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IN THIS ISSUE:Advances in charging for electric vehicles

Maximizing CPU efficiency • An intro to benchtop dc power supplies

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In This Issue... Advances in electric vehicles • Maximizing CPU efficiency

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Vol. 55, No. 4 SEPTEMBER 2012CONTENTS

WIRE & CABLE Advances in electric vehicles

5620PRODUCT APPLICATIONMedical electronics

COVER STORYANALOG & DIGITAL ICs

37A look at the ICs that drive today’s burgeoning technology, as well as the standards and software that support it all.

38 Where the iPad meets the road

42 Ethernet AVB, USB Audio Class 2.0 aid audio quality

46 Op amps: Not all the same

49 Key requirements for ultra high-definition television

52 The ODB++ data format for PCB designs

53 A tale of two standards: 802.11n and 802.11ac

FEATURES

20 Wire & Cable — Advances in charging for electric vehicles

24 Real-Time Software Design — Dynamic time partitioning maximizes CPU efficiency

31 Benchtop Power Supplies — An introduction to benchtop dc power supplies

ENERGY-SAVING INITIATIVE SERIES

28 Data center com links save 65 MWh/year

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DEPARTMENTS6 Viewpoint: We need to dream to survive

8 Product of the Year Story Behind the Story: National Instruments’ PXIe-5665 14-GHz VSA

11 OUTLOOK (Technology News)◾ Harvesting plastic power ◾ New performance standards enable RF emergency devices ◾ Researchers create lightest material◾ The Advanced/MicroTCA Summit 2012

56 Product Application: Medical Electronics ◾ Technologies for remote patient monitoring◾ CPU hacking and a nifty allergy application

61 Product Roundup: LEDs

63 What’s Inside: Samsung Galaxy Tablet 7.7

64 Product Update: Power Management ICs

NEW PRODUCTS67 Integrated Circuits

69 Components & Subassemblies

72 Test & Measurement

75 Power Sources

80 Optoelectronics

81 Packaging & Interconnections

Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No re-sponsibility is assumed by the publisher for its accuracy or completeness.

Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-7317 ©2012 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

Want to see what the Editors are thinking? www2.electronicproducts.com/ElectronicProductsBlogs.aspx

what’s ONLINE...electronicproducts.com

Special Interview Series: Doing business in Thailand

What’s It Worth: The Hickok Electrical Instrument Co.

Education Center:Getting the electronic edge in an age of restrictions

How to turn yourself into a robot

Device detects hazardous material instantly

Engineer turns human waste into electricity

63What’s Inside Sumsung Galaxy Tablet 7.7 LTE

ELECTRONIC PRODUCTS www2.electronicproducts.com SEPTEMBER 2012 5

ELECTRONIC PRODUCTS www2.electronicproducts.com SEPTEMBER 20126

VIEWPOINT

We need to dream to surviveWithout creativity we have nothing. At the

pure basis of it all, creativity lets us in-vent. (So scrap that ancient idea of neces-

sity being the mother of invention.) But it seems we have lost our ability to dream, especially when it comes to dreaming big. It seems we have sat back and rested on our laurels when it comes to dream-ing. What happened? Our forefathers dreamed of railroads that spanned the country, telephones, manned flight, televisions in every home, the In-ternet, landing on the moon — things that may have seemed insurmountable at their time. But they dared to dream and invent — to accomplish their dream.

It seems these days our idea of inventions are just minor upgrades: adding a touchscreen to a phone or adding an entertainment system to a car, or making a faster CPU or an LED brighter. Our en-gineering forefathers would be disappointed and all like sad face.

It’s usually the little guy that dares to dream big. Why? I’m not 100% sure, but maybe when you have nothing to lose it is easy to dream. He dreams of the new and radical things that can change the world (Macro-Inventions). Maybe a passion can only exist

in the individual and not a group or a company. Be-cause once there is something to lose, in many cases money, dreams become smaller. Companies seem to invent incremental inventions (Micro-inventions).

And let’s face it, most of us have to work for a living, but that’s not to say we can’t dream big at our companies, we just may need to find the right company. And look at what companies can do as a whole if they dare to dream. For the last few months, those funky cars that mapped the road ways for projects like Google maps and street view have been creeping around the road. Why? To create a bigger and better database. Wow! What a monumental project . . . and to do it twice!

Or maybe we just need to branch out on our own and dream big. Roll up those sleeves and get going. It’s time to dig in and invent. Get back to our roots.

If you’re working on a project that you think could change the world, let us know. We would love to see it.

Bryan [email protected]

To comment on this Viewpoint, visit, www.eebeat.com/?p=5504

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PRODUCT OF THE YEARThe STory Behind The STory

To find out how National Instru-ments developed its 2011 Prod-uct of the Year — the PXIe-5665

14-GHz three-stage RF vector signal analyzer — we held an e-mail inter-view with Raajit Lall, NI’s Product Marketing Manager for RF and Wire-less Test, who is responsible for the product. Here’s how he described the product’s origin.

Electronic Products: When was it decided to try to design the product?

Lall: At National Instrument we build upon a lot of technologies, start-ing from the 30+ years of expertise in LabVIEW to 20+ years of experience in PXI. We announced our 6.6 GHz suite of RF products (NI 5663e and NI 5673e) in 2008 that were well received. After the success of the 6.6 GHz prod-ucts, we wanted to prove that we could also build microwave instruments with world class performance in the PXI platform. That being said, our typical development time ranges from 1.5 to 3 years on RF products.

Electronic Products: Who came up with the idea for it?

Lall: The vision of our company is often driven by our CEO, Dr. James Truchard. While there aren’t any par-ticular individuals who came up with the idea, product marketing, sales, and R&D worked very closely to come up with the ideas and design of this product.

Electronic Products: What was the development timeline, from first con-cept to introduction?

Lall: Since many technologies such as PXI, FPGAs, and software get re-used, it is difficult to say when the concept was first started. However, the idea for a high-performance RF prod-uct was conceived 2.5 years before the product was released in 2011.

Electronic Products: What were the critical milestones in the design?

Lall: Fitting high-performance RF components in the small form factor of PXI is always challenging and was

definitely a key milestone. Some of the others were:

Phase noise requirements: The NI PXIe-5653 synthesizer module (part of the 5665) is a key compo-nent. Designing oscillators with the low jitter requirements of the 5665 in such a small space is al-ways a challenge. Given that the 5665 is a three-stage superhet ar-chitecture, all three local oscilla-tors on the 5653 contribute to the overall phase noise specification of the 5665. Figuring out the design, testing, and manufacturing of the 5653 was key to this project.Calibration: The NI design team came up with innovative group-delay calibration techniques ap-plied to the entire 50-MHz band-width of the instrument. This provides world class EVM numbers for wide-band RF standards such as LTE and WLAN.Electronic Products: Were there

any surprises in the course of design? Challenges? How were they dealt

with? Lall: In addition to

the challenges discussed above, heat dissipation in the small form factor of a PXI chassis was particu-larly challenging. The de-sign team came up with innovative shielding and heat dissipation tech-

niques to account for the heat gener-ated by the product. The calibration over varieties of temperatures also helps keep the instrument accurate over a wide temperature range.

Electronic Products: What was the market reaction to the introduction?

Lall: The 5665 was extremely well received by the market. It has the R&D grade quality required for character-ization and validation labs yet has 10X the speed of boxed instruments, mak-ing it ideal for production opportuni-ties as well. We have many customers, such as ST Ericsson, who are realizing the cost, speed, and accuracy benefits of the 5665.

Richard Comerford

•

•

National Instruments’ PXIe-5665 14-GHz VSA

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Electronic products


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News about Products... Product Technology... Product ApplicationsOUTLOOK


Triboelectric power generated by plastic can be harvested

Harvesting plastic power

Researchers at Georgia Tech have discovered yet an-other way to harvest small amounts of electricity from motion in the world around us, this time by

capturing the electrical charge produced when two differ-ent kinds of plastic materials rub against one another. This triboelectric generator could provide alternating current from activities such as walking.

The researchers say that this tribo-electric generator could supplement power produced by nanogenerators that use the piezoelectric effect to create current from the flexing of zinc oxide nanowires. They think that these tribo-electric generators can be made nearly transparent, and could offer a new way to produce active sensors to replace technology now used for touch-sensi-tive device displays.

Here’s how it works: The triboelectric generator operates when a sheet of poly-ester rubs against a sheet made of polydimethysiloxane (PDMS). The poly-ester tends to donate electrons, while the PDMS accepts electrons. Immediately after the polymer surfaces rub together, they are mechanically separated, cre-ating an air gap that isolates the charge on the PDMS surface and forms a dipole moment. If an electrical load is then con-nected between the two surfaces, a small current will flow to equalize the charge potential. By continuously rubbing the surfaces together and then quickly separating them, the generator can provide a small alternating current. An exter-nal deformation is used to press the surfaces together and

slide them to create the rubbing motion. But it doesn’t work unless you have two different kinds of materials to create the different electrodes. Rubbing surfaces made from the same material doesn’t provide the charge differential.

While smooth surfaces rubbing together do generate charge, the research team has increased the current produc-

tion by using micro-patterned surfaces. They studied three different types of sur-face patterning — lines, cubes, and pyra-mids — and found that placing pyramid shapes on one of the rubbing surfaces generated the most electrical current: as much as 18 V at about 0.13 µA/cm2. The patterns increased the generating capaci-ty by boosting the amount of charge formed, improving capacitance change due to the air voids created between the patterns, and by facilitating charge sepa-ration.

To fabricate the triboelectric genera-tors (see Fig. 1), the researchers began by creating a mold from a silicon wafer on which the friction-enhancing patterns

are formed using traditional photolithography and either a dry or wet etching process. The molds, in which the fea-tures of the patterns are formed in recess, were then treated with a chemical to prevent the PDMS from sticking.

The generators can produce current for more than 100,000 cycles of operation. So the next step in the research is to cre-ate systems that include storage mechanisms for the current generated. Call 404-894-6986 for more information.

Paul O’Shea

Fig. 1: Schematic shows the fabrication process for the triboelectric nanogenerators and pressure sensors. A patterned silicon wafer serves as the mold for fabrication of PDMS thin films with micro-patterned features. (Image courtesy of Zhong Lin Wang.)

New performance standards enable RF emergency devices

Researchers in PML’s Electromagnetic Division (part of NIST) have worked with the National Fire Protec-tion Agency (NFPA) to develop test methods that can

verify the performance of wireless devices that are used in emergency situations. Such a device is the PASS (personal alert safety systems) which is used by firefighters and inte-grates a transmitter that sends a signal back to the base station when the firefighter is motionless for 30 s.

Now the PML has developed test methods for point-to-point signal attenuation, as well as for interference effects between PASS units and wireless devices that operate in the same frequency bands, such as radio-frequency iden-tification (RFID) systems. They have been approved for

the proposed 2013 revision of NFPA's PASS standard, how-ever NFPA will vote on whether to adopt the revised stan-dard in October 2012. If it does, it will be the first time that new RF technology is included in the NFPA standard, and will likely pave the way for development of future RF devices.

In a firefighter’s surroundings, a major challenge is at-tenuation or path loss. Low attenuation exists when the signal travels through a few walls (such as in a residential structure or office building) before reaching the base sta-tion. But the majority of emergency situations require sig-nals from a portable PASS device to travel through thick walls, which produce high attenuation.

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antenna in the second chamber, where the base station picks up the signal.

The test operators can introduce precise amounts of attenuation and/or interference into the system. The process is fully controllable while also effectively simulating conditions in the fi eld (such as in buildings, tun-nels, the New York City subway, and

skyscrapers). Data taken from NIST fi eld measurements were used to cali-brate the settings for the anechoic chambers.

Two-legged transmission is used in PASS communications. For exam-ple, when a fi refi ghter goes in a building or underground location, his portable devices send a signal to a stationary repeater (placed at the entrance of the building or under-ground site), which than sends a sig-nal to the base station.

These systems are tested with a “single-hop” attenuation test that is being develop by the RF Fields Group’s Metrology for Wireless Systems Proj-ect with leader Kate Remley (see Fig. 1). For this test setup, the PASS device, repeater, and base station are each placed in three anechoic chambers, connected to one another by cable, and appropriate amounts of attenua-tion are introduced between the chambers for each hop.

The PASS signals are usually gener-ated in the 900-MHz or 2.4-GHz band, which many consumer wireless devices also use and therefore may in-terfere with PASS performance. Inter-ference signals with the same fre-quency band are fed into the chamber through one side of a power divider connected to the anechoiic chamber.

Because wireless transmitters in-teract with refl ections off of metallic surfaces, the team has started to de-velop test setups for that as well. One- and two-hop attenuation methods and testing that involve both hops and refl ection are being developed now and will be mostly useful for emergency teams that are called into subways or other underground envi-ronments where the attenuation is high and trains and tracks can cause refl ection.

Christina Nickolas

Fig. 1: Researcher Kate Remley examines the middle chamber containing a repeater unit in a "one-hop" communications test. The PASS is in the cabinet at left, and the base station is in the cabinet at right.

The tests are performed in two an-echoic chambers: one houses the por-table PASS unit mounted on a typical backpack-type air supply; the other contains the base receiver station. The PASS devices transmits its signal from within the fi rst chamber. The signal is picked up by an antenna in that chamber and transmitted through a coaxial cable to a broadcast

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Researchers create lightest materialA team of researchers at the Uni-

versities of Kiel and Hamburg have used carbon-nanotube

technology to produce the lightest solid material ever created. Dubbed aerographite, it is a good electrical conductor, and so the researchers sug-

gest that in may find use as an elec-trode in new kinds of lightweight bat-teries or supercapacitors.

Aerographite is both stronger and lighter than previous superlight mate-rials such as aerogel and metallic mi-crolattice. It has a density of 200 µg/

cm3 (only about a fifth that of micro-lattice), conductivity of 0.2 S/m, and the ability to support over 40,000 times its own weight. Further, the ma-terial has shape memory: it can be crushed into an extremely small space

and will return to its original shape once pressure is removed.

The researchers developed a single-step CVD synthesis process to grow the material so that it had very thin strands of hollow carbon nanotubes whose structure holds together (see Fig. 1). They created adjustable networks using zinc oxide as a template, and the resultant material is a light-absorbing sponge-like substance that can be fab-ricated in various macroscopic shapes several cubic centimeters in size.

Properly designed, the researchers note, the material could avoid typical electrode-material problems such as low mechanical cycling stability, de-generating electrical contacts, or non-optimized electrolyte-to-surface ratio. The material also exhibits such quali-ties as X-ray opacity, super hydropho-bicity, high-temperature stability, and chemical resistance, which may open new areas of application. For more, contact Professor R. Adelung, Institute for Materials Science/Functional Nanomaterials, University of Kiel, Germany at [email protected].

Richard Comerford

Fig. 1: Aerographite can be grown in a number of forms. One form of the material is shown in different magnifications in (a) through (d). Image (d) also shows how the graphite surface can be shaped in a wrinkled manner to give a higher mechanical stability. The super-lightweight variant of aerographite is shown in e through h, where the walls of the tubes are formed from a hollow framework of ribbons that consists of a transition state between amorphous and vitreous carbon. Other variants of the material are shown in i through k.

© 2011 Agilent Technologies, Inc.

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OUTLOOK


The Advanced/MicroTCA Summit 2012AdvancedTCA Summit 2012 will be a happening place

on September 18 and 19 at the Marriot in Santa Clara, CA (advancedTCAsummit.com). Informative technical

sessions, keynote presentations, insights from industry lead-ers, a hall full of the latest products, and a wealth of stan-dards updates make this event a must for anyone even thinking about using the ATCA/MicroATCA standard pack-aging system. Here are just a few of the many interesting products you can get your hands on at the exhibits:

Adax (www.adax.com, Booth 405) will show you the Network In A Box supporting the networks of your choice, LTE, and legacy on a single blade. The systems feature re-dundancy and high-availability.

ADLINK Technology (www.adlinktech.com, Booth 300) will demonstrate the aTCA-6200, a highly integrated 10 Gbit Ethernet processor blade with dual Xeon E5-2648L pro-cessors (Sandy Bridge), each of which can have up to 8 cores and 20 Mbytes of shared cache. Also available is the aTCA-6250 with dual Xeon E5-2658/2648L processors.

ebm-papst (www.ebmpapst.us, Booth 308) has intro-duced a large step forward in technology with the new di-agonal DV6300 series fan. This DV6300 fan offers a large decrease in sound (up to 8 dBA), significant increases in flow/pressure, and improved efficiency. This is accomplished with revolutionary aerodynamics and motor cooling tech-niques never seen before in one fan.

Kontron (www.kontron.com, Booth 404) will be showing off their AT8060 + RTM 10G processor blade designed for the heart of the carrier cloud and featuring dual Xeon E5-2600 series processors. Design elements include four DDR3 memory channels, up to 128 Gbytes of memory, dual 8 GT/s QPI interfaces between both CPUs for minimum latency on memory access and inter-processor communication, plus one AMC bay with PCIe x8 Gen2 + SATA connectivity, and RTM options available.

MEN Micro (www.menmicro.com, Booth 203) has the new CompactPCI PlusIO F75P SBC, said to be the first 3U CPCI board with three independent Intel CPUs. The F75P was developed for safe computing functions such as control and signaling in railway and other transportation applica-tions, where space is an issue. The board can control func-tions up to SIL3.

N.A.T. GmbH (www.nateurope.com, Booth 305) has the double-width NAT-MCH-M4 MicroTCA Carrier Hub, in-tended for applications based on the MicroTCA.4 form fac-tor. Combined with the µRTM COM Express Carrier NAT-MCH-Comex, it allows applications to utilize space behind the MCH in MTCA.4 systems. It has a new clock mezzanine,

the NAT-MCH-CLK-PHYS, offering extremely low jitter and constant latency, realized by using a spe-

cial clock multiplexer. Pigeon Point Systems (www.pi-

geonpoint.com, Booth 402) will have the ShMM-700R Shelf Management Mezza-

nine, which won Best of Show for Infra-

structure Products at the 2011 ATCA/MicroTCA Summit. The ShMM-700R is 20% smaller and 30% less expensive than the market-leading ShMM-500R that it supplements, while pre-serving the user interface, maturity, and quality.

Radisys (www.radisys.com, Booth 303) invites you to look at the T40 40G ATCA platform that delivers a 50% cost-per-bit reduction. It is a telecom-grade system pre-integrated with the larg-est selection of cutting-edge blades, processors, and software.

SANBlaze Technology (www.sanblaze.com, Booth 403) will have their ATCA2000 10 Gbit RAID Storage Blade that revolutionizes the bandwidth and capacity achievable with in-chassis ATCA storage. With up to 6 TB of solid-state flash storage capacity, it boasts 1500 MBytes/s of sustained back-plane bandwidth, high IOPS (25,000), and low latency.

Schroff (www.schroff.us, Booth 400) plans to display a 14U, 14 slot next generation ATCA chassis designed to fu-ture proof your embedded systems. It combines increased power availability and cooling capabilities of a 400-W/slot system with a 40-Gbit/s backplane.

Telco Systems (www.telco.com, Booth 303) will have the T-ATCA404 40G AdvancedTCA switch fabric that delivers unparalleled connectivity to ATCA platforms with support

of multi-rate 10/40G inter-faces on the FI switch and 1/10G interfaces on the BI switch. It provides unmatched

bandwidth and an ex-tensive networking soft-

ware suite, BiNOX, to provide complete networking solution for ATCA platform.

VadaTech (www.vadatech.com, Booth 309) is offering a full line of MicroTCA chassis and over 140 AMC Modules. They have more than 25 1U, 2U, 5U, and 7U chassis ranging from 2 to 12-slots. Fabrics supported include PCI Express, Serial RapidIO, and 10 Gigabit Ethernet or point-to-point connectivity.

V Rose Microsystems (www.vrosemicrosystems.com, Booth 307) will show you the VRM-8202/6250 complete AdvancedTCA system with a 2U shelf and processor blade. The shelf has a layer 2 base switch and dedicated shelf man-agement hub slot, and the processor blade is dual Xeon based with 10G Ethernet.

ZNYX (www.znyx.com, Booth 408) will have the Ultra5 ZX2000 5U platform that offers an ideal foundation for de-manding applications. The system has six payload slots for 10G ATCA 3.1 blades.

Jim Harrison

For more on the AdvancedTCA Summit from September 18 to 19 at the Marriott in Santa Clara, CA, visit ad-vancedTCAsummit.com.

The Pigeon Point Systems ShMM-700R Shelf Management Mezzanine is smaller and lower

cost than its predecessor.

The Telco Systems T-ATCA404 40G AdvancedTCA switch fabric delivers performance to ATCA platforms.

The Radisys T40 40G ATCA

platform features a 50% cost/bit

reduction.

En

a b l i ng t h e S m a r t S o c i e t y

Join us this Fall! Hands-on Labs, Seminars, Meet the Experts, Demos, Partner Solutions and much more!

Machine to MachineComputing ArchitecturesCloud ComputingAnalog & PowerDevelopment ToolsConnectivityOperating Systems

SESSION TRACKS

Human Machine InterfaceDisplay Technologies

System DesignMotor Control

AutomotiveSecurity

Guest SpeakerDean Kamen

R E G I S T E R N O W !

RenesasDevCon.com

O C T O B E R 2 2 - 2 5 , 2 0 1 2

For all things DevCon – including up-to-date course information, lodging and registration details – go to:

O C T O B E R 2 2 - 2 5 , 2 0 1 2

Computing Architectures

Hosted by the Number One MCU Supplier

Worldwide*

Dean Kamen landed in the limelight with the Segway, but he has been innovating since high school, with more than 150 patents under his belt. Recent projects include portable energy and water purification for the developing world.

