METAL LIFE · COMPANY OVERVIEW Packages-Technology / Process Design Brazing Glass sealing Reliabillity Packages Plating Material / Machining Thermal Matching Lens Window Hermetic

USAEUROPE

ISRAEL

INDIA

CHINA

KOREA Head Office

KOREA Head Office Metallife, Inc (Head Office) 경기도 안산시 단원구 강촌로 215 (반월공단 14블럭-22롯트)215 Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, 425-100 KOREATEL : +82-31-499-2817 / FAX : +82-31-499-2815Homepage : www.metal-life.co.kr / E-mail : [email protected] / [email protected]

www.metal-life.co.kr

METALLIFE Inc. specializes in the hermetic packages for usein following industries

METAL LIFEMake it Reliable-Make it Hermetic!

Hermetic Package Solutions for various essential industriesUSA

Metallife - USA Inc.Add: 2400 E. Katella Ave. Suite 800Anaheim, CA 92806E-mail: [email protected]@metallife-usa.comOffice / Fax: +1-470-282-6117

EUROPE

IHB Consulting & TradingAdd: Hopfenstrasse 8, D-80335,Munich, GermanyE-mail: [email protected] / Fax: +4989206054153 / +4989206054110

ISRAEL

LIYAM Electronics Ltd.Add: 6 Feinshtein St, Tel-Aviv 69123, IsraelE-mail: [email protected] / Fax: +972-3641-3872 / +972-3744-7036

OPTOELECTRONICS RF / MICROWAVE MILITARY & AEROSPACE INDUSTRIAL MEDICAL

CHINA

SANETRONIC COMPANY LIMITEDAdd: Rm. 701 Yiheng Building, No.28, BeiSanHuanDong Road, ChaoYang District,Beijing 100013,ChinaE-mail: [email protected] / Fax: +86-10-6440-5766 / +86-10-6440-5949Website: www.sanetronic.com

Founded in 2004, METALLIFE, INC is a professional manufacturer that develops and produces hermetic packages. As largest manufacturer of hermetic glass-to-metal packages and ceramic-to-metal packages in Korea, we are supplying the packages in application of telecommunications, RF Power Transister, Micro-wave, military, space, industrial and medical application. We offer user-defined products from our 20 years of manufacturing know-how by working closely with our customers. We strive to deliver added value to our customers by combining in-house and outsource manufacturing to maximize flexibility and provide local R&D and sales support for our US customers.

COMPANY OVERVIEW

Packages-Technology / Process

Design Brazing Glasssealing

Reliabillity Packages Plating

Material /Machining

ThermalMatching

LensWindow

Hermetic Package Solutions for various essential industries

Package and component design

Brazing and glass sealing

Thermal matching technology

Precision machining with Wcu / Kovar / Aluminum

Ni & Au & Au-Sn on metals and ceramic

Ceramic Metallization

www.metal-life.co.kr 19www.metal-life.co.kr02

Founded in 2004, METALLIFE, INC is a professional manufacturer that develops and produces hermetic packages. As largest manufacturer of hermetic glass-to-metal packages and ceramic-to-metal packages in Korea, we are supplying the packages in application of telecommunications, RF Power Transister, Micro-wave, military, space, industrial and medical application. We offer user-defined products from our 20 years of manufacturing know-how by working closely with our customers. We strive to deliver added value to our customers by combining in-house and outsource manufacturing to maximize flexibility and provide local R&D and sales support for our US customers.

COMPANY OVERVIEW

CONTENTSKEY PROCESS

PRODUCT

HERMETIC GLASS SEALING, BRAZING, SOLDERING 04

06PLATING, METALLIZING, THERMAL MATCHING

08MULTILAYER CERAMICS (HTCC)

10PACKAGE FOR RF POWER TRANSISTER

12PKG FOR OPTICAL COMMUNICATION

14PACKAGE FOR LASER MODULE

17SUB - COMPONENTS

16WSS BOX for ROADM

18PACKAGE FOR ELECTRONIC DEVICES (CERAMIC PKG)


KEY PROCESS- BRAZING, GLASS SEALING, SOLDERING, PLATING, METALLIZING

HERMETIC GLASS SEAL

Make it Reliable - Make it Hermetic !

