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KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr1
2017. ㈜ 코썸사이언스
To.
KORTherm Science Co.,Ltd.www.kortherm.co.kr
Optimization Of Laser Processes And Parameters
Laser Systems Supplier
KOS’s Services
Modification And Enhancement Of Laser Beam Delivery Systems
Training And Special Courses
Laser Micromachining On Demand
Mechanical And Electrical Enhancements
Advice On Laser, Machinery And Special Engineering
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr
- Scan Mode
- Fixed Optic Mode
- Flying Optic Mode
- MOTF
3
Laser Processing Mode
Wavelength UV(355nm) Green(532nm) IR(1064nm)
Spot Size Scan Mode(f-Theta Lens) 15~20 ㎛ 25~40 ㎛ 45~60 ㎛
Fixed Optic Mode(Projection Lens)
~10 ㎛ 15~20 ㎛ ~35 ㎛
* Spot Size at focused position D
fMd
24
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr
1. Scan mode without vision system(Compact type/Scan Mode)
2. Scanner with On-axis vision system(Scan Mode)
3. Scanner with Off-axis vision system(Scan Mode)
4. Direct Writing(Fixed Optic Mode)
5. Direct Writing & Scan Mode (Dual mode system)
6. Flying Optic Mode(Interface with Scanner; MOTF)
7. Large scan field with CO2 laser system(2.5D/3D)
8. µ-Fab 2000 ; both Excimer and Nd-YAG laser
KOS’s Products
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr5
1. Scan Mode(u-Lab) without vision system: compact type for laboratory
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr6
Fixed Optic Mode Fiber Laser (1080nm)
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr7
Laser Doping Machine (CW 15W, 532nm)
KORTherm Science Co.,Ltd.www.kortherm.co.krwww.kortherm.co.kr KORTherm Science Co.,Ltd.
Laser Beam
ShaperBeam
ExpanderMirror
Laser doping system using CW laser(532nm)
KORTherm Science Co.,Ltd.www.kortherm.co.krwww.kortherm.co.kr KORTherm Science Co.,Ltd.
Gaussian - Beam intensity profilebefore shaping
UniformBeam intensity profile after shaping
Function of beam shaper/Homozenizer
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CW Laser
Low M2
Gaussian Profile
Square imageSquare top hatCollimated
Beam
Beam
Shaper
Beam
Expander
Scanner Or
Focusing LensMask & Aperture
Unit
① ②
③
④
KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr11
ObjectiveCamera adapter
Controller IlluminationIllumination
1 Camera adapter objective
2 Camera filter
3 Beam splitter
4 Galvo mirrors
5 Camera chip Calibration plate
Scan head
3
Camera
Laser
KORtherm®
PC
5
1
24
Beam delivery of the on-axis vision system
KORTherm Science Co.,Ltd.www.kortherm.co.kr12
Scanner with On axis vision system(Scan mode)
On-axis vision
illumination
scanner
Dichroic element
Camera optical pathLaser beam path
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Features of on-axis/off-axis vision system
Intelligent image processing for the automation and monitoring
of laser processes!
1. Automatic localization of workpieces
2. Adaptation of the laser process to the part position and rotation
3. Immediate quality inspection during and after the laser process
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Scanner with Off axis vision system(Scan Mode)
Camera optical pathLaser beam path
Off-axis vision
180mm x 180mm 이상의 대면적 Sample 가공 가능
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Dedicated vision software (Self-Development)
µ-LAB Advanced has the dedicated software of the off-axis machine vision system
(2-cameras). This multi-functional software allows not only image detection also
quality control through live imaging marking.