Hyatt Regency Orange County, CAHyatt Regency Orange County, CAHyatt Regency Orange County, CAHHHHHHHyatt Regencyyatt Regencyyatt Regencyyatt Regencyyatt Regencyyatt Regencyyatt RegencyOrange County, CAOrange County, CAOrange County, CAOrange County, CAOrange County, CAOrange County, CAOrange County, CAHyatt Regency Orange County, CA

K e y S p o n s o r s

© 2012 Renesas Electronics America Inc. *Source: Gartner 2011 Worldwide Semiconductor Market Share Database, March 2012 results

Meet the Experts

Design Issues for Systems That Use LCD Panels

M2M Development

Development Ecosystem and Services

Customer Feedback

Expert Panel: The Auto Industry Speaks

Expert Panel: The Future of Auto Software/System Development

Model-based Development

Simulation: Expert Insights into Modelling Microcontrollers

Automotive

Cost Effective HIL for Rapid Prototyping

Virtual HIL test/ISO 2626 using Processor Models

Introduction to Velocity Lab

Infotainment & Instrumentation Solutions

QuantiPhi for RL78: The Fastest Path from Idea to Implementation

Simulation: Moving Development into the Virtual World

Active Safety SolutionsGraphic System Design Considerations

Insights into MCU & Mixed Signal Design

Automotive Quality/Failure Analysis

Working with AUTOSAR

Trends in Automotive Communication

Improve a Product’s User Experience with Model-based UI Design

Intelligent Power Devices

Mastering Functional Safety and ISO 26262

Advanced SOC for Telematics and Infotainment

MICON Racing – Qualify using QuantiPhi for RL78

Using Processor Models for Software Development and Validation

HEV/EV Traction Motor Control Lab

Computing Architecture

Renesas Next-generation Microcontroller and Microprocessor Technology Roadmap

Microcontroller Solutions Enabling a Greener Society

The Core Difference: When the Core Matters

RH850 & RL78: Introducing the Next Generation of Microcontollers for Automotive Applications

Benchmarking using EEMBC

Optimizing Performance of RX-based Applications

Connectivity

Industrial Ethernet

Instant Connectivity for the “Internet of Things”

PLM-1 Modem

Renesas Connecting through 802.15.4 Radio

CMX TCP-IP

LibUSB: Create a Solution Without the Class Struggle

CAN In a Day: Using the RX CAN API

IR and Bluetooth Connectivity Using the RL78

Development Tools

Getting Started with Renesas Development Tools

Introduction to e2studio, The New Eclipse-based IDE from Renesas

Getting the most out of the Renesas Demonstration Kits (RDKs)

Trends in Embedded Software Development

High-performance Compiler Solutions for Renesas MCUs

Getting the Most Out of the GNU Toolchain

Getting Started with e2studio, The New Eclipse-based IDE from Renesas

Introduction to the RX Arduino

Using Embedded Tools for I2C, SPI, and USB Debugging and Develop-ment on the Renesas RX63N RDK

Seeing Inside your Target at Run-time with µC/Probe

Advanced Debugging with the RX600

Migration from HEW to Eclipse

Migration from Cube Suite to Eclipse

Using Software Building Blocks for Faster Time-to-market

VectorCAST Tools: A Complete Test Environment for Safety-critical Applications

Using a Renesas Code-generation Tool for RL78 Devices

e2studio Advanced Topics

Advanced Debugging on RX with IAR Embedded Workbench

Security

NFC Ecosystem and Solutions

Hardware Roots of Trust – A Foundation for Security

Security Solutions for the Automotive Industry

Security Solutions Part 1: Javacard Applet Development Training

Security Solutions Lab 2: Secure Host Firmware Upgrade using BoardID Secure Solution

Human Machine Interface

Audio Solutions on the RX MCU Family

Capacitive Touch Based User Interfaces and Hardware-based Solutions

Enhance Embedded Designs with Low-cost TFT LCD Solutions

Embedded Vision: Creating “Machines that See”

Driving E Ink Displays

Direct-drive LCD

Using Altia to Design a GUI and Deploy it on Renesas SH7269

Extreme Makeover with the RX600: Adding Touch/Graphics to Your Product

Direct-drive LCD Software Integration for the RX62N/RX63N

Incorporating a Capacitive Touch Interface into Your Design

Industrial Controls GUI Application Using emWin

Display

Flat Panel Displays: LCD Technologies and Trends

Flat Panel Displays: Touch Panel Technologies and Integration

Flat Panel Displays: Beyond the Basics

Flat Panel Displays: How to Over-come High Ambient Light Conditions

Flat Panel Displays: Exploring a 2D/3D Solution

Flat Panel Displays: Advanced Technology TrendsM2M and Cloud Solutions

Energy-efficient Communications with Wi-Fi

Adding Wi-Fi to Embedded Applications

Wireless Connectivity for Embedded Systems

M2M: How to Create Revenue- generating Services and Applications

Wireless SensorsWireless TransceiversM2M: Cloud Connectivity with RX and Exosite

Power

IGBT vs. Mosfet: Which Device to Select?

How to Make Your House Smarter

Digital Power: Design and Architectural Trade-offs

Increasing the Performance of PFC and LED Driver IC Applications

Optical Isolation, SSR Switching, and Ambient Light Sensing in MCU-based Applications

IGBTs for HEV/EV

Motor Control

Power Factor Correction: Why and How?

Sensorless Vector Control and Implementation: Why and How

Know your Precise Position with RX600 MCUs

Field-oriented Control Using a 16-bit Low-power MCU

Operating Systems

Using ThreadX and IAR Embedded Workbench on the RX Processor

Introduction to RoweBots’ Ultra Tiny Linux™ RTOS

Embedding USB: Implementation Challenges and Limitations

FreeRTOS Lecture

Rapid Development on the Renesas RX63N RDK using µEZ® and FreeRTOS

Introduction to Python

Software Development with an Open Source Real-time Operating System

HTML5 HMI Development with QNX

Developing Next-gen Automotive User Interface using EB GUIDE 5.3 w/Windows Embedded Automotive 7 and Renesas R-Car H1

Getting Started with Micriµm’s µC/OS-III Kernel

Embedding TCP/IP: Working Through uC/TCP-IP Usage

Introduction to the .NET Micro Framework

System Design Technologies

Are all Batteries Created Equal?

A/D Converter Fundamentals

Designing Modern Medical Systems

Digital Filtering on a MCU

Infinite Runtime: Energy Harvesting with Renesas MCUs

Moving from 8-bit to 32-bit MCUs

Battery Management

ADC Resolution: Myth and Reality

Exploring the Safety Features of the RX210

Low-power Design

Increase the Dynamic Range and Precision of Digital Filters Using a FPU

RL78 Project Configuration Tips

RX Project Configuration Tips

Sensor Fundamentals

Extreme Low-power Design: Tools, Design Techniques and Implementation

Creating Virtual EEPROM on Renesas MCUs

Implementing Bootloaders on Renesas MCUs

Designing Energy Harvesting Applications with the RL78

Portable Instrumentation Applications with the RL78

Embedded Systems Bootcamp

For course descriptions, visit RenesasDevCon.com

RenesasDevCon.comRegister Today! Limited Space Available.


EngineeringDistribution

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The last sentence on the Mouser Smart Grid Technology home page caught my attention: “The power grid may have

been created ‘dumb,’ but Mouser Electronics offers the new-est products and tools to help raise its IQ.”

Indeed. The electric utility industry’s goal to incorporate information and communications technology into electricity generation, delivery and consumption has spawned an eco-system of components and systems for engineers to choose from. Let’s look at some of these.

Analog and digital parts“Smart meter” utility measurement devices perform remote readings and communicate the information back to the utility by means of pre-cise analog metrology circuits, em-bedded processors and two-way data links. These energy measurement systems require voltage and current sensors, an AFE to interface with these sensors and an MCU to per-form energy measurement calculations. The results can be displayed on an LCD screen or sent over a serial bus to another device for wireless communication.

Smart meters also have to use on-chip, high-accuracy ADCs as well as a range of support elements to provide security and accuracy. Major semiconductor players such as Freescale, Maxim, Microchip, NXP, STMi-croelectronics and Texas Instruments offer a variety of me-trology ICs designed to remove the complexities of metrol-ogy development, enabling designers to focus on product differentiating features.

Network infrastructure productsThe smart grid is a network overlaid on top of the existing power infrastructure. Smart meters can use low-power wireless, cellular networks or even the Internet to pass me-ter readings back to a central collection point. In the home, smart grid implementations can employ powerline com-munications (PLC) technologies operating over a Home Area Network (HAN). The HAN also allows HVAC systems

and other household appliances to communicate with the smart meter, as well as the utility.

Most low-power wireless WAN traffic will be transported using the ZigBee standard or other protocols based on the IEEE 802.15.4 physical specification for unlicensed ISM ra-dio bands. On the Mouser website engineers will find RF transceivers and modules or development kits for software stacks such as ZigBee PRO and 6LoWPAN, as well as EE-PROM and flash memory parts to support memory expan-sion for data logging and remote firmware upgrades.

Renewable energy solutionsAccess to renewable energy sources means that the smart grid can operate more ef-ficiently to meet growing demands for energy. Houses or communities can draw from the grid at off-peak hours when en-ergy prices are low, or generate their own energy at periods of high demand.

One of the major challenges posed by power supply systems such as photovoltaic and wind power generation is that they are dependent on the weather and are thus in-consistent. Power companies must there-fore constantly monitor and adjust the power levels (that is, voltage, current, phase angle) flowing in power lines. To monitor

the voltage fluctuations in the grid and support the advanced operation of the smart grid power distribution network, utili-ties install intelligent automatic load break switches equipped with integrated voltage sensors. These switches consist of a high-voltage capacitor and a low-voltage capacitor connected in parallel. High-voltage ceramic capacitors from suppliers such as TDK Epcos are a key component in the switch and are used as voltage or potential dividing capacitors.

Driven by new environmental and conservation con-cerns and regulations, the market for energy, water, and gas metering systems is rapidly changing. As such, specific design requirements will vary, largely steered by the needs of the devices and applications associated with each sub-system. Engineers can use Mouser’s Smart Grid Technology site to find the latest product information via easy-to-use block diagram navigation.

BY MURRAY SLOVICK

Components and Systems for Smart Grids: Lots of Choices

form energy measurement calculations. The results can be displayed on an LCD screen or sent over a serial bus to another

Smart meters also have to use on-chip,

sion for data logging and remote firmware upgrades.

Renewable energy solutionsAccess to renewable energy sources means that the smart grid can operate more ef-ficiently to meet growing demands for energy. Houses or communities can draw from the grid at off-peak hours when en-ergy prices are low, or generate their own energy at periods of high demand.

power supply systems such as photovoltaic and wind power generation is that they are dependent on the weather and are thus in-consistent. Power companies must there-fore constantly monitor and adjust the power levels (that is, voltage, current, phase angle) flowing in power lines. To monitor



Mouser offers the newest products, tools, and innovative resources to help raise the power grid’s IQ. The design-fulfillment distributor’s new Smart Grid Technology Site is a comprehensive resource center covering key areas such as Smart Meter and Smart Home components, and provides extra resources to help spearhead design development, such as in-depth industry articles and news, as well as a comprehensive library of technical resources.

“Ultimately, we wanted to create a polished technology site to help speed the development of a greener, more efficient and more reliable power

grid, allowing design engineers to get in and get out with what they need even faster. At Mouser, we realize the one component that’s always in short supply is time. We engineered our Smart Grid Technology site to be extremely intuitive, providing useful application information and component selection criteria in a single click,” Hess explains.

The new site’s streamlined graphical interface uses intuitive block diagram navigation, allowing engineers to quickly narrow in on a set universe of products and information based on defined parameters specific to their design needs. To experience the new site first-hand, visit http://www.mouser.com/smart-grid-technology.


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“Smart grid” is a term recognized now in many

circles, and when viewed at its highest level can be understood as any and all technologies, standards, and practices that contribute to a more efficient and more reliable power grid. One overarching goal of smart grid is to simply enable greater consumer participation, which could significantly improve power efficiency.

Smart grid technology promises many methods for reducing waste, lowering peak demand, improving grid reliability, and integrating renewable resources, explains Kevin Hess, Mouser Electronics’ Vice-President of Technical Marketing. Recently, Mouser launched a new technology site covering key information relating to Smart Grid Technology. The power grid may have been created "dumb," but with the significant roll-out of smart meter devices and the increased attention from companies like Mouser that believe in the vision of more intelligent energy, smart grid technology continues to gain momentum with each new innovation.

For example, new dynamic energy-pricing allows consumers to adjust when and how high-load devices are used, ultimately lowering energy bills and reducing the demand spikes which can lead to power outages. A smart appliance can even do this automatically, optimizing its operation to minimize cost and waste — a feature of smart grid called “prices-to-devices.”

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Advances in charging for

electric vehiclesRecent breakthroughs in standards,

cabling, and connectors are improving the consumer’s EV experience

BY MIKE GARDINERProduct ManagerITT Corporationwww.itt.com

Electric vehicles are becoming more prevalent in today’s soci-ety. Some consumers are choos-

ing hybrid and electric vehicles be-cause of the rising price of gas; others are switching out of concern for the environment. Whatever the reason, it is clear that electric vehicles are a more economically and environ-mentally friendly alternative to tra-ditional, gas-powered vehicles.

Manufacturers are continuously developing new designs and tech-nologies to keep pace with new auto-motive demands. The recent changes in consumer trends have steered au-tomotive manufacturers away from producing large SUVs to increased production of smaller, compact, more fuel-efficient vehicles powered by electric or hybrid engines.

Several factors have delayed the mass acceptance of these vehicles. The lack of an established charging infrastructure to support the vehi-cles has certainly hampered their sales. Another source of skepticism by the general public is the perceived inconvenience and inefficiency of the electric vehicle’s charging sys-tem. The energy storage capacity of the lithium-ion battery that powers the electric motor — and determines the distance a driver can travel be-tween charges — is much less than consumers desire. This is compound-ed by the fact that the battery has required a relatively long time to re-charge.

Recent breakthroughs have led to a possible solution to this problem. Engineers have found a way to short-en the charge time of an electric ve-hicle’s battery, easing the driver’s anxiety and providing more con-sumer confidence in the cars, which may lead to growth in the industry.

The shift to hybrid and electric vehicles required the industry to de-velop the J1772 vehicle charging standard to ensure infrastructure compatibility. Vehicle manufactur-ers have quickly adopted the J1772 standard, and manufacturers have in turn developed customized, high-amperage interconnect systems for recharging vehicles that meet both industry safety specifications and customer ergonomic and perfor-mance requirements.

SAE J1772 charging standardThe Society of Automotive Engineers (SAE) established the SAE J1772 Elec-tric Vehicle and Plug In Hybrid Elec-tric Vehicle Conducive Charge Cou-pler specification to cover the electrical and physical performance requirements and communication procedures for the charge systems of electric vehicles. This charging stan-dard was adopted in January 2010 by both the United States and Japan for Level I and Level II electric vehicle charging, and has been accepted by many of the leading electric vehicle manufacturers including GM, Ford, Honda, Nissan, and Toyota.

These levels are defined in the fol-lowing manner:

Level I is ac energy to the vehi-•

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cle service equipment) be limited to 32 A (40-A branch breaker).

Wires and cableThe advanced electric ve-hicle charging solution defined by SAE J1772 uses rugged, high-power cable that is UL certified. The EVE- and EVJE-type cable is made of thermoplastic elastomer that provides high dielectric strength and electrical perfor-mance compared to con-ventional EVT-type cable

made from thermoplastic material. The EVE cable is more flexible in

cold conditions (see Fig. 1) and has a lower brittle point that delivers bet-ter tear resistance in cold weather, making it more suitable for outdoor environments than EVT cables

The TPE’s high-density polyethyl-ene is also more resistant to moisture and acids than polyolefin material, de-livering a long operational life in elec-tric vehicle charging applications.

Connecting cable to carManufacturers addressing the need for a high-amperage solution have developed an electric vehicle charg-ing connector that delivers a 75-A Level II charge while delivering low-temperature rise.

One example of this technology is ITT’s EVC Series connectors (see Fig. 2), which provide a charging time that is 2.5 times faster than 30-A Level II technologies. This second-generation connector utilizes Louver Band technology, and consists of the J2CE connector and the J2IV inlet.

The female contacts in the Louver Band design are made of a special copper alloy that enables high-reli-ability and-performance characteris-tics. The system is designed for a minimum of 10,000 cycles of me-chanical operation and meets UL50 Type 3R/3S sealing for weather pro-tection.

The system is designed to exceed the electrical and mechanical UL specifications, as well as the SAE 1772 specifications across the power curve. The charging solutions fea-

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cle’s on-board charger from a common grounded household receptacle, commonly referred to as a 15-A/120-Vac outlet.Level II is 208-240 Vac, single-phase energy to the vehicle’s on-board charger. The maximum current specified is 80 A (contin-uous) with a branch circuit break-er rated per NEC 625. It is recom-mended that the current rating of residential EVSE (electric vehi-

•

Fig. 1: Thermoplastic elastomer (TPE) cables are able to handle higher voltages and currents, while providing better flexibility and tear resistance than in the past.


Fig. 2: New connector designs, such as the EVC connector from ITT, aid in faster vehicle charging while improving ergonomics and safety.

ErgonomicsAs is the case for many things, look and feel plays a large role in making the user’s charging experience pos-

itive. For that reason, several cos-metic changes have been made

to the next generation of 75-A electric vehicle charging

connectors, including minimizing the number

of screws and re-design

ture highly efficient power contacts to provide flexible functionality, with minimal modifications, across a power curve ranging from 15 A/120 V to 75 A/240 V. Five contacts (two power, one ground, and two signal) make up the J1772 inlet, which has a touch-proof seal on power and ground contacts.

SafetySafety systems, including hardware and software, are built into the elec-tric vehicle charging connector, as well as the electric vehicle and charg-ing stations themselves. The safety mechanisms monitor voltage, cur-rent, and heat; specify the amperage that can go through the charging connector; sensors disengage any drive function while a connector is plugged into the vehicle. Both the 1st Generation EVC Series and the 2nd Generation connector designs passed the full range of the governing body testing, as well as SAE, IEC and GB standards on the first attempt.

The electric vehicle charging connector features a standardized contact system and modular design (in everything from the tooling to the connector handle) makes it suit-able for use worldwide. High quality materials in the contacts and han-dle ensure proper heat manage-ment.

The electric vehicle charging con-nector easily meets the UL tempera-ture rise standard that mandates an increase below 50°C from ambient when activated. As specified above, the EVC Series connector contacts use a copper alloy on the female con-tacts system. Thermal plastic with a high UV resistance rating is used for the handle, with advanced plastic color particles added to keep the handle white, even when exposed to harsh environments over time.

of the handle based on user feed-back, as well as the creation of a new locking-latch mechanism.

For the new mechanism, the latch is exposed and raised from the handle body, allowing for easier engagement with standard inlets. The connector has a metal latch, versus plastic, to ensure ruggedness and reliability. Metal also provides a better tactile feel when the coupler is connector to the vehicle.

Advances in charging for electric vehicles

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Dynamic time partitioning maximizes CPU efficiencyCPU time is divided into periods to optimize process sharing

BY YI ZHENGProduct ManagerQNX Software Systemswww.qnx.com

Even with today’s powerful mul-ticore processors, system design-ers must make sure that process-

es share resources correctly. Time partitioning is a key technique for en-suring that an OS correctly shares re-sources among competing processes. It can also protect or secure computer resources from malicious software.

Time partitioning can be either static or dynamic. Some operating systems also support space partition-ing, which provides a guaranteed amount of memory for each parti-

tion. Space partitioning is beyond the scope of this article, however.

About time partitioningTime partitioning distributes CPU time within a defined time period (a periodic cycle) into logical divisions known as partitions. Partitions are made up of one or more threads. These threads don’t need to be from the same process. In fact, a multi-threaded process may have each of its threads assigned to a different partition. Each partition is guaranteed a predeter-mined amount of CPU time. Partitions need not be assigned equal amounts of CPU time; any logical division works as long as it does not exceed

100% of available time. Note that available CPU time does

not include overhead for typical OS functions such as scheduling. Process-ing time for hardware drivers and management software (such as a TCP/IP stack) may or may not be included, depending on the design of the OS and the overall system design. In the QNX Neutrino RTOS, for example, most or all of this functionality can be controlled by the time partition sched-uling mechanism.

When a partition is allocated CPU time, the question arises of which thread assigned to that partition should be scheduled. Although any scheduling algorithm, such as round-

Real-Time Software Design

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Fig. 1: Comparison of CPU consumption while rerouting on a GPS.

Fig. 2: Comparison of CPU consumption while powering up a GPS.

robin, could be used, priority-based scheduling tends to be preferred. The separation of partitioning and priority scheduling guarantees that each ma-jor division of work (the partition) is guaranteed some amount of CPU time within the periodic cycle, while the actual work to be done by the threads within that partition is based on each thread’s overall importance within the system.

For example, one partition might include threads from processes that provide the user interface, another par-tition might contain threads from pro-cesses that control multimedia (to en-sure uninterrupted music or video playback), and a third might control other data-processing functions neces-sary for a satisfying user experience. If this were a factory automation system, the divisions might be a user interface, motor control, sensor processing, and communication with central factory-control computers. The combinations are limited only by the number of par-titions that the OS permits, the overall system requirements, and the imagina-tion of the system architect.

Regardless of the design chosen, putting different parts of the system into different partitions prevents one part of the system from using all the computer’s resources, starving the other parts.

Static time partitioningIn static time parti-tioning, each partition is preassigned a specif-ic amount of CPU time within a periodic cycle and these assignments cannot be changed at run time. This is typi-cally found in avionics systems and is speci-fied in the ARINC 653 standard.

There are some disadvantages to stat-ic time partitioning, however. These in-clude:

It is difficult to determine the proper partition

•

size and allocation of threads to those partitions. Either formal analysis methods such as RMA must be used, or the programmer must rely on “gut feeling,” then experiment and adjust. Unused time is wasted time. If a •

Dynamic time partitioning maximizes CPU efficiency

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Real-Time Software Design

partition fails to use the CPU time allocated to it, the scheduler cannot assign it to another parti-tion and the CPU remains idle during the remainder of the par-tition’s time allocation.