- Two types of hermetic sealing available.

1. Compression seal

Glass and metal are sealed by their respective thermal expansion. The thermal expansion of metal and glass create the pressure necessary to make the sealwhich offers superior mechanical performance.

2. Matching seal

For this hermetic seal the glass and metal are sealed by matching rates of thermal expansion in conjunction with a layer of oxide. The layer of oxide is one of the key factors of matching sealing. It could be described as being the glue or binding agent for the seal. We use materials (Kovar or 42NiFe) which are almost equivalent to their thermal expansion within the wide thermal range, hence allowing more flexible, wider range of designs that can be applied.

BRAZING Brazing is a process that uses a Braze Filler Metal with a melting temperature above 840°F(450°C) but below the melting point of the metals to be joined. In brazing, the base metals areheated, usually to a point slightly above the liquidus (flow point) of the filler metal, causing it tomelt. The filler metal then flows into the parallel joint clearance between the two base materialsby capillary attraction and bonds to their surfaces through atomic attraction and diffusion.

SOLDERING Soldering has the same definition as brazing except for the fact that the filler metal used has a liquidus below 840°F (450°C) and below the solidus of the base metals.

Continous Glass Sealing(Brazing) Furnace- Environment : N2, H2 Gas- Max Temp’ : 1150 C

Vacuum Furnace- Environment : N2 Gas- Max Temp’ : 450 C

Vacuum Furnace- Environment : N2 Gas- Max Temp’ : 1100 C

Helium Leak Detector- Resoulution : 5*10 atm cc/sec-12

Coordinate Measuring Machine



KEY PROCESSPLATING (Ni & Au & Au-Sn)1. Au-PLATING

Soft gold plating is commonly used where the highest of gold purity is required for soldering, bonding, high temperature or high corrosion resistance applications. The soft gold plating deposit provides an extremely pure deposit of gold, which maintains the low hardness, and high corrosion resistance of gold consistent with its elemental form. Soft gold plating is preferred for high temperature applications due to the fact that alloying elements of hard gold plating can oxidize at elevated temperatures.

METALLIZINGCeramic metallization can be used a wide range of electronics and engineering applications with exceptionally strong bond strengths. The metallization inks utilize a Moly-Manganese (MoMn) refractory formula that is designed for oxide ceramic substrates. We apply the inks through screen printing, hand painting, immersion, needle painting. In a hydrogen/nitrogen controlled atmosphere, the inks are fired onto the substrate at temperatures ranging from 1300 to 1500°C.

THERMAL MATCHING TECHNOLOGY Every material has its characteristic in thermal expansion co-efficiency and thermal conductivity.To make the hermetic packages, the various materials are used, and their thermal matching iscritical factor. So, Metallife knows how to handle various materials such as WCu, MoCu, CMC, CPC, Super-CMC, Kovar, Alloy-42,…with good thermal matching technique.

2. Ni-PLATING

Sulfamate nickel plating produces a 99.9% pure deposit devoid of organic brighteners or levelers.The high purity of the deposit affords temperature resistance up to the 1400C+ melting point ofpure nickel. Sulfamate nickel plating excels in joining applications including brazing, soldering, over molding, epoxy bonding and welding. The high purity and lack of co-deposited organics improves the wetting of the nickel deposit when soldering and makes sulfamate nickel plating the preferred underplate and diffusion barrier when tin plating, silver plating or gold plating for solderability or brazing.

3. AuSn-Plating

Metallife can provide AuSn plating overall or partially based on the customer’s request. AuSn plating can simplify or improve your process(Die attachment, Soldering) because this platingprocess does not require the AuSn preform or sputtering. The maximum thickness of AuSn is 30um.Normally, Metallife recommend 10um for the stability of a product.


