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UNITEX Co.,Ltd.

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1. A. OLED (Organic Light Emitting Diode) B. ( ) Roll to Roll 2. 1) OLED (Organic Light Emitting Diode) 2) (1) Sputter System (2) Evaporator System (3) PVD & CVD System (4) Furnace,RTP, etc.3) Roll to Roll Sputter System (1) FPCB (Flexible Printed Circuit Board) (2) Film (ITO, Reflection , Anti- Reflection, Anti- Static, Au, Ag, Cr, Cu, Al, etc.)3.: () (UNITEX Co., Ltd.)1) : 2000 10262) : 3) :

. 4. 1) AE (Advanced Energy)(U.S.A) Sputtering Source (D.C Power Supply, RF Generator)

2) CTI (U.S.A) Cryo Pump

3) AE, CSC, Temescal,Cyantek Sputtering System component application Engineering & Sales

4) Applies Materials (AM) Korea, LAM Research Korea, Univ., Samsung, LG, Hyundai Sputtering plasma

5) OLED, Sputter, Evaporator, RTP, Furnace, PECVD 6) ULVAC, AKT, Varian system installation.

7) (,)

5. . A. OELD System

1) 1 : 200mm x 200mm Glass & 370 x 470 Glass 2) 2 : 5 3) 3 : Film B. Roll to Roll Sputter System

1) 1 : FPCB CCS (Copper Clad Sputter), Film for Decoration, EMI (Electromagnetic Shield ) 2) 2 : ITO FILM ( Indium Tin Oxide Film ), Touch Panel, PDP 3) 3 : AR (Anti Reflection ), AS (Anti Static ), OLED ( Organic Light Emitting Diode )

UNITEX Co.,Ltd. SYSTEM

PC-OVD (Pressure Control Organic Vapor Deposition)

1. crucible 2. Chamber Shutter, Chamber wall, Substrate Holder , etc.3. Cleaning 4. , Shutter, Substrate open-close , 5. Glass, Mask ., display 6. 7.

PumpingGlass(Substrate)Substrate holder & Heat controlDeposition AreaAbout 100mmProcess ChamberOrganic Source Inlet (Furnace)Fixed Shower Curtain(Substrate Up-down control)() Process Chamber-Schematic Diagram

Organic source & crucibleMFCVacuum PumpMFCMFCFurnace ChamberCarrier GasGas (Pressure Control)Throttle ValveTrapRegular valveLift pinShower curtainSubstrate heat controlFurnace Chamber(PC-OVD)-Schematic Diagram

Specifications & Characteristics1. Crucible Materials : Stainless or Quartz2. Temperature : Max 6003. Quick valve 0.05 control On/Off Organic material time control:0.05~ 4. deposition , doping vapor phase alternative 5. 6. Shower head & Shower curtain cleaning 7. Substrate : Heating & Cooling line 8. Shower curtain , 9. Particle

Specifications & Characteristics10. Furnace Chamber pump Range : 10-3~10-5 Torr, T.M.P 11. 12. 13. 14. Metal shadow mask 15. Organic source gas phase Shower head16. Chamber purge 17. 1m x 1.6m 18. Deposition Uniformity : within +/ 3%19. Film Adhesion 20.

Forecast PlanMetal Deposition Sputtering Roll to Roll Film

PC-OVD Block Diagram-Process Chamber

PC-OVD System

Glass size : 150mm x 150mm

PC-OVD SystemGlass size : 200mm x 200mm

PC-OVD SystemGlass size : 200mm x 200mm

PC-OVD SystemGlass size : 200mm x 200mm

PC-OVD SystemGlass size : 200mm x 200mm

PC-OVD SystemGlass size : 200mm x 200mm

PC-OVD System(200mm x 200mm)LAY-OUT

PC-OVD System(200mm x 200mm)LAY-OUT

PC-OVD System(200mm x 200mm)LAY-OUT

PC-OVD System(200mm x 200mm)LAY-OUT

PC-OVD System(200mm x 200mm)LAY-OUT

1. Gas 2. MFC(Mass Flow Controller)3. Gas heater4. Gas5. 6. Heater pipe7. 9. Scan head10. Buffer chamber11. Gate valve12. 13. 14. 15.

1. , 2. 3. SGHP(Solid-Gas Heterogeneous Phase)4. SGHP 5. SGHP 6. I) 1. 2. ETRI dilution gas 3. 4. II) -

Reference(IMID Conference,2006)

Reference(IMID Conference,2006)

2004, ETRI,

Reference( )- & ETRI

, ,(Pending) (2004 9)Reference( )- & ETRI OLED System OLED(Organic Light Emitting Diode) ( ) , , EL System Mobile Phone NoteBook, TV PDA Application Car Audio , Audio -1. OLED System

-2. Roll to Roll Sputtering System Roll Sputtering System Roll Film Unwinding Main drum(Sputtering Process) Rewinding Film ( : Wafer Display) Plasma ( RF, DC Power Supply)

Roll Sputtering System ITO( ) Film - Touch Panel, PDP, TFT LCD, EL AR(Anti-Reflection:) Film - Touch Panel, PDP, TFT LCD, EL Decoration(Au, Ag, Al, Cr, TiN ) - , , Mirror, , , Flexible PCB(Cu) - Touch Panel, PDP, TFT LCD, EL, Application Sputter System Wafer Glass Metal & Dielectric Material Plasma (Vacuum )Sputter System Wafer & Glass Chip MEMS DisplayApplication Decoration

-3. Research System(Sputter)

-4. Research System(PECVD) PECVD System PECVD(Plasma Enhanced Chemical Vapor Deposition) Chemical Gas (O2, He, NH3, SiH4, H2, Ar etc.) RF Generator PECVD System Wafer & Glass Chip Display SiO2 Application Cavity Hard Coating

-5. Research System(Evaporator) Evaporator System :Thermal, E-BeamEvaporator System Wafer & Glass Chip Display Application Case( ) Decoration ,

RTP System RTP(Rapid Thermal Process) Wafer Glass RTP System

-6. Research System(RTP)