Dynamic time partitioningWith dynamic time partitioning, the OS can vary the amount of time each partition receives during a processing cycle. The goal is to maximize CPU utilization; if the threads in a partition don’t use their entire CPU allocation, the remaining time can be allocated to other threads. Dynamic time parti-tioning is sometimes called slack steal-ing, a term that is not completely ac-curate. Slack-stealing schedulers are only one type of dynamic time parti-tion scheduler; others are available.

For this article, we look at adaptive partitioning, the type of dynamic time partitioning implemented by the QNX Neutrino RTOS. Adaptive parti-tioning reallocates CPU time not used by a partition and makes it available to other partitions, maximizing perfor-mance in resource-constrained devic-es. Adaptive partitioning is very good at handling bursty CPU demands. If the system is lightly loaded the sched-uling is similar to that in a priority-driven system; if the system is heavily loaded, the scheduling is similar to that in static time partitioning. Adap-tive partitioning permits program-mers to reassign threads to another partition and to dynamically adjust partition sizes (CPU allocated to the partition during the periodic cycle).

Some safety-critical systems require static time partitioning. An adaptive time partitioned system can easily be-come static. Placing a thread contain-ing a simple endless loop at the lowest priority in each partition forces the partition to use all its allocated time and turns a system into a static time partitioned system. A static time parti-tioned system cannot be made into an adaptive one, however.

Example 1: Global positioning systemLet’s compare how a GPS might work under static and adaptive time parti-tioning. Let’s assume that there are three partitions:

ReroutingWhen rerouting, the GPS needs to de-

termine a new route and display it, so the first two partitions might exceed their time allocations. In static parti-tioning, any time that the third parti-tion doesn’t use becomes idle time, as shown in Fig. 1 (left).

With adaptive partitioning, the un-used time is allocated to the other par-titions, resulting in a more responsive system and a more efficient use of re-sources, as shown in Fig. 1 (right).

Powering upThe effect of adaptive partitioning is even more dramatic when you power up the GPS. In this case, the partition for route calculation is idle, and the partition for the UI isn’t very busy. Un-der static time partitioning, the CPU usage might be as shown in Fig. 2 (left).

With adaptive time partitioning, the partition for diagnostics and data acquisition is allocated the time that the other partitions aren’t using, as shown in Fig. 2 (right).

Example 2: Simple automation systemAs another example, let’s consider a simple automation system with sever-al components:

If we rely on thread priorities alone in this system, then during the inte-gration phase, we might discover that the remote monitoring agent works well until the operator uses the local HMI, at which point the remote agent freezes and stops displaying updates. Troubleshooting might reveal that when the HMI commands result in a high level of motor control, the remote agent stops getting any CPU time.

In an attempt to fix the system, we might assign to the local HMI a lower priority than to the remote monitor-

ing agent, but this could lead to unac-ceptable HMI performance. Setting the remote agent, data acquisition, and HMI to medium priority might not work either, because this compro-mises the performance of the data ac-quisition. Because priority reassign-ment doesn’t resolve the issue, we must attempt to change thread behav-ior and monitor the HMI’s CPU con-sumption, and make sure that it yields occasionally to let the remote agent run — a costly solution at the integra-tion stage.

Designing with partitionsTime partitioning provides a better so-lution. We allocate CPU budget to sub-systems and to each of our design teams, eliminating the need for sys-tem-wide priority schemes. Each team can develop its own priority schemes

within each partition. The RTOS en-forces the partitions’ budgets, and then uses priority-based scheduling within each partition. The partitions can be static or adaptive, as required.

There are situations where time partitioning will have problems; for example, when someone presses the power button. In this case:

Cyclic schedulers need time to rec-ognize the event.The deadline must still be met.Handling the event in interrupt processing can be problematic.This type of situation affects both

static and adaptive partition schedul-ers, but adaptive partition schedulers may be less affected. In the QNX Neu-trino RTOS, for example, the concept of a critical thread exists; when this thread is activated (such as when someone presses an emergency power-off button), the scheduler stops all par-tition scheduling and immediately processes that thread.

•

••

Name Time allocation

User interface 30%

Route calculation 40%

Diagnostics and data acquisition 30%

Idle N/A

Component Thread priority

Remote web-monitoring agent Low

Local Human Machine Interface (HMI) Medium and low

Sensor scanning and data acquisition Medium and low

Motor control High

Fig. 3: The remote web monitor is starved for CPU time in a priority-based system when the local HMI is busy.

Dynamic time partitioning maximizes CPU efficiency


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To further illustrate the power savings, let’s consider a hypothetical large data center with 10,000 servers. if those servers all have 10-gbit/s links to the switches and rout-ers, they will need 10,000 ports. if sFP+ modules were used, the power dissipation in just those modules would be 10 kW. Using 12-channel parallel modules would reduce that power to just 2.5 kW. Over a month, this would save over 5,400 kWh of energy — enough to supply over five typical single-family homes. also moving the rack-to-rack connec-tions from single lane to parallel lane optics would result in significant ad-ditional power savings.

Cooling efficiencyIn the same way that host iCs can be positioned for optimal thermal man-agement, embedded optic modules

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provide flexibility in positioning to fa-cilitate thermal engineering. a typical layout for a high-capacity rack top 1rU switch with edge-mounted optics is shown in Fig. 2.

Cool air drawn in through the rear of the box is heated as it flows over switch iCs and other circuit components before it passes over the optical modules mounted on the front panel, where air exhausts

through perforations in the front faceplate. Preheating the air by high-power dissipation iCs presents sig-nificant thermal challenges for the edge-mounted optics, and can limit the system density.

Embedded optic modules, mount-ed on the PCB, can be positioned such that they are not subjected to pre-heated air and, since MTP adapt-ers consume less faceplate area than edge-mounted optics, there would

Fig. 1: Power per 10G lane vs. number of lanes.

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be more area on the faceplate for air exhaust. Higher air velocity through the switch and correspondingly im-proved fan efficiencies are other po-tential benefits.

To understand and quantify the practical benefits of an embedded op-tic implementation, a thermal simula-tion comparison was made between a system populated with the low-power Avago CXP modules, similar to the one illustrated in Fig. 3, and one popu-lated with mid-board-mounted Avago MiniPOD modules. Both implementa-

tions offered the same optical com-munication capacity and dissipated the same amount of power, but the PCB-mounted embedded modules were optimally located near the air in-let. In these simulations the MiniPOD modules operated up to 13° C cooler than their front panel mounted CXP equivalents. Cooling efficiency can translate into better reliability for the devices or reduced cooling cost, since less cooling is required.

Parallel optical products for data centersExamples of parallel optical products for data center applications include the recently introduced AFBR-79EIDZ iSR4 QSFP+ 4-channel modules from Avago Technologies, along with the 12-channel AFBR-83PDZ CXP plugga-ble and AFBR-81uVxyZ/AFBR-82uVxyZ embedded MiniPOD modules. The QSFP+ iSR4 modules integrate four 10G lanes in each direction. The Mini-POD modules deliver the highest front panel density in the industry. For us-ers needing a pluggable solution, the CXP transceivers are one-half the cost per 10 Gbit/s lane compared to standard pluggable SFP+ solutions. Both solutions operate at 25% the power per 10-Gbit/s lane, compared to SFP+ modules.

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An introduction to benchtop dc power supplies

One of the most popular pieces of electronic test equipment, dc supplies come in many forms to suit a broad range of uses

BY B&K STAFF with DON PETERSONB&K Precisionwww.bkprecision.com

Power supplies are among the most popular pieces of elec-tronic test equipment. This

isn’t surprising, as controlled electri-cal energy is used in a tremendous number of ways.

The term “bench” or “benchtop power supply” is used somewhat loosely, as some versions of the pow-er supplies discussed could be too heavy to put on a bench. Still, the

nomencla-ture is use-ful, as even the heavy, high-output power supplies have lots in common with their smaller cousins. But the term “bench” is descriptive

to many folks, as it conjures up a mental image of a dc power supply used on an engineer’s or technician’s bench for myriad power tasks.

Battery eliminator suppliesBattery eliminator types of supplies tend to be the least expensive. The name describes their main purpose, which is to act in place of a battery. These units are inexpensive and handy when one needs to work on battery-operated equipment, as they allow one to work on the equipment without having to find the necessary

Fig. 1: The model 1514 seen here emulates 9- and 12-Vdc batteries, as well as batteries with other voltages.

Benchtop Power Supplies


batteries.One popular type puts out 13.8

Vdc and is intended to provide dc power to devices normally powered from an automobile battery. Typical uses are servicing CB radios and au-tomotive stereo equipment. Their line regulation specification is usu-ally wider than lab supplies, but this is fine, as voltages in automobiles vary substantially.

Another popular type (see Fig. 1) replaces various arrangements of batteries such as 9- and 12-V batter-ies. The only controls are an on/off switch and a switch to allow you to choose the desired output voltage.

Because they are true power sup-plies, they are designed to operate safely into a dead short continuous-ly. Look for the banana jacks to be spaced at 0.75 in. (19 mm) so that the dual banana plug adapters used with coaxial cables can be used.

Constant-voltage supplyA slightly more complex power sup-ply than the battery eliminator, the constant-voltage supply, as its name

implies, supplies a user-adjustable constant voltage. Because they are adjustable, the supplies usually have a meter to show you the voltage the supply is set to.

The basic behavior of the supply is to maintain the set voltage regard-less of the load’s resistance. The sup-ply has a knob to adjust the output voltage. Some models may not be ad-justable all the way down to 0 V and their maximum output current may be proportional to the output volt-age, rather than supplying the rated current at any output voltage.

In some models, “tie” points are provided to allow monitoring output voltage with a more accurate digital

meter or to allow connections to other circuits.

These types of supplies work well as battery eliminators and will also show you the current that the load is drawing.

Constant-voltage/constant-current supplyProbably the most popular type of lab power supply is a

constant-voltage/constant-current supply (see Fig. 2). In addition to sup-plying constant voltage, these sup-plies can also supply constant cur-rent. When in constant current mode, the power supply will main-tain the set current regardless of changes in the load’s resistance.

The arrangement of output termi-nals with the ground terminal be-tween the + and – terminals is the most common, and makes connect-ing either terminal to ground using a metal shorting bar very convenient. This is useful when you want one of the terminals to be referenced to ground. Of course, the same thing can be done less conveniently with a

An introduction to benchtop dc power suppliesBenchtop Power Supplies

Fig. 2: A typical example of a constant-voltage/constant-current power supply is the model 1735A, which outputs one adjustable voltage, as indicated by the one set of banana jack terminals.

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piece of wire or a jumper wire with stackable banana plugs.

The supply in Fig. 2 has coarse and fine controls for both current and voltage. Some power supplies in-stead use 10-turn pots for adjust-ment. Others use thumbwheel switches or pushbutton switches. Thumbwheel and pushbutton switches are useful (if their settings are accurate) because they can elimi-

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nate the need for a meter.These types of power supplies of-

ten have other useful features:Remote sensing: A high-imped-ance input that lets you measure the voltage at the load. The power supply then corrects for the volt-age drop in the leads connecting the supply to the load.Master/slave connections: Various methods exist to allow you to

•

•

connect power supplies from the same family in parallel or series to get higher voltages or higher currents.Remote programming terminal: Some power supplies have input terminals for a voltage or resis-tance that can be used to control the voltage or current output. Note: This is called analog pro-gramming, not digital program-ming using a computer.

Multiple-output supplyMultiple-output power supplies typi-cally have two or three dc outputs, which is useful and cost effective for systems that require multiple voltag-es. A triple-output supply is often-used for circuit development: one output supplies 0 to 5 V, for digital logic, while the other two typically supply 0 to 20 V, which can be used with bipolar analog circuitry. Some-times a tracking adjustment is sup-plied for the two 20-V supplies so that the + and – 20-V supplies can be adjusted together by turning one knob.

The supply in Fig. 3 has three out-puts that can be set independently either by the knob or the keypad. The channel 1 and channel 2 out-puts are 30 V at 3 A, and the third

channel will output 5 V at 3 A. The supply is thus capable of putting out nearly 200 W continuously. The out-puts can be turned on and off inde-pendently or all at once (useful for powering up a whole printed circuit board).

The supply has a number of use-ful features. The outputs can be set to timed operation: after a time in-terval has passed, the output turns itself off. Voltage limits are settable for all channels, so your prototype electrical design can be protected from an accidental over-voltage set-ting. The two 30-V channels can be connected in series or parallel for higher voltage or current, respective-

•

Fig. 3: The popular 9130 supplies three outputs, useful for circuit design:


An introduction to benchtop dc power supplies

Instruments”, often pronounced “skippy” or “skuppy,” Because having to rewrite software upon a change of vendor is painful, the test/measurement industry de-

veloped SCPI to standardize the commands for instrumentation to make it easier

to change instrument vendors without having to re-write a lot of software. SCPI-like: SCPI has helped greatly, but isn’t a complete solution, be-cause new features get added that

•

ly. There are also storage registers for saving up to 50 instrument states for easy recall later (useful for repetitive testing).

A nice feature for unattended op-eration is that the power supply can be set to have its output on at the last power-on settings. Thus, if it is oper-ating a circuit and the ac power fails, the power supply will again start supplying power when the ac power comes back on.

This particular supply is also pro-grammable via a computer, which leads to the next type of supply.

Programmable supplyProgrammable power supplies are sometimes called “system” power supplies, as they are often used as part of a computer-operated system for testing or production. We’ll ex-clude from this discussion “program-ming” via external voltages or a re-sistance, which was used primarily before digital control became popu-lar.

There have been numerous types of computer interfaces over the years with instrumentation. Two of the most popular have been IEEE-488, also known as GPIB (general-purpose interface bus), and RS-232 serial communications. Network interfaces (e.g., Ethernet) and USB) interfaces have also been used (see Fig. 4). We won’t discuss the merits of the differ-ent types of interfaces here, as they are beyond the scope of this docu-ment.

At a slightly higher level than the type of interface is the command language for the power supply. This means the set of instructions sent to the instrument over the digital inter-face and the information received by the computer from the instrument. Three categories you will see are:

Proprietary: Proprietary command languages are typically specific to one manufacturer and some-times even specific to a specific set of instruments. A disadvan-tage of proprietary command languages is that the user needs to write software specific to that instrument. Changing to a differ-ent power supply from another vendor means rewriting the soft-ware. SCPI: SCPI Stands for “Standard Commands for Programmable

•

•

Fig. 4: The XLN3640 system power supply for bench and rackmount applications with USB, GPIB, and LAN interface.

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require new commands. In spite of this, many vendors try to make their instrument command lan-guages SCPI-like, meaning they use as much of the standard as they can. The syntax also looks familiar to software developers, so development times are faster.By sending commands through

the interface the instrument sup-ports, the supply can be controlled with a computer rather than push-ing front panel keys. This is very use-ful especially when doing more com-plex setups like generating dynamic voltage steps using a list mode.

Dual and multi-range supplyMost conventional power supplies

operate with fixed voltage and cur-rent ratings. Take for example a 30-V/3-A conventional supply. In this case, the maximum output power of 90 W can only be realized when the supply operates at 30 V/3 A. For all other voltage/current combinations, the output power will be less.

Dual-range supplies (see Fig. 5) of-fer greater flexibility by operating in two distinct ranges. The desired range can be selected manually via front panel button or automatically based on the voltage and current value entered. The model 9172 will automatically select between a 35-V/3-A range and a 70-V/1.5-A range, potentially eliminating the need for two power supplies with similar volt-

age and current ranges.Multi-range supplies are differ-

ent in that they recalculate voltage/current limits for each setting, forming a constant power hyper-bolic shaped boundary (see Fig 6). The 100-W/60-V/5-A-rated model 9110 is an example of this type of supply; any voltage/current combi-

nations that lie on the hyperbolic

curve are possible. In each case, the supply operates at maximum power.

The benefits of this architecture are clear: A multi range supply offers greater flexibility in output ratings and allows users to substitute several fixed rating with a single multi-range supply, thus saving cost and bench space.

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Fig. 5: The 9172 dual-range programmable power supply with automatic range selection.

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mechanical keys — an extension of the user interface is required. An in-teractive touch-sensitive display can provide drivers with the ability to combine various functions in the center console of the dashboard, with different on-screen pages offer-ing individual user interfaces for the separate function blocks.

But the touchscreen presents a new challenge for the menu defini-tion to make the user interface safe, easy to use, and intuitive. Looking at road details on a navigation system

without a touch-sensitive display, the driver must operate a cumber-some directional button. Diverting the driver’s attention from the road for long periods is not only a safety hazard but also clearly a design flaw. Conversely, a touchscreen provides the ability to recognize swipe and zoom gestures, thus allowing the driver to change the scale of the map or move the position efficiently. When scrolling through lists, for ex-ample,. in your mobile’s phone book, the swiping gesture reduces the du-ration of distraction significantly.

Generally, more and more drivers are using smartphones and tablets and know how to intuitively move or change images on the screen by touching it or by using other com-mon gestures. As we become increas-ingly dependent on our mobile de-vices, drivers will eventually become dissatisfied with vehicle systems that don’t provide gesture support or re-spond the same way as their smart-phone or tablet.

Many first-generation touch-sensi-tive interfaces were based on the same

principle as the mechanical soft-touch buttons on the dash-board: pressing two conductive surfaces together changes the electrical resistance. This resis-tive touchscreen technology comprises a flexible layer over an underlying substrate sepa-rated by a small air gap. The layers consist of transparent plastic coated with a grid of very thin electrical wires and mounted on top of the liquid crystal display (LCD). To regis-ter a touch, the electric wires must be compressed together through holes in the spacer.

Since this type of touch-screens only recognize the

touch of a single finger, they are not suitable for gestures.

Capacitive-touch technologyResistive touchscreens have tradition-ally been preferred because they are easy to control and relatively inexpen-sive. However, the additional layers of plastic cause many internal reflections reducing the light transmission. An outer layer of soft flexible plastic made the surface susceptible to scratches.

Capacitive-touch technology, which is universally used in smartphones and tablets, eliminates many of the known

BY STEPHAN THALER, Marketing Director, Automotive Touch Solutionsand THOMAS WENZELSenior Field Application EngineerAtmelwww.atmel.com

Fig. 1: Mutual-capacitance method.


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problems of resistive touch-screens and is evolving rapidly. A capacitive touchscreen can be seen as an array of many capacitors with a certain ca-pacitance. If a finger approach-es the surface it will cause a change of capacitance relative to ground.

There are two basic types of generating capacitance: self-capacitance or mutual capacitance. Many first-gen-eration touchscreens were based on measuring self-ca-pacitance, but these had sim-ilar problems to resistive touchscreens. Because the self-ca-pacitance method measures the in-put signal of an entire electrode row and column, the position may not always be clearly assigned when us-ing many fingers. Mutual-capaci-tance technology ensures this by measuring each intersection of the orthogonal array. Depending on the application software making touches visible on the screen, leaps within the assignment of fingers can be ex-cluded with this technology. An im-portant difference between capaci-tive and resistive technology is that the user’s finger does not have to ap-ply pressure on the surface of the screen to be recognized. The place-ment of the finger on the surface causes a small change in capacitance and is detected by the controller. Analyzing the measurements of all intersections calculates the exact po-sition of the finger on the touch-screen. A sensitive touchscreen con-troller, for example Atmel’s maXTouch family of products, is able to register the position as well as the approach of one or more fingers even if the user is wearing gloves.

Effective noise suppressionAlthough the capacitance changes are very small in this case, it is vital to be able to eliminate noise and in-terference. Several algorithms mini-mize the capture of interference and suppress harmonics by post-process-ing. The noise suppression feature of the maXTouch controller provides several advantages. Effective noise suppression reduces the number of layers on top of the LCD screen.

Many existing touchscreens re-

quire a shielding layer to protect the measuring signals from the strong ir-radiation of the display generated from fast-switching transistors inside the LCD screen. With fewer sensor layers, there is a smaller loss of bright-ness, which allows for a higher-quali-ty image reproduction on the display and reduced production costs.

Post-processing features ensure safe operation in special environ-ments such as the cab of an automo-

bile. Drift compensation ensures that the touchscreen interface is al-ways calibrated to ambient condi-tions and reacts independently to changes in humidity and tempera-ture. Post-processing also ensures that touches from both gloved and bare fingers are recognized without extra switching.

A distance of 5 mm or less makes it possible to detect not only small zoom gestures between two or more fingers, but also the difference be-tween a weak and firm touch. At-mel’s maXTouch post-processing

also detects when large areas of the screen are covered, for example when a user rests his palm on the screen. This ac-tivity will be rejected as un-intentional touch to avoid incorrect triggering of un-wanted functions.

Tablet experience in the carWith all these functions, sys-tem designers can develop intuitive and very responsive user interfaces making the tablet computer user experi-ence possible in the car.

Touchscreens can also be com-bined with capacitive proximity sen-sors to identify if a hand approaches the screen from the left or the right. This way, only the passenger is al-lowed to control specific functions inside the car. Car manufacturers can then meet individual legislative rules which demand that a driver is not allowed to change settings of a navigation system while driving, and when a passenger can do this at

the same time because his or her hand approach-es the system from a dif-ferent angle.

As the display size in the center console of the dashboard continues to increase, it is useful to of-fer shared interfaces. This allows the passenger to “shift” a part of the screen to view the inter-face for audio setting while the driver interacts with the main controls. By detecting which side the hand approaches the

display, the host MCU can provide access to the correct set of controls to the user.

By using intelligent capacitive-touch technology such as Atmel’s maXTouch family, auto manufactur-ers can design a new generation of user interfaces and continue the tra-dition of offering progressively intui-tive, easily accessible and responsive controls to drivers. These inherently smart controllers ensure that the lat-est features of modern consumer in-terfaces will be rapidly deployed in automotive applications.

Fig. 2: The distance between electrodes is another important criterion for touchscreens.

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Over the last decade the way we find, store, and listen to music has undergone a huge change.

For most people, long gone are the Sat-urday mornings browsing the CD racks (or record stores, if we go further back). Of course, many refuse to change, for a variety of reasons. Some like to look at their music collection on their living room shelves, others love having the CD case for the art and information.

