cc2590

8/10/2019 cc2590

1/19

1 F E A T U R E S A P P L I C A T I O N S

D E S C R I P T I O N

C C 2 5 9 0 B L O C K D I A G R A M

PA

Logic

Bias

15 7

2

3

411

LNA

5

6

BIAS HGM

RF_P

RXTX

RF_N

PAEN

EN

BALUN

ANT

C C 2 5 9

w w w . t i . c o m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . S W R S 0 8 0 S E P T E

2 . 4 - G H z R F F r o n t E n d , 1 4 - d B m o u

A l l 2 . 4 - G H z I S M B a n d S y s t e S e a m l e s s I n t e r f a c e t o 2 . 4 - G H z L o w P o w e r R F D e v i c e s f r o m T e x a s I n s t r u m e n t s W i r e l e s s S e n s o r N e t w o r k s

W i r e l e s s I n d u s t r i a l S y s t e m s U p t o + 1 4 - d B m ( 2 5 m W ) O u t p u t P o w e r I E E E 8 0 2 . 1 5 . 4 a n d Z i g B e e S y 6 - d B T y p i c a l I m p r o v e d S e n s i t i v i t y o n C C 2 4 x x W i r e l e s s C o n s u m e r S y s t e m a n d C C 2 5 0 0 , C C 2 5 1 0 , a n d C C 2 5 1 1 W i r e l e s s A u d i o S y s t e m s F e w E x t e r n a l C o m p o n e n t s

I n t e g r a t e d S w i t c h e s I n t e g r a t e d M a t c h i n g N e t w o r k

C C 2 5 9 0 i s a c o s t - e f f e c t i v e a n d h i g I n t e g r a t e d B a l u n F r o n t E n d f o r l o w - p o w e r a n d

I n t e g r a t e d I n d u c t o r s w i r e l e s s a p p l i c a t i o n s . I n t e g r a t e d P A

C C 2 5 9 0 i s a r a n g e e x t e n d e r f o r a l l I n t e g r a t e d L N A

2 . 4 - G H z l o w - p o w e r R F t r a n s c D i g i t a l C o n t r o l o f L N A G a i n b y H G M P i n S y s t e m - o n - C h i p p r o d u c t s f r o m 1 0 0 - n A i n P o w e r D o w n ( E N = P A E N = 0 ) C C 2 5 9 0 i n c r e a s e s t h e l i n k b u d g e

p o w e r a m p l i f i e r f o r i n c r e a s e d L o w T r a n s m i t C u r r e n t C o n s u m p t i o n L N A w i t h l o w n o i s e f i g u r e f o 2 2 - m A a t 3 - V f o r + 1 2 - d B m , P A E = 2 3 % s e n s i t i v i t y .

L o w R e c e i v e C u r r e n t C o n s u m p t i o n C C 2 5 9 0 p r o v i d e s a s m a l l s i z e , h i g 3 . 4 - m A f o r H i g h G a i n M o d e d e s i g n w i t h i t s 4 x 4 - m m Q F N - 1

1 . 8 - m A f o r L o w G a i n M o d e C C 2 5 9 0 c o n t a i n s P A , L N A , s w i t c

4 . 6 - d B L N A N o i s e F i g u r e , i n c l u d i n g T / R S w i t c h a n d b a l u n f o r s i m p l e d e s i g n oa n d e x t e r n a l a n t e n n a m a t c h w i r e l e s s a p p l i c a t i o n s .

