HIP-Module Technology HIP- 全新组件技术

THE WAY TO MAKE IT

HIP-Module TechnologyHIP- 全新组件技术

Higher Power and Lower Cost ($/W)

更高功率同时更低成本（美元 / 瓦）

THE WAY TO MAKE IT

HIP-Module Technology / SNEC 2013

HIP-Module Technology – powerfullHIP- 组件技术 - 高功效

compared to standard H-pattern module

和传统的 3 栅电池片组件相比， HIP 组件：

5% more power output

增加 5% 的功率输出

40% less shading

减小 40% 的遮光面积

60% lower resistive losses

降低 60% 的阻抗损失

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277W Module reached in first trial首批试产组件达到 277 瓦

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5% Higher Module Power提高 5% 的组件功率

5%

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Low cell-to-module losses更低的 CTM 封装损失

Calculated optical and electrical losses for a monocrystalline HIP-Module

单晶 HIP 组件从电池到组件的光电损失计算图

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60% Lower Resistive Losses in the Ribbon降低 60% 因焊带产生的阻抗损耗

FF loss in the RibbonHIP-Module:4x4mmx0.15mm: 1.6% relative

H-Pattern Module3x1.5mmx0.2mm

4x4mmx0.056mm: 4.3% relative

FF loss of HIP-Module is 60% lower than FF loss of standard H-pattern module.

HIP 组件的 FF 填充因子损失相比标准 H 型组件降低了60%

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HIP-Module Technology – cost efficientHIP- 组件技术 - 成本效益

2% lower cost ($/W) compared to standard H-pattern module

成本比标准 3 栅组件低 2%( 美元 / 瓦 )

35% lower Ag usage compared to standard 3 busbar cell

比标准 3 主栅电池片组件少用 35% 的银浆

30% lower invest and 10% lower material cost ($/W)

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2% Lower Cost降低 2% 的组件成本

2%

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Use of standard materials and processes

Standard PV-ribbons can be used for the cell interconnection

No additional material (such as solder paste or conductive glue) is needed to contact the cells

Only standard, off the shelf equipment (Stringing, Lay-Up, Bussing, EL-testing) is needed

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HIP-Module Technology – superior designHIP- 组件技术 - 更出众的设计

Only thin and straight lines are visible

整块组件只有稀少的几根直线图案

Ribbons are all hidden behind the cells

所有焊带联结隐藏在电池片背后

Module can be produced in a all white version or in a all black version

可实现全黑组件或全白底组件

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Breakthrough in cell interconnection电池片背面串联的突破

Old Interconnection 原串联方式Fork type 叉状型 – complex 复杂

New Interconnection 新串联方式S-shaped ribbon S 型焊带

Turning of every second cell 每隔一片进行旋转– asymmetic pad arrangement

- 不对称的背面形式

Eliminates 180° turning

避免了 180 度的旋转Enables symmetric pad arrangement

保证背面的对称性

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Isolation hides ribbons

Isolation hides ribbons also between the cells

绝缘胶带可隐藏电池片间的联结焊带

Isolation is available in black or white

可选择黑色或白色绝缘胶带

Holes are stamped during stringing process

焊接的同时可实现绝缘胶带圆孔冲压

Detailed view 局部细节

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HIP-Module Technology – easy to implementHIP- 组件技术 - 更出众的设计

Only the stringer needs to be exchanged in the module line, all the other equipments can still be used.

Only a hole drilling machine (with Laser) is needed in the cell line.

The reuse of existing equipment makes the implemenation of the HIP technology fast and affordable

THE WAY TO MAKE IT


Your way to implement the HIP-Technology

Interested in the HIP-Module Technology? 如对 HIP 新组件技术有兴趣Talk to 请联系：

Step 1: Adapt the cell for HIP, mainly the arrangement of the back contact pads. Komax Solar can provide support.

Step 2: Upgrade or install the production equipment for HIP cell interconnection. Komax Solar is the owner of the secured Intellectual Property and can provide a quotation for the cell interconnection equipment.

Step 3: Obtain the license for using HIP technology. The license is granted to PV module producers by Komax Solar free of charge.

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Acknowledgements致谢

Komax Solar, Inc. would like to thank Fraunhofer ISE for cell production, module lamination and the simulations. In addition, we would like to thank Heraeus Precious Metals and Pemco for providing pastes, as well as, Rena for wet chemical processes. We would also like to thank Ulbrich for providing wide and thin ribbons and 3M for providing insulating material between cell and ribbons.

库迈思太阳能公司想感谢弗劳恩霍夫（ Fraunhofer ISE ）提供协助电池生产，组件层压和模拟测试。此外，我们要感谢贺利氏公司和 Pemco 公司提供银浆，以及Rena 公司提供的湿化学工艺。我们还要感谢奥博锐提供宽而薄的焊带和 3M 公司提供电池和焊带之间的绝缘材料。

THE WAY TO MAKE IT

Thank you for your attention ！谢谢您的关注！

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HIP-Module Technology HIP- 全新组件技术