Online media has changed many aspects of the audio industry, but some things just don’t change. The debate over audio quality still goes on, some people prefer vinyl for its warmth, some people like CDs, and many are happy to listen to com-pressed formats such as AAC (Ad-vanced Audio Coding) as found in .m4a files. This may be the successor to the MP3 format (not to be confused with MPEG-3 or MPEG-4, which are video/audio formats).

The overall trend is that music no longer lives on shelves or in CD racks, but in hard drives in home comput-ers, and increasingly in the cloud. This brings about its own unique problems, not in the encoding system used, or the storage technology, but in distributing the audio from the storage media to the speakers.

Some facets of audio qualityCDs are sampled at 44.1 kHz using 16-bit samples. 44.1 K x 16 = 705.6 kbits/s (two tracks = 1,400 kbits/s total). CDs are often considered as a benchmark for audio quality, but increasingly mu-sic producers and consumers are turn-ing to new technologies to deliver higher performance. Many users are looking to higher sample frequencies to improve audio fidelity. Most pro au-dio equipment now supports sample

Ethernet AVB, USB Audio Class 2.0 aid audio quality

New technology aids audio transportrates of 96 kHz, and some even sup-port 192 kHz. Blue-ray, DVD, and HD DVD disks all have the capacity for au-dio to be distributed at these higher sample frequencies, offering higher quality audio than CDs.

An hour of CD-quality audio in uncompressed WAV format takes 630 Mbytes. If you double or triple the sample rate, to get audiophile quality, you end up with 1.3- and 1.9-Gbyte files. This is OK for the audiophile ap-plications, but not very workable for portable audio players and such.

The common way to transfer music via the Internet is using MP3 files. MP3 files are compressed and com-pression usually leads to degradation in audio quality. You can select the amount of compression of the MP3 file when it is created. Depending on that selection, it may come out at 64, 128, 192, 256, or 320 kbits/s — as com-pared to the 1,400 kbits/s for uncom-pressed WAV files. So, at 128 kbits/s, a one hour file is only 57.6 Mbytes. That’s much quicker to download to

my music player. At least 128-bit/s MP3 is needed for any high-quality content, and a true audiophile will likely say no MP3 file, at any bit rate, provides high-quality audio.

AAC stands for advanced audio coding and is the logical successor to MP3 for audio coding at medium to high bit rates. It is a compressed audio format similar to MP3, but offers sev-eral performance improvements, in-cluding a higher coding efficiency for both stationary and transient signals, a simpler filter bank, and better han-dling of frequencies above 16 kHz. This format maintains quality much higher than MP3.

High-quality audio probably de-mands data rates of at least 128 kbits/s in AAC format. AAC at 256 kbits/s is the default encoding used by Apple iTunes and the iTunes Music Store. In-creasing demand for higher quality audio formats is leading to common use of alternative audio encodings.

FLAC (Free Lossless Audio Codec) is a codec format increasingly used by audio enthusiasts. It allows digital au-dio to be losslessly compressed, achiev-ing compression rates of 30% to 50% for most music, and significantly greater for a simple voice recording. There are a number of other audio co-dec “standards” around.

Dynamic rangeDynamic range is another key mea-sure of audio quality, referring to the range between the quietest and loud-est signals. CDs use 16-bit data — each audio sample getting 96 dB of dynam-ic range. The dynamic range of human hearing is about 140 dB, so the use of 24-bit (144 dB) data is increasing, es-pecially in recording and mastering. These factors drive the requirement for external devices to enable record-ing and playback at higher sample fre-quencies and bit depths, and a reliable mechanism for connecting the devic-

BY ALI DIXONDirector, Product ManagementXMOSwww.xmos.com

Fig. 1: Ethernet AVB fits low-cost, small-form-factor products such as this microphone.


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es to the computer.However, computer hardware rare-

ly takes advantage of higher sample frequencies, leading to significant growth in the computer accessories market for products such as USB digi-tal audio converters.

USB audioUSB is ubiquitous and well suited to audio. USB 2.0 High Speed and USB Audio Class 2.0 (a driver for any USB 2.0 port) include a number of features to ensure the audio is transferred reli-ably and with high quality:

High sample frequencies: USB Audio Class 2.0 enables 192-kHz, and even 384-kHz, 24-bit audio.Low latency: Latency is particularly important when interaction is in-volved. If a singer sings into a digi-tal microphone and hears himself or herself singing through monitor speakers, delay as little as 10 ms can be heard.Asynchronous clocking: In some de-vices, the PC can be the master of the audio clock, which is used by the D/A converters. Keeping the audio clocks local to the convert-ers, and having the PC synchro-nize to this local clock helps to minimize jitter.Many audio channels: Ideal for sur-round sound and for professional applications where recording mul-tiple audio channels is required.

Ethernet audio/videoPerformance requirements for audio distribution can be more important in live sound and professional applica-tions. A common example is standing in an airport listening to announce-ments, and not being able to hear a thing due to the delay between the various speakers. In a recording stu-dio, the requirements are even more demanding. Recalling the example of the singer, a delay between singing words and hearing them sets a very stringent requirement on a network. Add to that the reliability require-ments of a recording studio, where a single dropped sample can ruin a re-cording — the network must deliver performance guarantees.

Ethernet Audio Video Bridging ad-dresses this problem by providing reli-able transport of audio across Ethernet networks. AVB is a collection of IEEE standards which augment Ethernet to provide functionality needed for AV

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distribution in professional and con-sumer applications, and is even find-ing its way into automotive.

Benefits include:Reservation of bandwidth: Ensures the network has sufficient band-width to deliver audio from point A to point B. The network guaran-tees that the bandwidth will be available, and prevents other traf-fic from using more bandwidth than they subscribed for.Connection management: Detects AVB endpoints on the network, to facilitate AV network setup.Clock synchronization: Allows end-points to synchronize, ensuring multiple speakers play the same audio at precisely the same time.Low latency: AVB guarantees 2-ms latency between endpoints in the network. This performance level allows AV content to be distributed across large networks. Ethernet AVB endpoints can be ex-

tremely lightweight, using embedded microcontrollers to provide AVB con-nectivity. Low-cost devices allow its use in cost-sensitive, small-form-factor

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Audio transport flexibilityDue to the large variety of standards, interfaces, and formats used within audio applications, technology to sup-port audio connectivity often requires flexibility. ICs provided for this task should be programmable to allow the user to define functionality. AVB, USB, I2S, SPDIF, and other interfaces can be selected for easy customization.

The 500-MIPS eight-thread XS1-L1 processor from XMOS can be used for USB Audio 2.0. XMOS also has a refer-ence design using the low-cost XMOS XS1-L2 processor as the basis for run-ning a software-only implementation of an Ethernet AVB audio endpoint, capa-ble of both talker and listener modes, running up to eight duplex audio chan-nels. It integrates the full range of AVB protocols, digital audio interfaces, and control software in a single board with a range of analog and digital I/O. Since the XMOS devices are programmable, they allow the user to define the func-tionality of the device.


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Are op amps all the same? Why are some better than others at certain tasks? How are some op

amps better than others? Below, we re-view some of the most popular types of op amps, then take a close-in look at a specific application. The application we’ll use is a guitar and microphone amplifier, mixer, filter and speaker driver. Could the same op amp work in all these functions? The answer is this: not likely and definitely not one that I’ve been able to find. If an op amp had all the characteristics needed to fulfill all of those roles, it would be

Op amps: Not all the sameA review of some popular types of op amps, plus a close

look at a specific applicationtoo expensive to use. Let’s find out why.

Choosing an op amp can be a daunting task. Within a very short period of time, the op amp adven-turer will run across terms like voltage feedback and current feedback, precision and high speed, instru-mentation and buffer, low power and low noise, and specialty parts like current sense amp and power amp, just to name a few. A comprehensive discus-sion of all of these types would make for a book and probably a sleep aid.

The first concept to understand is that op amps are typically designed to fill a specific need. Handheld devices

run on batteries and need to use components that are low power. Com-munication devices need to use radio frequencies to have reasonable size an-tennas, so their components are largely high speed. Military devices need to be extremely reliable, so they have com-ponents tested to extreme temperatures and in a range of test setups.

How does this apply to op amps? It

BY TAMARA SCHMITZSenior Principal Applications Engineer and Applications Manager for Light SensorsIntersilwww.intersil.com

Fig. 1: Block diagram of a simple two-input audio amplifier.



will help to work with an example. Look at the system in Figure 1. This is the block diagram of a two-input gui-tar and vocal amplifier. Conveniently, each of the five blocks in this system can be built with an op amp.

Before we step through the blocks, let’s acknowledge the subset of opera-tional amplifiers we will be consider-ing. Since this is an audio application, frequencies above 20 kHz are not need-ed since the human ear can’t hear those frequencies. It follows that we won’t need any “high speed” amplifiers since those run at frequencies far above 20 kHz — like 1 MHz, 100 MHz, or even a few gigahertz (1,000,000,000 Hz).

A second assumption we are going to make is that all of the amplifiers in our system are voltage feedback. This is the default type of op amp. (Person-al note: I didn’t learn about current feedback amplifiers until I spent time in industry.) Current feedback ampli-fiers use a different type of feedback signal than standard voltage feedback amplifiers.

Predictably, the feedback is a cur-rent instead of a voltage. This special feedback allows the amplifier to oper-ate very quickly. In this application, it doesn’t make sense to choose the add-ed performance and expense of a cur-rent feedback amplifier.

By the way, if an amplifier data-sheet doesn’t specify whether it is volt-age feedback or current feedback, check out the impedance of the in-verting input. If the inverting input is high impedance, then it is voltage feedback. Conversely, if the input im-pedance is low, it is current feedback. If the type of feedback is not specified, it’s a pretty safe guess that it is a volt-age feedback amplifier.

So far, we know that the op amps in our system will be low (audio) fre-quency and have the standard voltage feedback topology. Now we need to look at the specifics of the system.

Non-inverting feedback’s benefitsThe microphone amp and guitar amp are very similar. Though they are shown in Fig. 1 as if they have a single input, they will be standard two-in-put and one-output op amps. While they can be configured with invert-ing feedback or non-inverting feed-back, I strongly suggest non-inverting feedback.

Non-inverting feedback circuits sep-arate the circuit feedback from the in-put. In doing so, they also ensure that the input device, a microphone or gui-tar in this case, see a high input imped-ance. This is a convenient place to put gain (amplification) as well, since you probably want to be able to control the loudness of each input separately.

Remember that hearing responds to logarithmic changes, not linear

ones. Therefore, if a potentiometer (variable resistor) is used to vary the gain of the input circuit, make sure to use a logarithmic potentiometer, not a linear one.

Since the signals are small at the input, we would like the noise to be low as well or it might swamp out our signals. In radio circuits or in very sen-sitive applications, it is crucial to use a low-noise amplifier at the input stage.

Op amps: Not all the same

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In our simple audio amplifier, it is a little less critical. In other systems, the input amplifier may be an instrumen-tation amp. This is an extremely bal-anced two-input amplifier with high input impedance, like the ISL28617.

The next stage in our flow is the “summer.” The summing amplifier is another common place to put some variable gain. Now, the output from the microphone input amplifier and

the guitar input amplifier are attached together at the inverting input of the amplifier to act as a summer. A feed-back resistor from the output to that same inverting input can be varied to provide system gain.

The requirements on this amplifier are not very stringent. It doesn’t need to be low noise, since the signals are most likely 10 or 100 times greater than they are at the input. They don’t

need to have high bandwidth since this is an audio system. Also, they don’t need to drive large output cur-rents since they are driving the input of another op amp. The requirements on the filter stage amplifier are similar to those on the summer.

Another mid-system amplifier pos-sibility is an amplifier that might drive a converter. This particular system doesn’t convert the analog systems to digital. However, if it did, then the am-plifier before the converter must have sufficient resolution to match the number of digital bits to be generated.

The last amplifier in the audio am-plifier drives a speaker. This action takes a much larger amount of current than all of the other stages. Also, since the signal has been amplified by the time it reaches this point in the sys-tem, it is at its largest. That means the output will be moving the fastest, since the guitar and the (hopefully) melodic voice are composed of sine waves. That means the best choice is an amplifier with sufficient slew rate, which is defined as the volts per mi-crosecond that the output can change. This is the most glaring mistake that shows when designers try to use the same amplifier for any and all op amp applications. Basic amplifiers like the OP-07 or the 741 may barely succeed in the beginning and middle stages of the audio amp, but they fall flat at this output stage. They are simply unable to drive the output fast enough — a limitation in slew rate.

A side amplifier that can be used is a current sense amplifier. Current sense amps are used within power supply lines to monitor the current consumed in a circuit or system. They can be placed near the supply or near a ground connection, if they are de-signed like the ISL28006.

All kinds of different amplifiers noted above are available now and are getting better all the time. There really is no substitute for carefully reading the datasheet and making sure you choose a part that fits a system’s needs. With practice and with time, the trade-offs and optimizations become second nature. Don’t forget the in-sights that can be gained by running a few simulations, too. Using a program like Intersil’s iSim simulator can help you choose the right component, build the right filter, and ensure sys-tem design success.

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Fig. 1: Today’s crosspoint switches deliver signal equalization at both inputs and outputs, along with features that facilitate link optimization and system-level performance monitoring.


combination of adequate switching capacity and optimized signal integ-rity to enable a new generation of higher-speed routers, switchers and multi-viewers that can be used to create this content and support it se-rially in demanding real-time broad-cast networking applications. The next generation of crosspoint switch-es also must deliver low power con-sumption and backward-compatibil-ity with lower-speed SDI interfaces, providing a seamless migration path to the higher speeds of emerging UHDTV formats.

New UHDTV standardsThe new ITU-R Recommendations for UHDTV have been sub-mitted by the ITU-R Study Group 6 for approval. These Recommendations chart a two-step course for higher-quality UHDTV standards, each step similar to the one taken from standard-defini-tion television to today’s 1920 by 1080p Full-HD for-mat as defined by the ITU-R Rec. 709 standard.

According to the ITU’s announcement, the first lev-el of UHDTV picture quali-ty, also called “4K,” is de-fined at a horizontal and vertical pixel count of 3,840 x 2,160 (equivalent to about 8 megapixels), and the next level, called “8K,” is defined at 7,680 x 4,320 (equivalent to about 32 Mpixels). This contrasts with today’s HDTV pictures, whose horizontal and vertical pixel count is equivalent to between 1 and 2 megapixels. In other words, 4K will have twice the horizontal resolution and four times the spatial resolution of Full-HD in a progress format. The larger 8K resolution doubles 4K, and is 16 times the resolution of Full-HD. One of the first HDTV production trials at these higher-resolution specifica-tions will be launched by the BBC in conjunction with the London 2012 Olympics, using the Super High Vi-sion (7680 x 4320) video format de-veloped by NHK Science & Technol-ogy Research Laboratories.

The latest evolutionary HDTV

standards, including 1080p/50 (1920x1080), are already pushing switcher requirements to their lim-its. For example, the 1080p/50 signal requires a 3-Gbit/s baseband bit rate, which is double that of the earlier 1080i/25 or 720p/50 formats. Next-generation systems will need to sup-port serial uncompressed UHDTV SDI, including both Mapped Society of Motion Picture and Television En-gineers (SMPTE) ST2036-3-2010 at 10.692Gb/s as well as SDI at 11.88Gb/s. They also must support increased-density HD/3G systems, and multi-plexed SDI streams, including up to four 3G SDI streams or 8 HD SDI streams.

Solving the problemCrosspoint switches are a critical piece of the puzzle. Next-generation digital video switching systems al-ready must meet rigorous perfor-mance and timing requirements through the entire signal path in or-der to sustain robust transmission. The challenge becomes even greater with the move to 4K and 8K formats, such as Super Hi-Vision and Ultra-


Fig. 2a Unequalized signal at 11.88 Gbits/s after 24-dB insertion loss backplane at Nyquist Frequency (6.4 GHz)

Fig. 2b Equalized signal using Mindspeed’s M21605 160x160 crosspoint switch at 11.88Gb/s after 24dB Insertion Loss Backplane at Nyquist Frequency (6.4 GHz)


HD that operate at much higher data rates, which makes switching sys-tems significantly more susceptible to jitter and timing problems during signal transmission across back-planes and cables.

By delivering signal equalization at both inputs and outputs, today’s crosspoint switches compensate for difficult channels by mitigating or eliminating signal degradation due to transmission line effects (see Fig. 1). This dramatically improves signal integrity, enabling error-free data transmission at high data rates. To-day’s mainstream crosspoint solu-tions combine multi-rate broadcast video routing and switching in a single device and ensure signal in-tegrity at a system level for rates up to 11.5Gb/s per lane. This results in aggregate switching capacity of up to 1.2Tb/s and above, which can be of-fered at very low per-port power con-sumption.

The latest crosspoint switches provide even higher bandwidth, with each switching path operating independently at any data rate of up to 12.8Gb/s. Given that the size of the switching core dictates the size of the router, crosspoint switches will need to incorporate a non-block-ing 160x160 matrix size in order to yield the necessary 2Tb/s of switch-ing capacity that is required for users to route significantly higher num-bers of serial data streams. Mind-speed’s M21605 crosspoint switch that delivers this large routing switcher size also simplifies the de-sign of very large matrix video broad-cast routing switchers. Mindspeed’s crosspoint switches also enable loop-backs on any channel to aid system tests, debugging and optimization.

To deliver the necessary signal in-tegrity for higher data rates, each crosspoint input in an UHDTV switcher will need to be equipped with an adaptive equalizer capable of compensating for up to 25 deci-bels (dB) of loss at 12.8 Gb/s. This will ensure adequate throughput while simplifying design and reduc-ing system development costs since there is no need to spend time opti-mizing each channel. UHDTV crosspoints also much feature ultra-low jitter, and programmable trans-mit drivers that include three-tap programmable output pre-emphasis

and adjustable swing for link optimi-zation. Additionally, integrated diag-nostic features such as programma-ble loss of signal (LOS) and temperature sensor capabilities are important for facilitating system-level performance monitoring.

Finally, higher-bandwidth links require lower power consumption per bit communicated. As a result, crosspoints for UHDTV systems will require exceptionally low per-port power consumption so that they can be used to build systems that are more energy-efficient, generate less heat and operate more reliably. Switches must consume the least power possible with all channels ac-tive, and operate at as low standby power as possible.

In addition to crosspoint switch-es, there are a number of other prod-ucts that can be used to ensure supe-rior signal quality and reliability for digital video signal transmission at higher speeds. These include serial digital interface (SDI) equalizers, SDI reclockers, SDI cable drivers and op-tical transport solutions that pave the way beyond 3G-SDI data rates to 4K and 8K formats. For instance, ad-vances in cable equalizers are deliv-ering the lowest possible output jit-ter for demanding digital broadcast video applications across extended cable lengths. Similarly, SDI quad re-clockers are available that integrate a small crosspoint switch at the input and provide integrated trace equal-ization and automatic rate detect (ARD) circuitry. These and other ad-vances will continue to build a foun-dation for optimizing signal integri-ty at UDHTV data rates.

The recent ITU recommendations for UHDTV lay the foundation for a new era in television that will bring an unsurpassed immersive experi-ence to viewers. Realizing the prom-ise of UHDTV will require video crosspoint switches capable of opti-mizing data rate, bandwidth, perfor-mance and power efficiency of serial routing and production switches. Crosspoint switches with built-in signal conditioning technology will be essential in order to deliver sus-tained transmission performance at these higher data rates, as will non-blocking matrix sizes that are large enough to yield the necessary switch-ing capacity.

Key requirements for ultra high-definition television


Analog & Digital ICs

The ODB++ data format for PCB designs

Using the ODB++ data format ensures PCB manufacturers have all needed information in a single, automation-compatible file

BY JULIAN COATESDirector of Business DevelopmentMentor Graphicswww.mentor.com

Once a circuit design is complete and the PCB has been laid out, the complex process of transfer-

ring all the design data to manufactur-ing begins. The information com-municates not only the physical positions of components, traces, and layers, but also the intent. On top of this is manufacturing data: where to drill, what to mask, and how to apply the board stencil.

For decades this data exchange has required a lot of different files, each containing a part of the final picture, somewhat like a jigsaw puzzle. These files include Gerber data with the physical layout of the PCB; Excellon drill data; netlists; and many others as needed.

After receiving this set of files, the PCB fabricator or assembler must put the puzzle back together, perform a time-consuming verifi-cation process to determine if all the necessary files are there to produce the PCB, and determine if the data are correct. Because the process has a lot of manual input, hu-man errors often creep into the infor-mation. Fabricators estimate that about one-quarter of all Gerber file sets received have errors.

Intelligent data formatThe better way to transfer data is to have an intelligent data format from the outset. Since ODB++ was first in-troduced in 1995, it has been imple-mented by PCB design and manufac-turing organizations both large and small, globally. ODB++ format output is available on virtually all major CAD/CAM tools. Although not a formal standard, it has been accepted to the

point of being a de facto standard, ad-opted by many top-tier electronics manufacturers for many years already. It was created and maintained by Val-or Computerized Products. When Mentor Graphics acquired Valor, Men-tor re-pledged continuing support for maintaining and advancing the

ODB++ format. Recently formed, the ODB++ Solutions Alliance (www.odb-sa.com) provides a forum for imple-menters and supporters of the ODB++ format to share their interest and suc-cess with others.

The ODB++ formatThe ODB++ format is an open ASCII file structure containing all product data for fabrication, assembly, and test in a single file, including DFM analysis (see Fig. 1). Because of design and data quality checks, the ODB++ file does not need the rigorous examination by the fabricator. Minimizing the amount of manual manipulation and packag-

ing required data together ensures high quality and quick turnaround.

In addition to the usual set of infor-mation conveyed in ODB++, many at-tributes can be communicated as well, and automatically. Attributes such as impedance, plugged vias, surface fin-ish, and others can be included and

automatically read and under-stood by the fabricator. Users can also assign user-defined attri-butes of characteristics to easily communicate this information both internally and to suppliers that have been chosen to receive the definition of the attribute.

While a great deal of product design information is contained in the ODB++ file sent to the fab-ricator, there is no risk of disclos-ing important IP. ODB++ can carry net names, inner layer in-formation, and component data up to the level that the user feels appropriate for transmission into manufacturing, according to how the CAD or DFM tool is con-figured to create and manage the data. The intention of ODB++ is to give all necessary information to manufacturing in an intelli-gent and integrated data-struc-

ture, enabling the most efficient man-ufacturing.