R o H S C o m p l i a n t 4 4 - m m Q F N - 1 6 P a c k a g e

2 . 0 - V t o 3 . 6 - V O p e r a t i o n

1

P l e a s e b e a w a r e t h a t a n i m p o r t a n t n o t i c e c o n c e r n i n g a v a i l a b i l i t y , s t a n d a rI n s t r u m e n t s s e m i c o n d u c t o r p r o d u c t s a n d d i s c l a i m e r s t h e r e t o a p p e a r s a t

P R O D U C T I O N D A T A i n f o r m a t i o n i s c u r r e n t a s o f p u b l i c a t i o n d a t e . C o p y r i g h t 2 0 0 8 , T e x a s I n s tP r o d u c t s c o n f o r m t o s p e c i f i c a t i o n s p e r t h e t e r m s o f t h e T e x a s I n s t r u m e n t s s t a n d a r d w a r r a n t y . P r o d u c t i o n p r o c e s s i n g d o e s n o t

n e c e s s a r i l y i n c l u d e t e s t i n g o f a l l p a r a m e t e r s .
http://focus.ti.com/docs/prod/folders/print/cc2590.html

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A B S O L U T E M A X I M U M R A T I N G S

R E C O M M E N D E D O P E R A T I N G C O N D I T I O N S

E L E C T R I C A L C H A R A C T E R I S T I C S

C C 2 5 9 0

S W R S 0 8 0 S E P T E M B E R 2 0 0 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . w w w . t i . c o

T h e s e d e v i c e s h a v e l i m i t e d b u i l t - i n E S D p r o t e c t i o n . T h e l e a d s s h o u l d b e d u r i n g s t o r a g e o r h a n d l i n g t o p r e v e n t e l e c t r o s t a t i c d a m a g e t o t h e M O S g a

U n d e r n o c i r c u m s t a n c e s m u s t t h e a b s o l u t e m a x i m u m r a t i n g s b e v i o l m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e .

P A R A M E T E R V A L U E

S u p p l y v o l t a g e A l l s u p p l y p i n s m u s t h a v e t h e s a m e v o l t a g e

V o l t a g e o n a n y d i g i t a l p i n 0 . 3 t o V D D + 0 . 3 , m a x 3 . 6

I n p u t R F l e v e l + 1 0

S t o r a g e t e m p e r a t u r e r a n g e 5 0 t o 1 5

R e f l o w s o l d e r i n g t e m p e r a t u r e A c c o r d i n g t o I P C / J E D E C J - S T D - 0 2 0

H u m a n B o d y M o d e l , a l l p i n s e x c e p t p i n 1 0 2

E S D H u m a n B o d y M o d e l , p i n 1 0 1 9 0 0

C h a r g e d D e v i c e M o d e l 1 0 0 0

T h e o p e r a t i n g c o n d i t i o n s f o r C C 2 5 9 0 a r e l i s t e d b e l o w .

P A R A M E T E R M I N M A X

A m b i e n t t e m p e r a t u r e r a n g e 4 0

O p e r a t i n g s u p p l y v o l t a g e 2 . 0

O p e r a t i n g f r e q u e n c y r a n g e 2 4 0 0

T C = 2 5 C , V D D = 3 . 0 V , f R F = 2 4 4 0 M H z ( u n l e s s o t h e r w i s e n o t e d ) . M e a s u r e d o n C Ce x t e r n a l m a t c h i n g c o m p o n e n t s .

P A R A M E T E R T E S T C O N D I T I O N S M I N

R e c e i v e c u r r e n t , H i g h G a i n M o d e H G M = 1 R e c e i v e c u r r e n t , L o w G a i n M o d e H G M = 0

P I N = 0 . 5 d B m , P O U T = 1 2 . 2 d B m 2 2 . 1 T r a n s m i t c u r r e n t P I N = 3 . 5 d B m , P O U T = 1 0 . 0 d B m 1 6 . 8

T r a n s m i t c u r r e n t N o i n p u t s i g n a l 8

P o w e r d o w n c u r r e n t E N = P A E N = 0 A

H i g h i n p u t l e v e l ( c o n t r o l p i n s ) E N , P A E N , H G M , R X T X D D V

L o w i n p u t l e v e l ( c o n t r o l p i n s ) E N , P A E N , H G M , R X T X