Plating Line - Ni, Au, AuSn

Screen Printer

Metallized Ceramic

Push Type Furnace- Environment : N2, H2 Gas- Max Temp’ : 1500 C



KEY PROCESS

Make it Reliable - Make it Hermetic ! Hermetic Package Solutions for various essential industries

MULTILAYER CERAMICS HTCC (High Temperature Co-fired Ceramic)

Housing material

Furnaces

METALLIFE’s Unique characteristics of Multilayer Co-Fired and Post-Fired Ceramic technologies can provide a wide variety of solutions.Excellent Design Flexibility (3D Structure, High Density Design rule)Excellent Material Properties (Physical & Mechanical , Thermal)Metal Parts Brazing Capability (Heat Sinks / Seal Rings / Leads , Reliable High Temp Brazing)

Material Properties

Item Unit HTCCWhite Black

Material name - MHA-96 MBA-92

Dielectric Constant @ 1MHz 10GHz

9.48.8

9.89.2

Dielectric loss tangent (Tan δ) @ 1MHz 10GHz

5x10-4

1x10-34x10-4

1x10-3

Thermal conductivity W/mK 26 17TCE ppm/°C 7.5 7.4Density g/cm2 3.6 3.6Flexural strength MPa >350 >350Conductor Materials - W, Mo W, MoVolume Resistivity Ω.cm >1012 >1012

Alumina contents % 96 92

Design Rules for HTCC (EXPOSED SURFACE LAYER)

Clean Room & Related Facilities

Metalized Multilayer Ceramics

Relevant Products

Location Spec.a Via Hole Diameter ≥150b Via Hole Land ≥400c Via Hole Pitch ≥650

dVia Catch Pad to Line- w/Via from Upper layer- w/o Via from Upper layer

≥300≥200

e Via Catch Pad to Substrate Edge ≥650f Via Catch Pad to Cavity Edge ≥650g Line Width ≥150h Line Spacing ≥100i Line to Substrate Edge ≥500j Line to Cavity Edge ≥500k Castellation to Line ≥250l Castellation to Via Catch Pad ≥300

UNIT: ㎛

ab

c d fCavity

j

h

g

i

lkCastellation

e

Application- Optical Communications PKG (TOSA/ROSA, BTF, TO)- RF Power TR & High Frequency PKG- Various Sensor Package- MEMS, SMD Package- Hybrid IC with mixed Power circuit- Ceramic Heater



PRODUCT

PKG FOR RF POWER TRANSISTER- Metallife provides ceramic to metal seal packages for RF power transisters. Ceramic with low electrical resistance and heat sink with high thermal conductivity are available for high power application.

Features

HEAT SINK TYPE

CERAMIC

LEAD PIN

FINISH (PLATING)

• Low cost • High reliability • High efficiency • Good performance • Power Output : 10~500W

HEAT SINK THERMAL CONDUCTIVITY (W/mK)

W-Cu

Mo-Cu

CMC

CPC(141/111/212)

SUPER-CMC

Cu-C composite

Cu

Al Diamond

180~230

170~270

180~250

170~320

290~350

350~400

390

500

ALUMINA CONTENTDIELECTRIC CONSTANT (@1MHz)CTE (10-6/°C)THERMAL CONDUCTIVITY (W/mK)CONDUCTOR(Pattern) MATERIAL

90~96%

9 MIN

7.2 MAX

15 MIN

W, Mo-Mn

MATERIALTHICKNESS (mm)

KOVAR OR ALLOY420.1~0.2

NiAuApplication

Electroplated sulfamate Nickel; 2 - 7um

Electroplated matt gold; 0.5 - 2.5 um

Wire Bondable, Solderable, Die attachable



PRODUCT

PKG FOR OPTICAL COMMUNICATION- Metallife offers custom packages for fiber optic communication such as

- We can manufacture any custom machined configuration in a variety of materials and feedthru options.

Housing material

Base material

Connection optionsDirect glass to metal sealing / Glsss sealed insert brazing / Single layer ceramic brazingMulti-layer ceramic brazing / GPO, GPPO connnector soldering(Au-Sn, Sn Alloy) /AR coated sapphire(glass) window and lens attaching(Au-Sn, Sn Alloy)

Key BenefitsShortest Lead-Time. / Highly Reliable. / Flexible Design Options.

