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ОСНОВЫ СПАРК-ПЛАЗМЕННОГО СПЕКАНИЯ FUNDAMENTALS OF SPARK-PLASMA SINTERING ОЛЕВСКИЙ ЕВГЕНИЙ АЛЕКСАНДРОВИЧ EUGENE A. OLEVSKY 2й Научный семинар «Перспективные технологии консолидации материалов с применением электромагнитных полей» Москва, 20-23 мая 2013 г. Лаборатория Электромагнитных Методов Производства Новых Материалов Национальный Исследовательский Ядерный Университет «МИФИ» San Diego State University, USA Powder Technology Laboratory

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  • ОСНОВЫ СПАРК-ПЛАЗМЕННОГО СПЕКАНИЯ

    FUNDAMENTALS OF SPARK-PLASMA SINTERING

    ОЛЕВСКИЙ ЕВГЕНИЙ АЛЕКСАНДРОВИЧ

    EUGENE A. OLEVSKY

    2й Научный семинар «Перспективные технологии консолидации материалов

    с применением электромагнитных полей»

    Москва, 20-23 мая 2013 г.

    Лаборатория Электромагнитных Методов Производства Новых Материалов

    Национальный Исследовательский Ядерный Университет «МИФИ»

    San Diego State University, USA

    Powder Technology Laboratory

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    INTRODUCTION

  • SPS PUBLICATION STATISTICS

    Web of Science

    Overwhelming majority of ~ 3000 refereed publications on SPS describe empirical

    trial-and-error attempts to consolidate various powder material systems.

    About 80 publications include theoretical studies. In our publications*, sintering

    constitutive equations are expanded to include the contribution of SPS-specific

    factors.* E. Olevsky and L. Froyen, Constitutive modeling of spark-plasma sintering of conductive materials, Scripta

    Mater., 55, 1175-1178 (2006)

    E. Olevsky, S. Kandukuri, and L. Froyen, Consolidation enhancement in spark-plasma sintering: Impact of

    high heating rates, J. App. Phys., 102, 114913-114924 (2007)

    E. Olevsky and L. Froyen, Influence of thermal diffusion on spark-plasma sintering, J. Amer. Ceram.

    Soc., 92, S122-132 (2009)

    E. Grigoryev and E. Olevsky, Thermal Processes during high voltage electric discharge consolidation of

    powder materials, Scripta Mater. , 66, 662-665 (2012)

    W. Li, E. A. Olevsky, J. McKittrick, A. L. Maximenko, and R. M. German, Densification mechanisms of spark

    plasma sintering: multi-step pressure dilatometry, J. Mater. Sci., 47, 1-11 (2012)

    Citations in Each Year

    as of Summer 2010 as of Fall 2012

    W. L. Voelker, Improvements in the Manufacture of Filaments of Incandescing Electric

    Lamps and in Means applicable for use in such Manufacture, GB Patent 6149 (1899)

  • Moscow Engineering Physics University San Diego State University

    Field-Assisted Powder Consolidation

    High-Voltage Techniques Low-Voltage Techniques

    High Vs. Low Mode Field-Assisted Techniques

    < 300 s Up to 30kV 500 kA/cm2

    High-Voltage Electric Discharge Compaction

    < 50 kN < 10V < 1500 A

    Spark-Plasma Sintering

  • HVEDC PUBLICATION STATISTICS

    В. Д. Деменюк, М. С. Юрлова, Л. Ю. Лебедева, Е. Г. Григорьев, Е. А. Олевский, Методы

    электроимпульсной консолидации: альтернатива спарк-плазменному спеканию, Ядерн. Физ.

    Инжин. (2012) – в печати

    Олевский Е.А., Александрова Е.В., Ильина А.М., Новоселов А.Н., Пельве

    К.Ю, Григорьев, Е.Г., Исследования процессов консолидации порошковых материалов

    пропусканием электрического тока, проводившиеся на территории бывшего Советского

    Союза, Физ. Хим. Обраб. Матер. (2012) – в печати

  • cleaner grain boundaries in sintered ceramic materials

    a remarkable increase in superplasticity of ceramics

    higher permittivity in ferroelectrics

    improved magnetic properties

    improved electrical properties

    improved bonding quality

    improved thermoelectric properties

    reduced impurity segregation at grain boundaries

    improved oxidation and corrosion resistance

    improved optical transmission

    SPS promotes:

    SPS process: unique capabilities to densify

    nanostructured ceramic, intermetallic and composite

    materials in bulk form.

