufacturing, semiconductor processing equipment, components, materials, semiconductor packaging materials, and etc.
• Our Mission is to delivering authoritative, accurate, relevant, and unbiased market data to our members, covering the semiconductor and related manufacturing supply chains
• For our major reports, we collect actual data from suppliers around the world following strict professional standards of confidentiality. Our reports provide trends, forecast, and outlook to help the industry make important investment, strategic, and business planning decisions.
• For additional information regarding our products and SEMI data collection program, please visit us at www.semi.org/marketinfo or contact us at [email protected].
9
SEMI Market Data Reports and Databases
Fab Forecast Semiconductor, MEMS &
Sensors, LED, Power Devices
• SEMI FabView New Update
• World Fab Forecast Nov,
17
• World Fab Watch
• Global 200mm Fab Outlook to 2021New!
• Opto/LED Fab Forecast
• Opto/LED Fab Watch
• Customized Fab Reports
• Worldwide OSAT Manufacturing Sites Database New!
• Global Semiconductor Packaging Materials Outlook Coming soon!
• China Semiconductor Packaging Market Outlook TBD
Device Packaging and Testing Market
Material MarketSemiconductor
Materials
• Material Market Data Subscription Update
• Photomask Characterization Report Update
• Silicon Reclaim Wafer Characterization Update
• Mass Flow Controllers Report Update
Equipment & Component Market
• Equipment Market Data Subscription• Semiconductor Equipment
Market Statistics (WWSEMS)
• New Equipment Forecast
• SEMI Secondary Fab Equipment Report TBD
• Mass Flow Controller Market Statistics
Globalfoundries
• SEMI China IC Industry Outlook 2017 New! - a comprehensive report and database containing in-depth analysis of China’s wide-ranging IC manufacturing ecosystem within the global semiconductor industry.
10
Industry OverviewIndustry Overview
Electronics Supply Chain
Equipment
Materials
Semiconductors
Electronic End Equipment
2016Forecast
2017
US$41B US$54B
US$1,493BUS$1,457B
US$344B US$401B
US$44B US$47B
• The US$1.5 Trillion electronics end Market is enabled by almost US$400 Billion in semiconductor products
• Semiconductor materials and equipment represent a >US$90 Billion industry that allows semiconductor device makers to provide advanced device and packaging technologies.Source: IC Insights, SEMI, September 2017
Copyright © 2017 SEMI®. All Rights Reserved12
Industry Trends and Growth Drivers
• Expect a Strong 2017 With Numerous Applications Driving Growth Through 2025
Applications
Storage*
Industrial*
Wireless
Automotive*
Consumer
*Long-term Revenues
Largest Growth Products in 2017Memory
(DRAM due to strong pricing)
Sensors
Opto Electronics
Analog Devices
Discretes
Long Term Forecast to 2025
IoT * $16B -> $62B
Automotive* $32B -> $51B
5G ** $0B -> $20B
AR/VR*** $4B -> $131B
AI*** $5B -> $50B
* Semiconductor value** Network/Devices*** Market Size
Source: SEMI Industry Strategy Symposium, January 2017 Virtual Reality (VR)Augmented Reality (AR)AI Artificial Intelligence (AI)
• Robust volume shipments and higher ASPs for Memory are driving strong 2017 revenue growth.• Storage, industrial, wireless, and automotive applications are also contributing to strong 2017 growth.• Connectivity, data centers, communications, automotive, and advanced software will spur strong demand for
semiconductors through 2025.
