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7/24/2019 BU4522AX http://slidepdf.com/reader/full/bu4522ax 1/7 Philips Semiconductors Product specification  Silicon Diffused Power Transistor BU4522AX GENERAL DESCRIPTION New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour TV receivers and PC monitors. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V CESM Collector-emitter voltage peak value V BE  = 0 V - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 10 A I CM Collector current peak value - 25 A P tot Total power dissipation T hs   25 ˚C - 45 W V CEsat Collector-emitter saturation voltage I C  = 7 A; I B  = 1.75 A - 3.0 V I Csat Collector saturation current (Fig 17) f = 16 kHz 7 - A f = 64 kHz 6 - A t f Fall time I Csat  = 7 A; f = 16 kHz 285 400 ns I Csat  = 6 A; f = 64 kHz 170 230 ns PINNING - SOT399 PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 base 2 collector 3 emitter case isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CESM Collector-emitter voltage peak value V BE  = 0 V - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 10 A I CM Collector current peak value - 25 A I B Base current (DC) - 6 A I BM Base current peak value - 9 A -I BM Reverse base current peak value 1 - 6 A P tot Total power dissipation T hs   25 ˚C - 45 W T stg Storage temperature -55 150 ˚C T  j Junction temperature - 150 ˚C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-hs Junction to heatsink with heatsink compound - 2.8 K/W R th j-a Junction to ambient in free air 35 - K/W case 1 2 b c e 1 Turn-off current. December 1997 1 Rev 1.000

BU4522AX

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

GENERAL DESCRIPTIONNew generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use inhorizontal deflection circuits of colour TV receivers and PC monitors.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

VCESM Collector-emitter voltage peak value VBE = 0 V - 1500 VVCEO Collector-emitter voltage (open base) - 800 VIC Collector current (DC) - 10 AICM Collector current peak value - 25 AP

totTotal power dissipation T

hs ≤ 25 ˚C - 45 W

VCEsat Collector-emitter saturation voltage IC = 7 A; IB = 1.75 A - 3.0 VICsat Collector saturation current (Fig 17) f = 16 kHz 7 - A

f = 64 kHz 6 - Atf Fall time ICsat = 7 A; f = 16 kHz 285 400 ns

ICsat = 6 A; f = 64 kHz 170 230 ns

PINNING - SOT399 PIN CONFIGURATION SYMBOL

PIN DESCRIPTION

1 base

2 collector

3 emitter

case isolated

LIMITING VALUESLimiting values in accordance with the Absolute Maximum Rating System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCESM Collector-emitter voltage peak value VBE = 0 V - 1500 VVCEO Collector-emitter voltage (open base) - 800 VIC Collector current (DC) - 10 AICM Collector current peak value - 25 A

IB Base current (DC) - 6 AIBM Base current peak value - 9 A-IBM Reverse base current peak value 1 - 6 APtot Total power dissipation Ths ≤  25 ˚C - 45 WTstg Storage temperature -55 150 ˚CT j Junction temperature - 150 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

Rth j-hs Junction to heatsink with heatsink compound - 2.8 K/W

Rth j-a Junction to ambient in free air 35 - K/W

case 

1 2 3 

b

c

e

1 Turn-off current.

December 1997 1 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

ISOLATION LIMITING VALUE & CHARACTERISTICThs = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Visol Repetitive peak voltage from all R.H. ≤ 65 % ; clean and dustfree - - 2500 Vthree terminals to externalheatsink

Cisol Capacitance from T2 to external f = 1 MHz - 22 - pFheatsink

STATIC CHARACTERISTICSThs = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ICES Collector cut-off current 2 VBE = 0 V; VCE = VCESMmax - - 1.0 mAICES VBE = 0 V; VCE = VCESMmax; - - 2.0 mA

T j = 125 ˚CIEBO Emitter cut-off current VEB = 7.5 V; IC = 0 A - - 1.0 mABVEBO Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - VVCEOsust Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 800 - - V

L = 25 mHVCEsat Collector-emitter saturation voltage IC = 7 A; IB = 1.75 A - - 3.0 VVBEsat Base-emitter saturation voltage IC = 7 A; IB = 1.75 A 0.85 0.94 1.03 VhFE DC current gain IC = 1 A; VCE = 5 V - 10 -hFE IC = 7 A; VCE = 5 V 4.2 5.8 7.3

DYNAMIC CHARACTERISTICSThs = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

Switching times (16 kHz line f = 16 kHz; ICsat = 7 A; IB1 = 1.4 A;deflection circuit) (IB2 = -3.5 A)

ts Turn-off storage time 3.5 4.3   µstf Turn-off fall time 285 400 ns

Switching times (64 kHz line f = 64 kHz; ICsat = 6 A; IB1 = 1.2 A;deflection circuit) (IB2 = -3.6 A)

ts Turn-off storage time 2.3 2.7   µstf Turn-off fall time 170 230 ns

2 Measured with half sine-wave voltage (curve tracer).

December 1997 2 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

Fig.1. Test circuit for V CEOsust .