  • SPS-processed

    (SDSU) TaC

    powder specimen:

    99% dense;

    maximum

    temperature

    2300°C;

    maximum pressure

    50 MPa;

    SPS time – 8 min

    Microstructure of TaC specimens fabricated by spark plasma

    sintering

    E. Khaleghi, Y.-S. Lin, E. Olevsky, and M. Meyers, Spark plasma sintering of tantalum carbide, Scripta

    Mater., 63, 577-580 (2010)

  • A bulk nanocrystalline Al–5 at.% Fe alloy was synthesized by mechanical

    alloying and spark plasma sintering. The alloy exhibited a very high

    compressive yield strength of 1 GPa with a plastic strain of 0.3. The alloy

    consists of coarse α-Al grains that form from powder boundaries and

    nanocrystalline regions composed of α-Al and Al6Fe phases. The

    combination of the coarse and nanoscale grains are considered to be the

    reason for the large plastic strain in such a high-strength material.

    A high-strength bulk nanocrystalline Al–Fe alloy processed

    by mechanical alloying and spark plasma sintering

    spark plasma sintered Al–5 at.% Fe alloy.SEM image of the alloy that was deformed to a

    strain of 0.08. This micrograph indicates the

    coarse α-Al grains were mainly deformed.

    E. Olevsky, S. Kandukuri, and L. Froyen, Consolidation enhancement in spark-plasma sintering: Impact of high heating rates, J. App.

    Phys., 102, 114913-114924 (2007)

  • The SPS was carried out in an argon atmosphere at 1850 C and 100 MPa

    Debrupa Lahiri, Evan Khaleghi, Srinivasa Rao Bakshi, Wei Li, Eugene A. Olevsky, and Arvind Agarwal, Graphene-

    induced strengthening in spark plasma sintered tantalum carbide–nanotube composite, Scripta Materialia 68 (2013)

    285–288

    Graphene-induced strengthening in spark plasma

    sintered tantalum carbide–nanotube composite

    Fracture surfaces for TaC, TaC–LC and TaC–SC

    High-magnification SEM micrographs

    of TaC–SC fracture surface revealing:

    (a) transformed graphene platelets with

    straight edges; (b) graphene platelets

    sandwiched at TaC grain boundaries; (c)

    pulledout graphene platelet forming a

    strong interface with the TaC matrix

  • SEM OF FRACTURE SURFACES: HUMAN DENTIN

    Longitudinal

    Transverse

    Collagen fibers

    Micro-channels

  • 1µm

    SPS 1200C, 50MPa, 5min

    SPARK-PLASMA SINTERING OF HAP POWDER

    Hydroxyapatite(Ca10(PO4)6(OH)2), 0.5

    Melting point: 16700C, density: 3.14g/cm3

    The main component in human bones and teeth

  • SEM IMAGES OF MICRO CHANNEL STRUCTURE AFTER FPSPS

    The channel diameters decrease with the increase of the initial slurry concentration

    100µm

    15vol%

    20µm

    15vol%

    100µm

    20vol%

    20µm

    20vol%

    100µm

    25vol%

    25vol%

    20µm

    Y.-S. Lin, M. A. Meyers, and E. A. Olevsky, Microchannelled hydroxyapatite components by sequential freeze drying and

    free pressureless spark plasma sintering, Adv. App. Ceram., 111, 269-274 (2012)

  • SPS-FPSPS PROCESSING SEQUENCE

    Complex shape HAp-based dental

    implant prototype produced by SPS-

    FPSPS sequence

    FPSPSSPS

    500nm500nm 500nm

    Y.-S. Lin, M. A. Meyers, and E. A. Olevsky, Microchannelled hydroxyapatite components by sequential freeze drying and

    free pressureless spark plasma sintering, Adv. App. Ceram., 111, 269-274 (2012)

  • H2 H2H2

    Representation of adsorption bed settling, based on observations by:

    [Qin et. al, 2000, Collins et. al, 2007, and Ubago-Pérez et. al, 2006].

    Adsorbent

    ہ Activated Carbon from Biomass Sources

    ہ Structural stability; prevent reduction of system efficiency

    ہ Material Parameter Focus: Specific Surface Area

  • 250 µm

    Optical micrograph of 40MPa SPS SiCNW-AC compostie

    20 µm 5 µm

    ہ Conventional SPS of SiCNW-AC Composite

    ہ 50C/min to 1300C, 15min hold in vac.