P o w e r d o w n - R e c e i v e m o d e s w i t c h i n g 1 . 4 s t i m e

P o w e r d o w n - T r a n s m i t m o d e s w i t c h i n g 0 . 8 s t i m e

R F R e c e i v e G a i n , H i g h G a i n M o d e H G M = 1 1 1

G a i n , L o w G a i n M o d e H G M = 0 0

G a i n v a r i a t i o n , 2 4 0 0 2 4 8 3 . 5 M H z , H i g h H G M = 1 1 . 2 dG a i n M o d e

G a i n v a r i a t i o n , 2 . 0 V 3 . 6 V , H i g h G a i n H G M = 1 1 . 7 dM o d e

H G M = 1 , i n c l u d i n g i n t e r n a l T / R s w i t c h a n d e x t e r n a l N o i s e f i g u r e , H i g h G a i n M o d e 4 .a n t e n n a m a t c h

I n p u t 1 d B c o m p r e s s i o n , H i g h G a i n M o d e H G M = 1

2 S u b m i t D o c u m e n t a t i o n F e e d b a c k C o p y r i g h t 2 0 0 8 , T e x a s I n s t

P r o d u c t F o l d e r L i n k ( s ) : C C 2 5 9 0
http://focus.ti.com/docs/prod/folders/print/cc2590.htmlhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SWRS080&partnum=CC2590http://focus.ti.com/docs/prod/folders/print/cc2590.html

8/10/2019 cc2590

3/19

C C 2 5 9


E L E C T R I C A L C H A R A C T E R I S T I C S ( c o n t i n u e d ) T C = 2 5 C , V D D = 3 . 0 V , f R F = 2 4 4 0 M H z ( u n l e s s o t h e r w i s e n o t e d ) . M e a s u r e d o n C Ce x t e r n a l m a t c h i n g c o m p o n e n t s .

P A R A M E T E R T E S T C O N D I T I O N S M I N

I n p u t I P 3 , H i g h G a i n M o d e H G M = 1

I n p u t r e f l e c t i o n c o e f f i c i e n t , S 1 1 H G M = 1 , m e a s u r e d a t a n t e n n a p o r t

R F T r a n s m i t

G a i n 1 4 . 1 d B

P I N = 4 . 5 d B m 1 3 . 8 d

O u t p u t p o w e r , P O U T P I N = 0 . 5 d B m 1 2 . 2 d

P I N = - 3 . 5 d B m 1 0 . 0

P o w e r A d d e d E f f i c i e n c y , P A E P I N = 0 . 5 d B m 2 3 . 5

O u t p u t 1 d B c o m p r e s s i o n 1 0 . 4

O u t p u t I P 3 2 3 d

O u t p u t p o w e r v a r i a t i o n o v e r f r e q u e n c y 2 4 0 0 2 4 8 3 . 5 M H z , P I N = 0 . 5 d B m 0 . 3 d

O u t p u t p o w e r v a r i a t i o n o v e r p o w e r s u p p l y 2 . 0 V 3 . 6 V , P I N = 0 . 5 d B m 3 . 2 d

O u t p u t p o w e r v a r i a t i o n o v e r t e m p e r a t u r e - 4 0 C 8 5 C , P I N = 0 . 5 d B m 1 . 1 d

T h e 2 n d h a r m o n i c c a n b e r e d u c e d t o b e l o w r e g u l a t o r y2 n d h a r m o n i c p o w e r l i m i t s b y u s i n g a n e x t e r n a l L C f i l t e r a n d a n t e

a p p l i c a t i o n n o t e A N 0 3 2 f o r r e g u l a t o r y r e q u i r e m e n t s .

T h e 3 r d h a r m o n i c c a n b e r e d u c e d t o b e l o w r e g u l a t o r y 3 r d h a r m o n i c p o w e r l i m i t s b y u s i n g a n e x t e r n a l L C f i l t e r a n d a n t e

a p p l i c a t i o n n o t e A N 0 3 2 f o r r e g u l a t o r y r e q u i r e m e n t s .

