扬州扬杰电子科技股份有限公司 - Eurotronix Profile...Profile Products: Bridges, Diodes , Modules, Chips, Small Signal, Mosfet Sales Revenue: 225 Million USD(2017) Factory

2018 Version 2.

YANGZHOU YANGJIE ELECTRONIC TECHNOLOGY CO.,LTD.

扬州扬杰电子科技股份有限公司

www.21yangjie.com YJ Marketing Dept.

2018 Version 2.


1.

2.

4.

3.

Contents

Introduction

5.

Product

Quality

Sales

Future Development Plan

2018 Version 2.


1.

Contents

Introduction

销售 Sales

产品趋势 Product roadmap

2018 Version 2.


Foundation: 2000 Yangzhou

Profile

Products: Bridges, Diodes, Modules, Chips, Small Signal, Mosfet

Sales Revenue: 225 Million USD(2017)

Factory Space :120,000M2

Wafer FAB: 40,000M2 Assembly: 60,000M2

INTRODUCTION

2018 Version 2.


Company Milestone

• Achieve Revenue 16 Million USD• Relocate Factory to Jiangyang Industrial Zone

2000 • Company Set up

2003 • Set up Bridge&Diode Production Line• Suntech, Midea Approval

2006

2009 • Set up 4” Wafer FAB Line• Got National High Tech Enterprise Certificate

2011 • Achieve Revenue 80 Million USD• Pass TS16949：2009 • Sharp, Murata, Panasonic Approval

2000-2012

2012 • Set up Power Module Production Line• CSRC approved the IPO application

2013-2017

2013 • Set up the Second 4” Wafer FAB Line• Start the Automation of Production Line•Philips Approval

2014 • Be Public Company , Stock Code: 300373• Delta Certificate• Establish Sales Office in Taiwan•Delta Approval

2015 • Set up DFN、QFN Production Line• Acquire Sub company in USA• Establish Sales Office in South Korea

2016 • Set up 6” Wafer Production Line• Finished non-publicly offering and raising funds of 1Billion RMB

2017 • Set up Small Signal Production Line

2018 Version 2.


Orgnizational Structure

CEO

Strategy and PlanningSystem

R&D management

Dept.

Product Dept.

SKY PM

Bridge and Diode PM

Small Signal PM.

MOS PM

Power Module PM

Strategy and

Planning Dept.

Marketing System

Markrting Dept.

Vip Customer Business Dept.

Sales Channel Business

Wafer Business

Dept.

New Project Business

Dept.

Planning &Management

dept.

Operation System

Audit Dept.

Production Management Dept.

Quality Center

Innovation Management

SS Operations Center

Power Device Operations Center

4"Wafer Operations Center

6"Wafer Operations Center

Support System

Logistics Warehousing Dept.

Financial Dept.

IT Dept.

Administration Dept.

External Development Center

HR Dept.

Subsidiary

MCC

CHENDU QINGYANG

Shareholders 'Meeting

Board of Directors

Financial Dept.

2018 Version 2.


Contents

销售 Sales


2. Product

2018 Version 2.


Yangjie Group

Factory No.2

6” SKY Chip

Lead Wire Bridge

Rectifier

Lead Frame Bridge

Rectifier

Axial Diode

4” GPP Chip PV Diode Power

Module Small Signal

Factory No.1 Factory No.3

Factory Layout

SMD Diode

2018 Version 2.


Product Series

Diode • R-1 A-405 DO-41 DO-15 DO-201 DO-35 R-6• SMA/B/C SMAF SOD123FL SOD123 SOD323 SOD523 SOT23 TO-277

Bridge

• ABS LLB MBS/MBLS HDS/HDLS YBS DB/DBS/DBLS• KBP KBL KBU• 2KBJ/4KBJ/6KBJ JA/JB GBP GBL GBU D3K• K1 K6 K8/K10 KBPC GBPC GBPCW BR SKBPC

