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AUO Proprietary & Confidential
OLED Manufacturing OLED Manufacturing ProcessProcess
AUO Proprietary & Confidential
宋志峰宋志峰 經理經理
OLED OLED 技術處技術處, , 友達光電友達光電
Apr. 25Apr. 25thth, 2004, 2004
AUO Proprietary & Confidential
Gro
wth
rate
For example : CRT vs LCD ; Dram vs Flash
Gro
wth
rate
For example : LCD vs OLED
Taiwan’s maker
???
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AUO Proprietary & Confidential
Source : Annual Display Search US FPD Conference 2004
050
100150200250300350400450
Rev
enue
(mill
ion
US
D)
Others 2.1 2.6 3.3 3.3 3.3
Industrial 2.6 18.5 30.2 52.6 97.1
Car Audio 83.7 131.5 190.1 189.4 193.6
Mobile phone-Sub 26.4 101.4 127.7 108.1 116.4
Automotive - - 0.8 3.4 3.1
2002 2003 2004 2005 2006
Source : iSuppli OLEDs conference 2004
OLED市場是否能繼續成長端看AMOLED何時遞補??
AUO Proprietary & Confidential
LTPS-OLED LTPS-LCD
2003 : 2003 : World First Commercial AMOLED DisplayWorld First Commercial AMOLED DisplayKodak DSCKodak DSC
2004 : 2004 : World 2nd Commercial AMOLED DisplayWorld 2nd Commercial AMOLED DisplaySony Sony ClieClie PDAPDA
曇花一現的AMOLED!
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AUO Proprietary & Confidential
“贏利無望!”先鋒放棄有源型有機EL面板業務【日經BP社報道】
先鋒將放棄開展有源矩陣型有機EL面板業務。這是2005年12月8日先鋒集團業務結構改革發佈會宣佈的。今後將研究如何有效利用現有專利,準備繼續進行有源型產品的研發。
三洋電機退出有機EL業務 “將考慮出售”相關設備【日經BP社報道】
三洋電機日前宣佈將退出有機EL面板業務。由該公司與美國柯達合資成立的、旨在生產和銷售有機EL面板的SK顯示器公司將撤銷雙方的合資關係。對於退出有機EL面板業務的理由,三洋電機解釋說:“這是根據公司中期經營計劃對業務進行選擇與集中的結果,目的是進一步向核心業務進行集中。”
AUO Proprietary & Confidential
LPL、三星SDI宣佈加碼投資AMOLED產線
近來平面顯示器面板大廠先後發佈,加碼投資主動式有機電激發光顯示器(AMOLED)的消息,樂金飛利浦(LG. Philips LCD;LPL)計劃在坡州興建1條5.5代AMOLED生產線,在此同時,三星SDI(Samsung SDI)亦向外界宣佈,將投資4.5億美元擴增AMOLED產能,顯示儘管在TFT LCD和PDP面板技術成熟並漸成主流之際,廠商對於AMOLED市場的投資動作仍未停歇。
LPL與柯達合作發展AMOLED面板【電子時報】
據彭博資訊(Bloomberg)報導,TFT LCD面板大廠樂金飛利浦(LG. Philips LCD;LPL)與柯達(Eastman Kodak)日前達成初步協議,將合作研發有機電激發光二極體(OLED)面板。由於三洋電機日前甫宣佈退出OLED市場,而原與三洋電機(Sanyo Electric)擁有OLED合資關係的柯達,旋即與LPL促成合作契機,OLED面板合縱版圖勢必將再現變動。
主角登場了主角登場了!!!!