C o p y r i g h t 2 0 0 8 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d S u b m i t D o c u m e n t a t i o n F e e d 3


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D E V I C E I N F O R M A T I O N

1

2

3

45 6 7 8

9

10

11

1213141516

GND

ANT

AVDD_PA2

GND

G N D

H G M E

N

P A E N

NC

RF_N

RXTX

RF_P

A V D D

_ B I A S

P A B I A S

G N D

A V D D

_ L N A

QFN-16 4x4mm

C C 2 5 9 0


T h e C C 2 5 9 0 p i n o u t a n d d e s c r i p t i o n a r e s h o w n i n F i g u r e 1 a n d T a b l e 1 , r e s p e c t i v e l y .

P I N A N D I / O C O N F I G U R A T I O N ( T O P V I E W )

F i g u r e 1 .

N O T E :

T h e e x p o s e d d i e a t t a c h p a d m u s t b e c o n n e c t e d t o a s o l i d g r o u n d p l a n ep r i m a r y g r o u n d c o n n e c t i o n f o r t h e c h i p . I n d u c t a n c e i nm i n i m i z e d . I t i s h i g h l y r e c o m m e n d e d t o f o l l o w t h e r e f e t h e p e r f o r m a n c e . A l s o s e e t h e P C B l a n d p a t t e r n i n f o r m a

F o r b e s t p e r f o r m a n c e , m i n i m i z e t h e l e n g t h o f t h e g r o u nw i t h g r o u n d p l a n e a s l a y e r 2 w h e n C C 2 5 9 0 i s m o u n t e d



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C C 2 5 9


T a b l e 1 . P I N F U N C T I O N S

P I N T Y P E D E S C R I P T I O N

N O . N A M E

T h e e x p o s e d d i e a t t a c h p a d m u s t b e c o n n e c t e d t o G N D G r o u n d C C 2 5 9 0 E M r e f e r e n c e d e s i g n f o r r e c o m m e n d e d l

1 N C N o t C o n n e c t e d

2 R F _ N R F R F i n t e r f a c e t o w a r d s C C 2 4 x x o r C C 2 5 x x d e

R X T X s w i t c h i n g v o l t a g e w h e n c o n n e c t e d t o C C 2 T a b l e 3 , T a b l e 4 , 3 R X T X A n a l o g / C o n t r o l a n d T a b l e 5 f o r d e t a i l s .

4 R F _ P R F R F i n t e r f a c e t o w a r d s C C 2 4 x x o r C C 2 5 x x d e

5 P A E N D i g i t a l I n p u t D i g i t a l c o n t r o l p i n . S e e T a b l e 3 , T a b l e 4 , a n d T a b l e 5 f o r d e t a i l s .

6 E N D i g i t a l I n p u t D i g i t a l c o n t r o l p i n . S e e T a b l e 3 , T a b l e 4 , a n d T a b l e 5 f o r d e t a i l s .

D i g i t a l c o n t r o l p i n . 7 H G M D i g i t a l I n p u t H G M = 1 D e v i c e i n H i g h G a i n M o d e

H G M = 0 D e v i c e i n L o w G a i n M o d e ( R X o n l y )

S e c o n d a r y g r o u n d c o n n e c t i o n s . S h o u l d b e s h o r t e8 , 9 , 1 2 , 1 4 G N D G r o u n d P C B l a y e r .

2 . 0 - V 3 . 6 - V P o w e r . P C B t r a c e t o t h i s p i n s e r v e s 1 0 A V D D _ P A 2 P o w e r C C 2 5 9 0 E M r e f e r e n c e d e s i g n f o r r e c o m m e n d e d l

1 1 A N T R F A n t e n n a i n t e r f a c e .

2 . 0 - V 3 . 6 - V P o w e r . P C B t r a c e t o t h i s p i n s e r v e s 1 3 A V D D _ L N A P o w e r C C 2 5 9 0 E M r e f e r e n c e d e s i g n f o r r e c o m m e n d e d l

1 5 B I A S A n a l o g B i a s i n g i n p u t . R e s i s t o r b e t w e e n t h i s n o d e

1 6 A V D D _ B I A S P o w e r 2 . 0 - V 3 . 6 - V P o w e r .