PV Diode • R-6• TO263 GF004 TO220AB TO220AC ITO220AB ITO220AC• GF008 GF009 GF010

Chip • GPP Chips: STD FRD TVS Auto Electronics High Voltage Module• SKY Chips: SBD SKY TMBS SKY SiC MOS

Power Module

• Rectifier FRED Thyristor• Schottky MOSFET & IGBT

DFN • DFN1006 DFN2510 DFN2020• DFN2030 QFN3030 DFN3333• PDFN5060

www.21yangjie.com

2018 Version 2.

Cleaning Diffusion

LPCVD Deposition Glass Firing

Dicing Nicole& Golden Plating Test

Photo Glass


Wafer Fab( 4”)

2018 Version 2.


Implantation Photo

Wet Dry Etch &CVD PVD

Metrology Inspection Test

Diffusion

Wafer Fab（ 6"）

2018 Version 2.


Assembly Process (Bridge Rectifier & SMD Diode)

Auto Soldering Equipment Auto Cleaning Machine Molding Machine

Auto T/F Machine 3D/5S CCD detection system TMTT

2018 Version 2.


Assembly Line（Small Signal）

2018 Version 2.


Production Line Clean Class

www.21yangjie.com

Production Line Clean Class

4”GPP Wafer 1000~10000 class

6” SKY Wafer 10~1000 class

Wire Bonding TO/ITO 10000 class

Small Signal 10000 class

DFN/QFN 10000 class

Module 100000 class

Bridge/Diode 300000 class

2018 Version 2.


Assembly

KBL KBP KBU ABS DB DBS MBS D3K MBLS

BR-L BR BR-W GBPC GBPC-W KBPC25 KBPC-W SKBPC TSB-5 S35VT

GBJ4 GBP GBJ6 KBJ2 GBU KBPC1 KBPC6 KBPC8 JA JB GBL

YBS2 YBS4

2018 Version 2.


ITO-220AB ITO-220AC TO-3P/TO-247AD TO-220AB TO-220AC TO-277

R-1 R-6DO-41 DO-15 DO-201AD A-405 R-3

SMA SMB SMC SOD123FL SMAF

www.21yangjie.com

DFN SOD-123 SOD-323 SOD-523 SOT23

TO-252

Assembly

2018 Version 2.


Rectifier Module

IGBT Module

FRED Module Thyristor Module

Schottky Module

Assembly

2018 Version 2.


Contents

销售 Sales


产品 Product 3. Quality

2018 Version 2.


ISO9001 ISO14001 TS16949

ISO & TS16949 system certification ； All products meet the standard of RoHS； Halogen Free& Lead-Free Plating； IECQ QC 080000 Hazardous Substance Process Management System Requirements

QC080000

Quality and Environmental Management

2018 Version 2.


Test Assurance

Yangjie implements PAT (Parts Average Test) program to remove parts with abnormal characteristics (outliers). History has shown that parts with abnormal characteristics significantly contribute to quality and reliability problems.

00.10.20.30.40.50.60.70.80.9

1

1 151 301 451 601 751 901 1051 1201 1351 1501 1651 1801 1951 2101 2251 2401 2551 2701 2851

IR Trend Chart IRSpec upper limitPAT UCLPAT LCL

PAT Spec outlier outlier

outlier

Initial Test Spec

2018 Version 2.


PAT Program and Maverick Lot Control

PAT Program Test Spec

Maverick Lot Control

Low Yield Issue High Bin Reject Issue

OCAP and MRB Procedure

Yield Control Procedure

Failure Analysis C.A. , FMEA, CP, and CI Process

History Yield Data

2018 Version 2.


Quality Control on Chip

3. Functional test per chip lot to monitor chip and assembly quality performance.

4. HTRB test per chip lot to monitor short term reliability capability.

5. IRSM test per lot to monitor chip reverse surge capability.

1. To monitor the IR @ low VR of chip by curve tracer and tester.

2. To perform high temperature IR test on chip to find out micro crack issue and other potential quality risk.

V

IR

2018 Version 2.


Reliability Test In-house

YJ follows AEC Q101 and Mil-Std-750D standard to perform reliability test to assure product reliability. YJ can perform all reliability test items of discrete semiconductor in house.