Advantages are greatThe significant advantages and auto-mation abilities associated with the ODB++ format make it the clear choice for manufacturing data trans-fer in the future. Fewer errors mean less expense, fewer re-spins, and quicker turnaround on PCB fabrica-tion, assembly, and test. The inte-grated DFM data helps ensure that board assembly will proceed without any glitches to send the process back to design. The future of PCBs in-cludes ODB++.

Fig. 1: ODB++: One file for fabrication, assembly, and test.


The growing number of mobile devices used by the average consumer — paired with the

popularity of new wireless applica-tions such as HD video streaming, mobile gaming, and high-speed wire-

802.11n and 802.11ac:

A tale of two standards

Seamless wireless connectivity aided by new standard

less backup — require superior Wi-Fi solutions that meet today’s band-width demands. To deliver seamless connectivity across various mobile platforms, nonprofit organizations such as the Wi-Fi Alliance (www.wi-fi.org) work with OEMs and chip ven-dors to encourage the adoption of advanced wireless standards and en-sure interoperability.

BY BART GIORDANODirector of MarketingMarvellwww.marvell.com



802.11n and 802.11ac: A tale of two standardsspecialANALOG & DIGITAL ICs

PwrBlade+™ AC/DC power distribution connector systemFCI’s PwrBlade+™ connector serves applications requiring higher linear current density and low power loss. Capable of 192A/linear inch when 8 adjacent contacts are energized, the high power contact is rated up to 75A/contact. A low power contact option is available for applications with multiple voltages and lower power requirements. The number and placement of power and signal contacts are highly configurable. www.fciconnect.com/pwrblade+

High Speed Differential Signaling up to 20 Gb/s AirMax VSe® right-angle connectors feature mating-compatible interfaces to AirMax VS® vertical backplane connectors and provide an AirMax®

migration path for up to 20 Gb/s per differential pair while maintaining the pin assignment flexibility of an open pin field design. AirMax VSe connectors support backplane, midplane, orthogonal midplane, or coplanar applications. Available with 3, 4, or 5 differential pairs per column.www.fciconnect.com/newdevelopments

Next-generation SAS Storage InterfaceFCI Mini-SAS HD products support 6 Gb/s to 12 Gb/s per channel and meet or exceed the respective SAS 2.1 and proposed SAS 3.0 specifications. Mini-SAS HD products are compliant to SFF-8643 and SFF-8644. Internal and external connector configurations include 1X1 (4x), 1X2 (8x), and 1X4(16x) port options. The IMLA-based connector also provides greater port density than Mini-SAS 2.0 products. 4x and 8x internal and external cable assembly solutions include EEPROM communication. www.fciconnect.com/minisashd

FW929 EP 04-12 Satellite AF.indd 1 3/9/12 1:27 PM

Two of these standards — 802.11n and 802.11ac — were built to improve wireless connectivity for end-users for an enhanced mobile computing experience. While each has had a positive impact, the latter is expected to solidify it’s position as the No. 1 standard for today’s always-on, al-ways-connected lifestyle.

A significant step forward with 802.11nWhen the 802.11n standard first was published in 2009, it was regarded as a connectivity solution that would trump all others — and since that time, it has. The 802.11n standard significantly increased the network throughput of previous standards enabling a peak PHY rate of 450 Mbits/s in a three spatial stream con-figuration. 802.11n was the first Wi-Fi standard to support multiple-in-put, multiple-output (MIMO). MIMO speeds performance through the use of multiple antennae to process more data. This functionality has been in-tegrated into nearly every cutting-edge Wi-Fi product.

The most novel capability of the 802.11n standard, however, was its ability to enhance 5-GHz operation by widening the channels for higher throughput. This flexibility allowed Wi-Fi devices to take advantage of ad-ditional bandwidth in the 5-GHz band, which is less prone to interfer-ence than the more congested 2.4-GHz band. Due to the lower costs of implementing 2.4 GHz and a broad ecosystem of existing products, how-ever, 90% to 95% of all Wi-Fi devices still function in that band, and do not take advantage of the more efficient 5-

GHz option. During the past three years, the rampant growth of Wi-Fi devices — from smartphones to baby monitors to ultrabooks — and the bur-geoning ecosystem of Bluetooth-en-

abled devices — have overcrowded the 2.4-GHz band, and have resulted in a signifi-cant, negative impact on consumers’ mobile experience.

802.11ac for ubiquitous wirelessToday’s bandwidth-rich wireless applica-

tions require a new standard that le-verages a cleaner and wider spectrum with fewer devices and less interfer-ence. The latest Wi-Fi standard, 802.11ac, operates exclusively in the 5-GHz band and enables peak PHY data rate of 1.3 Gbits/s or more. This translates to Wi-Fi connectivity that is two- to three-times faster than what is possible in the 2.4-GHz band.

This additional throughput is achieved by widening the channels within the band, and the incorpora-tion of more complex modulation techniques. An increase in the width of the channels themselves offers ad-ditional throughput. Within the 2.4- and 5-GHz bands in 802.11n all of the channels are 20 or 40 MHz wide, while the width of the 5-GHz chan-nels in 802.11ac are 80 MHz and can support 160-MHz-wide channels in the future.

The 802.11ac standard also en-compasses a more complex channel modulation scheme than that found in 802.11n, further enhancing wire-less connectivity. While 802.11n uses a 64 quadrature amplitude modula-tion (QAM) to encode data, 802.11ac uses a more sophisticated 256 QAM scheme. This higher throughput in a less-crowded spectrum effectively doubles the wireless performance of consumer devices, and ensures con-tinual connectivity.

The industry continues to ex-plore further expanding the capabil-ities of next-generation mobile de-vices, with work underway that will offer nearly instant wireless transfers and unprecedented speeds, which will be key to continued advances in the connected experience.

The Marvell Avastar 88W8897 is an 802.11ac mobile MIMO dual-band wireless SoC.

AdverTISeMenT


www.fciconnect.com

Enabling your next generation systemsAirMax VSe® enhanced right-angle daughter card connectors provide a migration path to extend performance to up to 25 Gb/s per differential pair with the fl exibility of an open pin fi eld design. Mating-compatible interfaces to established AirMax VS® backplane connectors enable backplane designs that can support the evolution to higher-speed daughter cards and the continued use of existing line cards or blades. Learn more at www.fciconnect.com/newdevelopments.

Established. Evolving.

enhance enable extend

product application

The ability to monitor the medi-cal conditions of patients living in remote locations, called re-

mote patient monitoring or rpM, can help lift a huge pressure from today’s healthcare system. rpM plays a big role in bridging the hospitals and homes, has been shown to be effec-tive in several areas, such as chronic disease management, post-acute care, and monitoring the safety of the old-er adult population. It also helps older people to slow the progression of chronic diseases and ensures contin-ued recovery after being discharged from an acute care facility.

to make rpM as efficient as possi-ble, the medical industry is progres-sively taking advantage of the benefits offered by both sensor and wireless technologies’ innovations. using both technologies can help overcome some of the bottleneck in rpM.

Remote patient monitoringrpM activity can be divided into five important steps:

1. collect specific physiological data.

2. transmit collected data to a specific location.

3. Evaluate data collected to determine if there is any abnormality.

4. Notify concerned parties.5. Intervene for possible corrective

action. the flow of activity is seen in Fig. 1.

the first two steps, the collecting and transmitting of data, are very critical in the rpM systems. useful information needs to be reliably de-

tected and transmitted for the sys-tem to work effectively. If valuable information is inaccessible or ig-nored, the ability to respond appro-priately and to optimize the treat-ment regimen can be compromised.

For a long time rpM has been constricted by the lack of effective

data collection devices and reliable transmission systems. the reliability of sensors and transmission systems have constituted the main bottle-neck in any rpM system. therefore, any improvement of these two ele-ments will largely impact the func-tion of the system in a positive way.

Technology gainsrpM systems generally employ two types of sensors: behavioral and characteristic. Behavioral sensors are used to observe an individual’s ac-tions, and include motion detectors, pedometers, cameras to detect mo-tion patterns (such as potential falls), and so forth. data regarding actions is translated into behavioral infor-mation, which is evaluated to deter-mine if action should be taken.

characteristic sensors, on the other hand, help measure the an individual’s physiological attributes. they measure such factors as body temperature, blood pressure, stress levels, blood-glucose levels, and so on. the system stores or reacts to the data as required by the particular reading and application.

over the years, innovations in sensing technologies have helped improve this critical element of the rpM system. these innovations mainly cover such aspects as reduced form factor and current consump-tion, and increased reliability and intelligence. In addition to sensors reliability, the wires used in the tra-ditional patient monitoring systems limited the patient’s activity and level of comfort, which negatively impacted the measured results.

Advances in wireless technology, such as rFId tag or readers, and new sensors technologies, such as MEMS, are making possible such applica-tions as body-area networks, or BANs, (BANs) for rpM (Fig. 2).

In a body-area network, the sensed signal can be that for electro-encephalography (EEG), electrocar-diography (EcG), electromyography (EMG), skin temperature, skin con-ductance, and electrooculography (EoG). Each of these sensors trans-

Medical Electronics

Fig. 1: The five steps of a remote patient monitoring system flow from one to the next in orderly fashion. Steps 1 and 2 are often the ones that can present bottleneck to the system.

BY IBOUN TAIMIYA SYLLABusiness Dev. Manager, Low-Power RFTexas Instrumentswww.ti.com

Technologies for remote patient monitoring

To make RPM as efficient as possible, the medical industry is progressively using new sensor and wireless technologies.


product application

mits the collected information wire-lessly to an external processing unit, which instantly transmits all infor-mation in real time to the doctors or to a specific server. the sensors used in the BAN generally must be accu-rate, and have a certain level of a sig-nal processing as well as some wireless features. the sensors have transceiv-ers or only transmitters. this is a fac-tor in defining the network’s charac-teristics.

Transmission requirementsWith the explosion of wireless tech-nologies and the emergence of several standards, especially in the industrial scientific and medical (ISM) band, rpM systems of today is a reliable way of transmitting data using electro-magnetic signals, thus bypassing wires. rpM systems can be imple-mented using several existing wireless

Fig. 2: In a typical wireless body area network, a network of sensors is placed close to the human body or implanted in some tissues to enable the collection of specific physiological data to continuously monitor a patient’s health, regardless of his physical location.

Medical Electronics

standards such as Bluetooth, ZigBee, Wi-Fi, ANt, or BLE. table 1 de-

scribes the different useable standards in rpM and appli-

cations for which they have been optimized.

Existing standards, however, have not been optimized for medical applications such as BAN: they have signifi-cant overhead because they were designed

with other applications in mind. therefore, they

don’t generally meet the de-sirable peak-power consump-tion for medical applications.

to develop a communica-tion standard that is optimized for low power devices and suitable for rpM applications, IEEE has launched the IEEE 802.15 task Group 6 (BAN) known as IEEE 802.15.6 standard.

IEEE 802.15.6 presents several ad-vantages compared to existing stan-dards. While focusing on short dis-tance and low cost, it has low complexity and low current consump-tion. the IEEE 802.15.6 standard de-fines the pHY layer as well as the MAc protocol and the security layers.

the IEEE 802.15.6 pHY layer is di-vided into three frequency bands to address the diverse data rate require-ments imposed by medical and con-sumer applications: narrowband, ul-tra-wide band, and human-body- communication band. It targets a distance of three meters while sup-porting data rates between 100 kbit/s and 1 Mbits/s with a peak power con-sumption of 3 mA. the MAc protocol is defined to control access to the channel. the standard also defines three levels of security: unsecured communication (level 0), authentica-tion only (level 1), and both authenti-cation and encryption (level 2).

With the technological advances accomplished in both sensing and wireless technologies, remote patient monitoring can play a major role in healthcare systems worldwide. Even though hospitals and home health-care are expected to remain the pri-mary drivers of remote patient moni-toring, we might witness the enabling of many other medical applications such as teleconference visits or remote vital sign checks.

Table 1: Wireless standards used in remote patient

monitoring.Standards OptimizationBluetooth Voice linksZigBee Industrial sensors, smart

grids, smart energy

WI-FI Data networksANT Low-current consumption,

but high peak currentBLE Low-current consumption,

but high peak current

C

M

Y

CM

MY

CY

CMY

K

EMCO_AD_March_EP_AD_PRINT.pdf 1 2/7/12 9:24 AM


product application

Among the latest products in the medical electronics field are two different means of preven-

tion. renesas Electronics America is working on preventing medical sys-tems from being hacked and Ford has an app for its SYNc platform that works at preventing allergy attacks while driving.

Preventing hacking in medical devicesAs more and more electronics are em-ployed in modern medical systems, concerns on potential hacking are on the rise. regardless of whether the hacking is malicious or not, the con-cerns are paramount in medical sys-tems because they have tremendous implications for wellness. Even if the application is a simple thermometer, a misleading temperature could cause unnecessary intake of medication or negligence of required care. the stakes are high for blood glucose me-ters and other clinical equipment.

Bobby Wong, Medical Segment Marketing Manager at renesas Elec-tronics America, says there are sim-ple design steps to prevent hacking in electronic medical systems. Most medical devices use one or more Mcus and the first step is to ensure that the application inside this Mcu is not illicitly modified.

one way to approach this is to do a check-sum on the application as part of the initialization of the sys-tem in start-up. Many Mcus today have a debug interface, which must be disabled to prevent external ac-cess to reprogram the Mcus. Some more advanced systems could deploy two different kinds of Mcus to per-form redundant computation or pro-cessing. Hacking into two Mcus that

are architecturally different is expo-nentially more difficult.

A number of available Mcus offer flash memory protection and au-thenticated debugging. Some also provide additional measures to pre-vent leaking of source code through different testing houses and contract

CPU hacking prevention and a nifty

allergy application

Medical Electronics

manufacturers. Keeping the source code safe in the development and manufacturing environment is as important as protecting the applica-tion in its deployment. the 15-page application note r01AN1131Eu0101 (Mar 31, 2012) from renesas details protection of the flash contents

Meets UHS-I Specifications

Superior EMI Protection: Double-Sided Shielding and Welded Seams

HONDA Connectors - Honda Tsushin Kogyo Co., Ltd.For Purchase Please Visit: http://www.masterdistributors.com/Visit Us on the Web: http://www.honda-connectors.co.jp/Technical & Sales Information: [email protected]

FEATURES:Durable: Strong, Robust Laser-welded Double-sided Metal Shell Structure

Safe: Locking Structure Prevents Jump-out and Forced Pull Out

Comprehensive Line:Standard & Reverse Models for PCB, Through-hole and SMD; Several Optional Stand-off Models are also Available

APPLICATIONS:Digital CamerasDSCsPDAsTabletsGPSSSD Storage UnitsMedicalHandheldsFA and OA Equipment

SD Card Slot AXA2S: SMD Model SD Card Slot AXA2R: Through-Hole Model

BY JIM HARRISONWest Coast Editor


product applicationagainst a fraudulent readout on 78K0, 78K0r, rL78, and V850 processors.

Ford enables SYNC voice control of allergy alert appdrivers of Ford SYNc AppLink-equipped vehicles now can check al-lergy, pollen, asthma, flu, and uV con-ditions on the go with the Allergy Alert app. Allergy sufferers can check

current forecasts using simple voice commands in an effort by Ford to im-prove the health and wellness of driv-ers by using connectivity for more than information and entertainment.

“Mobile health apps are changing the way consumers manage their own wellness, and Ford SYNc provides the platform to extend this growing trend to the driving experience,” explained

doug Vandagens, global director of Ford connected Services. “the SYNc AppLink-enabled Allergy Alert app al-lows drivers to quickly check current and upcoming pollen and other health risk conditions with simple voice com-mands while keeping their hands on the wheel and eyes on the road.”

through the app’s pollen index rating, drivers can request to hear the types of allergen conditions they are likely to encounter that may cause a flare-up in personal allergy symp-toms. the app also provides a risk in-dex for asthma, flu/cough/cold and ultraviolet rays.

the voice commands and features include:• “current location” updates loca-

tion using the car’s GpS receiver to yield accurate and up-to-date information

• “Allergy” provides a verbal pollen index to users that rates the se-verity of pollen levels in the sur-rounding environment on a scale from 0 to 12

• “pollen” specifies what pollens are predominantly in the air

• “Asthma” uses a 0 to 12 scale to address potential and upcoming concerns for asthmatics

• “Flu” addresses the current and upcoming flu index and report

• “uV” tells drivers of the current and upcoming risks of uV rays

• “ZIp 1,” “ZIp 2” and “ZIp 3” stores up to three ZIp codes in the set-tings menu of users’ device. the first ZIp code is the default loca-tion when not using the GpS posi-tion. the second and third enable users to store ZIp codes outside of their current area, such as a moth-er storing the ZIp code of her child’s school.

Ford has expanded its SYN AppLink to include an Allergy Alert app.

Medical Electronics


Driven by increasing demand from manufacturers of lumi-naires, street lights and other

lighting systems, LEd manufacturers have been ramping up their products to provide ever higher efficacy, color performance, and lumen output. the following recent products amply dem-onstrate their efforts.

cree (www.cree.com) developed the XLamp Xt-E white LEd, using a tech-nology platform in-troduced in January (www2.electronic-products.com/-arti-cle-hlrc02_feb2012-html.aspx) to not only provide twice the lumens-per-dol-lar of other LEds, but also deliver the highest efficacy commercially avail-able: 148 lm/W in cool white (6,000 K) at 85°c and 350 mA. the warm-white (3,000-K) version provides 114 lm/W at 85°c and 350 mA.

the company’s aim is to reducing the number of LEds needed to achieve

a given brightness. With its 3.45 x 3.45-mm XP footprint, the LEd can be used for almost all lighting applica-tions, directly replacing existing XP LEds on circuit boards to shorten the fixture design cycle. And, since it is a successor to the XP-E high-efficiency LEd, application for Energy Star quali-fication with the new LEd requires LM-80 data be collected for only 3,000 hours, instead of the usual 6,000.

cree has also introduced the XLamp XP-G2 LEd to deliver lumi-naire manufacturers up to 20% more lumens per watt and 2.5 times the lu-mens-per-dollar over the original XP-G LEd. It too provides customers an immediate boost in performance and enables manufacturers to use fewer LEds to get the same brightness at lower cost. Both LEds are based on cree’s silicon-carbide technology.

Future Lighting Solutions (www.futurelightingsolutions.com) is now offering LEds designed to improve the efficacy and cost of heavy-duty light-ing: Philips Lumileds LuXEoN r se-

Philips LumiLEDs LUXEON R

Limit SwitchesSealed cable or M12 connector versionsLarge range of actuators

MicroswitchesHigh precision and small differential movementSealed switches up to IP68Much longer life – 50 million cycles

LED AssembliesCustom board mount andpanel mountRoHS compliant componentsRugged IP66 panel mount LEDsCall for free LED sampler kit

Metal Foil ResistorsClose tolerancesMIL and NASA approved

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Microswitches

LED Assemblies

BEST of 2 WORLDSWilbrecht Ledco manufactures custom and standard components in the US and Switzerland

Limit SwitchesLimit Switches

Wilbrecht Ledco manufactures custom and standard components in the

Cree’s XLamp XT-E white LED

ries LEds. designed for outdoor and industrial lighting applications such as streetlights, high-bay lights, wall packs, and bollards, the LEds have

typical efficacies as high as 128 lm/W depending on color temperature. the devices have a minimum crI of 70 and are foot-print compatible with earlier LuXEoN rebel and LuXEoN rebel ES LEds.

delivering 160 to 200 lm mini-mum, the Philips LEds are tested and specified at a junction temperature of 85°c, and all devices of a particular cct (3,000K, 4,000K, 5,000K, 5,700K, and 6,500K are offered) have a standard deviation of color match-ing (ScdM) of 5 to eliminate the need for binning selection.

With its oslon Signal LEd, oSrAM opto Semiconductors (www.osram-os.com) intends to enhance the visi-bility of emergency vehicle lighting.the LEd is said to provide the world’s

Zettler Magnetics Encapsulated Power Transformers

ZETTLER Magnetics, Inc.

The Zettler Magnetics BV series low voltage encapsulated power The Zettler Magnetics BV series low voltage encapsulated power The Zettler Magnetics BV series low voltage encapsulated power transformer provides great functionality in a compact package. Designed with safety in mind, the BV series is not only touch-safe, but its epoxy-filled design allows for better heat dissipation than standard open frame models. The BV series transformer is typically smaller physically than an open frame transformer with a similar VA rating.

Features:

Competitor parts:

ProductRoundup

LEDs


ProductRoundupbrightest blue light, double that of previous devices. Made using a spe-cial thin-film chip technology, the LEd emits 472-nm light at an 80° angle, typically producing a lumi-nous flux of 52 lm at 350 mA.

the devices uses uX:3 chips capa-ble of operating at very high perfor-mance levels even when pulsed at ex-tremely high currents, as emergency

signals typically are. the 3 x 3-mm LEd is equipped with an electrically isolated heat slug so it is suited to con-ventional Fr4 boards, and all color bins comply with the uS and Eu stan-dards for signaling.

the first in a series of products from SemiLEds (www.semileds.com) to fea-ture color-Precision technology, the c35 LEd with the EV (Enhanced Ver-

tical) chip lets users specify color pre-cision within a seven-, four-, or two-step MacAdam ellipse centered in ANSI-defined standard color spaces from 2,600K to 7,000K.

Further, the LEd uses a ceramic submount that gives it low thermal re-sistance (rth <8°c/W) . Its design is said to simplify integration of second-ary optics and ensure even light distri-bution. typical output for a neutral white LEd is 107 lm at 350 mA.

In July as this article was being pre-pared for publication, Seoul Semicon-ductor (www.seoulsemicon.com) an-nounced a new LEd technology named “nPola” that it said currently increases brightness levels five times that of current LEds based on equiva-lent die surface area. the patented nonpolar LEd technology has been under development for over 10 years, and the company expects further im-provements will increase brightness levels more than 10 times existing LEds.

use of LEds based on nPola, the company points out, would result in an LEd replacement for a 60-W incan-descent bulb that uses only one or two LEds, versus the current 10 to 20.

