Technical Capability

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  • TECHNICAL CAPABILITY

  • Thru hole : Aspect ratio =< 14 Drilling diameter 150 Materials (RoHS) : High Tg epoxy (Tg 175C) completely compatible RoHS (Filler et phenolic hardener) Materials for high frequencies (4 to 15 GHz) Green materials (Halogen free) Low deformation materials (X,Y,Z)Lines & spacing : AOI check Clean room classe 100 40 lines / 60 spacingLaser vias : Sequential multilayers (3 levels) Stacked Microvias Laser Holes 75 Finishes : Electroless nickel-gold Electroless tin - OSP HASL- Fused tin-lead

    Ionic contamination < 0.3 g/cm2Blind vias : drilling 100 General capability

  • General capability

    technologie

    Today20092010

    External lines and spacing75 / 85 60 / 75 50 / 70

    CMS minimum pitch200 200 200

    BGA minimum pitch300 250 200

    Drilled holes (D)

    --> board150 100 100

    --> laser via75 75 75

    Pad diameterD + 250 D + 220 D + 200

    Aspect ratio14:116:116:1

    Internal lines and spacing60 / 80 50 / 75 40 / 60

    Base MaterialsHigh Tg Epoxy - Halogen free - Polyimide - BT epoxy - RogersHigh Tg Epoxy - Halogen free - Polyimide - BT epoxy - RogersHigh Tg Epoxy - Halogen free - Polyimide - BT epoxy - Rogers

    TechnologySequential multilayers - laser vias 2 & 3 levels - Stacked vias - Burried & blind vias - Thermal drains- Rigid-flexSequential multilayers - laser vias 2 & 3 levels - Stacked vias - Burried & blind vias - Thermal drains- Rigid-flexSequential multilayers - laser vias 2 & 3 levels - Stacked vias - Burried & blind vias - Thermal drains- Rigid-flex

  • Technical investments

  • Technical investments

  • Reliability

  • 12 layers 2.4 mm thickness8000 interconnected holes ( daisy chain)Drilled holes from 0.25 mm to 1.1 mmBGAs au pas de 1 et 1.27 mmCMS padsInternal connections at several levelsReliability : Process Control Board

  • Process Control Board

    Production of 3 boards per week Base Materials control (Tg 175C) Plating Control (Electroless & electrolytic copper baths) Thermal shocks and microsections : - 1 to 4*10s at 287 C on standard high Tg epoxy - 2 to 8*10s at 300 C on high Tg epoxy ROHS --> Controls according to IPC A600 (classe 3) Advance detection of board failure modes Process and Material board qualification

  • Industrial designs & examples

    for high reliable boards

  • orBase materials : high Tg (175C) epoxy with fillers and phenolic hardener

    ci rigide

    () / mils

    Board Thickness (Average)1600 to 2800

    Laminate thickness (minimum with one or two copper plane layer)75 to 100

    Laminate thickness (minimum with two signal layers)100 to 152

    Internal line width75 to 100

    External line width75 to 125

    Drilled thru hole diameter>= 200

    Internal pad for thru holehole dia + 250 400

    Internal spacing80 to 125

    External spacing85 to 125

    Insulation (hole/copperplane)Hole dia + 250 to 400 + 2* mini spacing +60

    Aspect ratio6 to 10

    Caractristiques standards

    Stratifi Log/Masse

    152

    Stratifi Masse/Tension

    102

    A

    B

    C

    Trait interne

    75

    Isolement interne

    100

    E

    F

    G

    Gnd / Pwr Clearance Diameter

    36 mils

    Trou enterr (Diamtre perc)

    D

    200

    H

    I

    J

    K

    L

    M

    250

    External Via Pad Diam. I + 10 mils

    20 mils

    Solder Mask Clearance Diam. J+8 mils

    28 mils

    Board Thickness ( Max )

    120 mils

    Ar < = 8

    Optimised Board Aspect Ratio L / I

    127

    Trou total (Diamtre perc)

    Pastille interne (trou enterr)

    400

    Stratifi Log/Log

    ci microvias

    CaractristiquesValeurs ()

    Epaisseur CI central (Typique)600 1000

    Diamtre de perage du CI central200 300

    Diamtre de perage microvias100

    Pastille externe microvia350 400

    Pastille interne microvia300 350

    Dilectrique microvia70

    Pastille trou enterr400

    Diamtre de perage trou enterr200

    Trait interne75 100

    Trait externe100 125

    Diamtre de perage trou via total>= 250

    Pastille interne trou totalDia trou + 250 400

    Isolement interne100 125

    Isolement externe125 150

    Epargne trou totalDia trou + 250 400 + 2* is. Mini.

