To. 2017. ㈜코썸사이언스 · 2017-07-20 · KORThermScience Co.,Ltd.-Scan Mode -Fixed Optic Mode-Flying Optic Mode-MOTF3 Laser Processing Mode Wavelength UV(355nm) Green(532nm)

KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr1

2017. ㈜ 코썸사이언스

To.

KORTherm Science Co.,Ltd.www.kortherm.co.kr

Optimization Of Laser Processes And Parameters

Laser Systems Supplier

KOS’s Services

Modification And Enhancement Of Laser Beam Delivery Systems

Training And Special Courses

Laser Micromachining On Demand

Mechanical And Electrical Enhancements

Advice On Laser, Machinery And Special Engineering

KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr

- Scan Mode

- Fixed Optic Mode

- Flying Optic Mode

- MOTF

3

Laser Processing Mode

Wavelength UV(355nm) Green(532nm) IR(1064nm)

Spot Size Scan Mode(f-Theta Lens) 15~20 ㎛ 25~40 ㎛ 45~60 ㎛

Fixed Optic Mode(Projection Lens)

~10 ㎛ 15~20 ㎛ ~35 ㎛

* Spot Size at focused position D

fMd

24

KORTherm Science Co.,Ltd.www.kortherm.co.kr KORTherm Science Co.,Ltd.www.kortherm.co.kr

1. Scan mode without vision system(Compact type/Scan Mode)

2. Scanner with On-axis vision system(Scan Mode)

3. Scanner with Off-axis vision system(Scan Mode)

4. Direct Writing(Fixed Optic Mode)

5. Direct Writing & Scan Mode (Dual mode system)

6. Flying Optic Mode(Interface with Scanner; MOTF)

7. Large scan field with CO2 laser system(2.5D/3D)

8. µ-Fab 2000 ; both Excimer and Nd-YAG laser

KOS’s Products


1. Scan Mode(u-Lab) without vision system: compact type for laboratory


Fixed Optic Mode Fiber Laser (1080nm)


Laser Doping Machine (CW 15W, 532nm)

KORTherm Science Co.,Ltd.www.kortherm.co.krwww.kortherm.co.kr KORTherm Science Co.,Ltd.

Laser Beam

ShaperBeam

ExpanderMirror

Laser doping system using CW laser(532nm)


Gaussian - Beam intensity profilebefore shaping

UniformBeam intensity profile after shaping

Function of beam shaper/Homozenizer


CW Laser

Low M2

Gaussian Profile

Square imageSquare top hatCollimated

Beam

Beam

Shaper

Beam

Expander

Scanner Or

Focusing LensMask & Aperture

Unit

① ②

③

④


ObjectiveCamera adapter

Controller IlluminationIllumination

1 Camera adapter objective

2 Camera filter

3 Beam splitter

4 Galvo mirrors

5 Camera chip Calibration plate

Scan head

3

Camera

Laser

KORtherm®

PC

5

1

24

Beam delivery of the on-axis vision system

KORTherm Science Co.,Ltd.www.kortherm.co.kr12

Scanner with On axis vision system(Scan mode)

On-axis vision

illumination

scanner

Dichroic element

Camera optical pathLaser beam path

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Features of on-axis/off-axis vision system

Intelligent image processing for the automation and monitoring

of laser processes!

1. Automatic localization of workpieces

2. Adaptation of the laser process to the part position and rotation

3. Immediate quality inspection during and after the laser process


Scanner with Off axis vision system(Scan Mode)

Camera optical pathLaser beam path

Off-axis vision

180mm x 180mm 이상의 대면적 Sample 가공 가능


Dedicated vision software (Self-Development)

µ-LAB Advanced has the dedicated software of the off-axis machine vision system

(2-cameras). This multi-functional software allows not only image detection also

quality control through live imaging marking.

www.kortherm.co.kr KORTherm Science Co.,Ltd.