    ہ Structurally stable sample of thickness

  • Comparative Analysis of SSA Values

    ہ Lack of SSA retention under pressure-assisted conditions

    ہ Significant structural stability in both cases

    ہ Additional SSA retention with SiC-AC composite

    SSA data for the precursor material and the SPS consolidated SiC-AC compact

  • ہ Enhanced low pressure and porosity control

    ہ Potential application to reactive SPS systems

    ہ Significant tool for study of fundamental SPS mechanisms

    Design and demonstration of a novel FPSPS

    method

    15 and 10mm FPSPS dies with unsintered and sintered zirconia spacers respectively

  • As produced CNW structures – morphologies marked by arrowsPlatelet CNF structures – interstitial spacing marked by arrows

    Nanofiber and Nanowire Morphology3-D CNF Textured Structure

    Fe and Mg content observed by analyzing the center of the nanowire structure.

    Tailoring Nano-scale Synthesis Template Properties

    Nanowire cluster characterization reveals presence of Mg, Ca, and K.

    Biomass is carbon source for CNF growth, initiated by inherent metallic particles.

    Synthesized during processing of AC biomass templatesPlatelet CNF and CNW growth may increase specific surface area, interstitial spacing and preferential adsorption of hydrogen.

    W. Bradbury and E. Olevsky, Synthesis of carbide nano-structures on monolithic agricultural-waste biomass-activated carbon

    templates, Int. J. App. Ceram. Techn., 8 [4] 947–952 (2011)

  • Nanoscale necking between monolithic AC-stalk materials

    Stable 3-D 10mm SiC-AC Sample

    ہ Significant Structural Enhancement

    ہ Production of stable porous compact

    FPSPS Processing of Biomass-Derived Silicon Carbide

    W.L. Bradbury and E.A. Olevsky, Scripta Materialia, Production of SiC-Ccomposites by free-pressureless spark plasma sintering (FPSPS), 63 [1](July, 2010) 77-80.

  • Comparative Analysis of SSA Values

    ہ Improved SSA retention under pressure-less conditions

    ہ Significant structural stability obtained

    SSA data for the precursor material, SPS and FPSPS SiC-AC compacts

  • High-Voltage Electric Discharge Consolidation:

    Manufacturing of Pressing Tools with High Wear Resistance

  • Specimen WC, diameter 9мм

    J = 90 кА/см2, P = 200 МPаSpecimen WC, diameter 9мм

    J = 90 кА/см2, P = 130 МPа

    Steel Р6М5,

    J = 256 кА/см2, P = 350 МPа

    Steel Р6М5,

    J = 296 кА/см2, P = 350 МPа

    Specimen WC, axial cross-section:

    High-Voltage Electric Discharge Consolidation: Structure

    Inhomogeneity and Control

    E. Grigoryev and E. Olevsky, Thermal Processes during high voltage electric discharge consolidation of powder

    materials, Scripta Mater. , 66, 662-665 (2012)

  • Flash Sintering Experimentation

    u Performed by Rishi

    Raj et.al.

    u Yitria stabilized

    Zirconia powder

    u Vertical Tube Furnace

    u Dog bone specimen

    u Pt Electrodes

    u Shrinkage recorded

    via CCD camera

    Pt Electrode

    Tube FurnaceSpecimen

  • Flash Sintering Results

    u Sintering rate depends on

    applied electric field

    u Sintering rate becomes

    unstable ~40V/cm

    u Small particle contacts

    necessary for flash

    sintering to occur

    Source: Flash Sintering of Nanograin Zirconia in o5 s at

    8500C, Rishi Raj et. al., J. Am. Ceram. Soc., 93 [11] 3556–

    3559 (2010)

  • SPS: ENHANCEMENT OF MASS TRANSPORT

    electromigration

    (diffusion enhancement)

    electroplasticity

    (electron wind,

    magnetic depinning of

    dislocations)

    dielectric breakdown of

    oxide films at grain

    boundaries

    ponderomotive forces

    “pinch effect”

    surface plasmons

    Field Effects in SPS

    high heating rates

    high local non-

    uniformities of

    temperature distribution

    (local melting and

    sublimation)

    macroscopic

    temperature gradients

    thermal diffusion

    thermal stresses

    Thermal Effects in SPS

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    INFLUENCE OF HIGH HEATING RATES

  • Micromechanical Model

    E. A. Olevsky, B. Kushnarev, A.

    Maximenko, V. Tikare and M.