    Aspect ratio (microvias)== 250

    Pastille interne trou totalDia trou + 250 400

    Isolement interne100 125

    Isolement externe125 150

    Epargne trou totalDia trou + 250 400 + 2* is. Mini. +60

    Aspect ratio (CI total)8 9

    "Intermediate board"

    ()

    Thickness400 to 1500

    Drilled hole diameter150 to 250

    Aspect ratio4 8

    Caractristiques standards

    Stratifi Log/Masse

    152

    Stratifi Masse/Tension

    102

    A

    B

    C

    Trait interne

    75

    Isolement interne

    100

    E

    F

    G

    Gnd / Pwr Clearance Diameter

    36 mils

    Trou enterr (Diamtre perc)

    D

    200

    H

    I

    J

    K

    L

    M

    250

    External Via Pad Diam. I + 10 mils

    20 mils

    Solder Mask Clearance Diam. J+8 mils

    28 mils

    Board Thickness ( Max )

    120 mils

    Ar < = 8

    Optimised Board Aspect Ratio L / I

    127

    Trou total (Diamtre perc)

    Pastille interne (trou enterr)

    400

    Stratifi Log/Log

    ci microvias

    CaractristiquesValeurs ()

    Epaisseur CI central (Typique)600 1000

    Diamtre de perage du CI central200 300

    Diamtre de perage microvias100

    Pastille externe microvia350 400

    Pastille interne microvia300 350

    Dilectrique microvia70

    Pastille trou enterr400

    Diamtre de perage trou enterr200

    Trait interne75 100

    Trait externe100 125

    Diamtre de perage trou via total>= 250

    Pastille interne trou totalDia trou + 250 400

    Isolement interne100 125

    Isolement externe125 150

    Epargne trou totalDia trou + 250 400 + 2* is. Mini.

    Aspect ratio (microvias)== 250

    Pastille interne trou totalDia trou + 250 400

    Isolement interne100 125

    Isolement externe125 150

    Epargne trou totalDia trou + 250 400 + 2* is. Mini. +60

    Aspect ratio (CI total)8 9

    CI intermdiaire

    CaractristiquesValeurs ()

    Epaisseur400 1000

    Diamtre de perage200 300

    Aspect ratio (CI total)5 6

    Base Copper Thickness

    Layers()

    Externals9 to 18

    Signal inner18 to 35

    Copper plane inner18 to 70

    Caractristiques standards

    Stratifi Log/Masse

    152

    Stratifi Masse/Tension

    102

    A

    B

    C

    Trait interne

    75

    Isolement interne

    100

    E

    F

    G

    Gnd / Pwr Clearance Diameter

    36 mils

    Trou enterr (Diamtre perc)

    D

    200

    H

    I

    J

    K

    L

    M

    250

    External Via Pad Diam. I + 10 mils

    20 mils

    Solder Mask Clearance Diam. J+8 mils

    28 mils

    Board Thickness ( Max )

    120 mils

    Ar < = 8

    Optimised Board Aspect Ratio L / I

    127

    Trou total (Diamtre perc)

    Pastille interne (trou enterr)

    400

    Stratifi Log/Log

    ci microvias

    CaractristiquesValeurs ()

    Epaisseur CI central (Typique)600 1000

    Diamtre de perage du CI central200 300

    Diamtre de perage microvias100

    Pastille externe microvia350 400

    Pastille interne microvia300 350

    Dilectrique microvia70

    Pastille trou enterr400

    Diamtre de perage trou enterr200

    Trait interne75 100

    Trait externe100 125

    Diamtre de perage trou via total>= 250

    Pastille interne trou totalDia trou + 250 400

    Isolement interne100 125

    Isolement externe125 150

    Epargne trou totalDia trou + 250 400 + 2* is. Mini.

    Aspect ratio (microvias)=

  • BGA from 0.8 to 1 mm pitch

  • Blind holesThru holesBGA at 1 mm pitch (1500 boules)

  • Main technology in the case of large BGAs (number of balls from 800 to 1800) Main markets : Avionics, Military, Industriel, big computersEvolutions : high number of layers (+ 40% in 4 years)

    Base copper thickness of 35 (Low voltage ; differential signals)

    Controlled impedances

    Sequential boards

  • High Density PCBsDesigns & examples

    for HDI boards

    (Advanced technology)

  • High Density PCBsThe packaging orientation is mainly due to :

    - the market segment (consumer vs professional...)

    - the BGA pitch

    - the matrix size (number of balls)

    - the electrical constraints (impedance, signal quality ...)

    - the assembly constraints (thermal shocks, finishes ...)

  • High Density PCBsBGA at 0.5 to 0.3 mm pitch

  • High Density PCBsBGA at 0.5 mm pitch without lines between pads

  • High Density PCBsExampleThru holes drilled at 0.25 mm

    Laserholes drilled at 0.1 mm

    100 lines

    Thickness : 1 mm

    BGA pitch 0.5 mmExternal LayerInternal Layer

  • High Density PCBsBGA at 0.5 mm pitch with one line between 2 pads

  • High Density PCBsBGA at 0.4 mm pitch with one line between 2 pads

  • High Density PCBsBGA at 0.3 mm pitch without lines between pads

  • High Density PCBsMain packaging when BGA pitch =< 0.5 mm Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...)Future : high packages matrix (more balls)stacked viasLess total plated thru holesthinner lines & spacing

  • High Density PCBsAdvanced technology forSpecific Needs (close to s