Copyright © 2017 SEMI®. All Rights Reserved14
Year-to-Date “Snapshot”: Up across the board and record levels
0% 10% 20% 30% 40% 50%
Silicon Shipments
IC Leadframes
IC Units
Mass Flow Controllers
Equipment Billings
% Y-o-Y Change
Year-over-Year Growth Comparison through September
Source: SEMI and SIA/WSTS
Copyright © 2017 SEMI®. All Rights Reserved
Semiconductor Industry Outlook2017 soars past $400 billion
Source: IC Insights, October 2017
$0
$100
$200
$300
$400
$500
2011 2012 2013 2014 2015 2016 2017F
US$
Billi
ons
Semiconductor Revenue
Copyright © 2017 SEMI®. All Rights Reserved
2018 Semiconductor Forecasts
Cowan LRA (Oct 17), 3.3%
Gartner (Oct 17), 4.0%
WSTS (Aug 17), 4.3%
IHS Markit (Oct 17), 5.4%
IC Insights (Jul 17), 7.0%
Semico Research (Jul 17), 7.8%
Future Horizons (Sep 17), 16.0%
0% 2% 4% 6% 8% 10% 12% 14% 16% 18% 20%
Source: SEMI, October 2017
Average = 6.8%
Copyright © 2017 SEMI®. All Rights Reserved
Fabs, Equipment and Materials
Semiconductor Wafer Fab Migration to Asia-Pacific
• In 2000, Asia-Pacific-based companies (excluding Japan) represented less than 30% of the installed semiconductor fab capacity globally. China’s installed fab capacity was just 2%
• With strong growth and investments by foundries and memory in Asia-Pacific, these companies now have 50% of the installed capacity base, with a 12% share for China 12%
Source: SEMI World Fab Forecast
Americas, 14%
China, 12%
Europe, 8%
Japan, 18%
Korea, 19%
SE Asia, 7%
Taiwan, 22%
2016 Capacity Distribution
Americas, 24%
China, 2%
Europe, 16%Japan, 32%
Korea, 11%
SE Asia, 4% Taiwan, 11%
2000 Capacity Distribution
Copyright © 2017 SEMI®. All Rights Reserved18
$0
$10
$20
$30
$40
$50
$60
1987
1988
1989
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
E
Equipment $B Materials $B
Total Equipment Revenue vs. Total Material Revenue Trends
Source: Equipment: SEMI/SEAJ, SEMI EMDSMaterials: Rose and Associates 1987-1999, SEMI, MMDS August 2017
200 mm ramp
“IrrationalExuberance”
300 mm ramp
Copyright © 2017 SEMI®. All Rights Reserved
Equipment Trends Over Time
59%67% 68% 70%
75% 79% 80%
23%
20% 19% 16%10%
9% 9%9%7% 8% 6% 10% 7% 7%
9% 5% 5% 8% 5% 5% 4%
0%
20%
40%
60%
80%
100%
1991 1995 2000 2005 2010 2015 2017 YTD 2017F 2018F
Wafer Processing Equipment Total Test Assembly & Packaging Other Front End*
Forecast will be
released next month
Source: SEMI EMDS* Includes: Fab Facilities, Mask/Reticle, and Wafer Manufacturing Equipment
$8.9B $24.0B $47.7B $32.9B $39.9B $36.5B $35.5B ~$47B $???B
Copyright © 2017 SEMI®. All Rights Reserved
25%21%
27% 24% 26%
15%14%
15% 21%24%
24%
24%18% 16%
16%
19%21% 22% 20% 15%
11%14% 10% 11% 12%
5% 7% 8% 7% 8%
0%
20%
40%
60%
80%
100%
2000 2005 2010 2015 2017 YTD
Deposition (CVD, Sputter, & Other) Etch Equipment Other Wafer Process Equipment*Expose & Write Equipment Inspection & Measurement Equipment Surface Conditioning/Clean & Dry Equipment
Wafer Processing Equipment Trends Over Time
* Includes: CMP, Ion Implant, Resist Processing Equipment, Thermal Processing, and Other Wafer Processing EquipmentSource: SEMI EMDS
Copyright © 2017 SEMI®. All Rights Reserved
2000-2017YTD Average = 21%
21
Regional Semiconductor Materials Market
China15.1%
Europe7.1%
Japan14.6%
Korea16.2%
North America11.1%
Taiwan22.5%
ROW13.3%
2017F = $46.7 Billion
Source: SEMI, MMDS August 2017Totals may not add due to rounding
China3.6%
Europe9.9%
Japan26.9%
Korea10.5%
North America18.5%
Taiwan15.8%
ROW14.8%
2003 = $23.5 Billion
Copyright © 2017 SEMI®. All Rights Reserved22
Silicon versus Organic Substrates Revenues
$0
$2,000
$4,000
$6,000
$8,000
$10,000
$12,000
$14,000
2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017F
Rev
enue
s (U
S$ M
illion
s)
Silicon Organic Substrates
Silicon revenues do not include SOI or reclaimed silicon
Source: SEMI, MMDS August 2017
Copyright © 2017 SEMI®. All Rights Reserved23
Global Silicon Wafer Diameter Trends
Source: Rose Associates 1978 to 1995; SEMI SMG 1995 to 2016; MMDS August 2017
Copyright © 2017 SEMI®. All Rights Reserved24
200mm