Motorized Stage (X-Y)

Wafer (Solar Cell)

CCD Camera

Z-axis Stage

Displacement Sensor


Single Mode with 1064nm 100W

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Scanner head

F-theta lensVacuum

chuck

Alignment

camera

Inspection

camera

Evacuation

chamber

Assist gas nozzle

Evacuation

chamber


µ- wafer scribing tool(Scan Mode)TMFab


4. Direct Writing (Fixed Optic Mode)

Cutting head (Fixed)

Motion stage (Moving)


Laser Water Jet(Fixed Optic Mode)


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DPSS LaserHomogenizerScanner

X,Y,Z,Θ - Stage


Wafer Cutting Machine with transfer robot


Beam delivery of the dual mode system

5. Dual Mode System


5-1. Direct writing & Scan mode (µ-Fab): Dual Mode system


Dual Mode with Pico Second Laser(1064nm)

3D Profiler

Scan Mode

Fixed Optic Mode Motion Stage (4 Axis : X, Y, Z, Θ)



Pico Second Laser (1064/532nm) : Dual Mode(S and F)


µ-FAB Series(For PV Solar)


Dual mode with Pico Second Laser (1064/532nm)

Scanner

532nm Laser1064nm Laser

Fixed Optic Stage


Pico Second Laser with 532/1064nm wavelength


UV

Green

NIR

Pico Second Laser (3λ)

Motion Stage

M1

M2

M3

M4

M5

Rotary Chuck

Scanner

Projection Lens

Standard for Multi-purpose Custom Oriented (Option)

Scanning Area : 100x100mm²Projection Area : 250x250mm²

Vision Camera

Off-Axis Camera

Scan Mode Direct Writing Mode

MOTF

Pico Second Laser System for using 3 wavelength selectively


Beam wavelength 355nm (UV)

Average power 20W at 40kHz

Max. Area(mm) 560 x 690 x 1panel

XY축 이송속도(mm/min) 50,000

Frequency(kHz) 30-150

Scan Area(mm) 50 X50

Hole size(µm) >20µm

Drilling speed(100um)> 300hole/sec(via hole for double side FPCB)

Scanning speed 2000pps

Registration accuracy <10um

Beam Mode Changer Punch/Trepanning


KOS-SF_ RBS Drilling system(Dual Mode)


Beam delivery unit & Load/Unload

Fixed Optic

Galvano scanner



Laser beam path

Dual Mode system

Scan Mode

Fixed Optic Mode


Flying Optic Mode (Air Bearing Based/MOTF)

Air Bearing Motion Stage

X Axis

Y Axis

Homogenizer

Z Axis


– ITO Patterning for thin film solar

– FPD Patterning

– Black matrix patterning for LCD

Large panel laser patterning system


Flying Optic Mode


Roll to Roll(MOTF)


Laser Controller

Front View of Typical Mark on the Fly Configuration

Laser Head

Lens

Marking Field

Conveyor Belt

Part

Cycle Start

Sensor

Laser Beam Active Area

encoder

Encoder Feedback D약ㄷㅇㄹ

Direction ofLine Movement


Roll to Roll(MOTF-UV)

Hole 윗면 focusing

6.98 μm

1.58 μm

10 μm

가공된 윗면 모습

가공된 단면 모습


ROLL TO ROLL - LASER(CO2)

1.과제

가공 Film 재질 및 가공형태

748mm

1

8

1

8

ROLL

140mm

90mm

20mm

83µm

PETPE

AㅣPE

12um

15um

7um


Work piece

1

8

1

8

ROLL11m/s

160mm

3m/s(180m/Min)

Laser(Co2)

Focusingoptics

sm5.29)(258.10112311 22 원위치가공속도s

m

800mm


Working distance(we defined)

7. Large scan field with CO2 laser system(2.5D/3D)

✓ Applying 3D scanner✓ Adjusting beam focusing

: 250mm~1500mm✓ Scan field

: 100x100㎟~1250x1250㎟✓ Spot size depends on the

working distance. : 200um~1 or 2 mm


9. µ-Fab 2000 ; both Excimer and Nd-YAG laser


9. Vision Alignment with Cross-Mark


9. Vision Alignment with Motion Control


**발췌자료: Technical report“Subsurface precision machining of glass substrates by innovative lasers”, Keming Du 외, EdgeWaveGmbH(Germany)

레이저 빔 파장대에 따른 매질의 흡수율 그래프

20

40

60

80

0.2 0.4 0.6 1 2 3 5 7 10

ExcimerND:YAG/YVO₄ CO₂

Ab

sorp

tion A

in ％

Wavelength λ in µm

Absorption of different materials as a function of the wavelength.