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C C 2 5 9 0 E M E v a l u a t i o n M o d u l e

c

RXTX

RF_N

RF_P

RXTX

RF_N

= PCB trace inductor

CC2590 ANT

PAEN

EN

HGM B I A S

VDD

A V

D D

_ P A 2

A V D D

_ L N A

A V D D

_ B I A S

VDD

VDD

RF_P

RXTX

RF_N

R151

T L 1 0 1

T L 1 3 1

PAEN

EN

C111

L111

C161

C101/C102

C131/C132

HGM

RXTX

C2

LDB182G4520C-110

Balun

SMA

SMA C112

C C 2 5 9 0


F i g u r e 2 . C C 2 5 9 0 E M E v a l u a t i o n M o d u l e

T a b l e 2 . L i s t o f M a t e r i a l s ( S e e C C 2 5 9 0 E M R e f e r e

D E V I C E F U N C T I O N V A L U E

L 1 1 2 P a r t o f a n t e n n a m a t c h . 1 . 5 n H : L Q W 1 5 A N

C 1 1 1 P a r t o f a n t e n n a m a t c h . 0 . 5 p F , G R M 1 5 5 5

C 1 1 2 D C b l o c k . 4 7 p F , G R M 1 5 5 5 C 1 H 4

C 1 6 1 D e c o u p l i n g c a p a c i t o r . 1 n F : G R M 1 5 5 5 C

2 7 p F | | 1 n F . T h e s m a l l e s t c a p c D e c o u p l i n g . W i l l a f f e c t P A r e s o n a n c e . S e e C C 2 5 9 0 E M r e f e r e n c e C 1 0 1 / C 1 0 2 2 7 p F : G R M 1 5 5 5 C 1 H 2 7 0d e s i g n f o r p l a c e m e n t . 1 n F : G R M 1 5 5 5 C 1 H 1 0 2 J A 0 1 f

1 8 p F | | 1 n F . T h e s m a l l e s t c a p c D e c o u p l i n g . W i l l a f f e c t L N A r e s o n a n c e . S e e C C 2 5 9 0 E M r e f e r e n c e C 1 3 1 / C 1 3 2 1 8 p F : G R M 1 5 5 5 C 1 H 1 8 0d e s i g n f o r p l a c e m e n t . 1 n F : G R M 1 5 5 5 C 1 H 1 0 2 J A 0 1 f

C 2 D e c o u p l i n g o f e x t e r n a l b a l u n 1 n F : L W Q 1 5 A N

T L 1 0 1 ( 1 ) T r a n s m i s s i o n l i n e . W i l l a f f e c t P A r e s o n a n c e . ( s i m u l a t e d i n d u c t a n c e : 0 . 8 7 n H ) T r a n s m i s s i o n l i n e : L e n g t h 4 0 m i l , W i d t h = 8

T L 1 3 1 T r a n s m i s s i o n l i n e . W i l l a f f e c t L N A r e s o n a n c e . ( s i m u l a t e d i n d u c t a 1 . 6 4 n H ) T r a n s m i s s i o n l i n e : L e n g t h 1 0 0 m i l , W i d t h =

R 1 5 1 B i a s r e s i s t o r 4 . 3 k : R K 7 3 H 1 E T T P 4 3 0 1 F f r o m

( 1 ) T r a n s m i s s i o n l i n e s a r e m e a s u r e d f r o m e d g e o f p a d o f t h e C C 2 5 9 0 f o o t p r i nt r a n s m i s s i o n l i n e s d e p e n d o n t h e d i s t a n c e t o t h e g r o u n d p l a n e . I f a n o t h e r P C

n e e d s t o b e a d j u s t e d . P C B d e s c r i p t i o n : 4 l a y e r P C B 1 . 6 m m