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Motorized Stage (X-Y)
Wafer (Solar Cell)
CCD Camera
Z-axis Stage
Displacement Sensor
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Single Mode with 1064nm 100W
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Scanner head
F-theta lensVacuum
chuck
Alignment
camera
Inspection
camera
Evacuation
chamber
Assist gas nozzle
Evacuation
chamber
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µ- wafer scribing tool(Scan Mode)TMFab
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4. Direct Writing (Fixed Optic Mode)
Cutting head (Fixed)
Motion stage (Moving)
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Laser Water Jet(Fixed Optic Mode)
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DPSS LaserHomogenizerScanner
X,Y,Z,Θ - Stage
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Wafer Cutting Machine with transfer robot
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Beam delivery of the dual mode system
5. Dual Mode System
KORTherm Science Co.,Ltd.www.kortherm.co.kr25
5-1. Direct writing & Scan mode (µ-Fab): Dual Mode system
KORTherm Science Co.,Ltd.www.kortherm.co.kr26
Dual Mode with Pico Second Laser(1064nm)
3D Profiler
Scan Mode
Fixed Optic Mode Motion Stage (4 Axis : X, Y, Z, Θ)
KORTherm Science Co.,Ltd.www.kortherm.co.kr27
KORTherm Science Co.,Ltd.www.kortherm.co.kr28
Pico Second Laser (1064/532nm) : Dual Mode(S and F)
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µ-FAB Series(For PV Solar)
KORTherm Science Co.,Ltd.www.kortherm.co.kr30
Dual mode with Pico Second Laser (1064/532nm)
Scanner
532nm Laser1064nm Laser
Fixed Optic Stage
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Pico Second Laser with 532/1064nm wavelength
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UV
Green
NIR
Pico Second Laser (3λ)
Motion Stage
M1
M2
M3
M4
M5
Rotary Chuck
Scanner
Projection Lens
Standard for Multi-purpose Custom Oriented (Option)
Scanning Area : 100x100mm²Projection Area : 250x250mm²
Vision Camera
Off-Axis Camera
Scan Mode Direct Writing Mode
MOTF
Pico Second Laser System for using 3 wavelength selectively
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Beam wavelength 355nm (UV)
Average power 20W at 40kHz
Max. Area(mm) 560 x 690 x 1panel
XY축 이송속도(mm/min) 50,000
Frequency(kHz) 30-150
Scan Area(mm) 50 X50
Hole size(µm) >20µm
Drilling speed(100um)> 300hole/sec(via hole for double side FPCB)
Scanning speed 2000pps
Registration accuracy <10um
Beam Mode Changer Punch/Trepanning
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KOS-SF_ RBS Drilling system(Dual Mode)
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Beam delivery unit & Load/Unload
Fixed Optic
Galvano scanner
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Laser beam path
Dual Mode system
Scan Mode
Fixed Optic Mode
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Flying Optic Mode (Air Bearing Based/MOTF)
Air Bearing Motion Stage
X Axis
Y Axis
Homogenizer
Z Axis
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– ITO Patterning for thin film solar
– FPD Patterning
– Black matrix patterning for LCD
Large panel laser patterning system
KORTherm Science Co.,Ltd.www.kortherm.co.kr38
Flying Optic Mode
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Roll to Roll(MOTF)
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Laser Controller
Front View of Typical Mark on the Fly Configuration
Laser Head
Lens
Marking Field
Conveyor Belt
Part
Cycle Start
Sensor
Laser Beam Active Area
encoder
Encoder Feedback D약ㄷㅇㄹ
Direction ofLine Movement
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Roll to Roll(MOTF-UV)
Hole 윗면 focusing
6.98 μm
1.58 μm
10 μm
가공된 윗면 모습
가공된 단면 모습
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ROLL TO ROLL - LASER(CO2)
1.과제
가공 Film 재질 및 가공형태
748mm
1
8
1
8
ROLL
140mm
90mm
20mm
83µm
PETPE
AㅣPE
12um
15um
7um
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Work piece
1
8
1
8
ROLL11m/s
160mm
3m/s(180m/Min)
Laser(Co2)
Focusingoptics
sm5.29)(258.10112311 22 원위치가공속도s
m
800mm
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Working distance(we defined)
7. Large scan field with CO2 laser system(2.5D/3D)
✓ Applying 3D scanner✓ Adjusting beam focusing
: 250mm~1500mm✓ Scan field
: 100x100㎟~1250x1250㎟✓ Spot size depends on the
working distance. : 200um~1 or 2 mm
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9. µ-Fab 2000 ; both Excimer and Nd-YAG laser
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9. Vision Alignment with Cross-Mark
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9. Vision Alignment with Motion Control
KORTherm Science Co.,Ltd.www.kortherm.co.kr48
**발췌자료: Technical report“Subsurface precision machining of glass substrates by innovative lasers”, Keming Du 외, EdgeWaveGmbH(Germany)
레이저 빔 파장대에 따른 매질의 흡수율 그래프
20
40
60
80
0.2 0.4 0.6 1 2 3 5 7 10
ExcimerND:YAG/YVO₄ CO₂
Ab
sorp
tion A
in %
Wavelength λ in µm
Absorption of different materials as a function of the wavelength.