Transition metalsFe, Ni, Wo, Mo

glass

Other metalsAu, Ag, Al, Cu

8-1. Reference :Wavelength & Material


What is the most important factor for processing a material?

1. Wavelength Selection : Light Absorption Rate in material

2. Laser parameter : Pulse Energy, Pulse Width, Repetition RatePeak Power, Average Power

3. Scanning Speed : Flying Optic, Fixed Optic, Scanning Optic

4. Fluence(J/cm²) : Beam shaping

8-2. Important factors in Laser Material Processing


Laser 가공을 위한 Parameters ?

1. Pass

2. Scanning Speed

3. Pulse Energy

4. Repetition Rate


10. Gallery (가공 예시) - Polymer

Scribing of IMI film on GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 500mm/s

Cutting of polymerWavelength: 1064nmPulse energy: Rep rate: 40kHzProceeding speed : 300mm/s

Film ReleaseWavelength: 532nm

Hole Drilling(on the PI film)Wavelength: 355nm

FTO Patterning (FTO on glass)Wavelength: 1060nm

FTO Patterning(on the PI film)Wavelength: 1080nm

PET Easy CutWavelength: 355nm

ITO Patterning (on the PET film)Wavelength: 355nm

PET Film CuttingWavelength: 10.6 μm


Polyimide Film ReleaseWavelength: 532nm

PET Film CuttingWavelength: 355nm

PET Film CuttingWavelength: 355nm

FTO Release (FTO on glass)Wavelength: 355nm

Polyimide Film CuttingWavelength: 355nm

ITO Scribing (Including Ag)Wavelength: 355nm

ABS Hole DrillingWavelength: 355nmThickness: 2.8mm

Polaroid Film PatterningWavelength: 355nm

ITO Scribing (Ag Including)Wavelength: 355nm



PMMA CuttingWavelength: 10.6 μm

Acrylic Resin PatterningWavelength: 10.6 μmThickness: 5mm

PI Film DrillingWavelength: 355nm

ITO Patterning Wavelength: 1,080nm(PICO Laser)

Ag Film Punching(Ag & Polymer Film)Wavelength: 10.6 μm

PI Film DrillingWavelength: 355nm



Ceramic Film PatterningWavelength: 532nm

Ceramic HoleWavelength: 10.6 μm

Solar Cell Wafer DopingWavelength: 532nm

LED CELLWavelength: 532nm

Scribing of CeramicWavelength: 1080nm

Solar cell Wafer Edge isolation Wavelength : 532nm

Wafer DopingWavelength : 532nm

Si Wafer DrillingWavelength : 532nm

Si Wafer Align KeyMarkingWavelength: 355nm

10. Gallery (가공 예시) - Wafer (Ceramic)


Drilling of Si-WaferWavelength: 1064nmPulse energy: Rep rate: 10kHzProceeding speed : 20mm/s

Edge Isolation of Si SolarcellWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s

Removal of CIGS on Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s

Removal of TCO on CIGS + Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s

Si Wafer Round CuttingWavelength: 532nmThickness: 520 μm

Si Wafer Pattern CuttingWavelength: 532nm

Silicone Sheet HoleDrillingWavelength: 355nm

AIN Wafer HoleDrillingWavelength: 355nm

Si Wafer Pattern CuttingWavelength: 532nm



Patterned Si-Wafer Cutting(Membrane Pattern)Wavelength: 355nm

ARC Ablation(Anti-Reflective Coating)Wavelength: 355nmPulse energy:

Si Wafer CuttingWavelength: 532nm

Green Sheet Scribing(Unfired Ceramic Sheet)Wavelength: 532nm

Si Wafer Full CuttingWavelength: 532nm

LGBC Scribing (Laser Grooved Buried Contracts)Wavelength: 355nm

Fired Ceramic Sheet(Via Hole)Wavelength: 355nm

Si Wafer PatterningWavelength: 532nm

Si Wafer ScribingWavelength: 532nm(Scanner Type)