My pad or yoursFor the rapidly evolving LEd market, osram announced a concept for uni-form solder pads for ceramic LEd components. Based on its oslon LEd family, the approach is said to make it easier for customers to use LEds from different manufacturers so as to have a number of second sources. It can also reduce the costs of both process modification and storage.

the approach requires only one adjustment to the initial design of the board layout, and can be used for Fr4, metal core, and ceramic boards. It di-vides individual solder surfaces into electrically connected and discon-nected segments. By selecting appro-priate spacings between the solder surfaces, a different type ofLEd rotat-ed 90° can be attached to the same pad configuration. By dividing the solder surfaces, the two LEd types au-tomatically align themselves to the edges of the solder surfaces during the reflow soldering process.

Richard Comerford

LEDs

SemiLEDs’ C35 LED

LED Indication and Illumination SolutionsEffective LED solutions from VCC mean a lighter burden on your product development team. You can concentrate on just one thing: brilliant design. From design support and rapid prototyping through supply chain logistics, VCC will light the way.

Making Light Work for You

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The Galaxy Tab 7.7 is the 5th Galaxy tablet that Samsung has produced and is the thinnest and lightest of the series while maintaining high battery capacity. It features LTE wireless connectivity. The first sub-8-in.-diagonal Galaxy tablet to feature 1,280 x 800 resolution, it has the fastest processor to date (1.4 GHz with 8 Gbits (1 Gbyte) of DRAM on top). It weighs in at 335 grams and is less than 8 mm thick, with the usual stable of expected features beyond the SuperAMOLED HD resolution display, which includes full 802.11ab/g/n, Bluetooth, and a 3-Mpixel rear camera, complemented by a

2-Mpixel front-facing camera module.

Product Teardown:Samsung Galaxy Tablet 7.7 LTE

Courtesy of Samsung

The information in this feature represents a small sample of the data available from the IHS iSuppli Teardown Analysis Service. This service provides complete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. IHS delivers complete assessments of all elec-tronic, electro-mechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes parts and estimated pricing and is broken down by assembly, function, component family, and type.

For more information on the IHS iSuppli Teardown Analysis Service, e-mail IHS at [email protected]

To get the complete teardown analysis and parts list of the Samsung Galaxy Tablet 7.7 LTE, including datasheets, go to...www2.electronicproducts.com/whatsinside.aspx

% of Total Cost by Component Type

% of Total Cost by Function % of Total Cost by Assembly

Battery 4.89%

RF / PA 4.75%

Power Management 3.69%

User Interface 3.30%

BT/GPS/WLAN 3.14%

Camera 2.84%

Memory12.83%

Mechanical/ Electro-

Mechanical11.13%

Display & Touch41.11%

Baseband7.45%

Other - EnclosuresFinal Assembly 5.23%

CameraAssembly 2.99%

Misc PCBAssemblies 1.49%

Display / Touchscreen

43.22%

Main PCB

47.07%

Apps Processing4.90%


What’s InsIde?

ICs eliminate opto circuits for regulationThe LinkSwitch-HP family of off-line switcher ICs delivers from 9 to 90-W out-put power with primary-side regulation (PSR). It uses control algorithms and the properties of the main power transformer and output diode instead of optocouplers and related feedback circuitry to de-termine the amount of power to deliver from the primary to the isolated secondary side. The method reduces component count, saving space and cost while enhancing reliability.

The switcher IC devices suit tablet chargers, ultra-book adapters, LCD monitors and TVs, STBs, appliances and em-bedded power supplies. It automatically selects a control mode according to prevailing line and load conditions to optimize conversion efficiency and response to transient load demands. The device provides a no-load power con-sumption <30 mW at 230 Vac and >50% efficiency at 0.1–W input power, meeting all global energy-efficiency regu-lations. It is offered in eSIP-7C and eDIP-12B packages. (From $0.42 ea/10,000 — available now.)Power Integrations, San Jose, CASales 408-414-9200 [email protected]

Multi-cell, multi-chemistry gauge suits Li batteriesThe bq34z100 power management chip family of multi-chemistry, multi-cell battery management gas gauge circuits with a proprietary Impedance Track capacity measurement technology is the first gas gauge in the industry to support lithium-ion and lithium-iron-phosphate chemistries in two- to sixteen-cell battery packs. It supports battery run-time in applications like medical instruments, power tools, e-bikes,

Buck converters need 2.7-µA quiescent currentThe LT3975 and LT3976 42-V step-down switching regu-lators delivers 2.5-A continuous output current and re-quires only 2.7-µA quiescent current. The converters can operate from a 40-V input, deliver up to 5-A output cur-rent and requires only 3.3µA of quiescent current. Both devices offer a 4.2- to a nominal 40-V input voltage range, suiting them for automotive and industrial applications.

The buck regulators have 75-mΩ switches that deliver 90% efficiency. The device maintains a minimum drop-out voltage of 500 mV when the output voltage drops be-low the programmed output voltage. Switching frequency is user-programmable from 200 kHz to 2 MHz, and syn-chronizable from 250 kHz to 2 MHz. They are packaged in a thermally enhanced MSOP-16. (Ea/1,000: LT3975, $3.10; LT3976, $3.75 — available now.)Linear Technology, Milpitas, CASales Office 408-428-2050www.linear.com

Integrated ZVS buck regulator targets PoL

The Picor PI33XX Cool-Power ZVS buck regulator series targets point of load dc/dc regulation. The integration of a

high performance zero-voltage switch-ing (ZVS) topology increases point of

load performance, providing best in class power efficiency up to 98%. The devices integrate control circuitry, power semiconductors and support components in a 10 x 14 x 2.56-mm LGA system in package (SiP).

The buck regulators convert input supplies from 8 to 36 V to output voltages from 1 to 16 V, and output current up to 10 A for power delivery up to 120 W. Power delivery can be further increased by interleaving up to six of the buck regulators using single-wire current sharing without the need of any additional components. An optional I2C fault telemetry allows six distinct types of fault reporting. ($12.85 ea/1,000 — available now.)Vicor, Andover, MASales 800-735-6200 [email protected]

and uninterruptible power supplies.The battery gauge IC technology uses

charge voltage measurements, plus bat-tery characteristics and properties to de-termine a battery’s state-of-health and maintain up to a 94% accurate capacity measurement for the entire life of the battery. The circuit also works independently of se-ries-cell configuration, and can reduce power consump-tion through an external voltage translation circuit. It is available in a 14-pin, 5 x 6-mm TSSOP package. ($2.10 ea/1,000 — available now.)Texas Instruments, Dallas, TXInformation 800-477-8924www.ti.com

600-V IC suits 3-phase motor drive appsThe automotive qualified AUIRS2334S 600-V IC suits three-phase inverterized motor drive applications such as HV compressors and fans. The AUIRS2334S features an ad-vanced input filter to improve the input/output pulse symme-try of the signals processed by the device. Other key features include integrated fixed deadtime protection circuitry, shoot-through protection circuitry and undervoltage lockout protec-tion on both the VCC low-side and all VBS high-side floating power supplies. The new device is also fully characterized for negative transients on the switching node that may occur dur-ing normal operation and protection mode.

The automotive-qualified IC uses proprietary HVIC and latch-immune CMOS technology to enable ruggedized

PRODUCTUPDATE


Automotive gate driver targets hybrid/EV appsThe FAN7171 high-current, high-side gate driver IC and the FAN7190 high-current, high- and low-side gate driver IC target electric and hybrid electric dc/dc power supplies and power in-verters, diesel and gasoline injectors and valves, as well as MOSFET and IGBT high-side driver applications. The FAN7171 can drive high-speed MOSFETs and IGBTs that operate up to 500 V, while the FAN7190 can drive MOSFETs and IGBTs that oper-ate up to 600 V.

Both driver IC devices have a buff-ered output stage with all NMOS tran-sistors designed for high-pulse current driving capability and minimum cross-conduction. They have a negative volt-age swing (VS) down to –9.8 V at 15 VBS. The driver ICs are qualified to AEC Q100 Automotive Class 1 standards. They have an undervoltage lockout cir-cuit that prevents malfunction when VBS is lower than the specified thresh-old voltage. Both devices are packaged in an 8-lead SOP and are RoHS compli-ant. (Ea/1,000: FAN7171, $1.28; FAN7190, $1.50 — available now.)Fairchild SemiconductorSan Jose, CAInformation 408-822-2000www.fairchildsemi.com

Booster module captures low-power energyThe ALD EH4200 series of micropower step-up low-voltage booster modules are the missing link in energy harvest-ing technology that, until now, has been untapable. These PCB modules

monolithic construction. The logic in-puts are compatible with CMOS or LSTTL outputs, down to 3.3 V. The out-put drivers feature a high pulse current buffer stage for minimum driver cross-conduction. The floating channel can be used to drive n-channel power MOS-FETs or IGBTs in the high-side configu-ration up to 600 V. (From $1.30 ea/10,000 — available now.)International RectifierEl Segundo, CASales 310-252-7105www.irf.com

Power Management ICs

are designed to boost the output volt-age of thermoelectric generators, elec-tro-magnetic coils, single photovoltaic cells, and infrared emitters whose out-put voltages are generally in the low mV-range and power outputs that range from µW to mW.

The booster modules use micropower MOSFET semiconductor devices and a self-starting transformer-oscillator stage

78 Cherry Hill Drive Beverly, MA 01915 978-524-6768

www.ixysic.com/Products/IGBT-MOSFETDvr.htm

Part Number Sink / Source Drive Current

(A)

Rise / Fall Times(ns)

Propagation Delay On / Off

(ns)

AvailablePackages

Low-Side Gate Drivers (Operating Voltage: 4V to 35V)

IXD_602 Family ±2 7.5 / 6.5 35 / 38 DFN, DIP, SOIC

IXD_604 Family ±4 9 / 8 29 / 35 DFN, DIP, SOIC

IXD_609 Family ±9 22 / 15 40 / 42 DFN, DIP, SOIC, TO-220, TO-263

IXD_614 Family ±14 25 / 18 50 / 50 DIP, SOIC, TO-220, TO-263

IXD_630 Family ±30 11 / 11 46 / 46 TO-220, TO-263

High-Side Gate Driver (Offset Voltage: -5V to +600V)

IX2127 0.5 / -0.25 23 / 20 100 / 73 DIP, SOIC

Optocoupler Gate Driver (3750Vrms Input to Output Isolation)

IX3120 ±2.5 100 / 100 300 / 300 DIP, Surface Mount

RoHS2002/95/ECPb e3

• Highest Drive Current Available• Highest Voltage Capability• Low-Side and High-Side Drivers• Automotive Temperature Range• Fast Rise & Fall Times• Very Low Quiescent Supply Current • Surface Mount & Power Packages

From 2A to 30A!Clare offers the largest line of Low-Side Gate Drivers

Industry’s Broadest Supplier of IGBT & MOSFET Gate Drivers

IN

VCC

GND

OUT

Formerly


Driver is optimized for high-C loads up to 5 WThe iW1816 AccuSwitch primary-side driver has an internal power switch rated to 800 V for universal ac-input. It

Power Management ICs

Next Stop – DIN

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Where Are You Headed?Arrivals/Departures

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HARTING-ad16-EPsept_Layout 1 8/9/12 12:38 PM Page 1

LED driver handles demanding lighting appsOperating from 60 V down to as low as 5.0 V, the ZXLD1371 LED controller IC is capable of control-ling external MOSFETs to drive as many as 20 high-current LEDs. Features in-

PRODUCTUPDATEto derive their operating power directly from one of the energy generators and create a voltage gain ranging from 75 to 150 times. The ALD EH4205 features a nominal input impedance of 50 Ω, while the ALD EH4295 features an input im-pedance of 950 Ω. The booster modules can also be used, independently, for trickle-charging batteries or supercaps. ($41 ea/small qty — available now.)Advanced Linear DevicesSunnyvale, CAInformation 408-747-1155www.aldinc.com

has a digital pulse width modulation (PWM) driver that supports up to 6,000-µF loads at up to 5 W. The device

includes an adaptively controlled soft start that enables fast start-up for out-put voltages from 5 to 12 V.

The primary-side driver enables <100-mW system standby power with a 50-mW light load to meet the de-mands for high energy efficiency in standby mode. The device was devel-oped in conjunction with manufactur-ers of home appliances and is opti-mized to meet the requirements of power supply applications in smart meters, industrial control applications, microwave ovens and household appli-ances. It operates in noisy environ-ments and drives large-capacitance loads. ($0.39 ea/1,000 — samples avail-able now.)iWattLos Gatos, CAInformation 408-374-4200www.iwatt.com

clude a typical output current tolerance of 1% and a typical output current ac-curacy of 0.5%.

The LED driver controller offers us-ers dimming over a wide dynamic range, through separate 20:1 dc dim-ming and 1,000:1 PWM dimming op-tions, resulting in higher-accuracy light control particularly at lower brightness levels. Housed in the TSSOP-16EP package, the part is also available in automotive grade with AEC-Q100 and TS16949 certification. ($1.30 ea/1,000 — available now.)Diodes, Plano, TXSales [email protected]


HIGHLIGHTS

8-ch ultrasound receiver integrates digital demodulator and decimation filter Offered as the first of its kind, the 8-channel AD9670 ultra-sound receiver with on-chip digital I/Q demodulation and decimation filtering is able to condition eight channels of

data from RF to a baseband frequency, reducing the processing load on the system FPGA by at least 50% compared to other receivers. This part also integrates a low-noise amplifier, variable gain amplifier, anti-aliasing filter, and a 14-bit, A/D converter with the industry’s highest sample rate of 125 Msamples/s and best SNR performance of 75 dB.

Power consumption is 130-mW/channel at 40 Msamples/s in TGC (time gain compensation) mode and 55 mW/channel in CW mode, while input-referred noise is 0.78 nV/√Hz typical at 5 MHz (gain = 21.3 dB). Housing is in a 144-ball 10 x 10-mm BGA package. ($69 ea — prod qty, August 2012.) Analog Devices , Wilmington , MA Sales 800-262-5643 www.analog.com

Sensor IC enables short-range human presence detection The SX9300 capacitive proximity sensor with on-chip Specific Absorption Rate (SAR) engine for human body detection is claimed to be the only device of its kind with true discrimination between a human body and inert material. This unique feature enables mobile and tablet

PC manufacturers to comply with SAR regulation for optimized data & voice communication quality of service.

The device offers a dual-channel design with built-in human body dis-crimination on two distinct sets of sensors. This configuration is optimized for multiple axis proximity detection with very tiny sensor areas. Features include an operating voltage range from 2.7 to 5.5 V, and a current con-sumption of 18 µA in doze mode, 170 µA in active mode, and 2.5 µA in sleep mode. It is supported by a 400-kHz I2C interface and dedicated interrupt

ETSI Cat 1 transceiver reduces cost and size by 50% compared to discretes The CC1125 sub-1 GHz RF transceiver is claimed the indus-try’s first single-chip solution for wireless social alarms and ultra narrowband applications, targeting ETSI EN 300 220 cat-egory 1 (ETSI Cat.1) compliance for the European 869 MHz band. To address the ETSI Cat. 1 standard (one of the world’s strictest RF regulations) the CC1125 delivers a 50% reduc-tion in system cost and size over discrete designs enabling smaller and more affordable end products.

The transceiver offers a low phase noise of –115 dBc/Hz at 10 kHz offset and supports 169, 433, 868, 915, and 950 MHz bands. Additional features include an output power of up to 16 dBm, a sensitivity of –129 dBm at 300 bit/s, a link budget of 159 dB, and a extended battery life with less than 2 mA Rx sniff mode current consumption.

The part comes with an associated ETSI Cat. 1 compliant CC1125DK development kit and CC1125EM-CAT1-868RD reference design optimized for 869.2 to 869.25 MHz and European social alarm applications. The solu-tion is packaged in a ROHS-compliant 5 x 5 mm QFN-32 package. It offers a range of more than 25 km out-of-box with development kit. (Develop-ment kit CC125DK, $299 — available now.) Texas Instruments , Dallas , TX Information 800-477-8924 www.ti.com

pin. Housing is in 3 x 3-mm thin 20-QFN package and operating temperature is from –40° to 85°C. ($0.56 ea/10,000 — available now.) Semtech , Camarillo , CA Sales 805-498-2111 [email protected] www.semtech.com


NEWPRODUCTS

Radio ICs simplify sub-GHz wireless development The EZRadio Si4455 transceiver and Si4355 receiver are well suited for a variety of wireless applications such as remote controls, automotive re-mote keyless entry (RKE), home and building automation, security and lighting control, wireless sensor net-works, and health and fitness devic-es. Covering the 283 to 350-MHz, 425 to 525-MHz, and 850 to 960-MHz frequency bands, the Si4x55 devices offer +13-dBm output power and –116-dBm sensitivity, enabling them to deliver significantly better range than other sub-GHz solutions.

In addition, the parts offer –56-dB-selectivity and –61-dB blocking at 1 MHz offset. Housed in a tiny 3 x 3-mm QFN package, the Si4x55 devices

also offer a standby current of 50 nA, an active transmit current of 20 mA at +10 dBm, and a low receive current of

10 mA. They are supported by the GUI-based EZConfig configuration tool. (10,000; Si4355, from $0.99; Si4455 from $1.19 — available now.) Silicon Laboratories , Austin , TX Information 512-416-8500 www.silabs.com

Buck converters need 2.7-µA quiescent current The LT3975 and LT3976 42-V step-down switching regulators delivers 2.5-A continuous output current and requires only 2.7–µA quiescent cur-rent. The converters can operate from a 40-V input, deliver up to 5-A output current and require only 3.3–µA of quiescent current. Both devic-

Integrated Circuitsedited by christinanickolas, jimharrison and paulo’shea

Find samples, buy now and more at electronicproducts.com

POWER MANAGEMENT

ANALOG/MIXED SIGNAL


NEWPRODUCTSes offer a 4.2- to a nomi-nal 40-V input voltage range, suiting them for automotive and indus-trial applications.

The buck regulators have 75-mΩ switches that deliver 90% efficiency. The device maintains a minimum

dropout voltage of 500 mV when the output volt-age drops below the pro-grammed output voltage. Switching frequency is user-programmable from 200 kHz to 2 MHz, and synchronizable from 250

kHz to 2 MHz. They are packaged in a

thermally enhanced MSOP-16. (Ea/1,000: LT3975, $3.10; LT3976, $3.75 — available now.)Linear Technology, Milpitas, CASales Office 408-428-2050www.linear.com

10/100 Ethernet PHYs are low power

The LAN8740, LAN8741 and LAN8742 10/100 Ethernet PHY ICs of-fer up to 50% lower power consumption than their predeces-

sors. The LAN874x family also features cable diagnostics and deterministic loopback delay.

The LAN8740 and LAN8741 im-plement the IEEE 802.3az Energy Ef-ficient Ethernet standard directly into the physical layer and the LAN8742, while not IEEE compati-ble, implements a “wake on LAN” mode. They come in a 32-pin SQFN 5 x 5 x 0.9-mm package in commer-cial or industrial temperature ranges. ($0.69 to $0.95 ea/volume qty — samples available now.)SMSC, Hauppauge, NYSales [email protected]

Low-power 11-port GbE switch has IEEE 1588The VSC7414 11-port Gigabit Ethernet switch features low 1.6-W operating power along with sub-10-ns accurate VeriTime IEEE1588v2 timing support. The chip has nine 10/100/1,000-Mbit/s SGMII/SerDes ports and two 1G/2.5G SGMII/SerDes ports. All ports support both 100BASE-FX and 1000BASE-X SerDes.

The IC supports more than eight queues/port along with a priority flow control (IEEE 802.1Qbb) mech-anism for advanced QoS. The VSC7414 includes a 416 MHz MIPS processor with DDR2/DDR3 external memory. The 24 × 24-mm thermally enhanced TQFP packaged IC oper-ates from –40° to 125°C. (~$40 ea/1,000 — samples available now.)Vitesse SemiconductorCamarillo, CASales [email protected]

Integrated Circuits

Digital


NEWPRODUCTS

Relay & Switch

Step motors include controller, EthernetThe STM23 NEMA23 step motors

feature an integrated high performance motion

controller and 100 Mbit/s Ethernet port. The STM23Q-2Ex provides 125 oz-in of

torque, while the ST-M23Q-3Ex yields 210 oz-in and both can have an optional internal opti-cal encoder.

Software applications can com-municate with the STM23 in real time, using the SCL and Q languages over standard Ethernet cabling, ad-dressing, and protocols. (From $371 ea/50 — delivery 1 to 2 weeks ARO.)Applied Motion ProductsWatsonville, CASales 831-761-6555www.applied-motion.com

Transformer combines low cost, ruggednessThe RL-9500 “green” gate drive trans-former features a low-cost design and isolated primary winding, a 1:1:1 turn ratio, and 3,000-V Hi-Pot. It has a slim profile (only 18 mm high) and a wide

temperature range (–40° to 130°C).For use in push-pull converters and

half- and full-bridge circuits, the RL-9500 is packaged in quantities of 50 units per tray. ($0.65 — available now.)Renco Electronics, Rockledge, FLSales [email protected]

Power capacitors have wide voltage rangeThe MKP DC B2562 series power ca-pacitors feature high rated voltage, high peak current capability, and customized configura-tions. The capacitors have a rated voltage range from 880 to 1,980 Vdc, and a capacitance range from 30 to 1,500 μF. High dielectric strength is enabled by a special met-alized film profile. Six terminal types are available.

The capacitors feature low equiva-lent serial resistance (ESR) and in-ductance (ESL). Designed for temper-atures from –55° to 70°C, the cans have diameters of 75, 85, and 116 mm and heights between 70 and 223 mm. (Contact company for pricing and availability.)TDK-EPC, Iselin, NJAnil Shangloo 732-906-4325www.epcos.com

8-V power MOSFETs extend battery lifeThe AON2400 and AON2401 MOS-FETs are the first 8-V devices and fea-

ture 11- and 22-mΩ on-resistance rated at 1.2 VGS. The devices pro-vide extended battery life in low-voltage ap-

plications and suit space-constrained portable applications such as smart-phones, tablet PCs, UltraBook com-puters, eReaders, digital cameras, and portable music players.

