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Signal Integrity @ Intel CDCColumbia, SC

11WW14

Hendrick, Matt R [matt.r.hendrick@intel.com]Gregory, Adam J[adam.j.gregory@intel.com]

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Intel Columbia ~230 employees Largely Validation EE’s

Analog & Digital Product Application Engineers Signal Integrity Software (BIOS) Engineers Product Architecture Marketing Many more…

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Signal Integrity Roles Chip to Chip Communication Ingredients

PCB (FR4, Megtron) Connectors, Cables Packages, Sockets, Vias Flex Cable

USB, PCI-Express, SATA, DDR – you name it! Current Emphasis on High-Speed Serial 5GT/s+

Simulations consist of many different 3D and circuit-based tools Circuit: Spice, Nexxim Full 3D: HFSS, CST, ADS, etc. Statistics based data analysis: JMP Scripting: Matlab, Perl, VBA, etc.

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Surface Current (J) @ 1GHz

79-mil stub11-mil stub

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Surface Current (J) @ 15GHz

79-mil stub11-mil stub

66

Via Insertion Loss (S21)

11-mil stub

79-mil stubdB

Hz

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Signal Integrity Internship, Summer 2011

Qualifications Ability to communicate effectively with internal

customers Ability to work well in a diverse team environment, and

with minimal supervision Disciplined and high attention to details Willingness to learn new things Good documentation skills and practices Familiarity with HSPICE/Spice tools would be an added

advantage Programming skills with Perl, and C is highly desired

Related Course Work preferred but not req’d CMOS and VLSI Design Applied Electromagnetics Numerical Analysis High Speed Digital Design Analog and Mixed Signal IC Design Digital Electronics Electron Devices Advanced Logic Design Computer System Architecture design Computer Architecture Linear Integrated Circuits

Signal Integrity Engrg. Intern. Job ID #597860 http://www.intel.com/jobs/index.htm

#1 Resume Booster: ELCT 762 (Signal Integrity for High Speed Circuits)