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8/16/2019 02072013 Webinar HDI DesignGuide 1 En
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Webinar: Design recommendations HDI – HDI Design Guide
Würth Elektronik Circuit Board Technology
www.we-online.de Seite 1 02.07.2013
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Agenda
Nomenclature and definition
Why Microvia technology?
Possibilities
Costs
Route out a BGA
www.we-online.de Seite 2 02.07.2013
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www.we-online.de Seite 3 02.07.2013
Nomenclature and definition
HDI• High Density Interconnection
Microvia
• Smallest, laser drilled holes
Buried Via• Buried drills on the inner layers
Pitch• Middle of a pad to the middle of a pad
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www.we-online.de Seite 4 02.07.2013
Nomenclature and definition
Number of microvia layers Number of inner layersbetween the microvias
Number of microvia layers
Number of microvia layers Number of inner layers with
buried vias
Number of microvia layers
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www.we-online.de Seite 5 02.07.2013
Nomenclature and definition
Number of microvia layers
Number of inner layersbetween the microvias
Number of microvia layers
Number of inner layers with buried vias
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www.we-online.de Seite 6 02.07.2013
Why Microvia technology?
High reliabilityRoute out thesmallest BGA
pitch
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www.we-online.de Seite 7 02.07.2013
Why Microvia technology?
t
h
h
Basic materialCTEz
Copper thickness t
Aspect Ratio AR= h / IPC-2221/2122
TCT i.d.R -45° / + 125° CSolder process
Expand! 010203040506070
25 50 75 100 125 150 175 200 225 250T [°C]
E x p a n d Z - a x i s
[ µ m ]
Standard-FR4 Z-Achse Cu
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www.we-online.de Seite 8 02.07.2013
Why Microvia technology?
Route out thesmallest BGA
pitch High reliability
Miniaturisationwith ‘Via in Pad’
technology
Cost-effectivegeneration ofhigh wiringdensity
Future-prooftechnology –
components aregetting smaller all
the time
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We will have a…
02.07.2013www.we-online.de Page 9
What's the reason that plated through holes / vias can not be
reduced to any small size?
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Possibilities – Standard Microvias
www.we-online.de Seite 10 02.07.2013
Standard - Microvia
Pad Ø 300µm
FinalØ 100µm
With 60-70µmdielectric
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Possibilities –Microvias with impedance
www.we-online.de Seite 11 02.07.2013
Standard - Microvia
Pad Ø 325µm
FinalØ 125µm
- 1 x pressed
- 1 x electroplated
With 85-110µmdielectric
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Possibilities – Staggered Microvias
www.we-online.de Seite 12 02.07.2013
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Possibilities – Staggered Microvias
www.we-online.de Seite 13 02.07.2013
- 2 x pressed- 2 x electroplated
- Filling of the microvias and buried vias with epoxy
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Via Filling Process
www.we-online.de Seite 14 02.07.2013
Copper
FR4
Copper
Drilling
Metallization
Vacuum fillingprocess
Hardening
Polish
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Possibilities – Staggered Microvias
www.we-online.de Seite 15 02.07.2013
Staggered Microvias
Pitch ≥ 300µm
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Possibilities – Staggered Microvias
www.we-online.de Seite 16 02.07.2013
- 3 x pressed- 3 x electroplated
- Filling of the Micro- and buriedvias with epoxy
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Possibilities – Staggered Microvias and Buried Vias
www.we-online.de Seite 17 02.07.2013
Pitch ≥ 400µm
PadØ 550µm
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Possibilities – Staggered Microvias und Buried Vias
www.we-online.de Seite 18 02.07.2013
- 3 x pressed
- 3 x electroplated
- Filling of the buried vias with epoxy
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Possibilities – Stacked Microvias
www.we-online.de Seite 19 02.07.2013
Copper filled
Stacked microvia
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Possibilities – Stacked Microvias
www.we-online.de Seite 20 02.07.2013
- 3 x pressed
- Filling of Buried Vias with epoxy
- Filling of Microvias with epoxy
- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias
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Possibilities – Stacked Microvias on Buried Vias
www.we-online.de Seite 21 02.07.2013
Stacked Microvia on
Buried Via
Buried Via filled andcapped
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We will have a…
02.07.2013www.we-online.de Page 22
With respect to the manufacturing costs, why is it preferable to use
staggered microvias in comparision with the stacked option?
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Via Filling Process
www.we-online.de Seite 23 02.07.2013
Copper
FR4
Copper
Drilling
Metallization
Vacuum fillingprocess
Hardening
Polish
Metallization
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Possibilities – Stacked Microvias on Buried Vias
www.we-online.de Seite 24 02.07.2013
- 3 x pressed
- Filling of Buried Vias with epoxy and capping
- Filling of Microvias with epoxy
- 4 x electroplated
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www.we-online.de Seite 25 11.06.2013
Complexity
C o s t s
1 + 6 + 1
1.
Microvias 1 to 2
8 to 7PTH 1 to 81 x pressed1 x electroplated1 x laserdrilled1 x mech. drilled
2 + 4 + 22.
1.
Microvias 1 to 2+ 1 to 38 to 68 to 7
PTH 1 to 82 x pressed1 x electroplated1 x laserdrilled1 x mech. drilledMicrovia Filling?
2 + 4 + 22.
1.
Microvias 1 to 22 to 37 to 68 to 7
PTH 1 to 82 x pressed
2 x electroplated2 x laserdrilled1 x mech. drilled
1 + 6b + 1
1.2.
Microvias 1 to 28 to 7
PTH 1 to 8Buried Via 2 to 72 x pressed2 x electroplated1 x laserdrilled2 x mech. drilled
2 + 4(6b) + 22.
1.
Microvias 1 to 22 to 37 to 68 to 7
PTH 1 to 8Buried Via 2 to 72 x pressed2 x electroplated2 x laserdrilled2 x mech. drilled
2 + 4b + 2
2.1.3.
Microvias 1 to 22 to 37 to 68 to 7
PTH 1 to 8
Buried Via 3 to 63 x pressed3 x electroplated2 x laserdrilled2 x mech. drilled
Laser drilling
1 to 3
Staggered
Microvias
buried Vias
extraburiedMicrovias
1 x pressed 2 x pressed3 x pressed
100 %
115 %
120 %
142 %
150 %
175 %
90 %
ML08ohneµ-Vías
Costs
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Route out
www.we-online.de Seite 26 02.07.2013
BGA Pitch 0,8mm
Route out with mech. vias
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Route out
www.we-online.de Seite 27 02.07.2013
BGA Pitch 0,8mm
Route out with Microvias, Dog bone
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Route out
www.we-online.de Seite 28 02.07.2013
BGA Pitch 0,8mm
Route out with Via in Pad
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Route out
www.we-online.de Page 29 02.07.2013
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02.07.2013www.we-online.de Page 30
Thank you for your attention!
Dominic BüchWÜRTH ELEKTRONIK GmbH & Co. KGProduct Management
LasercavityCircuit Board TechnologyP.: +49 7622 397 223M.:+49 151 7270 9888E. [email protected]. www.we-online.de