Fig.2. Oscilloscope display for V CEOsust .

Fig.3. Switching times waveforms (16 kHz).

Fig.4. Switching times waveforms (64 kHz).

Fig.5. Switching times definitions.

Fig.6. Switching times test circuit .

+ 50v 

100-200R 

Horizontal 

Vertical 

Oscilloscope 

1R 

6V 30-60 Hz 

100R  V

ICsat 

IB1

16 us 

6.5 us 5 us 

TRANSISTOR 

DIODE I C 

I B 

CE 

IB2

VCE / V  min 

VCEOsust 

IC / mA

100 

200 

250 

ICsat 

90 % 

10 % 

tf 

ts 

IB1

IC 

IB 

- IB2 

IC 

IB 

VCE 

ICsat 

IB1

64us 

26us 20us 

TRANSISTOR 

DIODE 

IB2 

+ 150 v nominal

adjust for ICsat 

Lc 

Cfb T.U.T.LB IBend 

-VBB 

December 1997 3 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

Fig.7. High and low DC current gain.

Fig.8. High and low DC current gain.

Fig.9. Typical collector-emitter saturation voltage.

Fig.10. Typical base-emitter saturation voltage.

Fig.11. Typical collector storage and fall time.I C  =7 A; T  j  = 85˚C; f = 16kHz 

Fig.12. Typical collector storage and fall time.I C  = 6 A; T  j  = 85˚C; f = 64 kHz 

0.01 0.1 1 10 1001

10

100

IC / A

hFE

Ths = 25 C

Ths = 85 CVCE = 1 V

BU4522AF/X

0 1 2 3 40.6

0.7

0.8

0.9

1

1.1

1.2

1.3

IB / A

VBEsat \ V

Ths = 25 C

Ths = 85 C

IC = 7 A

IC = 6 A

0.01 0.1 1 10 1001

10

100

IC / A

       h       F       E

Ths = 25 C

Ths = 85 CVCE = 5 V

BU4522AF/X

0.5 1 1.5 2

1

2

3

4

5

IBend / A

ts/tf/ us BU4522AF/X 16kHz

ICsat = 7 AThs = 85 CFreq = 16 kHz

00

0.1 1 10 1000.01

0.1

1

10

IC / A

VCEsat (V) BU4522AF/X

Ths = 25 C

Ths = 85 C

IC/IB = 5

0 0.5 1 1.5 20

1

2

3

4

5

IB / A

ts/tf/ us BU4522AF/X 64kHz

ICsat = 6 AThs = 85 CFreq = 64 kHz

December 1997 4 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

Fig.13. Normalised power dissipation.PD% = 100 ⋅P D  /P D 25˚C 

Fig.14. Transient thermal impedance.

Fig.15. Test Circuit RBSOA.

Fig.16. Reverse bias safe operating area. T  j  ≤ T  jmax 

Fig.17. I Csat  during normal running vs. frequency of operation for optimum performance 

0 20 40 60 80 100 120 140  

Ths / C 

PD%  Normalised Power Derating 120

110

100

90

80

70

60

50

40

30

20

100

with heatsink compound 

BU2522AF 

30

20

10

0500 1000 1500  

VCE / V 

IC / A

1.0E-07 1.0E-05 1.0E-03 1.0E-01 1.0E-010.001

0.01

0.1

1

10

0

0.2

0.1

0.05

0.02

0.5

t / s

Zth / (K/W) BU4522AF

D =t p  t p 

T P 

0 20 40 60 80 1000

2

4

6

8

10

Horizontal frequency (kHz)

Ic(sat) (A)

10 30 50 70 90

1

3

5

7

9

LB IBend 

-VBB 

LC 

T.U.T.

VCC 

VCL

CFB

December 1997 5 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

MECHANICAL DATA

Dimensions in mm 

Net Mass: 5.88 g 

Fig.18. SOT399; The seating plane is electrically isolated from all terminals.

Notes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".

4.5 

16.0 max 

0.7 

10.0 

5.1

27 

max 

18.1

min 4.5 

2.2 max 

1.1

0.4 M 

5.45 5.45  

25 

25.1

3.0 

25.7 

5.8 max 

3.3 

 0.95 max 2 

3.3 

22.5 

max 

December 1997 6 Rev 1.000

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Philips Semiconductors Product specification

 Silicon Diffused Power Transistor BU4522AX

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above oneor more of the limiting values may cause permanent damage to the device. These are stress ratings only andoperation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of thecopyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to beaccurate and reliable and may be changed without notice. No liability will be accepted by the publisher for anyconsequence of its use. Publication thereof does not convey nor imply any license under patent or otherindustrial or intellectual property rights.

LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of theseproducts can be reasonably expected to result in personal injury. Philips customers using or selling these productsfor use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resultingfrom such improper use or sale.

December 1997 7 Rev 1.000