4
AUO Proprietary & Confidential
友達AMOLED產品明年可望問市【電子時報 2005/11/25】
友達(2409)2006年主動式有機電激發光顯示器(AMOLED)產品將開始小幅量產,友達副總經理盧博彥表示,2005年底友達將會有小量的AMOLED產品開始送樣給客戶,2006年開始陸續會有一些產品開始問市。盧博彥表示,AMOLED顯示效果佳,且不需要背光模組可以做得十分輕薄,在中小尺寸市場有其利基。不過目前AMOLED量產技術仍需要一段時間的發展,其良率及生產成本才能與TFT LCD在市場上競爭。
在參加了工研院電子所舉辦的「前瞻顯示技術論壇」上,盧博彥表示,他對於三星SDI(Samsung SDI)資深研發副總鄭昊鈞所談,關於三星SDI在AMOLED量產技術的努力,覺得心有戚戚焉,因為雖然每一項有關於技術的改進都只是輕描淡寫地帶過,但是背後事實上都代表了大量的研發經費與人力,而友達在AMOLED技術的發展過程,確實也遭遇到同樣艱辛的挑戰,因此聽來特別有感覺。
對於AMOLED受到TFT LCD技術發展快速的威脅,盧博彥認為,倘若AMOLED技術早在10〜15年前被開發出來,那麼這個技術現在必然會是獨霸市場的顯示技術,因為AMOLED的顯示效果確實是十分地討人喜歡。不過過去幾年由於TFT LCD的技術快速發展,AMOLED確實也面臨很大的壓力。
盧博彥表示,友達看好AMOLED的技術潛力,但對於AMOLED的發展不敢貪心,先以小量出貨為主。盧博彥表示,事實上2006年整個AMOLED市場的產品量應該還不是很明顯的起來,畢竟AMOLED的技術發展完全成熟仍需要一段時間。同時盧博彥也表示,目前AMOLED最重要的課題仍是在於如何在這幾年趕緊把技術快速提升,否則面臨TFT LCD的追趕,未來市場必然更受擠壓。
AUO Proprietary & Confidential
AgendaAgenda
1. AMOLED v.s. TFT-LCD
2. Manufacturing Process
3. Challenge of OLED
4. AMOLED Development in AUO
5. Summary
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AUO Proprietary & Confidential
q Different pixel design
q Enough current supply to drive OLEDq Good stability of TFTs
LC×
VcomScan
Data
OLED
V1
V2
Scan
Data
TFT Request for OLED TFT Request for OLED
AUO Proprietary & Confidential
TFT-LCD
AMOLED
Cover glass
FPC
Desiccant
FrameTFTPolarizer
Structure of TFTStructure of TFT--LCD & AMOLED LCD & AMOLED
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AUO Proprietary & Confidential
Ø OLED replaces liquid crystal, color filter and backlight unit
Ø The module thickness of OLED smaller than 2.1 mm.
Cover glass
FPC
Desiccant
FrameTFTPolarizer
Main Components of AMOLED Main Components of AMOLED
AUO Proprietary & Confidential
Polarizer1/4 λ Retardation Retardation Film
GlassITO
Glass
Metallic Pole
Org. Layer
Dark Bright
1/4λcircularpolarizer
Circular Circular Polarizer Polarizer for OLED for OLED
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AUO Proprietary & Confidential
0.250
1.000
0.250
0.0850.100
0.550
0.065
Top PFColor filter (0.5t)TFT glass (0.5t)Bottom PFGap (built up by shielding tap)Reverse (downward) prism sheet
Light guide plate (flat type)
Reflector
0.280
1.200
Circular polarizerTFT glass (0.5t)Cover glass (0.7t)
Thickness (mm)MaterialsStructureItems
HO
US
ING
FR
AM
E
0.6mm height
2.3mm
Tran
sfle
ctiv
e LC
D
disp
lay
Act
ive
Mat
rix O
LED
D
ispl
ay
HOUSING FRAME
1.48mm
è thinner form factor
Thinner Form FactorThinner Form Factor
AUO Proprietary & Confidential
OLED LCD
0
50
100
150
200
250
-80 -60 -40 -20 0 20 40 60 80
View angle
Brig
htne
ss (c
d/m
2 )
1.93 AM LCD
AU-OLED
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
-80 -60 -40 -20 0 20 40 60 80
View angle
Con
trast
ratio
1.93 AM LCDAU-OLED
Virtually no viewing angle problem
Contrast ~2 orders of LCD
Wide Viewing Angle & High ContrastWide Viewing Angle & High Contrast
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AUO Proprietary & Confidential
Superior Viewing AngleSuperior Viewing Angle
Co ntra st ratio
0
2 00
4 00
6 00
8 00
10 00
12 00
-100 -50 0 50 100
ang les from n or.