Transition metalsFe, Ni, Wo, Mo
glass
Other metalsAu, Ag, Al, Cu
8-1. Reference :Wavelength & Material
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What is the most important factor for processing a material?
1. Wavelength Selection : Light Absorption Rate in material
2. Laser parameter : Pulse Energy, Pulse Width, Repetition RatePeak Power, Average Power
3. Scanning Speed : Flying Optic, Fixed Optic, Scanning Optic
4. Fluence(J/cm²) : Beam shaping
8-2. Important factors in Laser Material Processing
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Laser 가공을 위한 Parameters ?
1. Pass
2. Scanning Speed
3. Pulse Energy
4. Repetition Rate
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10. Gallery (가공 예시) - Polymer
Scribing of IMI film on GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 500mm/s
Cutting of polymerWavelength: 1064nmPulse energy: Rep rate: 40kHzProceeding speed : 300mm/s
Film ReleaseWavelength: 532nm
Hole Drilling(on the PI film)Wavelength: 355nm
FTO Patterning (FTO on glass)Wavelength: 1060nm
FTO Patterning(on the PI film)Wavelength: 1080nm
PET Easy CutWavelength: 355nm
ITO Patterning (on the PET film)Wavelength: 355nm
PET Film CuttingWavelength: 10.6 μm
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Polyimide Film ReleaseWavelength: 532nm
PET Film CuttingWavelength: 355nm
PET Film CuttingWavelength: 355nm
FTO Release (FTO on glass)Wavelength: 355nm
Polyimide Film CuttingWavelength: 355nm
ITO Scribing (Including Ag)Wavelength: 355nm
ABS Hole DrillingWavelength: 355nmThickness: 2.8mm
Polaroid Film PatterningWavelength: 355nm
ITO Scribing (Ag Including)Wavelength: 355nm
10. Gallery (가공 예시) - Polymer
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PMMA CuttingWavelength: 10.6 μm
Acrylic Resin PatterningWavelength: 10.6 μmThickness: 5mm
PI Film DrillingWavelength: 355nm
ITO Patterning Wavelength: 1,080nm(PICO Laser)
Ag Film Punching(Ag & Polymer Film)Wavelength: 10.6 μm
PI Film DrillingWavelength: 355nm
10. Gallery (가공 예시) - Polymer
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Ceramic Film PatterningWavelength: 532nm
Ceramic HoleWavelength: 10.6 μm
Solar Cell Wafer DopingWavelength: 532nm
LED CELLWavelength: 532nm
Scribing of CeramicWavelength: 1080nm
Solar cell Wafer Edge isolation Wavelength : 532nm
Wafer DopingWavelength : 532nm
Si Wafer DrillingWavelength : 532nm
Si Wafer Align KeyMarkingWavelength: 355nm
10. Gallery (가공 예시) - Wafer (Ceramic)
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Drilling of Si-WaferWavelength: 1064nmPulse energy: Rep rate: 10kHzProceeding speed : 20mm/s
Edge Isolation of Si SolarcellWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Removal of CIGS on Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Removal of TCO on CIGS + Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Si Wafer Round CuttingWavelength: 532nmThickness: 520 μm
Si Wafer Pattern CuttingWavelength: 532nm
Silicone Sheet HoleDrillingWavelength: 355nm
AIN Wafer HoleDrillingWavelength: 355nm
Si Wafer Pattern CuttingWavelength: 532nm
10. Gallery (가공 예시) - Wafer (Ceramic)
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Patterned Si-Wafer Cutting(Membrane Pattern)Wavelength: 355nm
ARC Ablation(Anti-Reflective Coating)Wavelength: 355nmPulse energy:
Si Wafer CuttingWavelength: 532nm
Green Sheet Scribing(Unfired Ceramic Sheet)Wavelength: 532nm
Si Wafer Full CuttingWavelength: 532nm
LGBC Scribing (Laser Grooved Buried Contracts)Wavelength: 355nm
Fired Ceramic Sheet(Via Hole)Wavelength: 355nm
Si Wafer PatterningWavelength: 532nm
Si Wafer ScribingWavelength: 532nm(Scanner Type)
