Sandeep Kumar Mobile No.: +91- 9971873079

Sector-56, Kendriya Vihar Email: s.sandilya05@gmail.com

Gurgaon, Haryana 122002

Professional Synopsis

3 years and 6 months hands on experience in Embedded Product Hardware

Design and Development, Signal Integrity Analysis and Testing.

Area of Interest

High speed Digital System Design & Testing

Analog and Mixed Signal Design and Testing.

Signal Integrity & Power Integrity Analysis

Skill Set

Micro-Processor based design including mixed signal design interfacing

ADCs, DACs and OPAMPs.

High Speed Design & Multi-Layer Board Stackup Layout & Routing

planning and review.

Experience in Signal Integrity Analysis with HyperLynx Simulation tool.

Hardware Design Verification through ORCAD, ALTIUM & ALLEGRO.

Providing High Speed Layout & Routing Guidelines to PCB engineer

keeping Signal Integrity & EMC aspect in picture.

PSPICE and ORCAD Simulation for Design aid.

Power Integrity analysis for Decoupling, Plane noise & DC drop.

BOM preparation and Design documentation for consumer/industrial

product designs.

Exposure to Industrial standard protocols RS232, RS485, SPI, I2C, UART,

LON, MVB HART, CAN.

Experience in interfacing of USB, DDR2, DDR3, LPDDR, NAND FLASH, NOR

FLASH, ETHERNET, EEPROM, SENSORS.

Value Engineering

Reverse Engineering

Knowledge of LDO & Switching regulators.

Knowledge of EMI/EMC and Environmental Testing as per IEC61000

Experience in Obsolescence Management with the web tool Part Miner.

Experience in MTBF calculation with Item Tool Kit for given BOM.

Exposure to all stages of PDLC and Customers quality process.

Primary Skills Sets

Basic knowledge of C Language.

Knowledge of VHDL (Very High Speed Integrated Circuit Hardware Description

Language )

Proactive , Interactive , Quick Learner

Adaptable & Optimistic

Good Communication skill & Strong team building qualities.

Tools used/ known

Orcad 16.5 for schematic design.

Hyperlynx Simulation for signal integrity & Power Integrity Analysis.

Part Miner for Obsolescence Management.

Item Tool Kit for MTBF calculation

Altium Designer for Schematic & PCB

Allegro for schematic design & PCB.

Achievements

Winner of GOLD TEAM ACADEMY award of year 2011 in Larsen & Toubro Ltd. -

IES for outstanding contribution in the project management.

Career Highlights

Employer Larsen & Toubro Ltd-IES [CMMI–5],

Period June 20th,2011 – November 8th,2013

Work Location Mysore (India)

Designation Embedded Hardware Engineer

Responsibilities Hardware Design and Development

Hardware Functional Testing

Pre-compliance testing

Obsolescence Management

Signal Integrity Testing

MTBF Report Generation

Employer Mando Corp Korea (South Korean MNC)

Period November 15th,2013 to present

Work Location Gurgaon (India)

Designation Embedded Hardware Design & Signal Integrity Engineer

Responsibilities Signal Integrity Analysis

Hardware Design and Development

Hardware Functional Testing

Pre-compliance testing

Obsolescence Management

MTBF Report Generation

Education

Examination

Passed

Board/

University

Name of school

/college

Year of

Passing

Percentage

Scored

B.TECH

(Electronics &

Communication

Engineering)

G.B.T.U.

Hindustan College Of

Science & Technology

2011

75.00%

12th C.B.S.E Kendriya Vidyalaya

Muzaffarpur 2006 86.00%

10th C.B.S.E Shantiniketan Awasiya

Bal Vidayalaya 2004 88.40%

Project Profiles

Project1

Wabtec Minerva Electronics Control Unit Development

(Railway Domain)

Description

Minerva ECU (Electronics Control Unit) development consists of

the Brake network, Command network & Diagnostics network.