200mm Fab Capacity Trends by Wafer Size
Copyright © 2017 SEMI®. All Rights Reserved
200mm Fab Expansion and New Construction Drivers
• Over 70% of all IC content in automobiles, mobile devices, and wearables are made on =< 200mm wafers
• Increase content in smart phones.• Example iPhone 6 Plus: About 75% of its chips are made on 200mm wafers
Mobile and WirelessAutomotiveIoTIndustrialWearables and Health
Analog and Mixed SignalPower managementSensors and MEMSLogic/MCUDiscretes
Global 200mm Fab Outlook, July 2017. Copyright © 2017 SEMI®. All Rights Reserved. 27
Trend: Fabs Become Larger (Again)
More capacity per fab
Largest Fabs in wpm:
1995: 25K-30K (Japan, Europe)2001: 45K-50K (Korea, Taiwan, Europe)2007: 100K-140K (Korea, Japan)2010: 80K-110K (Korea, Taiwan, Europe)2015: 100K-140K (Taiwan, Europe, Korea, China, SE Asia)2021*: 100K-140K (Taiwan, SE Asia, China, Europe, Korea)
*China by 2021: most China fabs are about 50-60K
Size matters until a certain point
Fabs have maxed out capacity potential:Since about 2015, most fabs are running at 100% utilization with no slowdown in sight
Copyright © 2017 SEMI®. All Rights Reserved28
Capacity Changes by Product Type
Change 2016 to 2021MEMS 60%Discrete 22%Power 19%Analog 15%Foundry 11%Logic 6%MPU 0%Other 0%
Source: 200mm Fab Outlook, July 2017, SEMI
MEMS makes big leap
4Q15 to 4Q21
Driven mainly by mobile and wireless, IOT, automotive, the 200mm market is thriving
Copyright © 2017 SEMI®. All Rights Reserved29
Capacity Changes by Region
4Q15 to 4Q21
Change 2016 to 2021China 48%SE Asia 35%Americas 15%Japan 5%Taiwan 5%Europe & Mideast 4%Korea 0%Source: 200mm Fab Report, July 2017, SEMI
China is adding most capacity
Copyright © 2017 SEMI®. All Rights Reserved
30
China
1702
1920
23132176
2307 2271
326
534
877
609693 614
1376 1386 14361567 1613 1657
$0
$500
$1,000
$1,500
$2,000
$2,500
2011 2012 2013 2014 2015 2016
US$
Milli
ons
Import Export Trade Deficit
Dominated by Imports - Semiconductors are China’s No. 1 Import, Resulting in Large Trade Deficit
Source: China Customs, SEMI April 2017
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.32
China National IC Industry Development Guideline国家纲要目标及达成度分析
2015 Goal 2020 GoalTotal Revenue > 350 Billion RMB > 870 Billion RMB (CAGR > 20%)
IC Design Part of key area technologies approach international first class level (e.g. mobile smart terminal, network communication)
Key area technologies achieve international leading edge (e.g. mobile smart terminal, network communication, cloud computing,IOT, big data, etc.)
Packaging & Test Mid- to high-end revenue > 30% revenue Technology to achieve international leading edge
IC Manufacture 32/28nm mass production 16/14nm mass production
Materials 300mm silicon wafer into production line Enter global supply chain
Equipment 65-45nm key equipment into production line
Enter global supply chain
Source: SEMI, July 2017
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved. 33
52%
11%
45%
13%
9%
19%21%
35%
24%
0%
10%
20%
30%
40%
50%
60%
0
1800
2008 2009 2010 2011 2012 2013 2014 2015 2016
IC Design 设计业 YoY Rate %
IC Design Sector is Booming with 20+% Growth Rate 中国集成电路设计保持高速发展
2008-2016年CAGR = 22%
Unit:100M RMB
单位:亿元人民币
Source: CSIA, SEMI, April 2017
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.34
-1%
-20%
26%
55%
6% 6%
14%10% 13%
-30%
-20%
-10%
0%
10%
20%
30%
40%
50%
60%
0
1800
2008 2009 2010 2011 2012 2013 2014 2015 2016
Packaging&Test 封测业 YoY Rate %
China IC Packaging and Test Grows Steadily中国集成电路封装测试业稳步成长
2008-2016年CAGR = 12%Unit:100M RMB
单位:亿元人民币
Source: CSIA, SEMI, April 2017
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.35
New Fab Projects – China Leads the Way中国主导全球新建产线趋势
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.51
Silicon24%
Electronic Gases19%
Photoresists & Ancilliaries
16%
Other**41%
Wafer Fabrication Materials
32%
Packaging Materials68%
2016 China Material Market by Segment2016中国半导体材料分类市场
Leadframes25%
Substrates23%Bonding Wire
21%
Other *31%
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.