# Test Item Conditions Time

1 TC 150℃+15/-0℃/25min, -55℃+0/-10℃/25min

Transfer time: 5min 1000 Cycles

2 Operation Life 25℃±5℃,I(AV) 1000Hrs

3 Autoclave 121℃±5℃, 15Psi 96Hrs

4 Forward Surge 8.3ms Five times

5 Soldering Heat Resistance

Axial：270±5℃ SMD: 260℃(+5,-0)

7sec 10 sec

6 Solder-ability Test

235℃±5℃ (for SnAgCu solder) 3 sec

7 HTSL 150℃±5℃ 1000Hrs

8 HTRB 80% VRRM 150℃ 1000Hrs

9 H.T.H.H 85% H and 85%T 1000Hrs

10 H3TRB 85% H and 85%T， 80% VRRM 1000Hrs

2018 Version 2.


Failure Analysis Capability in House

Solder ball

Digital Microscope*1000X

Crack

X-Ray Crack

Grinding

SEM ( Yangzhou University)

EDX( Yangzhou University)

2018 Version 2.


Failure Analysis Procedure Warranty

No

Within 5 working

days

QA Verification

Error Proofed Corrective Action

Root Cause

Containment Action F.A. Team

Failure Analysis

Design/PD/Mat’l Problem?

Eng & Prod. Action

FMEA/CP/SPC

Yes

8D Format Corrective

Action Report

Regional Sales

Customer

Within 24hrs

Application Study

Problem Solving Team

2018 Version 2.


Contents

销售 Sales


产品 Product 4. Sales

2018 Version 2.


Sales Revenue Trend

Sales Revenue

23 27 38

60

80 88

102

122 132

173

225

280

0

50

100

150

200

250

300

Million USD

2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018（Forecast）

2018 Version 2.


www.21yangjie.com

Diode 34%

PV Diode 22%

Bridge 25%

Chip 18%

Power Module 1%

Sales Ratio

Sales by products Sales by application

Distribution 20%

Chip 18%

PV 22%

Lighting 10%

Power 7%

Home Appliance5%

Security3% Industrial 1%

Other 14%

2018 Version 2.


江苏林洋湖南威胜浙江华立

POWER

Main Customer

LIGHTING

APPLIANCE

SOLAR

INDUSTRIAL

2018 Version 2.


Domestic Sales Network

Yangzhou

Guangzhou

Xiamen

Wenzhou Chengdu

Shenzhen

Wuhan Shanghai Ningbo

Hangzhou

Tianjin Qingdao

13 sales offices & 2 warehouses(Shenzhen, Guangzhou) to ensure fast delivery and technical support to local customer。

2018 Version 2.


International Sales Network

Russia

Japan Germany, Italy

Argentina

Brazil

Poland

Hong Kong

Taiwan Office

South Korea Office

India

Thailand

Singapore

Subsidiary company MCC headquarter

5 overseas sales offices, distribution network through out 16 countries

Spain

YJ

MCC

Turkey

France Czech

2018 Version 2.


Contents

销售 Sales


产品 Product 5. Future Plan (Capacity and Product roadmap)

2018 Version 2.


Capacity Plan (Wafer)

0100200300400500600700800900

1000 900

2016 2017 2018 2019 2020

400

800

1000 1000

4inch Fab. (GPP)

Fab. 2016 2017 2018 2019 2020

4” GPP Fab. 400 800 900 1000 1000

6“ Fab. 1 20 35 40 80

（Kw/M）

0

10

20

30

40

50

60

70

80

2016 2017 2018 2019 2020

1

20

35 40

80

6inch Fab. (planar/trench SKY, Mos SKY)

2018 Version 2.


Capacity Plan (Assembly)

（KKpcs/M）

Line 2017 2018 2019 2020 TO/ITO 60 60 60 60

DFN/QFN 100 200 300 500 Module 0.08 0.1 0.1 0.1 Bridge 150 200 220 250

Diode/SMD 600 800 1000 1000

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2017 2018 2019 2020

60 60 60 60 100 200 300

500 150

200 220

250 600

800

1000

1000 Diode/SMD

Bridge

Module

DFN/QFN

TO/ITO

2018 Version 2.


6” Wafer Fab.