    Braginsky, Modelling of

    anisotropic sintering in crystalline

    ceramics, Philosophical Magazine,

    85, (19), 2123-2146 (2005)

    2

    p

    a

    p

    cr

    a

    2

    p

    c

    p

    ar

    c

    2

    1 2 3x x x xb y b y b

    2

    1 2 3y y y yb x b x b

    0

    sin2

    ap

    xx

    c cdx c

    c

    ( ) ;xc

    cr

    0 0 0xx yy

    22 33 1 1 3 3 1 1 3

    sin sin2 2 2 2 2 2 2

    x xx p p

    c c

    c c y c cc r c c c r c

    where is the surface tension, is the dihedral angle, a and c

    are the grain semi-axes; x - effective (far-field) external stress in

    the x-direction (compressive x is negative). Parameter

    px

    c c

    c

    is a local stress on the grain boundary (

    pc c

    c

    is the

    stress concentration factor).

    23 1 1

    sin2

    gb gb pxgbx

    cp p

    D c c

    kT c r c ca a c c

    gb gbgb xy

    DJ

    kT y

    ( )

    2

    gb

    y

    gbx

    p p

    J c

    a a c c

    gb

    yJ is the flux of matter in the direction of the

    axis y caused by the grain boundary diffusion,

    gbD is the coefficient of the grain boundary

    diffusion, gb is the grain boundary thickness,

    k – Boltzman constant; T – absolute temperature.

  • Influence of High Heating Rates

    E. Olevsky, S. Kandukuri, and L. Froyen, Consolidation

    enhancement in spark-plasma sintering: Impact of high

    heating rates, J. App. Phys. 102, 114913-114924 (2007)

    For an aluminum alloy

    powder

    , ,x gbx crx f G

    4

    22

    4 2

    31 1 1

    8

    s sD

    kTG

    x

    θ= e= ε

    1-θ

    3

    1.3400

    fd GG GG

    G is the porous material’s grain growth rate, 0fdG

    is the grain growth rate of the fully-dense material

    with the grain size 0G , 0G is the initial grain size of

    the porous (powder) material

    Du and Cocks

    4 16.67 10 3.55 10

    0

    fd fd TG G t

    Beck et al. fdG is the current grain size of the fully-dense material; 0

    fdG is the initial grain size of the fully-

    dense material; t is time, s; and T is temperature, K

    3

    4 1.3400

    1 235 /6.67 10 ln , 533

    0, 533

    GK sG if T K

    G K G

    if T K

    dT

    dt = const is the heating rate, K/s

  • Influence of High Heating Rates

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0 1000 2000 3000

    Time, s

    Po

    ros

    ity

    200C/min

    100C/min

    50C/min

    25C/min

    10C/min

    For aluminum powder

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    INFLUENCE OF THERMAL DIFFUSION

  • Influence of Thermal Diffusion

    J is the vacancy flux, D is the coefficient of diffusion, vC is the vacancy concentration,

    vC is the vacancy concentration gradient, *Q is the heat of vacancy transport, T is the

    temperature gradient.

    *

    v v

    Q TJ D C C

    kT T

  • Influence of Thermal Diffusion

    Ludwig-Soret effect of thermal diffusion causes

    concentration gradients in initially homogeneous two-

    component systems subjected to a temperature gradient.J. Chipman, The Soret effect, Journal of the American Chemical Society, 48, 2577-2589 (1926)

    For the case of atomic and vacancy diffusion in crystalline

    solids, this effect was studied by a number of authors

    including it’s theoretical interpretation by Shewmon and

    Schottky.P. Shewmon, Thermal diffusion of vacancies in zinc, Journal of Chemical Physics, 29, (5), 1032-1036 (1958)

    G. Schottky, A theory of thermal diffusion based on lattice dynamics of a linear chain, Physica Status Solidi, 8, (1),

    357 (1965)

    For the electric-current assisted sintering, the effect of

    thermal diffusion was analyzed by Kornyushin and co-

    workers. Later, for rapid densification, the role of

    temperature gradients was studied by Searcy and by Young

    and McPherson.Y. V. Kornyushin, Influence of external magnetic and electric-fields on sintering, structure and properties, Journal of

    Materials Science, 15, (3), 799-801 (1980)

    A. W. Searcy, Theory for sintering in temperature-gradients - role of long-range mass-transport, Journal of the

    American Ceramic Society, 70, (3), C61-C62 (1987)

    R. M. Young and R. McPherson, Temperature-gradient-driven diffusion in rapid-rate sintering, Journal of the

  • Influence of Thermal DiffusionJ is the vacancy flux, D is the coefficient of diffusion, vC is the vacancy concentration,

    vC is the vacancy concentration gradient, *Q is the heat of vacancy transport, T is the

    temperature gradient.