C o p p e r 1 : 3 5 m D i e l e c t r i c 1 - 2 : 0 . 3 5 m m ( e . g . 2 x P r e p r e g 7 6 2 8 A T 0 5 4 7 % R e s i n ) C o p p e r 2 : 1 8 m D i e l e c t r i c 2 - 3 : 0 . 7 6 m m ( 4 x 7 6 2 8 M 4 3 % R e s i n ) C o p p e r 3 : 1 8 m D i e l e c t r i c 3 - 4 : 0 . 3 5 m m ( e . g . 2 x P r e p r e g 7 6 2 8 A T 0 5 4 7 % R e s i n ) C o p p e r 4 : 3 5 m

D E 1 0 4 i M L o r e q u i v a l e n t s u b s t r a t e ( R e s i n c o n t e n t s a r o u n d 4 5 % , w h i c h g i v



8/10/2019 cc2590

7/19

T Y P I C A L C H A R A C T E R I S T I C S

GaindB

2400 2410 2420 2430 2440 2450 2460 2470 2480

f Frequency MHz

Noise FiguredB

-2

-1

0

1

2

3

4

5

6

7

8

9

10

11

12

13

3.9

4

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

5

5.1

5.2

5.3

5.4

Gain HGM

Noise Figure HGM

Gain LGM

G a

i n

d B

T Temperature Co-40 -20 0 20 40 60 80

-3

-2

-1

0

1

2

3

4

5

6

7

8

9

10

11

1213

14

HGM

LGM

G a

i n

d B

Power Supply V2 2.4 2.6 2.8 3 3.2 3.42.2 3.6

-3

-2

-1

0

1

2

3

4

5

6

7

8

9

10

11

12

13

HGM

LGM

freq (2.400GHz to 2.485GHz)

S ( 1

, 1 )

m1

m1freq=S(1,1)=0.129 / -31.279impedance = 61.723 - j8.383

2.440GHz

C C 2 5 9


L N A G A I N A N D N O I S E F I G U R E L N A Gv s v s

F R E Q U E N C Y T E M P E R A T U R E

F i g u r e 3 . F i g u r e 4 .

L N A G A I N v s

P O W E R S U P P L Y

F i g u r e 5 . F i g u r e 6 . I n p u t I m p e d a n c e o f L NP o r t o n C C 2 5 9 0 E M



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Output Power(dBm) and PAE

%

f Frequency MHz

Current Consumption

mA

2400 2410 2420 2430 2440 2450 2460 2470 248011

12

13

14

15

16

17

18

19

20

21

22

23

24

25

18

18.5

19

19.5

20

20.5

21

21.5

22

22.5

23

23.5

24

24.5

25

I_VDD

PAE

PoutO

utput Power(dBm) and PAE

%

Input Power dBm

Current Consumption

mA

-20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6-8

-4

-6

-2

0

2

4

6

8

10

12

14

16

18

20

22

2426

28

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

3638

40

I_VDD

PAE

Pout


%

T Temperature C o

Current Consumption

mA

8 21-40 - 30 -20 -10 0 10 20 30 40 50 60 70 80

10

12

14

16

18

20

22

24

26

28

21.2

21.4

21.6

21.8

22

22.2

22.4

22.6

22.8

23

PAE

Pout

I_VDD


%

Power Supply V

Current Consumption

mA

8

18

20

22

24

26

17

19

20

21

22

23

24

25

26

16

14

12

10 18

2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

PAE

I_VDD

P OUT

C C 2 5 9 0


T Y P I C A L C H A R A C T E R I S T I C S ( c o n t i n

O U T P U T P O W E R , P A E A N D O U T P U T P O WC U R R E N T C O N S U M P T I O N C U R R E N T C

v s v s I N P U T P O W E R F R E Q U E N C Y

F i g u r e 7 . F i g u r e 8 .