Packaging Materials Other* includes: Ceramic packages, Encapsulation Resins, Die Attach Materials, Solder Balls, and Wafer Level DielectricsWafer Fab Materials Other** includes: Photomasks, Process Chemicals, Sputtering Targets, CMP, low k dielectrics, copper plating solutions, dielectric precursors, organometallic precursors, other substrates, etc
75
China Domestic Equipment Suppliers Cannot Meet Market Demand中国半导体本土供应商的设备自给率非常低
5%
6%
8%
7%
0%
1%
2%
3%
4%
5%
6%
7%
8%
$0
$7
2013 2014 2015 2016
US$
Billi
ons
China market Local Supplier sales
Source: SEMI/SEAJ, CEPEA, May 2017 *China Market refers to SEMI WWSEMS by China region*Domestic supplier sales refer to CEPEA statistics, including ~20% export.
SEMI China IC Industry Outlook 2017, Version 18, October 2017. Copyright © 2017 SEMI®. All Rights Reserved.38
Summary
• Status of the Industry• Record Year for device and fab and equipment spending• Materials up but selling prices under pressure
• 200 mm• Fabs are at max capacity• Large growth in MEMS, Discrete, Power and Analog segments• China is adding the most fab 200mm fab capacity
• China• Emerging is a world player in the semiconductor manufacturing ecosystem• IC Design has overtaken Packaging & Test• Many new fab projects (200 mm & 300 mm)• Materials market is growing and will shift to more fab materials• Equipment suppliers advancing but still can’t meet domestic demand
Q&A
Webinar Agenda
• 5:00 – 5:05 pm CET/ 8:00 – 8:05 am PSTIntroduction by Denada Hodaj, Sales Manager SEMI Europe
• 5:05 – 5:35 pm CET/ 8:05 – 8:35 am PST• Presentation by Lara Chamness
Senior Market Analyst Manager, SEMI Industry Research and Statistics
• 5:35 – 5:45 pm CET/ 8:35 – 8:45 am PSTQ&A Session
• 5:45 pmAdditional Resource and Contact Information
Denada HodajSales Manager, SEMI EuropeTel: +33 4 56 52 94 45Mob: +33 6 45 68 34 87Email: [email protected]
China IC Industry Outlook 2017 with Supply Chain Database
POLICIES – ECOSYSTEM – INVESTMENTS - CAPACITIES
Segmented Market Details
Forward Analysis
Opportunities and Challenges
To Request a Sample Report
www.semi.org/china-ic-industry-outlook
To order, call SEMIGlobal Customer Service at1.877.746.7788 (toll free)
Connect to the Trends in 200mm and Grow Your Business
Global 200mm capacity is growing and approaching levels close to those last seen in 2007, driven by demand for mobile, Internet of Things (IoT) devices, sensors, MEMS, analog devices, power semiconductors, and other applications suited for 200mm production.
Is your business ready to take advantage of the boom in 200mm manufacturing?
To Request a Sample Report
http://www.semi.org/200mm-outlook-report-sample
To order, call SEMIGlobal Customer Service at1.877.746.7788 (toll free)
Connect to the Latest Fab Details with SEMI World Fab Forecast
Past, Present, and Future Outlook
IDM, Foundry, Discrete and Power, Opto/LED, and MEMS
To Request a Sample Report
www.semi.org/world-fab-forecast-sample
To order, call SEMIGlobal Customer Service at1.877.746.7788 (toll free)
To Request a Sample Report
http://info.semi.org/semi-equipment-market-data-
subscriptionTo order, call SEMI
Global Customer Service at1.877.746.7788 (toll free)
Worldwide benchmark for the semiconductor equipment market• Monthly global billings report for North American based equipment manufactures
• Detailed monthly worldwide semiconductor equipment market statistics (WWSEMS) report for 22 categories to 7 “ship-to” market regions
• Bi-annual Semiconductor equipment forecast
Connect to the Worldwide Semiconductor Materials Markets and Trends
Annual market revenues by 7 “ship-to” regions for • 9 segments for wafer fab related materials• 7 segments for packaging related materials
2 in-depth reports• Silicon reclaim and photomask characterization reports
To Request a Sample Report
www.semi.org/semi-materials-market-data-
suscriptionTo order, call SEMI
Global Customer Service at1.877.746.7788 (toll free)
Past, Present, and Future Forecast
Empowering Innovation and Shaping the Value Chain
Thank You for Joining Us!
The presentation link will be emailed to you.
Questions about SEMI Market Data?Please contact us at [email protected]