    *

    v v

    Q TJ D C C

    kT T

    2

    v fC HC T

    kT

    *v fDC T

    J H QkT T

    *

    m fQ H H

    Schottky:

    Young &

    McPherson:

    Wirtz:

    Kornyushin:

    mH is the enthalpy of vacancy migration;

    fH is the enthalpy of vacancy formation

    vm

    DC TJ H

    kT T

    ;

    v m f TT

    C H HJ D T

    k T T

    did not include the term vC ! Otherwise:

    T is the thermal diffusion ratio ( T is

    the spatial average of temperature)

    v mT

    C H

    k T We re-define:

    TdivJ D TT

    The driving force for

    the vacancy migration:

    T

    TT q

    dt

    C

    Heat transfer equation:

    T is the thermal conductivity; C is heat capacity; t is time; and q is the

    heat production per unit volume of the material and per unit time, which in the case of SPS can be represented as

    2

    eq E , where e is the specific

    electric conductivity, and E is the electric field intensity 2T

    e

    T

    TdivJ D E

    T t

    C

  • Influence of Thermal Diffusion

    22 2gb Ttd gb gb eT

    TJ divJ G D E G

    T t

    C2T e

    T

    TdivJ D E

    T t

    C

    2

    2 2

    2

    gbgb gb Ttd td

    gbx e

    Tp p

    DJ T GE

    T tG r G r

    C

    _ ,gbx gbx

    curvature driven th diffusion driven

    x crx f G

    x

    θ= e= ε

    1-θ

    3

    10 1.3401.5 10 /G

    G m sG

    E. Olevsky and L. Froyen, Influence of thermal diffusion on spark-plasma sintering, J. Amer. Ceram. Soc. 92, S122-132 (2009)

    T is the thermal conductivity; C is heat capacity; t is time; and q is the

    heat production per unit volume of the material and per unit time, which in the case of SPS can be represented as

    2

    eq E , where e is the specific

    electric conductivity, and E is the electric field intensity

    is porosity; G is the average grain size

  • Influence of Thermal Diffusion

    25

    125

    225

    325

    425

    525

    625

    0 200 400 600 800 1000

    Time, s

    Te

    mp

    era

    ture

    , C

    0.00

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    Po

    ros

    ity

    Temperature

    Porosity - Model

    Porosity - Experiment

    25

    207

    389

    571

    753

    936

    1118

    1300

    0 70 141 211 281 352 422

    Time, s

    Te

    mp

    era

    ture

    , C

    0.00

    0.05

    0.10

    0.15

    0.20

    0.25

    0.30

    0.35

    0.40

    0.45

    Po

    ros

    ity

    Temperature

    Porosity - Model

    Porosity - Experiment

    Porosity kinetics during SPS of aluminum

    powder. Comparison of the developed model

    taking into account the impact of thermal

    diffusion with experimental data of Xie et al.,

    Effect of interface behavior between particles on

    properties of pure al powder compacts by spark

    plasma sintering, Materials Transactions, 42, (9),

    1846-1849 (2001)

    Porosity kinetics during SPS of alumina powder.

    Comparison of the developed model taking into

    account the impact of thermal diffusion with

    experimental data of Shen et al., Spark plasma

    sintering of alumina, J. Amer. Ceram. Soc., 85, (8),

    1921 (2002)

    3

    2

    11

    2 223

    4 24

    0

    2

    2

    2

    3 32 129 2 23

    1 4 1 9 1 2 exp 1

    3 2

    2 1

    m

    m m

    xx

    gb gb ref

    gbx

    cr

    gb gb v m

    e

    T

    G G

    D G

    QkTGA G

    RT

    D C H TE

    t Gk T

    C

    curvature-driven grain boundary diffusion thermal diffusion power-law creep

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    INFLUENCE OF ELECTROMIGRATION

  • Major Components of Densification-Contributing Mass Transfer

    During SPS (model including electromigration):

    EC C J E

    Nernst-Einstein equation

    grain-boundary diffusion power-law creep

    driving sources

    externally applied loadsintering stress

    electromigration

    *gb gb

    E q

    DC Z e

    kT

    Blech’s formula

    gb gbD

    CkT

    where is the atomic volume, *Z is the valence of a migrating ion, and qe is

    the electron charge (the product * qZ e is called “the effective charge”).