O U T P U T P O W E R , P A E A N D O U T P U T P O WC U R R E N T C O N S U M P T I O N C U R R E N T C

v s v s T E M P E R A T U R E P O W E R S U P P L

F i g u r e 9 . F i g u r e 1 0 .


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C o n t r o l l i n g t h e O u t p u t P o w e r f r o m C C 2 5 9 0

I n p u t L e v e l s o n C o n t r o l P i n s

C o n n e c t i n g C C 2 5 9 0 t o a C C 2 4 x x D e v i c e

RF_P

RXTX

RF_N

RF_P

TXRX_SWITCH

RF_N

CC24xx

RREG_OUT (CC243x, CC2480),VREGOUT (CC2420), GIO1 (CC2400)

AlternativelyVDD/GND

to/MCU

(CC2420) Alternativelyfrom MCU

RF_P

RXTX

RF_N


CC2590 ANTPAEN

EN

HGM B I A S

VDD

A V D D

_ P A 2

A V D D

_ L N A

A V D D

_ B I A S

VDD

VDD

RF_P

RXTX

RF_N

L112 C113 C111

L111 C112

C161

C101/C102

C131/C132

R151

T L 1 0 1

T L 1 3 1

P1_1 (CC243x), GPIO1 (CC2480),GIO6 (CC2400)

L21

C C 2 5 9


T h e o u t p u t p o w e r o f C C 2 5 9 0 i s c o n t r o l l e d b y c o n t r o l l i n g t h e i nc o m p r e s s i o n ( c l a s s A B ) , a n d t h e b e s t e f f i c i e n c y i s r e a c h e d w h

T h e f o u r d i g i t a l c o n t r o l p i n s ( P A E N , E N , H G M , R X T X ) h a v e b C C 2 5 9 0 i s o p e r a t i n g f r o m a 3 . 6 - V s u p p l y v o l t a g e , t h e c o n t r o l 1 .

A n e x a m p l e o f t h e a b o v e w o u l d b e t h a t R X T X i s c o n n e c t e d d i s u p p l y v o l t a g e i s 3 . 6 - V . T h e R X T X p i n o n C C 2 4 x x w i l l s w i t c hh i g h e n o u g h v o l t a g e t o c o n t r o l t h e m o d e o f C C 2 5 9 0 .

T h e i n p u t v o l t a g e s s h o u l d h o w e v e r n o t h a v e l o g i c a l 1 l e v e l t h

T a b l e 3 . C o n t r o l L o g i c f o r C o n n e c t i n g C C 2 5 9 0 t o a

P A E N = E N R X T X H G M M O D E O F O P E R A

0 X X P o w e r D o w n 1 0 0 R X L o w G a i n M o d e

1 0 1 R X H i g h G a i n M o d e

1 1 X T X

F i g u r e 1 1 . C C 2 5 9 0 + C C 2 4 x x A p p l i c a t i o n C i r



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C o n n e c t i n g C C 2 5 9 0 t o t h e C C 2 5 0 0 , C C 2 5 1 0 , o r C C 2 5 1

RF_P

RXTX

RF_N

RF_P

RF_N

CC25CC2510CC2511

00

Connected toVDD/GND/MCU

Alternativel yfrom MCU

RF_P

RXTX

RF_N


CC2590 ANTPAEN

EN

HGM B I A S

VDD

A V D D

_ P A 2

A V D D

_ L N A

A V

D D

_ B I A S

VDD

VDD

RF_P

RXTX

RF_N

R151

T L 1 0 1

T L 1 3 1

NC

GDO0

GDO2

L112 C113 C111

L111 C112

C161

C101/C102

C131/C132

C C 2 5 9 0


T a b l e 4 . C o n t r o l L o g i c f o r C o n n e c t i n g C C 2 5 9 0 t o a C