Kovar

W-Cu

Invar 42 Alloy Aluminum St. St(SUS) SPCC

St. St(SUS) SPCCMo-Cu Cu CMC/CPC

• WADM Modules • Modulators • Attenuators • Pump Lasers • Switches • Amplifiers • LD/PD Module


- CERAMIC BRAZED PACKAGES

- GLASS TO METAL SEALED PACKAGES



PRODUCT


PKG FOR LASER MODULE

Connection optionsGlass to metal sealing / Ceramic brazingCu-cored Kovar Pin / Kovar / 52 Alloy pins available

Key BenefitsShortest Lead-Time. / Highly Reliable. / Flexible Design Options.

- Metallife offers custom packages for power electronics applications as

- We can manufacture any custom machined configuration in a variety of materials and feedthru options.

• Defense • Fiber laser solutions • DPSS solutions • Material processing • Medical • Display & Entertainment

Housing material

Base material

Kovar

W-Cu

Cu

Cu

ST.ST304 SPCC

SPCCMo-Cu CMC/CPC St. St(SUS)

- PKG for Industrial Laser Module

- PKG for Medical Equipment



PRODUCT


PRODUCT


WSS BOX for ROADM SUB-COMPONENTS

Specification

- Metallife provides various heat dissipation material like WCu/CPC/CMC/Super-CMC/Al-diamond/ Al-50~70%Si alloy. Such materials are suitable for high thermal conductivity and low CTE applications.

① Hermeticity : 1× 10-9 atm-cc/sec He ② Finish : 2~9㎛ electrolytic Ni, 1~3㎛ high purity Au(soft gold) in the pin③ Good work efficiency : Soldering / Wire Bonding / Seam Sealing ④ High reliability : Satisfy MIL STD-883E⑤ Low Cost with minimized material using

Kovar Components- Lid, Ferrule- Kovar or Alloy42 material- Precise manufacturing process- Reliable Finishing (Soft Au) - Low C.T.E. - Soldering available

Metallife can offer big size kovar box for ROADM module with low cost and high quality.With high technology of brazing, We also can make big size package with various materials something like kovar, invar, stainless steel, aluminum, etc. This packages can be used ROADM module and industry laser applications.

Materials① Kovar② Invar③ Stainless Steel ④ Aluminum⑤ Another low cost materials

SubstrateA variety of substrates for BTF PKG are available with low cost. High thermal conductive material can be used (W-Cu / Mo-Cu / Cu-Mo-Cu clad / Cu ,…)

- High thermal conductivity(170~300 W/K) - Wire bondable / laser weld-able / solder-able - Controlled CTE- Ni/Au Plating to meet MIL-STD- Can be attached with patterned ceramics(Al2O3/AlN)

Heat Sink & Carrier- High thermal conductivity(170~250W/K)- W-10~25%Cu / Mo-Cu / Cu-Mo-Cu / Cu- Precise machining- Controlled CTE- Ni/Au Plating to meet MIL-STD- Flatness : under 20um

Applications• Substrate • Heat Sink • Carrier • Optical bench • Jumper • Flange


PRODUCT

Ceramic Packages - Metallife provides ceramic packages with superior mechanical properties, suitable for small, high density,

and surface mountable applications. Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in RF Power , OSA , Defense & Avionics due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials

Features• Low cost • High reliability • High efficiency • Good performance • Wire bondable • Seam sealable


Packages-Technology / Process

Design Brazing Glasssealing

Reliabillity Packages Plating

Material /Machining

ThermalMatching

LensWindow


Package and component design

Brazing and glass sealing

Thermal matching technology

Precision machining with Wcu / Kovar / Aluminum

Ni & Au & Au-Sn on metals and ceramic

Ceramic Metallization


Documents

METAL LIFE · COMPANY OVERVIEW Packages-Technology / Process Design Brazing Glass sealing Reliabillity Packages Plating Material / Machining Thermal Matching Lens Window Hermetic