C.R
.
LCD
OLED
Int. Vs viewing angles (White)
0
0.2
0.4
0.6
0.8
1
1.2
-100 -80 -60 -40 -20 0 20 40 60 80 100
angles to normal( deg.)
int.
(a.
u.) LCD
OLED
0.2
0.4
0.6
0.8
1
30
210
60
240
90
270
120
300
150
330
180 0
AMOLED AMOLED
TFTLCD_MVATFTLCD_MVA
AUO Proprietary & Confidential
AMOLED only shows few advantage than LCD
Performance Comparison Performance Comparison
Contrast ratio
Response time
Viewangle
Power consumptionLifetime
Cost
Thickness& Weight
TFT-LCD AMOLED
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AUO Proprietary & Confidential
AgendaAgenda
1. AMOLED v.s. TFT-LCD
2. Manufacturing Process
3. Challenge of OLED
4. AMOLED Development in AUO
5. Summary
AUO Proprietary & Confidential
Color FilterLiquid Crystal Backlight module
OLED process
a-Si TFT array process Cell process Module process
AMOLEDAMOLED
TFTTFT--LCDLCD
Extra equipment for LTPS process
AMOLED Process Flow AMOLED Process Flow
Majority of investment (~80%) is in place for AMOLED manufacturing
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AUO Proprietary & Confidential
Substrate pre-treating
OLED Deposition
OLED Encapsulation
TFT arrayprocess
Panel Module
OLED Process Flow OLED Process Flow
AUO Proprietary & Confidential
Substrate cleaning
Baking
cooling
UV Ozone cleaning& O2 plasma
Substrate pre-treating
OLED Deposition
OLED Encapsulation
particleCathode
OLEDITO
Short circuit
Yield Killer Yield Killer –– Point DefectsPoint Defects
Substrate PreSubstrate Pre--treatment treatment
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AUO Proprietary & Confidential
Substrate cleaning
Baking
Invert and cooling
UV Ozone cleaning& O2 plasma
Substrate pre-treating
OLED Deposition
OLED Encapsulation
ITO Anode§ High work function§ Smooth surface
4.7 eV
5.1 eV
Substrate PreSubstrate Pre--treatment treatment
AUO Proprietary & Confidential
HIL deposition
HTL deposition
EML deposition
ETL deposition
Cathode deposition
Substrate pre-treating
OLED Deposition
OLED Encapsulation
Substrate
Emitting layer
Hole transport layer
Hole injection layerAnode
Electron transport layer
Cathode
⊕ ⊕ ⊕ ⊕ ⊕ ⊕ ⊕ ⊕ ⊕
Light emitting
Optimized OLED structure
OLED Deposition OLED Deposition
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AUO Proprietary & Confidential
Red color change material development
High efficient white emitter1. Fine pitch process2. Mass production
Problem
Higher efficiency than color filterNo differential aging
Easier processEasier scale up
Low power consumptionHigher color saturation
Advantage
IdemitsuTDK, Sony, KodakPioneer, SNMD ,Sony, AUOMaker
Full color technology
R G B R G B R G B
Separate RGB pixel White emitter+ color filter
Blue emitter+ color change medium
FullFull--color Patterning color Patterning
AUO Proprietary & Confidential
EvaporatorTFT driver TFT driver TFT driver
TFT driver TFT driver TFT driver
TFT driver TFT driver TFT driver
Shadow mask
The accuracy of shadow mask and alignment system is very critical
Shadow Masking ProcessShadow Masking Process
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AUO Proprietary & Confidential
Display pixel
Design rule for mask : (traditional pixel design)Hole width > 50 µm ; Bridge > 40µm è Resolution < 170 ppi
> 50 umφ
Realhole
d > 40um