Via HoleWavelength: 355nm

Ferrite CompoundCutting(Cross-Section)Wavelength: 355nmThickness: 150μm

Scribing of ZnOon glassWavelength: 532nm

Removing of ZnO on GlassWavelength: 355nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s

Metal on PETWavelength: 10.6μm

SUS Thin Film Hole DrillingWavelength: 355nm

Metal Hole DrillingWavelength: 355nm

Cu Thin Film DrillingWavelength: 355nm

Mo Scribing(Solar Cell Thin Film)Wavelength: 532nm

10. Gallery (가공 예시) - Metal


Tungsten-Carbide Hole Drilling(Via Hole)Wavelength: 355nm

Wafer DopingWavelength : 532nm

Gold Thin FilmPatterning(Inner Transparent & Flexible PDMA Film)Wavelength: 532nm

Mo (Molybdenum)Thin Film Hole DrillingWavelength: 355nm

Tungsten-Carbide & Nickel Complex Hole Drilling(Via Hole)Wavelength: 355nm

Mg Surface PatterningWavelength: 355nm

Tantalum (Ta)Hole DrillingWavelength: 532nm

Cu Wafer CuttingWavelength: 532nm

Aluminium Oxide Wafer Hole DrillingWavelength: 355nm



SUS ScribingWavelength: 355nm

Cathode/Anode Electrode Cutting(Copper & Aluminium)Wavelength: 355nmThickness: 25μm

AluminiumThrough Line PatterningWavelength: 532nm

Si Wafer Metal Layer AblationWavelength: 355nm

Invar Steel (Fe-NI) ScribingWavelength: 355nm

SUS420J2 ScribingWavelength: 355nm

Pure Mg Cutting(Magnesium)Wavelength: 355nm

Ag Coated GdBCO on STS Cutting(Cross-Section) Wavelength: 355nm

Metal Oxide Film AblationWavelength: 532nm



Au Pad Full ScribingWavelength: 355nm

Copper Foil Hole DrillingWavelength: 532nm

Back Electrode Film Ablation (ZnO on the Glass)Wavelength: 355nm



Graphite PatterningWavelength: 355nm

Artificial Diamond PatterningWavelength: 532nm

Graphene CuttingWavelength: 355nm

Quartz Hole Patterning(Via Hole)Wavelength: 355nm

Scribing of GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s

Hole Drillingon the Aluminium

Wavelength : 355nm

Glass PatterningWavelength: 355nm

Quartz PatterningWavelength: 355nm

Carbon Disk Hole Drilling(100% Carbon)Wavelength: 355nm

10. Gallery (가공 예시) - Etc.


Quartz Micro-HoleDrilling(Cross-Section)Wavelength: 355nm

Epoxy Resin PatterningWavelength: 10.6μm

Quartz ScribingWavelength: 10.6μm

Slide Glass CuttingWavelength: 355nm

Sapphire Micro-HoleDrillingWavelength: 355nmThickness: 420μm

Soda-Lime Glass HoleScribing (Via Hole)

Wavelength : 355nm

Superconductor GdBCO Thin Film Scribing(Cross-Section)Wavelength: 355nm

Superconductor GdBCO Thin Film Hole Drilling(Through Hole)Wavelength: 355nm

Flexible Gorilla Glass CuttingWavelength: 355nm



Sapphire Wafer Cutting(Cross-Section)Wavelength: 355nm

PMN-PT Patterning(Piezoelectric Element)Wavelength: 532nm

Sapphire Wafer ScribingWavelength: 355nm

Gold/Pt/CVD Diamond Pattern Scribing(Using Edge Alignment)Wavelength: 355nm

Glass Full CuttingWavelength: 355nmThickness: 0.5T

Glass Microwire CuttingWavelength: 355nm

Quartz Thin Film CuttingWavelength: 355nm


http://www.kortherm.co.kr

인천광역시 부평구 청천동 425 우림라이온스밸리 C동 1203B호TEL. 032)623-6320~4 FAX. 032)623-6325 e-mail : [email protected]

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Documents

To. 2017. ㈜코썸사이언스 · 2017-07-20 · KORThermScience Co.,Ltd.-Scan Mode -Fixed Optic Mode-Flying Optic Mode-MOTF3 Laser Processing Mode Wavelength UV(355nm) Green(532nm)