The MOSFETs are housed in a ther-mally enhanced DFN2x2 power pack-age and are available in n- and p-chan-nel versions. The devices have a 2 x

Thin-film resistors come in SOIC packagesThe NOMCA series AEC-Q200-qual-ified, dual-in-line thin film resistor networks feature low absolute TCR of ±25 ppm/°C, TCR tracking of 5 ppm/°C, tight ratio tolerances to ± 0.05%, and long-term ratio stability of 0.05% after 1,000 hours at 125ºC.

A rugged, molded 50-mil-pitch construction of self-passivating tan-talum nitride resistor film on a high-purity alumina or ceramic substrate, the resistor networks offer seven or eight isolated resistors of equal value. Packages are compact, narrow (0.150-in.) 14- or 16-pin SOIC, in accor-dance with JEDEC MS-012 variations AB and AC. (From $1.50 to $2.00 — samples available now.)Vishay IntertechnologyMalvern, PAwww.vishay.com/analog-switches/saleswww.vishay.com

Components & Subassemblies

edited by p.o’shea, c.nickolas, r.comerford and j.harrison Find samples, buy now and more at electronicproducts.com

2–mm footprint and 0.6–mm profile. ($0.27 ea/1,000 — available now.)Alpha & Omega Semiconductor Sunnyvale, CA, information 408-830-9742www.aosmd.com

VCO operates from 1,662 to 1,708 MHzIdeal for use in applications such as digital radio equipment, fixed wire-

less access, satellite communicat ions systems, and base stations, the CVC-O33BE-1662-1708 VCO operates from

1,662 to 1,708 MHz with a control voltage range of 0.5 to 4.5 V. Addi-tional features include a typical phase noise of –106 dBc/Hz at 10-kHz offset and an output power of typically 2 dBm.

Housed in a 0.5 x 0.5-in. SMD package, the VCO also offers an in-put voltage of 5 V, with a maximum current consumption of 20 mA. Pull-ing and pushing are minimized to 5.0 MHz and 5.0 MHz/V, respective-ly, while second-harmonic suppres-sion is –15 dBc typ. (Contact compa-ny for pricing — available now.)Crystek, Fort Myers, [email protected]

Angular sensor thrives in tough environmentsUsing magnetoresistive (MR) tech-nology to determine angular posi-tion, the SMART rotary configura-tion position sensor provides 360° non-contact position sensing, en-abling design engineers to replace

optical encoders or resolvers, which can be expensive and difficult to

integrate. The sen-sor is well suited for

high-accuracy measurement in dirty, harsh environments, in-cluding transportation (steering an-gle, articulation angle, boom-arm detection) and industrial (solar pan-els, wind turbines) applications.

The sensor determines the angu-lar position of a magnetic collar at-tached to a rotating object with a resolution of 0.01°, reliably provid-ing repeatable output with a typical sensor-collar air gap of ±2.0 mm and with radial misalignment up to a

2.50 mm. Automotive-grade potting makes the sensor more resistant to vibration, shock, and extreme tem-peratures. (Contact Robyn Seykora for pricing and availability.)Honeywell Sensing and Control Minneapolis, MNRobyn Seykora [email protected]

Comm port targets renewable energy systemThe AXS Port Modbus/TCP interface enables users to remotely communi-cate and control renewable and back-up energy systems. The interface makes it possible to securely and re-motely monitor and control an en-ergy system by communicating with networked key system components via an Ethernet connection.

Intended for plug-and-play opera-tion, the AXS Port is a SunSpec-com-pliant device developed to establish global interoperability among renew-able energy components by defining open interface standards. It offers a 10/100 Ethernet interface, over two years of data logging accessible using FTP download, is upgradable over Ethernet or MicroSD card, and meets TCPIP, DNS, SMTP, FTP, DHCP, and NTP Internet standards. (Contact company for price and availability.)OutBack Power, Arlington, WAInformation [email protected]

DC-DC ConvertersHIGH VOLTAGE

Ultra Miniature Size0.55" x 0.75" x 0.4"

• 100 to 1,000 VDC Outputs• Input Voltage, 5V, 12V, 24V,

28V DC Standard• Isolated - Input to Output• Ultra Miniature - 0.55"x 0.75"x 0.4"• Excellent Load Regulation • Hi Reliability/Custom Models• Military Upgrades/Environmental

Screening Available• Call Factory 800-431-1064

PICO Electronics,Inc.143 Sparks Ave, Pelham, NY 10803-1837

E-Mail: [email protected]

MILITARY • COTS • INDUSTRIALDC-DC CONVERTERS &

POWER SUPPLIESTRANSFORMERS & INDUCTORS

100-1000 VDC OutputHi-Efficiency/Excellent LoadRegulationSingle Output with Center Tap

Input Over Voltage/Over Temperature Protection

Remote Shutdown

www.picoelectronics.com

100 to 1000 VDC outHigh Power 3 Watts

NEW! SA Series

For Full Product Specifications

Shown Actual Size

A43_ElecProd_2-06x9-5_Layout 1 8/6/12 4:22 P

Low-ESR MLCCs meet RF power demandsRoHS-compliant multilayer ceramic chip capacitors (MLCCs) with ultra-low equivalent series resistance (ESR) provide enhanced capabilities using an existing stable high-Q material system with excel-lent low-loss perfor-mance in systems to beyond 3 GHz.

Features include case sizes of 0604, 0805, and 1111; a capacitance range from 0.5 to 240 pF; rated volt-ages of 200, 250, and 500 V; and high self-resonant frequencies to 10 GHz. (Contact company for pricing — prod qty 6 weeks ARO.)Syfer TechnologyNorwich Norfolk, U.K.Chris Noades +44-1603-723314www.syfer.com


NEWPRODUCTS

Design kits debut for e3 thick-film resistorsFour engineering design kits are available for the AEC-Q200-quali-

fied DCRCW e3 thick-film chip re-sistors. The kits of-fer commercial off-the-shelf devices in 0402, 0603, 0805, and 1206 case siz-

es, and a variety of resistance values.The four design kits feature E96

series resistance values from 10 Ω to 1 MΩ (every fourth value) — in addi-tion to a 0-Ω jumper — for 122 dif-ferent values each. The resistors pro-vide tolerance of ±1%, TCR of ±100 ppm/K, power dissipation (P70) from 0.063 W to 0.25 W, and limiting ele-ment voltage from 50 to 200 V. (From $100 — 6 weeks ARO.)Vishay IntertechnologyMalvern, PAwww.vishay.com/analog-switches/saleswww.vishay.com

100-V MOSFET on-resistance targets telecomThe AON6290 100-V AlphaMOS (αMOS) MOSFET is suited for second-ary side synchronous rectification in dc/dc and ac/dc converters, primary side and secondary side switching in telecom and industrial dc/dc convert-

Optical xmitter/receiver run at 28 Gbits/s The T25-850 transmitter optical sub-assembly (TOSA) and the R25-850 receiver optical subassembly (ROSA) handle data rates of up to 28 Gbits/s. The transmitter uses an 850-nm VC-SEL, and the receiver uses a PIN pho-todetector within a spectral range of 700 to 890 nm and a transimped-ance amplifier.

The devices are coupled with 50-µm multimode fiber and the assem-blies are less than 6 mm in diameter, matching SFP transceivers. The transmitter runs on 3.3 V with oper-ating power of 130 mW. The receiver uses 3.3 V, takes only 110 mW, and has a responsivity of 0.4 A/W. Ex-pected volume price in the future is $10 to $15 each. (Samples 3,500 eu-ros each — available now.)VI Systems, Berlin, GermanyGeorge Schaefer +49 30 3083143 [email protected]

ers, and PoL modules for telecom sys-tems. The on-resistance of this device is 68% lower than the previous gener-ation of products. It is available in a DFN5x6 package.

The αMOS MOSFET features a fig-ure-of-merit for Qg, RDS(on) that is 5% better, CISS and RDS(on) that is 3% bet-ter, and COSS that is 50% better,

than the current leading competitor. The Qg at 10 V is 63 nC typ., the RDS(on) typ. is 3.8 mΩ, and the COSS is 415 pF typ. ($1.184 ea/10,000 — available now.)Alpha & Omega Semiconductor Sunnyvale, CAinformation 408-830-9742www.aosmd.com

Ultra-Miniature - High Reliability

MEETING THE EXTREME DEMANDS

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Quartz Crystals, Oscillatorsand Sensors

Military and Avionics | Industrial | Medical

High-Shock High-Temperature High-Precision

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16 MHz to 250 MHz Crystal

3.2 x 1.5 x 0.6 mm


3.2 x 1.5 x 0.6 mm

CX11A


2.0 x 1.2 x 0.4 mm

CX16A32.768 kHz to 200 MHz Oscillator

6.5 x 5.0 mm

32.768 kHz to 200 MHz CXOMK/HG/HT

CX11L32.768 kHz to 160 MHz Oscillator

3.2 x 2.5 mm

CXOX/HG/HT

CX16

512 N. Main St., Orange, CA 92868 Tel. 714-639-7810 Fax 714-997-1256 www.statek.com

High Reliability Crystals and Oscillators

• Expert technical support• Designed and manufactured in the USA

INNOVATION

• Highest shock capability in the industry• Military temperature range and beyond• Ultra-low power consumption• High stability and precision • Excellent long term aging

High Reliability High Reliability Crystals and OscillatorsCrystals and Oscillators

Expert technical support Expert technical support

INNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATIONINNOVATION

•• High stability and precision High stability and precision High stability and precision High stability and precision •• Excellent long term aging Excellent long term aging Excellent long term aging Excellent long term aging

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NEWPRODUCTS

©2012 Measurement Computing Corporation 10 Commerce Way, Norton, MA 02766

[email protected]

mccdaq.com

Learn about

DAQ,

A/D Converters,

Signal Conditioning,

Measurement

Techniques,

and more...

DownloadYour Copy Today!

Contact us1.800.234.4232

FREEDATA

ACQUISITIONHANDBOOK

Audio analyzer tests all the essentialsThe dScope Series IIIE audio test and measurement system comprises a Windows PC software application (XP, Vista, and Windows 7 compati-ble) coupled with an external high-precision audio I/O processor for connection to equipment under test. Based the original dScope Series III instrument and dubbed E for ‘Essen-tials’, the analyzer offers analog and digital audio signal generation and analysis particularly suited to auto-mated production line testing.

The system omits some of the ad-

USB power sensors take 3,500 readings/sProviding the peak and average pow-er measurement capabilities of a power meter, the U2020 X-series USB power sensors are capable of taking 3,500 readings/s or higher, said to be the fastest speeds attainable by such

devices today. The product’s mea-

surement speed, along with its internal zero and calibration

function, let users maximize test ef-ficiency and reduce test cost in areas such as high-volume component manufacturing.

The sensors come in two versions: 50 MHz to 18 GHz U2021XA and the 50 MHz to 40 GHz U2022XA. Both models have built-in trigger func-tions that allow accurate triggering from small signals close to the signal noise floor. The trigger-out port lets users to perform data logging, while the video-output feature lets them use the units with an oscilloscope. For R&D, an N1918A Option 100 Power Analyzer PC license key is bundled with each sensor to provide access to PC software that performs complex pulse analysis similar to a power meter. (U2021XA, $6,700; U2022XA $7,100 — available now.)Agilent TechnologiesSanta Clara, CASales 800-829-4444www.agilent.com/find/ usbpeaksensor_pr

vanced design capabilities of earlier models to offer the most commonly

used measurement functions for analog, digital, and sound-

card-based audio test-ing, includ-ing multi-

channel switching capabilities and modern analysis methods such as multi-tones and chirps. The system in-cludes a built in VBScript interpreter for creating automated test sequences as well as a dedicated test sequencer which avoids the need for script writ-ing. Test automation can also be ac-complished with dScope’s “ActiveX COM” interface, offering support for third party software such as National Instruments TestStand. Users can up-grade at any time should their require-ments change. (Contact Doug Ordon for price and availability.)Prism Media ProductsFort Worth, TXDoug Ordon 817 514 [email protected]/ test_measure/products_subs/dscope/dscope_features.php

PXI DMM measures 6.5 digits, waveformsThe high-performance GX2065 PXI DMM provides 6.5 digit measure-ment of of ac and dc voltage and cur-rent, as well as 2 and 4 –wire resis-tance measurements. Using its input-isolated, 16-bit, 3-Msample/s digitizer, the full-featured multi-function DMM also lets users acquire and analyze waveforms.

The DMM comes with a software package that includes a virtual in-strument panel and Windows 32/64 driver libraries for ATEasy, LabVIEW, LabVIEW/Real-Time, C/C++, Micro-soft Visual Basic, Linux 32/64, Del-phi, and Pascal. Compatible drivers for the Signametrics SMX2040 & SMX2060 DMMs are also supplied. ($1,895 — available now.)Geotest-Marvin Test Systems Irvine, CAInformation [email protected]

Test & Measurement

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Another Fast, Easy-to-Use, Ultra-Modern Test Instrument from RIGOLSimplify your testing with our new fast, user-friendly DG4000 series multifunctional generators. Our design features a high resolution 7" display that gives you excellent visibility and loads of functions...all controlled from the front panel with ease. The DG4000 seriescan help you accomplish a range of testing by combining many functions into one instrument, including Function Generator, Arbitrary Waveform Generator, Pulse Generator, Harmonic Generator, Analog/Digital Modulator and Counter. And Direct Digital Synthesizer (DDS) technology ensures stable, precise and low distortion signals.

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• Single and dual output models

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• I/O-isolation voltage 1500 VDC

• No minimum load required

• High efficiency of about 90 %

• Operation temperature up to 85 °C

• Approvals according IEC/UL 60950-1

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High Power Density DC/DC-Converters

The trend to shrink isolated DC/DC-converters may lead to thermal issues asthe high power loss creates a challenge for dissipating heat and maintainingmaximum component life.

TRACOPOWER offers miniaturized, isolated DC/DC-converters implementing new design technology with increased efficiency, optimizedthermal management and the highest grade components to insure superior reliability for industrial and high performance applications.

SIP-8 Package up to 6 WattTMR-6 Series 2:1 input voltage range

DIP-24 Package up to 15 WattTHD-15N Series 2:1 input voltage rangeTHD-15WIN Series 4:1 input voltage range

1” x 1” Package up to 30 WattTHN-30 Series 2:1 input voltage rangeTHN-30WI Series 4:1 input voltage range

2” x 1” Package up to 50 WattTEN-40WIN Series 40 Watt, 4:1 input voltage rangeTEN-50 Series 50 Watt, 2:1 input voltage range


NEWPRODUCTS Need

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Ads as of 7.9.12_Electronic Products 8/6/2012 11:32 AM Page 1

200-W LED supply features lowest profile The LDB200 series of LED power supplies offer 200-W constant cur-rent / constant voltage power in an IP67-rated alu-minum case measuring 7.80 x 2.48 x 1.38-in. with UL8750 and EN61347 safety approvals. The units offer constant voltage opera-tion up to their full load capability and then constant current operation down to 50% of their nominal out-put voltage.

The LED power supply series con-sists of two standard models offering 24– or 48–V nominal output. The ac-input extends from 90 to 305 Vac with active power factor correction and 92.5% efficiency. The supply also fea-tures an operating temperature from

–30° to +70°C, a built-in OCP, OVP, OTP, and SCP protection. (From $100 ea/100 — available now.)Excelsys TechnologiesRockwal, TXSales 972 771 [email protected]

Converter offers 4:1 input in ½ brickThe PMD75UHB dc/dc converters available in a half brick case (57.9 x 61.0 x 12.7 mm) have an output pow-er from 50 to 75 W. The converters have an input range from 9 to 36 Vdc

and 18 to 75 Vdc with output voltages of 3.3, 5, 12,

15, 24 or 48 Vdc.The dc/dc con-

verters operate from –40° to +100°C. They

have an isolation voltage of 1.5 kVDC

Power Sources

edited by paulo’sheaFind samples, buy now and more at electronicproducts.com

Toll Free: 1-866-997-3853Email: [email protected]

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PDUKE TECHNOLOGY, INC

DC to DC Converters

and a transient response time of <500 µs. The converters feature effi-ciency up to 85 % and are built in an aluminum case. They have remote on/off control, external output volt-age trimming, undervoltage lockout, continuous short circuit protection as well as overvoltage protection. (Contact company for price and availability.)MTM Power, Rehoboth, MASales [email protected]

Battery pack provides fuel gauge dataThe B L3100C1865004S1PSQA Li-Ion battery pack provides smart recharge-able power capability for advanced

portable and re-mote devices. It in-corporates fuel-gauge functionality with power status information. The

14.4–V pack has a 3.1–Ah capacity and includes a built-in protection circuit as well.

The battery packs are approved to UL1642 and use an SMBus commu-nication line to access battery pa-rameters from the fuel gauge memo-ry. Protection features include overcharge detection, overdischarge detection, and overcurrent detec-tion. Charge retention at one year storage at –20° to +20°C is greater than 80%, and the operational tem-perature range for discharge is from –20° to +60°C. (Contact company for price and availability.)GlobTek, Northvale, NJSales [email protected]

Digital dc/dc converter offers 4:1 inputThe WDE series 75-W 1/8th brick features 4:1 input range from 9 to 36 and 18 to 75 Vdc. The output voltag-es are 24, 28 and 48 Vdc. All models offer isolated input to output and are housed in an encapsulated, five sided shielded enclosure. The case dimen-sions are 2.5 x 1.1 x 0.55-in.

The dc/dc converter series offers

remote sense, trim and analog on/off. Efficiency is 90% typ while line and load regulation is 0.2% typ. Out-put noise is typ-

ically 1% of Vout. The switching fre-quency is 275 kHz. (Contact company for price and availability.)Calex Mfg., Concord, CAPaul Cuff [email protected]

Tiny boost power module targets tabletsThe TPS81256 MicroSiP boost con-verter is the industry’s smallest inte-grated step-up dc/dc power module for smartphones, tablets and other portable electronics. It integrates the inductor and input/output capaci-tors to achieve a solution <9 mm2 and sub 1–mm height, saving up to 50% board space versus competing solutions.

The 4–MHz, 600–mA boost mod-ule supports a 5–V output with a


NEWPRODUCTS

power density of 400 mW/mm3. The device extends battery life by reduc-ing the supply current to 43 µA dur-ing light load operation. It achieves power efficiency of >90% from an input voltage of 2.5 V to 5.5 V, en-abling it to manage 3 W over a full Li-Ion battery voltage range. ($1.70 ea/1,000 — available now.)Texas Instruments, Dallas, TXInformation 800-477-8924www.ti.com

Go Direct

Don’t sacri ce performance or service for price. Put us to the test, call MPD to-day for a surprisingly low cost quotation. For product datasheets or samples, go to:

•2W DC/DC Converter•6,000 VDC I/O Isolation•Short Circuit Protected• -40°C to +85°C Operation•Miniature DIP Case•5V, 12V & 24V Inputs

ASC200EHI

LDF24E-xxx (LED Drivers)

•Constant Current Output•Output Current to 700 mA•Analog & PWM Dimming•96% Ef ciency•Wide 5.5V to 48V Input•Compact SMT Package

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MPD EP1209.indd 1 8/8/2012 2:12:13 PM

Rack-mount power features 4.5-kW outputThe PFC 4K5-3U19 series modular, rack-mount ac/dc power supply sys-tem with PFC input delivers 4.5 kW or 3 kW with n+1 redundancy. The series targets critical applications in telecommunications, power utilities and industrial control.

The rack-mount power supply sys-tem is made with three 1.5–W (PFC

1K5) power supply modules assembled on a 3U x 19–in. rack-mount cradle. The modules are hot-pluggable and accept 95 to 264–Vac

input offer several different output configurations including 24 Vdc/60 A, 48 Vdc/30 A, 54 Vdc/27 A, 110 Vdc/13 A or 125 Vdc/12 A. Efficiency at full load is typically 80%. Protec-tion features include 4,300 Vdc input to output isolation, output current limiting with non-hiccup type short-circuit protection and thermal shut-down with self-resetting. (Contact company for price and availability.)Absopulse ElectronicsCarp, Ontario, CanadaCarole Lombard [email protected]

162-W half-brick module suits PoE appsThe EMH-54/3-Q48N-C dc/dc power module targets Power-over-Ethernet (PoE) applications. The power mod-ule provides a 54-V safety extra-low voltage (SELV) output, 2,250 Vdc iso-lation and a ba-sic insulation system meeting the requirements for multiport IEEE 802.3at (PoE+) applications. The module de-livers 30+ W at 54 V to each of four

54-V at 3-A output with efficiencies up to 91.5%. The brick measures 3 x 2.4 x 0.5-in. (Contact company for price and availability.)Murata Power SolutionsMansfield, MAInformation [email protected]

PoE+ Ethernet ports or delivers up to 162 W to loads requiring 54 V.

The power module suits applica-tions requiring a wide operating voltage range such as 24-, 48- or 60-V battery-powered systems, and wireless base-station applications. The modules accommodate a Vin range of 18 to 72 Vdc and delivers


Power Sources

6-kW HV supply offers 150-kV outputsThe STR series 6-kW high voltage power supplies are available in posi-tive or negative polarities in 19 dif-ferent models with outputs ranging from 1 to 150 kV. Standard input

Miniature dc/dc converter provides 4:1 inputThe A1500RU series of 15-W dc/dc converters packaged in a 24-pin DIP package feature 4:1 inputs, 1,600–Vdc isolation, and single or dual outputs. The series provides 14 models that op-erate from 9 to 36 or 18 to 75 Vdc in-puts; providing outputs of 3.3, 5.1, 12, 15, ±5, ±12, or ±15 Vdc.

Wall-plug offers constant current for LEDsThe PDA006A, PDA012A, and PDA024A constant-current LED driv-ers are designed as fixed wall plug adapters. The three series provide outputs ranging from 6 to 24-W to-tal to meet the needs of standard residential, office, and retail lighting applications.