Limitations of ResolutionLimitations of Resolution
AUO Proprietary & Confidential
Shadow Mask for OLEDShadow Mask for OLED
HIL deposition
HTL deposition
EML deposition
ETL deposition
Cathode deposition
Substrate Pre-Treating
OLED Deposition
OLED Encapsulation
Shadow mask issue —Materials:Low CTE < 1 ppm/oCEx: G 3.5 shadow maskà 610x720 mmTemperature variation à < 5oCMask expansion è 3.6 µmProcess:Etching type or electron formingAccuracy < +/- 5µmGood taper < 45°
For large size:Mask difficult to manufactureAlignment accuracy hard to achieve
TFT driver TFT driver TFT driver
TFT driver TFT driver TFT driver
TFT driver TFT driver TFT driver
Shadow mask
45º
+/-5µm
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AUO Proprietary & Confidential
Cover-glass clean
UV clean
Desiccant attach
Glue dispensing
Encapsulation
Substrate Pre-Treating
OLED Deposition
OLED Encapsulation
Functions• Environmental protection• Moisture-free cavity• Mechanical support
UV glueCover glass
Desiccant
OLED EncapsulationOLED Encapsulation
AUO Proprietary & Confidential
cover
glass
metal X (bending, adhesion)
○
•Photo mask•Cost
•Less micro-crack•High strength
Wet etching
•High cost•More micro-crack•Weak strength
•Suitable for large size or asymmetric patternMicro blasting
DisadvantagesAdvantagesManufacturing Process
CoverCover--glass for OLEDglass for OLED
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AUO Proprietary & Confidential
量測面
32.2mm
10mm
10mm
0.8
6.2
0
2
4
6
8
10
F1 F2 M1 M2
Stre
ngth
(Kg)
代號 F1 F2 M1 M2
Condition 鈉玻璃量
噴砂面
鈉玻璃量
玻璃面
Etch玻璃Etch面
Etch玻璃玻璃面
The measured sample is cover-glass only
CoverCover--glass for OLEDglass for OLED
AUO Proprietary & Confidential
LiquidunknownChemicalKodak
CaOChemicalSaes getter
SrOChemicalGore-Tex
CaOChemicalDynic
NotesMaterialAbsorption TypeCompany
Desiccant for OLEDDesiccant for OLED
Poor encapsulation
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AUO Proprietary & Confidential
Future requirement
•Feature :Slim factor( < 0.6 mm)Low cost
Simple manufacturePotentially flexible
•Feature :Slim factor ( < 1mm )Low cost potentially flexible
•Feature :Stable and reliable processThickness ~1.61mm
PassivationPassivation plus Encapsulation
Glass Encapsulation
OLED
Glass cap
Desiccant
UV glue
OLED
Polymer
Insulator
OLED
Passivation layerGlass or plastic
UV glue
New Approach for EncapsulationNew Approach for Encapsulation
AUO Proprietary & Confidential
Enc.(305x360)
Cutting CT-1 Beveling Clean
PolarizerAttach
AutoClaveCT-2Package
Module Process
Process Flow for CellProcess Flow for Cell
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AUO Proprietary & Confidential
MCOG
OLED Cell
Light-onTest-1
白膠&FPC膠 Burn-in
Light-onTest-2
FrameOutlineInspectionPackage
Customer
Process Flow for ModuleProcess Flow for Module
AUO Proprietary & Confidential
AgendaAgenda
1. AMOLED v.s. TFT-LCD
2. Manufacturing Process
3. Challenge of OLED
4. AMOLED Development in AUO
5. Summary
18
AUO Proprietary & Confidential
q Performance-wiseDifferential agingImage sticking
q Manufacture-wiseYield : >97% for small size display
Scale-up : G3.5 àG5 à….
Cost : same as LCD
Challenge of OLEDChallenge of OLED
AUO Proprietary & Confidential
0.5
0.6
0.7
0.8
0.9
1
1.1
0 Time (hrs)
Brig
htne
ss (a
.u.)