10. Gallery (가공 예시) - Wafer (Ceramic)
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Via HoleWavelength: 355nm
Ferrite CompoundCutting(Cross-Section)Wavelength: 355nmThickness: 150μm
Scribing of ZnOon glassWavelength: 532nm
Removing of ZnO on GlassWavelength: 355nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s
Metal on PETWavelength: 10.6μm
SUS Thin Film Hole DrillingWavelength: 355nm
Metal Hole DrillingWavelength: 355nm
Cu Thin Film DrillingWavelength: 355nm
Mo Scribing(Solar Cell Thin Film)Wavelength: 532nm
10. Gallery (가공 예시) - Metal
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Tungsten-Carbide Hole Drilling(Via Hole)Wavelength: 355nm
Wafer DopingWavelength : 532nm
Gold Thin FilmPatterning(Inner Transparent & Flexible PDMA Film)Wavelength: 532nm
Mo (Molybdenum)Thin Film Hole DrillingWavelength: 355nm
Tungsten-Carbide & Nickel Complex Hole Drilling(Via Hole)Wavelength: 355nm
Mg Surface PatterningWavelength: 355nm
Tantalum (Ta)Hole DrillingWavelength: 532nm
Cu Wafer CuttingWavelength: 532nm
Aluminium Oxide Wafer Hole DrillingWavelength: 355nm
10. Gallery (가공 예시) - Metal
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SUS ScribingWavelength: 355nm
Cathode/Anode Electrode Cutting(Copper & Aluminium)Wavelength: 355nmThickness: 25μm
AluminiumThrough Line PatterningWavelength: 532nm
Si Wafer Metal Layer AblationWavelength: 355nm
Invar Steel (Fe-NI) ScribingWavelength: 355nm
SUS420J2 ScribingWavelength: 355nm
Pure Mg Cutting(Magnesium)Wavelength: 355nm
Ag Coated GdBCO on STS Cutting(Cross-Section) Wavelength: 355nm
Metal Oxide Film AblationWavelength: 532nm
10. Gallery (가공 예시) - Metal
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Au Pad Full ScribingWavelength: 355nm
Copper Foil Hole DrillingWavelength: 532nm
Back Electrode Film Ablation (ZnO on the Glass)Wavelength: 355nm
10. Gallery (가공 예시) - Metal
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Graphite PatterningWavelength: 355nm
Artificial Diamond PatterningWavelength: 532nm
Graphene CuttingWavelength: 355nm
Quartz Hole Patterning(Via Hole)Wavelength: 355nm
Scribing of GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s
Hole Drillingon the Aluminium
Wavelength : 355nm
Glass PatterningWavelength: 355nm
Quartz PatterningWavelength: 355nm
Carbon Disk Hole Drilling(100% Carbon)Wavelength: 355nm
10. Gallery (가공 예시) - Etc.
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Quartz Micro-HoleDrilling(Cross-Section)Wavelength: 355nm
Epoxy Resin PatterningWavelength: 10.6μm
Quartz ScribingWavelength: 10.6μm
Slide Glass CuttingWavelength: 355nm
Sapphire Micro-HoleDrillingWavelength: 355nmThickness: 420μm
Soda-Lime Glass HoleScribing (Via Hole)
Wavelength : 355nm
Superconductor GdBCO Thin Film Scribing(Cross-Section)Wavelength: 355nm
Superconductor GdBCO Thin Film Hole Drilling(Through Hole)Wavelength: 355nm
Flexible Gorilla Glass CuttingWavelength: 355nm
10. Gallery (가공 예시) - Etc.
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Sapphire Wafer Cutting(Cross-Section)Wavelength: 355nm
PMN-PT Patterning(Piezoelectric Element)Wavelength: 532nm
Sapphire Wafer ScribingWavelength: 355nm
Gold/Pt/CVD Diamond Pattern Scribing(Using Edge Alignment)Wavelength: 355nm
Glass Full CuttingWavelength: 355nmThickness: 0.5T
Glass Microwire CuttingWavelength: 355nm
Quartz Thin Film CuttingWavelength: 355nm
10. Gallery (가공 예시) - Etc.
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인천광역시 부평구 청천동 425 우림라이온스밸리 C동 1203B호TEL. 032)623-6320~4 FAX. 032)623-6325 e-mail : sales1@kortherm.co.kr
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