P A E N E N R X T X H G M M O D E O F O P E R A T I

0 0 N C X P o w e r D o w n

0 1 N C 0 R X L o w G a i n M o d e 0 1 N C 1 R X H i g h G a i n M o d e

1 0 N C X T X

1 1 N C X N o t a l l o w e d

F i g u r e 1 2 . C C 2 5 9 0 + C C 2 5 0 0 / 1 0 / 1 1 D e v i c e A p p l

1 0 S u b m i t D o c u m e n t a t i o n F e e d b a c k C o p y r i g h t 2 0 0 8 , T e x a s I n s t

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C o n n e c t i n g C C 2 5 9 0 t o a C C 2 5 2 0 D e v i c e

RF_P

RXTX

RF_N

RF_P

RF_N

CC2520

Alternatively toVDD/GND/MCU

Alterna tivelyfrom MCU

RF_P

RXTX

RF_N


CC2590 ANTPAEN

EN

HGM B I A S

VDD

A V D D

_ P A 2

A V D D

_ L N A

A V D D

_ B I A S

VDD

VDD

RF_P

RXTX

RF_N

R151

T L 1 0 1

T L 1 3 1

NC

GPIO5

GPIO4

C1

L112 C113 C111

L111 C112

C161

C101/C102

C131/C132

GPIO3

P C B L a y o u t G u i d e l i n e s

C C 2 5 9


T a b l e 5 . C o n t r o l L o g i c f o r C o n n e c t i n g C C 2 5 9 0 t o a

P A E N E N R X T X H G M M O D E O F O P E R A T I

0 0 N C X P o w e r D o w n

0 1 N C 0 R X L o w G a i n M o d e 0 1 N C 1 R X H i g h G a i n M o d e

1 0 N C X T X

1 1 N C X N o t a l l o w e d

F i g u r e 1 3 . C C 2 5 9 0 + C C 2 5 2 0 A p p l i c a t i o n C i r

T h e e x p o s e d d i e a t t a c h p a d m u s t b e c o n n e c t e d t o a s o l i d g r o u nf o r t h e c h i p . I n d u c t a n c e i n v i a s t o t h e p a d s h o u l d b e m i n i m i z e dl a y o u t . C h a n g e s w i l l a l t e r t h e p e r f o r m a n c e . A l s o s e e t h e P C B p e r f o r m a n c e , m i n i m i z e t h e l e n g t h o f t h e g r o u n d v i a s , b y u s i n gC C 2 5 9 0 i s m o u n t e d o n t o l a y e r 1 .

P C B t r a c e i n d u c t o r s a r e u s e d t o b e a b l e t o o p t i m i z e t h e i n d u c t ab y d i s c r e t e i n d u c t o r s . T h e p l a c e m e n t o f t h e p o w e r s u p p l y d e c i m p o r t a n t t o s e t t h e P C B t r a c e i n d u c t a n c e v a l u e s a c c u r a t e l y .

C o p y r i g h t 2 0 0 8 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d S u b m i t D o c u m e n t a t i o n F e e d 1 1

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PACKAGE OPTION ADDENDUM

www.ti.com 15-Nov-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (C) Device Marking(4/5)

CC2590RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS& no Sb/Br)

CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 85 CC2590

CC2590RGVRG4 ACTIVE VQFN RGV 16 2500 Green (RoHS& no Sb/Br)

Call TI Level-2-260C-1 YEAR -40 to 85 CC2590

CC2590RGVT ACTIVE VQFN RGV 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 85 CC2590

CC2590RGVTG4 ACTIVE VQFN RGV 16 250 Green (RoHS& no Sb/Br)

Call TI Level-2-260C-1 YEAR -40 to 85 CC2590

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.
http://www.ti.com/productcontent

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

CC2590RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2CC2590RGVT VQFN RGV 16 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 21-Mar-2013

Pack Materials-Page 1

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CC2590RGVR VQFN RGV 16 2500 338.1 338.1 20.6

CC2590RGVT VQFN RGV 16 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 21-Mar-2013

Pack Materials-Page 2

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http://www.ti.com/lit/slua271

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have n ot been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2014, Texas Instruments Incorporated
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