Its main work is to calculate the brake need for a particular car

based on the information provided by PCM (pressure Control

Module) & PTM (pressure transducer Module) & Communicate it

to the Main Control Unit placed in the Locomotive. It consists of

nearly all the main communication protocols & Memory

interfaces.

DDR2SDRAM ,NOR flash interface

MVB, ETHERNET & LON interface.

RTC, EEPROM & Temperature sensor interface.

Power supply: Buck-Boost converter, LDO’s & PMIC.

SPI Ethernet port.

USB on the go implementation.

CAN interface

Team size 5

Role & Contribution

Role: Project Team Member

Contribution:

Component selection, BOM preparation and cost

estimation

Preparation of design documents and working on part

miner software

DDR2 SDRAM, NOR FLASH, MVB interfacing with

Processor MCF54415.

Study & providing inputs for LON and Battery to Digital

Circuit design.

Vender Interaction

Hardware troubleshooting and debugging for the

DDR2SDRAM,NOR Flash ,Power Supply and other

functionalities in the unit

Project2 Leica Electronic Box (Medical Domain)

Description

Electronic box is used in medical equipments such as Tissue

processor units. The purpose of this project is to design and

develop Electronic Box for LEICA Products ST8000 Staining

Machine (Colorado Project) and CV8010 Cover Slipping Machine

(Sepia Project).

Processor and carrier board interface

DDR2SDRAM ,NAND flash interface

DVI interface

Power supply: Buck-Boost converter, PMIC and coin cell

for RTC.

FEC 2 port Ethernet switch

SPI Ethernet port

2 port USB switch and USB to RS232 converter

AUDIO Codec and AUDIO amplifier

SD card interface

CAN interface

Team size 5

Role & Contribution

Role: Project Team Member

Contribution:

Component selection, BOM preparation and cost

estimation

Preparation of design documents and working on part

miner software

USB, ETHERNET interfacing & PMIC implementation.

Study & providing inputs for CAN and LDO in the unit.

Vender Interaction

Hardware troubleshooting and debugging for different

modules in the unit

Project3

High Definition – Around View Monitoring

Description The Project aims at providing assistance to driver while driving

by providing bird’s eye view of all around the vehicle.

Team size 1

Role & Contribution

Role: Signal Integrity Analyst

Contribution:

Providing high-speed guidelines to the PCB engineer for

layout & routing.

Pre-Layout Signal Integrity analysis for length constraint

determination in case of high speed signal DDR3, PCIe.

IBIS Model collection, check & editing them if correction

required.

Vender Interaction

Post- Layout simulation of Address & Command, Data and

Control signals

Analyzing Overshoot, Undershoot, Reflection,

Ringing, Length matching, Set up time & Hold time

margin & Crosstalk, giving solution if there is any

discrepancy found.

Report preparation

Project4 Lane Keeping Assistance System (LKAS)

Description LKAS makes a vehicle to follow a particular lane, if a vehicle

violates lane rule because of any reason then it produces a

reverse torque to keep the vehicle in lane.

Team size 1

Role & Contribution

Role: Signal Integrity Analyst

Contribution:

Providing high-speed guidelines to the PCB engineer for

layout & routing.

Pre-Layout Signal Integrity analysis for length constraint

determination in case of high speed signal LPDDR2.

IBIS Model collection, check & editing them if correction

required.

Vender Interaction

Post- Layout simulation of Address & Command, Data and

Control signals

Analyzing Overshoot, Undershoot, Reflection,

Ringing, Length matching, Set up time & Hold time

margin & Crosstalk, giving solution if there is any

discrepancy found.

Report preparation

Project5 MOSS-30 (Mando Operated Safety System)

Description

The Project aims at providing assistance to driver by displaying all

information from front of a vehicle through camera like pedestrian

detection , Lane detection etc.

Team size 1

Role & Contribution

Role: Signal Integrity Analyst

Contribution:

Providing high-speed guidelines to the PCB engineer for

layout & routing.

Pre-Layout Signal Integrity analysis for length constraint

determination in case of high speed signal DDR3.

IBIS Model collection, check & editing them if correction

required.

