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Semiconductor Components Industries, LLC, 2004

March, 2004 Rev. 5

1 Publication Order Number:

SS16/D

SS16

Surface MountSchottky Power Rectifier

SMA Power Surface Mount Package. . . employing the Schottky Barrier principle in a large area

metaltosilicon power diode. State of the art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification, or

as free wheeling and polarity diodes in surface mount applications

where compact size and weight are critical to the system.

Small Compact Surface Mountable Package with JBent Leads

Rectangular Package for Automated Handling

Highly Stable Oxide Passivated Junction

Very Low Forward Voltage Drop

Guardring for Stress Protection

Mechanical Characteristics:

Case: Epoxy, Molded, Epoxy Meets UL94, VO

Weight: 70 mg (approximately)

Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

Lead and Mounting Surface Temperature for Soldering Purposes:

260C Max. for 10 Seconds

Shipped in 12 mm tape, 5000 units per 13 inch reel

Polarity: Cathode Lead Indicated by Polarity Band

ESD Ratings: Machine Model = C

ESD Ratings: Human Body Model = 3B Device Meets MSL 1 Requirements

Marking: SS16

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRMVRWM

VR

60 V

Average Rectified Forward Current

(At Rated VR, TC = 105C)

IO 1.0 A

NonRepetitive Peak Surge Current

(Surge Applied at Rated LoadConditions Halfwave, Single

Phase, 60 Hz)

IFSM 40 A

Storage/Operating Case

Temperature

Tstg, TC 55 to +150 C

Operating Junction Temperature TJ 55 to +150 C

Voltage Rate of Change

(Rated VR, TJ = 25C)

dv/dt 10,000 V/ ms

Device Package Shipping

ORDERING INFORMATION

SS16T3 SMA 5000/Tape & Reel

SCHOTTKY BARRIERRECTIFIER

1.0 AMPERES60 VOLTS

MARKING DIAGRAM

SS16 = Device Code

SMA

CASE 403D

PLASTIC

SS16

http://onsemi.com

For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.


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2

THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance JunctiontoLead (Note 1)

Thermal Resistance JunctiontoAmbient (Note 1)

RJLRJA

35

86

C/W

ELECTRICAL CHARACTERISTICS

VF TJ = 25C Voltsaxmum ns an aneous orwar o age o e

(IF = 0.1 A)(IF = 1.0 A)

0.510.72

Maximum Instantaneous Reverse CurrentIR TJ = 25C TJ = 100C mA

(VR = 60 V) 0.2 5.0

1. Mounted on 2Square PC Board with 1Square Total Pad Size, PC Board FR4.2. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%.


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SS16

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3

Figure 1. Typical Forward Voltage

Figure 2. Typical Reverse Current*

Figure 3. Forward Power Dissipation

1.4

vF, INSTANTANEOUS VOLTAGE (VOLTS)

10

1.0

VR, REVERSE VOLTAGE (VOLTS)

40 700

0.1

0.05

0.001

IF(AV), AVERAGE FORWARD CURRENT (AMPS)

1.00

4.0

2.0

02.0

iF,I

NSTANTANEOUSFORWARDCURRENT(AMPS)

I

PF(AV),AVERAGEFORWARD0.1

0.60.2 0.4 0.8 1.0

50 6010 20 30

10

3.0 4.0 5.00

1.6

5.0

3.0

1.0

,REV

ERSECURRENT(mA)

R

0.2

0.5

1.0

0.020.01

0.005

0.002

TJ = 150C 100C25C

IPK/IAV = 20

SQUAREWAVE

dc

10

5

TJ = 150C

*The curves shown are typical for the highest voltage device in the volt-

age grouping. Typical reverse current for lower voltage selections can

be estimated from these same curves if VR is sufficiently below rated VR.

125C5.0

2.0

100C

75C

25C

POWERDISSIPATION(WATTS)

1.2

0.07

0.05

0.03

0.02

0.2

0.3

0.5

0.7

2.0

3.0

5.0

7.0

p

Figure 4. Typical Capacitance

VR, REVERSE VOLTAGE (VOLTS)

50 800

60

40

30

2060 7010 20 30 40

50

7080

100

200

C

,CAPACITANCE(pF)

10090

TJ = 25C

f = 1 MHz


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PACKAGE DIMENSIONS

SMAPLASTIC PACKAGE

CASE 403D02ISSUE AS

A

D B

K J

C

H

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.1 60 0.180 4.06 4.57

B 0.0 90 0.11 5 2.29 2.92

C 0.0 75 0.095 1.91 2.41

D 0.0 50 0.064 1.27 1.63

H 0.0 02 0.006 0.05 0.15

J 0.0 06 0.016 0.15 0.41

K 0.0 30 0.060 0.76 1.52

S 0.1 90 0.220 4.83 5.59

POLARITY INDICATOR OPTIONALAS NEEDED

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.

3. 403D01 OBSOLETE, NEW STANDARD IS403D02.

mm

inches

0.157

4.0

0.0787

2.0

0.0787

2.0

*For additional information on our PbFree strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 8002829855 Toll FreeUSA/Canada

Japan: ON Semiconductor, Japan Customer Focus Center291 Kamimeguro, Meguroku, Tokyo, Japan 1530051Phone: 81357733850

SS16/D

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 3036752175 or 8003443860 Toll Free USA/CanadaFax: 3036752176 or 8003443867Toll Free USA/CanadaEmail: [email protected]

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

For additional information, please contact yourlocal Sales Representative.


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