    *1gb gbgb x

    y q

    D UJ Z e

    kT l y

    U and l are the electric potential and the characteristic length along the

    electric field.

    ( )

    2

    gb

    y

    gbx

    p

    J c

    ca a

    *

    2 2

    3 1 1

    2

    gb gb q pxgbx

    pp

    D Z e G rU

    kT l G r G GG r

    is the surface tension, x - effective (far-field) external stress in the x-direction

    G a c is the grain size, p p pr a c is the pore radius.

    • M. Scherge, C.L. Bauer, and W.W. Mullins, Acta

    Met. Mater., 43 (9), 3525-3538 (1995):

    electromigration stress of 23MPa along grain

    boundaries under an electric field of 500 V/m (in a 1-

    thick film) and up to GPa range stresses for grain

    structures with closed surface junctions

    • M.R. Gungor and D. Maroudas, Int. J. Fracture, 109

    (1), 47-68 (2001): electromigration stress of

    140MPa in a 1 -thick film under the field of about 425

    V/m

    • Q.F. Duan and Y.L. Shen, J. Appl. Phys. 87 (8),

    4039-4041 (2000): electromigration stress of

    450MPa along fast-diffusion length of 15 under 650

    V/m

    • Z. Suo, Q. Ma, and W.K. Meyer, MRS Symposium

    Proceedings, 6p. (2000): electromigration stress in 0.5

    -thick Al film under 300 V/m field should reach the

    level of 1.5GPa

  • 5

    2

    13

    *2 2

    2 2

    3 1 1 3 31 1

    2 22

    m

    gb gb q pxx gbx crx x

    pp

    D Z e G rUA

    GkT l G r G GG r

    G is the grain size; pr is the pore radius; A and m are power-law creep frequency

    factor and power-law creep exponent, respectively; gbD is the coefficient of the

    grain boundary diffusion, gb is the grain boundary thickness, k is the Boltzman’s

    constant, T is the absolute temperature; is the atomic volume, *Z is the

    valence of a migrating ion, and qe is the electron charge (the product *

    qZ e is

    called “the effective charge”); U and l are the electric potential and the

    characteristic length along the electric field; is the surface tension; x - effective (far-field) external stress in the x-direction; is porosity.

    E. Olevsky and L. Froyen, Constitutive modeling of spark-plasma sintering of conductive materials, Scripta Mater. 55, 1175-1178 (2006)

    shrinkage due to grain-boundary diffusion

    shrinkage due to dislocation creep

    Constitutive Model of Spark-Plasma Sintering

  • Densification map for aluminum powder,

    T=673K, =28.3MPa

    Contribution of different factors to shrinkage under SPS

    E. Olevsky and L. Froyen, Constitutive modeling of spark-

    plasma sintering of conductive materials, Scripta

    Mater. 55, 1175-1178 (2006)

    1.E-10

    1.E-07

    1.E-04

    1.E-01

    1.E+02

    1.E+05

    1.E+08

    0.00 0.10 0.20 0.30 0.40 0.50 0.60

    Porosity

    Sh

    rin

    kag

    e R

    ate

    , 1/s

    shrinkage rate due to electromigration (electric current)

    shrinkage rate due to sintering stress (surface tension)

    shrinkage rate due to power-law creep (punch load)

    1.E-10

    1.E-07

    1.E-04

    1.E-01

    1.E+02

    1.E+05

    1.E+08

    0.00 0.10 0.20 0.30 0.40 0.50 0.60

    Porosity

    Sh

    rin

    kag

    e R

    ate

    , 1/s

    shrinkage rate due to electromigration (electric current)

    shrinkage rate due to sintering stress (surface tension)

    shrinkage rate due to power-law creep (punch load)

    1.E-10

    1.E-07

    1.E-04

    1.E-01

    1.E+02

    1.E+05

    1.E+08

    0.00 0.10 0.20 0.30 0.40 0.50 0.60

    Porosity

    Sh

    rin

    kag

    e R

    ate

    , 1/s

    shrinkage rate due to electromigration (electric current)

    shrinkage rate due to sintering stress (surface tension)

    shrinkage rate due to power-law creep (punch load)

    Grain Size: 1Grain Size: 40Grain Size: 100nm

    0

    0.05

    0.1

    0.15

    0.2

    0.25

    0.3

    0.35

    1.E-08 1.E-07 1.E-06 1.E-05 1.E-04

    Grain Size, m

    Po

    rosit

    y

    external load

    surface tension

    electromigration

    Contribution of different factors to shrinkage rate of aluminum powder under SPS

    417U V

    l m , T=6730K, x =28.3MPa

  • The average particle size is 55m. The applied field is accepted to be of

    500V

    m (Joule heat generation balance –based estimation), the pressure is

    constant and equal to 23.5 MPa.