RedGreenBlue
0.25
0.27
0.29
0.31
0.33
0.35
0.37
0.39
0
Time (hrs)
CIE
CIE(x)CIE(y)
Differential aging among
RGB
Blue color is the bottleneck
Differential AgingDifferential Aging
Color balance shifts with time due to the shorter lifetime of blue color
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AUO Proprietary & Confidential
Differential Aging ImprovementDifferential Aging Improvement
1. Improve blue lifetime2. Balance RGB lifetime
lifetime
brig
htne
ss
lifetimebr
ight
ness
Change
Emitting area
AUO Proprietary & Confidential
AUO AUO
after stress
Images sticking
400 hrs continuously stress
Solutions
2-line icons
+128x128 pixel
Reduce continuous usage of icons (lower brightness or fixed icons)
Improve display lifetime
Image StickingImage Sticking
20
AUO Proprietary & Confidential
particleCathode
OLEDITO
Short circuit
Because the organic film is very thin, very small particle still can form the short circuit between anode and cathode
For small size panel, any point defect can not acceptable
Yield Killer_Dead PixelYield Killer_Dead Pixel
AUO Proprietary & Confidential
particleCathode
OLEDITO
Short circuit
Vdd
Vss
Redundant Pixel DesignRedundant Pixel Design
With redundant pixel design, single dark defect is negligible
21
AUO Proprietary & Confidential
evaporatedrange
evaporating source
substrate
deposited film (OLED)
new evaporation equipment with higher material utilization ratio
local material vendors
recycle of residues in chamber
Cost Down for Organic MaterialsCost Down for Organic Materialsmodification of OLED recipe
AUO Proprietary & Confidential
Material usage ratio: ~3%
H
H/2~2H/3
H/3
Material usage ratio: 8~10%(based on TS)
Materials Utilization Ratio IssueMaterials Utilization Ratio Issue
OLED material is very expensive, and the materials utilization ratio is low.
22
AUO Proprietary & Confidential
AgendaAgenda
1. AMOLED v.s. TFT-LCD
2. Manufacturing Process
3. Challenge of OLED
4. AMOLED Development in AUO
5. Summary
AUO Proprietary & Confidential
OLED TimelineOLED Timeline
97 98 99 00 01 02 03 04 05 06
PMOLED ProductAMOLED Product
Japan started
Korea entered
Japan started SKD-DSC
AUO R&D team established
World first a-Si AMOLED Double Sided AMOLED
Sony PDATaiwan entered
AUO entered
23
AUO Proprietary & Confidential
OLED ActivitiesOLED Activities
OLED Depositing Equipment
ATC
Location§ R&D line : 200x200 mm, 100x100mm)
§ L3B Fab (Pilot-line )
§Design center –
AUO Technology Center 5F
§RD Employee : 53
AUO Proprietary & Confidential
11stst AMOLED for MobileAMOLED for Mobile--PhonePhone
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AUO Proprietary & Confidential
12/21/2001
World First Double Sided AMOLED
10/20/2004
FPD International ‘04
Ultra Fast Speed in AMOLED R&DUltra Fast Speed in AMOLED R&D
[Product: 2006] 2“ mobile-phone
application
10/30/2002
FPD International 2005
270PPI High Resolution AMOLED
10/30/2002
FPD International 2002World First a-Si
AMOLED Prototype
[Product: 2004] 2“ DSC
application
9/14/2001
4” a-Si prototype
7/19/2001
4” a-Si prototype
AUO Proprietary & Confidential
AgendaAgenda
1. AMOLED v.s. TFT-LCD
2. Manufacturing Process
3. Challenge of OLED
4. AMOLED Development in AUO
5. Summary
25
AUO Proprietary & Confidential
SummarySummary
q Where is the market ?Small mobile display e.g. cell phoneHigh end product
q Success in the futureContinuous improvement on lower power consumption Maturity on manufactureLower cost TV application
AUO Proprietary & Confidential