Low Vol. TVS

High Vol. TVS

High Power Zener

5” GPP Wafer

High Vol. Module Chip

Dis Charge Device（LOW Vol）

Solid discharge tube(High Vol）

Year Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

2016 2017 2018

SBD Schottky Trench SKY

SiC MOS and SKY

5.0V, 6.5V, 6.8V

350V, 400V, 440V (Single die)

2W, 3W, 5W

5” GPP Wafer

2600V Chip

P0800B

TPA200

Product Roadmap (Wafer)

2018 Version 2.


2~4A Surface Mount Bridge


Year Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

2018 2019 2020 2021 2022




2018 2019 2020 2021 2022

YBS4 Package

YBSL2006~ YBSL2010 YBSL3006~ YBSL3010 YBSL4006~ YBSL4010

YBS3 Package

YBSM4006~ YBSM4010

4~6A SMD Bridge

8~10A SMD Bridge

6~8A SMD Bridge

YBS3 Package

YBSL6010

Product Roadmap (SMD Bridge)

2018 Version 2.


Product Roadmap—Low Vf Bridge

GBU Package Low vf Bridge

GBJ Package Low vf Bridge

SMD Package Low vf Bridge

Year Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

2018 2019 2020

GBU Package

GBUL4A~10A

GBJ Package

GBJL10A~35A

YBS Package

YBS 2~6 A Low vf Bridge

2018 Version 2.


SKY for TO Series

Low VF SKY for TO Series


2018 2019 2020 2021 2022

TO-220 Package

MBR1060CT MBR10100CT MBR10150CT MBR10200CT MBR2060CT

MBR20100CT MBR20150CT MBR20200CT MBR3060CT

MBR30100CT MBR30150CT

TO-263 Package

MBRB10150CT MBRB10200CT MBRB2060CT

10~30A TSBD Schottky

10~20A SBD Schottky

Product Roadmap—Power Diode

10~30A SBD Schottky

MBRL1060CT MBRL10100CT MBRL2060CT MBRL20100CT MBRL3060CT MBRL30100CT

TO-220 Package

2018 Version 2.


SKY for TO Series

Low VF SKY for TO Series


2018 2019 2020 2021 2022

TO-252 Package

MBR1060CD MBR10100CD MBR10150CD MBR10200CD MBR2060CD MBR20100CD MBR20150CD MBR20200CD MBR3060CD MBR30100CD MBR30150CD

10~30A TSBD Schottky

Product Roadmap—Power Diode

10~30A SBD Schottky

MBRL1060CD MBRL10100CD MBRL2060CD

MBRL20100CD MBRL3060CD

MBRL30100CD

TO-252 Package

2018 Version 2.


Switching Diodes


2018 2019 2020 2021 2022

SOD-123 Package

1N4148W

SOD-323 Package

1SS355 BAS16WX

BAS316 BAV19WS BAV20WS BAV21WS

SOD-523 Package

1N4448X 1SS400

SOT-23 Package

BAW56

150~400mW, VR 75~200V SOD-123

150~400mW, VR 75~200V SOD-323

150~400mW, VR 75~200V SOD-523

150~400mW, VR 75~200V SOT-23

Product Roadmap (Small Signal)