    Shrinkage kinetics during SPS of aluminum powder:

    comparison with experiments

    Pressure 10 MPa

    Field 250 V/m

    10 MPa

    250 V/m

    E. Olevsky and L. Froyen, Constitutive modeling of spark-plasma sintering of conductive materials, Scripta Mater. 55, 1175-1178 (2006)

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    LOCAL HEAT BALANCE

  • Total Electric Current Density (A/m2)

    Total Electric Current Density in the contact between

    two Aluminum particles under SPS conditions

    A ratio of neck radius to particle radius of 1/1000 was used for the analysis. This means that the area of

    the neck is 106 times smaller than the area of the particle diameter cross-section.

    A voltage drop of about 0.4 V across a specimen 4 mm high for an electric field of 100 V/m. When

    considering two particles with a 1 m radius - a voltage drop from the center of the top particle to the

    center of the bottom particle is of 2x10-4 V.

    An average current density of about 3x107 A/m2 in the center cross-section of the particle.

    FEM COMSOLTM

    software-based

    solution:

  • Applied Voltage 12:2 ms (30 ms) Initial heat-up 12:2 Pulse (30 ms)

    The stability of the temperature gradient in the inter-particle contact area is related

    to the on and off pulse frequency, which controls the local and, in turn, the

    macroscopic heating rate.

    Applied Voltage and Initial Heat-Up in the contact

    between two Aluminum particles under SPS conditions

    FEM COMSOLTM software-based

    solution:

  • Local Temperature Gradients

    1.0E-06

    1.0E-04

    1.0E-02

    1.0E+00

    1.0E+02

    1.0E+04

    1.0E+06

    1.0E+08

    0.0E+00 5.0E-08 1.0E-07 1.5E-07 2.0E-07

    Cu

    rre

    nt D

    en

    sit

    y (

    A/m

    ^2

    )

    Arc Length (m)

    Current Density for 55 "A-Spot" Model

    1.0E-06

    1.0E-04

    1.0E-02

    1.0E+00

    1.0E+02

    1.0E+04

    1.0E+06

    1.0E+08

    1.0E+10

    1.0E+12

    0.0E+00 5.0E-08 1.0E-07 1.5E-07 2.0E-07

    Cu

    rre

    nt D

    en

    sit

    y (

    A/m

    ^2

    )

    Arc Length (m)

    Current Density for 60 "A-Spot" Model

    0.000

    0.005

    0.010

    0.015

    0.020

    0.025

    0.030

    0 20 40 60 80 100 120 140 160

    Eff

    ective C

    ond

    uctivity,

    1/(

    Ohm

    xm

    )

    Number of Included Particles - "A-Spots" (r=2nm)

    Conductivity of Alumina layer with Aluminum Particles - "A-Spots"

    Fritting and channeling:

    alumina reduction and

    creation of aluminum

    conductive “A-spots”

  • Fritting and channeling: alumina reduction and creation of

    aluminum conductive “A-spots”

    1000

    1010

    1020

    1030

    1040

    1050

    1060

    1070

    0 50 100 150

    T, K

    particle diameter, μm

    T, K

    h=0.005

    h=0.01

    h=0.015

    T – the average temperature of

    the inter-particle contact area

    (the temperature in the center

    of the particle is 1000K)

    h – the specimen’s height, m

    (determines the average

    voltage per particle)

    0

    2

    4

    6

    8

    10

    12

    14

    16

    18

    20

    0 50 100 150

    ∆F

    , %

    particle diameter, μm

    ΔF,%:

    h=0.005

    h=0.01

    h=0.015

    U, V:

    F – the difference between

    the shrinkage rates determined

    by the difference in

    temperatures in the particle

    center and the inter-particle

    contact area

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    MACROSCOPIC MODELING

  • ( elV ) 0

    CpT

    t (kT T) el V

    2

    ij (W )

    Wij

    .

    1

    3

    e.

    ij

    PLij

    .

    1 e

    .