The PDA006A series consists of 6–W LED adapters available in 350, 700, and 1,000–mA outputs, target-ing small porch lights and desk lamps. The PDA012A series consists of 12–W LED adapters available in 350, 700, 1,000, and 1,500–mA out-puts, suitable for floor lamps, cabinet lighting, and retail display lighting. The PDA024A consists of 24–W LED adapters and is available in 700, 1,000 and 1,500–mA outputs, best used for bright displays and higher power under-counter lighting. All the drivers feature Level V efficiency markings and have power factors >0.90. (Contact company for price and availability.)Phihong USA, Fremont, CAGlenn Morton [email protected]

Chassis-mount supply offers 50-W outputThe CM50 series of ac/dc switching power supplies offers 50-W output power in a chassis mount case. The terminal block and output voltage ad-justment potentiometer are easily ac-

cessible targeting an assortment of applications.

The switching power supply has

an input voltage range from 88 to 264 Vac. The series offers output voltages of 5, 12, 24 and 48 Vdc, with efficiencies up to 84%. The supply has protective features such as short-circuit, overvoltage, and overload protection. The metal cage type chassis mount case is designed for air convection cooling. The series is rat-ed for 3,000–Vac isolation. (Contact company for price and availability.)ConTech, Concord, CAInformation [email protected]

Thin ultracap modules suit power conditioningThe THiNCAP iMOD modules are thin-cell ultracapacitors that suit pow-er conditioning and automated guided vehicle (AGV), telecommunications, silicon and food production, renew-able energy, hospitals and pharmaceu-tical applications. They consist of high power, thin, flexible ultracapacitor packs, instead of cylindrical cells.

The ultracapacitor modules cut charge times in half, and eliminate the need for battery replacement or charg-ing. They replace or enhance common rack mount battery systems. The mod-ules are compatible with all common rack enclosures, including 19–, 23–in. wide, and >20–in. depth. They also provide low equivalent series resistance for higher efficiency. (Contact compa-ny for price and availability.)Ioxus, Oneonta, NYSales [email protected]

voltages extend from 180 to 264 Vac at 50/60 Hz. The front panel allows local control, an analog interface provides remote capability, and an Ethernet digital interface enables system integration.

The power supply’s IGBT inverter is fault tolerant and suits semicon-ductor processing and vacuum depo-sition. Operational features can be configured to suit user requirements. Operating temperature extends from 0° to 40°C. (Contact company for price and availability.)Spellman High Voltage Electron Hauppauge, NYInformation [email protected]

Innovation3

Part No.

VinVout

IoutLoad Regulation

VV

mA

%M

TU1D

0305MC

3.3±5

±1008.0

MTU

1D0505M

C5

±5±100

6.6M

TU1D

0509MC

5±9

±565.6

MTU

1D0512M

C5

±12±42

5.0M

TU1D

0515MC

5±15

±335.1

MTU

1D1205M

C12

±5±100

4.3M

TU1D

1209MC

12±9

±563.1

MTU

1D1212M

C12

±12±42

3.0M

TU1D

1215MC

12±15

±332.6

MTU

1 Series: 1 Watt isolated D

C DC converters

Actual size

XYYWW

MTU1S

0505C

Footprint reduced by 50%

56% less pow

er dissipation

Lower running tem

peratures

Load regulation from 2.6%

Patent pending

Changing the Shape of DC D

C Converters . . . Again

Now

available in dual output models!

For complete series speci cations, visit m

urata-ps.com/m

tu1


NEWPRODUCTS

http://www.astrodyne.com/ep912

ISO 13485:2003

. Multiple form factors

. Custom sheet metal to meet your exact dimensions . The output voltage and amperes to meet your exact needs . CAD design PCB layout and chassis layout . Power Factor Correction . Contacts with worldwide safety approval agencies

Feel free to visit our website for a custom power supply application form www.total-power.com\custom.html

or Give us a call: Toll Free # 877-646-0900

Phone: 978-453-7272

Total Power International We offer Custom Design!

Some of our Capabilities are:

60-W dc/dc converter achieves 92% efficiencyThe JCK60 series of metal cased 60-W dc/dc converters target telecom-munications, networking and indus-trial applications. Measuring 2 x 2 x

0.4-in. the convection cooled con-verter has a power density of 37.5 W/in.3 and does not need forced air cooling, additional heat sinking or baseplate cooling.

The single output dc/dc converter series accommodates a 2:1 input volt-age range and includes undervoltage lockout. Models are available with either a 24–Vdc (18 to 36 Vdc) or 48–Vdc (36 to 75 Vdc) nominal input. Outputs voltages are 3.3, 5, 12 or 15 Vdc. An output trim function allows the adjustment of output voltage of ±10% of nominal. Remote sense compensates for drops in voltage at the load. The operating temperature range extends from –40° to + 85°C. ($77.22 ea/500 — available now.)XP Power, Sunnyvale, CADuane Darrow [email protected]

The dc/dc converters feature 90% efficiency, continuous short circuit protection, overload protection, and are compliant to EN55022 & EN6100-

4. The MTBF (per MIL HDBK 217F) is >410 kh. The con-verters have a power density of 37.5 W/in3. Each model is speci-

fied over the an operating temperature range from –40° to +85°C ambient. They suit board-level power applica-tions including industrial process sys-tems, wireless equipment, test and measurement instrumentation, and portable systems. (Ea/100: from $22.55 to $24.35 — available now.)MicroPower Direct, Stoughton, MASteve Forrester [email protected]

Digitally controlled supplies meet UL60601-1The CFE400M series medically-ap-proved power supplies are digitally-controlled, 300 to 400-W single out-

put that are available in convection and fan-cooled versions. Combining a 4-kVac reinforced input-to-output isolation with dual fusing and an out-put-to-ground isolation of 1,500 Vac, the series meets IEC/EN/UL/CSA

60601-1 Editions 2 & 3 safety ap-provals, suitable for medical and dental applica-tions. The sup-

plies also suit ITE and laboratory/pro-cess control equipment.

The digitally controlled power sup-plies are rated at 300-W when convec-tion cooled for operating tempera-tures from 0° to +40°C, and 250 W at +50°C. When fan cooled with either an integral fan or forced air at 1.5 m/s, the power supply is rated at 400 W from 0° to +50°C. These units also have a 450–W peak power rating for up to 10 s. (From $236.20 ea/100 — available now.)TDK-Lambda AmericasSan Diego, CAMel Berman [email protected]/lp


Power Sources


NEWPRODUCTS

7-segment LED displays withstand high tempsThe QuasarBrite high-temperature SMD seven-segment numeric LED displays can perform in temperatures up to 105°C, thanks to a combination of proprietary epoxy and

LED candelabra lamps have 120° outputWith a wide 120° viewing angle, the ETL-registered SLF467-UL Se-ries S6 candelabra bulbs are aimed at decorative and architectural ap-plications such as low-wattage nightlights and aisle light-ing. The E12 screw-based lamp series has a 44.75-mm-long version with a domed top and seven LEDs that provides 3,000K (warm white) light, as well as domeless 47.8-mm-long versions with six or seven LEDs, in warm white, cool white (8,000K), ultra red (660 nm), super yel-low (595nm), lime green (570nm), and aqua green (525nm).

The domed version (SLF467-SIW-120A-UL) operates from 120 Vac, to provide 4 cd while consuming just 1 W. Other versions operate from 24 Vdc, 130 Vdc, or 120 Vac. The lamps are rated for an MTBF of 50,000 hours. (SLF467-SIW-120A-UL, $26.60 ea / 25 — prod qty available 3 to 5 days ARO.)Ledtronics, Torrance, CAJordon Papanier 310-534-1505 [email protected]

Low-glare case lights run from a single driverDesigned for use in refrigeration and display cases, the Shiver vertical LED luminaire delivers even light distribu-tion and reduced glare. The LED fixtures have AccuDrive technology, allowing a single driver system to operate all fixtures in a 2- to 6-door case and thereby reducing in-stallation and maintenance costs.

Glare is reduced by having a 90° cut-off angle for the high-CRI (85) luminaire, which can be used in environ-ments ranging from −30°C to 30°C. It has an L70 lifetime rating of 50,000 hours and delivers up to 80% energy sav-ings over traditional fluorescents. (Contact Jamie Pearson for pricing and availability.)Lithonia Lighting, an Acuity Brands companyAtlanta, GA Jamie Pearson 770-860-2062 [email protected]

SMT IR emitter is very ‘bright’Aimed for use in proximity sensors, touch displays, and light barriers where space is limited, the Mini Mi-dled SFH 4451 IR emitter is only 2.3 x 1.95 x 0.9 mm, yet it provides a narrow beam (half-angle of 17°) with

the highest radiant intensity of any device its size: 60 mW/sr at 100 mA.

The device is designed for surface mounting and its non-metalized surfaces are dark colored so it can be mounted inconspicuously behind a smartphone cover. It produces an 850-nm-wavelength output and uses a met-alized reflector which is said to considerably reduce opti-cal crosstalk, so no optical shielding is required. (Contact Sevugan Nagappan for pricing and availability.)OSRAM Opto Semiconductors, Sunnyvale, CASevugan Nagappan [email protected]

plastic. Compatible with lead-free soldering, the devices can eliminate the need for the additional soldering step needed for through-hole displays, saving time and reduc-ing manual labor by up to 80%.

The displays are compatible with standard drivers and are available in red or green in 0.3- and 0.56-in. sizes with sin-gle- or double-digit layout and common-anode or common-cathode format. Custom technologies are also available in any color and with wide varieties in size, character height, thickness, and shapes. (Less than $1 ea / prod qty — avail-able 6 to 8 weeks ARO, 8 to 12 weeks for custom products.)Lumex, Palatine, ILSales 800-278-5666 [email protected]

Optoelectronicsedited by richardcomerford

Find samples, buy now and more at electronicproducts.com


NEWPRODUCTS

Header, socket strips add durabilityThe 1-mm 860-10-0XX-10-002000 header and 861-13-0XX-10-002000 socket are suitable for real-estate-sav-ing inter-c o n n e c t solutions. The con-n e c t o r s are through-hole soldered to the PCB, supporting applications that re-quire multiple insertions and extrac-tions. They have solder-tall diame-ters of 0.015 and 0.014 in., respectively. The insulator bodies have standoffs on the termination side of the connectors to aid in sol-der flow during the soldering pro-cess. They provide a mated height of 0.200 in. for board-stacking apps.

Available in 2-60 positions and RoHS compliant, the sockets have

gold-plated shells and contacts, and headers have gold-plated pins. (Con-tact company for pricing and avail-ability.)Mill-Max, Oyster Bay, NYCustomer Service 516-922-6000www.mill-max.com

Small enclosures come in new shape, sizesMolded in high-impact polystyrene (UL 94 HB) in either of two standard colors — off-white (RAL 9002) or black (RAL 9004) — Smartbox enclo-sures are now available in a square version with different heights, in-

creasing the series’ standard configu-ration options by 60%. The 4.37 x 4.37-in. cases are offered in heights

of 0.71, 1.22, and 1.71 in.

Packaging & Interconnections

edited by paulo’shea and richardcomerfordFind samples, buy now and more at electronicproducts.com

Cases consist of a top and base molding which are mated with self-tapping screws. The top has internal screw pillars for PCBs and can be eas-ily machined for LED, switches, con-nectors, and such. The base can be had with or without external mount-ing ears. (From $7 — available now.)Teko EnclosuresBridgeville, PASean Bailey [email protected]

Ac fans feature smart thermal controls

A 6-in. energy-effi-cient ac-fan with smart thermal con-trols is an addition to the OA172 series of axial fans. It fea-tures a ball-bearing

design that delivers airflows of 105 to 200 cfm with reduced noise levels of 37.5 to 50.8 dB.

The fans provide thermal control to reduce power consumption by in-creasing or decreasing fan speed ac-

cording to the ambient air tempera-ture. They provide up to 30% energy savings versus similar sized single-speed fans. They measure 172 x 51-mm, feature an impedance- and thermally-protected motor, and an aluminum alloy frame with a UL94V-0 plastic impeller. The rated speeds range from 1,600 to 2,600 rpm, and feature an operating temperature range from –10° to +70°C. (From $21 ea/small OEM qty — available now.)Orion Fans/Knight Electronics Dallas, TXInformation [email protected]

Enclosure serves Raspberry PiThe Pi-Sandwich enclosure is specifi-cally designed for Raspberry Pi, the popular, credit-card-sized microcom-puter board created to help children learn programming. Made of two identical halves, the case has windows on four sides to allow easy access to ports for connecting keyboard, TV/video, audio, USB, and LAN cables.

Widows are oversized to accommodate future ports or port locations, and have built-in slots for user-supplied cover panels.

Constructed of 2-mm-thick rasp-berry-colored ABS plastic, the 130 x 85 x 64-mm impact-resistant case is trans-

parent, so users can see components and indicator lights. No hardware is required for assembly: the two halves snap together

and the Raspbery Pi board snaps se-curely into place. The case has space for a battery compartment and can also securely mount a second board. (Under $6.50 — available now.)Bud IndustriesWilloughby, OHBlair Haas [email protected]/78


NEWPRODUCTS

Thermally Conductive Epoxy Adhesive Resists Up To 400ºF

Supreme 10AOHT Electrically insulative High shear and peel strength Withstands impact and shock

154 Hobart Street, Hackensack, NJ 07601 USA+1.201.343.8983

mainmasterbond.com

www.masterbond.com

2017AS_3.25x4.5.indd 1 12/20/11 8:39 PM

[email protected] www.caton.com 781-585-4315

Caton Connector: Custom Wiring and Cable Assemblies

· Manufactures high voltage connectors and cable assemblies for use in the Military, Semiconductor, Utility, Medical and Avionics industries

· Creates products that operate at voltages exceeding 100kVdc, altitudes over 50,000 ft, and have partial discharge levels of 5 to 15 picocoulombs at voltages up to 15kV RMS

· Designs assembly configurations that have up to 13 conductors, multi-shields and use single, double and triple extruded silicone cables built to lengths over 300 feet

· Award-winning supplier with 39 years of high-voltage interconnect experience

Connection system handles 32 circuitsA 32-circuit wire-to-wire connec-tion system is designed to perform in high-conductivity applications

Thermoelectric coolers feature heat exchangerThe AHP-2250 and the AHP-3250 thermoelectric air conditioner mod-els feature a heat exchanger mode. The AHP-2250 offers 2,060 BTU/hr (605 W) cooling capacity, and the

AHP-3250 offers 2,600 BTU/hr (765 W) cooling capacity.

Heat and cool versions are avail-able offering heat capacity of 3,750 BTU/hr for the AHP-2250 and 5,320 BTU/hr for the and AHP-3250. The heat exchanger mode switches on as the enclosure temperature rises through 25°C, providing passive cool-ing. The AHP-3250 uses 83% less en-ergy in the heat exchanger mode than it does in the active cooling mode using 18-W/°C cooling. A tempera-ture controller is built into the mod-els. All configura-tions include either a cool only TC-4F or heat/cool TC-7F integral temperature con-troller. Applications include general industry, telecom, overhead crane controls, military transit cases, equip-ment or medication storage, LED screens, ATMs, and kiosks. (From $3,357 — available now.)Teca, Chicago, ILInformation [email protected]

Connector Performancewhen you need it most

www.harwin.com/hotshoe

• For Hand-Held / Rechargeable Devices

• Contacts: Female – Spring-Loaded Pogos Male – Fixed

• Solder Cup or PC Tail Contacts

• 10,000 Mating Cycles

• No. of positions: 8,12,16

Features:

HotShoe third square USA medical theme.qxd:Layout 1 25/07/2012 16:19 Page 1


in automotive and transportation powertrain and body electronics ap-

plications. The system enables users to implement one female

connector and CP terminal system throughout an entire vehicle.

Primarily used in cars, trucks,

and buses, the system allows harness makers to use only one female con-nector and terminal system for both wire-to-board and wire-to-wire apps. The male plug is designed for either bracket or clip mounting. (Contact company for price and availability.)Molex, Lisle, ILSales [email protected]

Packaging & Interconnections


BlockMaster’s Clear Connects™ Push-In Wire ConnectorsBlockMaster’s “Clear Connects™” Push-In Wire Connectors are faster, simpler and safer than twist-on wire connectors. No more twisting or taping! Transparent, color-coded and easy to use, Clear Connects™ provide visual confirmation of wire termination for a perfect connection every time! Available in 2-8 positions, Clear Connects™ accept wire sizes from 22-12 AWG. A built-in strip guide shows how much wire to strip, and their compact size enables connections in tight spaces.

BlockMaster Electronics, Inc.1-800-595-8881www.BlockMaster.com

INTER-8® Weave Cable vs. Twisted Pair Is your signal susceptible to cross-talk? Have you sampled our INTER-8® Weave Cable which provides substantial improvement over conventional “twisted pair” by reducing electromagnetic radiation, cross-talk, and pickup of external noise. Four types to choose from – with or without high temperature insulation or low-frequency braided shielding. Contact us for a quote & free samples.

Magnetic Shield Corporation630-766-7800shields@magnetic-shield.comwww.magnetic-shield.com/ products/cable.html

Module Displays are Custom Built for Critical ApplicationsLXD Research & Display, LLC offers a complete line of Custom Module Displays for critical applications. These module assemblies have built-in digital control and drivers to suit a wide variety of specialized displays. Features and options include:

-20ºC to +85ºC (-40ºC with Heater)LXD Research & Display, [email protected]

“Nomex®” Insulating Tubing & BobbinsNomex® is a calendered, aramid insulation paper that, when wound into an insulating tube with appropriate binders, offers superior high temperature resistance and high dielectric strength in insulating tubing and bobbins. Nomex® also possesses excellent mechanical toughness, resilience and high mechanical strength. Full PDF Lit available at www.pptube.com.

Precision Paper Tube CompanyPhone: 847-537-4250Fax: [email protected] Than 75 Years - The Original®“Nomex” is a registered trademark of the DuPont Co.

IC Device & Package ConvertersQuick-Turn Custom Solutions

Ironwood Electronics

www.ironwoodelectronics.com

Turbo® Miniature Piezoelectric Alarms Tiny (approx.1”x1”) piezoelectric alarms provide LOUD output with a super-sleek design. Available in variety of voltages and output up to 103dB! Rugged, tamper-proof, lo-profile panel mount design is IP68 and NEMA 4X. Optional manual volume control offers increased attenuation. ISO 9001:2000 registered company – all products made in the USA.

Floyd Bell Inc.Tel: (614) 294-4000Fax: (614) [email protected]

Absopulse Electronics Ltd. ……………………76Advanced Interconnections Corp. ……………81Advanced Power Solutions ……………………20Agilent Technologies, Inc. ……… Cover 2, 15AKM Semiconductor, Inc. ……………………68Allied Electronics Inc. ………………… Cover 3America II Electronics, Inc. ……………………27Astrodyne Corp. …………………………………79Avago Technologies ……………………………33Avnet Electronic Marketing …………………… 3BlockMaster Electronics, Inc. …………………84BUD Industries, Inc. ……………………………50Caton Connector Corporation ………………82Central Semiconductor Corp. …………………43CIT Relay & Switch ………………………………69Coilcraft CPS ……………………………………57Coilcraft, Inc. ……………………………………10Components Corporation ……………………35Concept Group, Inc. ……………………………46Connor-Winfield Corporation…………………32CUI Inc. ……………………………………………34Digi-Key Corporation ……………… Cover 1, 1E-T-A Circuit Breakers ………………………… 2ELMA Electronic, Inc. …………………………60EMCO High Voltage Corporation ……………58FCI Electronics ……………………………… 54, 55Floyd Bell Inc. ……………………………………84General Cable ……………………………………23GlobTek, Inc. ……………………… Cover 1, 75Hammond Manufacturing Company Inc. ………………………………83Harting, Inc. ……………………………………66Harwin ……………………………………………83Hittite Microwave Corporation ………………39Integrated Power Designs, Inc. ………… 24, 25International Rectifier …………………………29Ironwood Electronics, Inc. ……………………84IXYS Integrated Circuits Division ……… 48, 65Keystone Electronics Corp. ……………………21

KOA Speer Electronics, Inc. ……………………30Linear Technology Corporation ………………13LXD Inc. …………………………………………84Magnetic Shield Corp. …………………………84Master Bond Inc. ………………………………82Maxim Integrated Products, Inc. …… Cover 4Mean Well USA, Inc. …………………………… 4Measurement Computing Corporation …………………………………72MEGA Electronics, Inc. …………………………22Melexis ……………………………………………12Micro-Precision Technologies, Inc. …………61MicroPower Direct, LLC ………………………77Minmax Technology Co., Ltd. ………………75Mouser Electronics ……………………… 7, 18, 19MuRata Power Solutions, Inc. …………………78Newark/element14 ……………………………… 9NTE Electronics, Inc. ……………………………47Octagon Systems Corporation …………………36OKW Enclosures, Inc. …………………………81Panasonic Electric Works Corporation ………59Pduke Technology ………………………………76Pico Electronics, Inc. ……………………………70Precision Paper Tube Company ………………84RECOM Power, Inc. ………………… 49, 51, 53Renesas/DevCon …………………………………17Rigol Technologies ………………………………73RTG, Inc. …………………………………………80SCHURTER Inc. …………………………………22Solid State Inc. …………………………………41Spectrum Control Inc. …………………… 44, 45Statek Corporation ………………………………71TDK-EPC Corporation …………………………31TDK-Lambda Americas, Inc. …………………14Total Power International, Inc. ………………79Traco Power ………………………………………74Visual Communications Co. …………………62Yuan Dean Scientific Co., Ltd. …………………53Zettler Magnetics, Inc. …………………………61

Product martElectronic Products Presented by the Manufacturer

advertiser indexThis index is provided as an additional service.

The publisher does not assume any liability for errors or omissions.

1.800.433.5700© Allied Electronics, Inc 2012. ‘Allied Electronics’ and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.

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© 2012 Maxim Integrated Products, Inc. All rights reserved. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.,in the United States and other jurisdictions throughout the world.

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