Vender Interaction

Post- Layout simulation of Address & Command, Data and

Control signals.

Analyzing Overshoot, Undershoot, Reflection,

Ringing, Length matching, Set up time & Hold time

margin & Crosstalk, giving solution if there is any

discrepancy found.

Report preparation

Project6 Smart Serial Adapter

Description

The purpose of the project is to design the hardware of Smart

Serial Adapter and improve the performance in terms of

accuracy, cost and electromagnetic compatibility

Product / Project Overview

The Smart Serial Adapter can be operated in 2 modes:

RS232 or USB to RS485 pass-thru adapter

Host controller using a Atmega2560uC

1. Pass thru Adapter:

In this mode, RS232 and USB are connected to the PC. The data

from RS232/USB is serially transferred to RS485 using pass thru

adapter. A jumper switch is used to select the device from RS232

and USB. The data received by the serial adapter is transferred

to RS485 in both full duplex and half duplex modes.

2. Stand-alone host:

In this mode, we can use it as a stand-alone host which can

measure the charge of Li-ion battery pack and also it can handle

some external interfaces to connect to other PCs. This can be

done by interfacing an ATMEGA 2560 microcontroller with the

serial adapter. This microcontroller is pre-programmed which

executes simple ASCII command strings and is compatible with

standard terminal programs like Hyper Terminal.

Team size 2

Role & Contribution

Role: Project Team Member

Contribution:

Component selection, BOM preparation and cost

estimation

Schematic preparation using tool ORCAD.

Overvoltage protection circuit implementation

Preparation of design documents

Involved in Module Testing

Bug Fixing

Project7 Leica Sunrise-DMR (Device Master Record)

Description

The purpose of the project to create a master record of the

device which is essential to get FDA approvals for medical

devices. It consists of verifying schematic, Bill Of materials,

creating test instruction and testing of the PCB boards along with

the documentation.

Team size 5

Role & Contribution

Role: Project Team Member

Contribution:

Creation of DB Files

Creation of Bill of Materials

Creation of PRS (Project Requirement Specification) &

Test Instructions.

Review of Documents done by team members

Verifying Schematics and Layout

Suggesting alternate for the obsolete components

Testing of different PCB modules

Project8 Z-Series BOM Scrubbing (RoHS Conversion)

Description

This project consist of recognizing RoHS components and if they

are non RoHS then suggest alternate for them. Z-series is a

medical device manufactured by Beckman & Coulter.

Team size 3 people

Role & Contribution

Role: Project Team Member

Contribution:

Verifying Components as RoHS

Searching of alternate components to replace Non RoHS

parts

Project9 TQ Prep BOM Scrubbing (RoHS Conversion)

Description This project consist of recognizing RoHS components and if they

are non RoHS then suggest alternate for them. TQ Prep is a

medical device manufactured by Beckman & Coulter.

Team size 3 People

Role & Contribution

Role: Project Team Member

Contribution:

Verifying Components as RoHS

Searching of alternate components to replace Non RoHS

parts

Project10 MTBF report generation for 2 different BOMs using Part Count

Method

Description Generate the MTBF Report at different ambient temperatures for

predicting the reliability of the components used & whole Board.

Team size 2

Role & Contribution

Role: Project Team Member

Contribution:

Data collection (FIT Rate) for the components from their

respective Manufacturer site

Vender Interaction for getting the data if not available on

their Website

Generate the Report at different ambient temperatures

Personal Details

Name Sandeep Kumar

Father’s Name Ram Pravesh Ojha

Date Of Birth 05-01-1989

Nationality Indian

Sex Male

Marital Status Single

Passport Number L2399990

Present Address Sector-56, House No. – MS-12, Kendriya Vihar, Distt. – Gurgaon,

State – Haryana, PIN - 122002

Permanent

Address

Village + P.O. - Amma, P.S. – Hathuari, Via – Bochaha, Distt. –

Muzaffarpur , State – Bihar, PIN - 843103

Languages

Known English, Hindi