    Conductive DC

    Heat Transfer by Conduction

    Stress-Strain Analysis

    Densification

    Coupled electro-thermo-mechanical FEM calculations

    Olevsky E.A. (1998), Theory of sintering: from discrete to continuum. Review, Mater. Sci. & Eng. R: Reports, 40-100

  • Constitutive Modeling - material model

    Constitutive Equation

    I. Diffusional creep n = 1 (m = 1)

    a.Nabarro-Herring creep (grain lattice diffusion)

    b.Coble creep (grain-boundary diffusion)

    II. Grain-boundary sliding creep n = 2 (m = 0.5).

    III. Dislocation creep

    a.Glide-controlled creep, n =3 (m=0.3)

    b.Climb-controlled creep, n = 4-5, (m = 0.2 – 0.3)

    IV. Dispersion-strengthened alloys n > 8 (m < 0.1).

    For Solid Material For Porous Material

  • SEM Analysis: Morphology of Copper

    Powder, (Left) 300X, (Right) 1600X

    Copper Powder (Alfa Aesar, MA, USA)

    Spherical

    High Purity (99.9999%)

    Particle Size -170 to + 400 Mesh (38 - 90 μm)

  • Temperature, Pressure and Densification Profiles

    for 625ºC MSPD Experiment

    (20-50 MPa)

  • Strain Rate Sensitivity Component m of

    MSPD Experiments at Different

    Temperatures (20-50 MPa)

  • Coupled electro-thermo-mechanical FEM calculations

    electrical current density temperature porosity

    SPS of an Alumina Specimen

  • FCT DIE-PUNCH SETUP: TEMPERATURE DISTRIBUTION

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    SCALABILITY

  • SPS SCALABILITY (SIZE DEPENDENCE)

    Alumina Disk-Shape Specimens (Same Aspect Ratio):

    experimental calibration

    temperature evolution relative density evolution

    15 mm 40 mm 48 mm 56 mm

    Sample Height [mm] 3 7.9 9.5 11.1

    Radius [mm] 7.5 20 24 28

    Die Height [mm] 30 80 96 111.4

    Radius [mm] 15 40 47.85 55.7

    Punch Height [mm] 15 40 47.8 56

    Insert Height [mm] 3.8 10 12 13.9

    External Spacers Height [mm] 8 20 20 20

    Radius [mm] 30 80 80 80

    Transition Height [mm] 30 80 95.7 111.4

    Radius 1 [mm] 7.5 20 23.9 27.85

    Radius 2 [mm] 30 80 95.7 111.4

    voltage evolution

    Alumina powder, -325 mesh, 99.99 % pure from Cerac Inc. (now

    Materion Advanced Chemicals Inc.) Initial average grain size: 0.38 µm

    E.A. Olevsky, W.L. Bradbury, C.D. Haines, D.G. Martin, and D. Kapoor, Fundamental Aspects of Spark Plasma Sintering: I. Experimental Analysis of

    Scalability, J. Amer. Ceram. Soc., 95, 2406-2413 (2012)

  • SPS SCALABILITY (SIZE DEPENDENCE)

    -1.00

    -0.80

    -0.60

    -0.40

    -0.20

    0.00

    0.20

    0.40

    0.015 0.030 0.045 0.060

    (Po

    ros

    ity (C

    en

    ter)

    –P

    oro

    sit

    y (S

    urf

    ac

    e))

    / S

    am

    ple

    Ra

    diu

    s

    Die Radius [m]

    Porosity Gradient

    0.219

    0.106

    0.216

    0.187

    0.195

    0.153

    0.175

    0.140

  • SPS SCALABILITY (SIZE DEPENDENCE)

    Alumina

    powder, -325

    mesh, 99.99

    % pure from

    Cerac Inc.

    (now

    Materion

    Advanced

    Chemicals

    Inc.) Initial

    average

    grain size:

    0.38 µm

    E.A. Olevsky, W.L. Bradbury, C.D. Haines, D.G. Martin, and D. Kapoor, Fundamental Aspects of Spark Plasma Sintering: I. Experimental Analysis of

    Scalability, J. Amer. Ceram. Soc., 95, 2406-2413 (2012)

  • FUNDAMENTALS OF SPARK PLASMA SINTERING:

    OVERHEATING OF TOOLING

  • Geometries of (left-to-right): 2 Disks, 3 Disks and 4 Disks Configurations

    The Problem Overheating of SPS Tooling

  • The Problem Overheating of SPS Tooling

  • QUESTIONS ?