2018 Version 2.


Schottky Barrier Rectifiers


2018 2019 2020 2021 2022

SOD-123 Package

B5817W B5818W B5819W

MBR0520 MBR0530 MBR0540 MBR0560 MBR0580

SOD-323 Package

B5817WS B5818WS B5819WS

BSR106WS RB551V-30

SOT-23 Package

BAS40 BAS40-04 BAS40-05 BAS40-06

IF 0.5~1A, VR 20~40V SOD-123

IF 0.5~1A, VR 60~200V SOD-123

IF 0.5~1A, VR 20~40V SOD-323

IF 0.5~1A, VR 20~40V SOT-23

IF 0.5~1A, VR 60~200V SOD-323

IF 0.5~1A, VR 60~200V SOT-23


2018 Version 2.


Zener Diodes


2018 2019 2020 2021 2022

SOD-123 Package

BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11

SOD-323 Package

BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3

500mW, VR 2.4~11V BE：SOD-123

500mW, VR 2.4~11V BE：SOD-323


2018 Version 2.


Bipolar Transistors


2018 2019 2020 2021 2022

SOT-23 Package

2CS1623-L5 2CS1623-L6 2CS1623-L7 BC807-16 BC807-25 BC817-40 BC817-16 BC817-25 BC817-40

MMBT2222A MMBT3904 MMBT4401 MMBT4403 MMBTA05 MMBTA06 MMBTA55 MMBTA56

0.3W，0.5A，50V SOT-23

0.3W，0.5A，50V SOT-323


2018 Version 2.


ESD Protection Devices


2018 2019 2020 2021 2022

SOD-323 Package

ESD5V0D3 ESD12VD3

ESDLC3V3D3B ESDLC5V3D3B ESDLC12VD3B ESDLC3V3D3

SD05C

SOD-523 Package

ESD3V3D5 ESD5V0D5 ESD7V0D5

ESD12V0D5 ESD5V0D5B

3.3~12V SOD-523

3.3~12V SOD-323


2018 Version 2.


Rectifier Diode Modules

Thyristor Rectifier Modules

FRD Rectifier Modules


2018 2019 2020 2021 2022

Al-P GPP

Half-Bridge & 3-phase bridge

Rectifier diode package

High-voltage （1800~2400V） Rectifier diode package

Product Roadmap (Modules)

26mm Half-Bridge (T1N)

Package

MT25C16T1N MT40C16T1N MT60C16T1N MT90C16T1N

MT110C16T1N

800V~2200V Thyristor 3-phase bridge

rectifier Package

1200V Series rectifier Package

1700V Series rectifier Package

2018 Version 2.


MOSFET Modules

IGBT Modules


2018 2019 2020 2021 2022

100~400A Half-Bridge

Package

600V PIM Package

MG15H06CP1 MG25H06CP1 MG45H06CP1 MG50H06CP1

600V~1200V 6-unit & 7-unit (C3/C4)

Package

3-phase bridge Package

Product Roadmap (Modules)

100~800A Full-Bridge

Package

600V IPM (Molding & Potting) Package

2018 Version 2.


Product Roadmap (Mosfet) Plan

Segment Platform 2017

Q1 Q2 Q3 Q4

2018

Q1 Q2 Q3 Q4

2019

Q1 Q2 Q3 Q4

LV-MOS

MV-MOS

0.9um pitch G1 5masks

12-30V N/P Trench

(ESD / CSP )

40-200V N/P Trench

30-200V SGT MOS

0.9um pitch G2(High-Rsp) 5masks

0.6um shrink pitch CSP(CT self-aligned) High-Rsp G3 (Onsemi/Panasonic)

40-100V Trench G1 5Masks

60V SGT MOS G1

30-45V SGT MOS G1

30-60V SGT shrink pitch G2 (High-Rsp) (OptiMOS5)

120-250V SGT(Left-right) MOS G1 (Big current & Strong ) (OptiMOS3)

40-100V Trench G2 (Big current & Strong )

0.9um pitch CSP Termination Thick oxide (AOS)

0.9um pitch ESD 6masks

IGBT Trench NPT 1200V Trench NPT （15A-100A）

Trench FS 1200V Trench FS（15A-100A）

Ready Develop

2018 Version 2.


Documents

扬州扬杰电子科技股份有限公司 - Eurotronix Profile...Profile Products: Bridges, Diodes , Modules, Chips, Small Signal, Mosfet Sales Revenue: 225 Million USD(2017) Factory