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November 2008 16
1. SMD LED .
2. LED .
LED
1991 () North Carolina State University , . , LED , (EU)THERMINICS
. LED . LED . (LED) SMD
. (mold) LED . (Surface Mount Device) (PCB)
. SMD LED .
LED
LED , , , .
LED p-n . LED
. , , , . LED . LED . LED
. LED . LED .
. LED ,
, , X-, . LED . , , , LED . LED
. LED LED . LED , , , TEC , heat sink slug . 3
Lens GaN chipSiC substrate
Slug-
November 2008 17
4. .
5. LED .
3. LED (Heat sink).
[1] US Air Force Avionics Integrity Program.
[2] J. Park, M.W. Shin, and C.C. Lee, Optics Letters 29, No.
22 (2004).
heat sink .
LED LED , .
. 55%
, 19%
.[1] LED . 5 LED
.[2] LED LED
.
LED LED . . , , , LED . LED chip .
4 inch 2014 6 inch . GaN GaN
. LED . LED . LED .
6 inch GaN
a/c
LED LED . LED chip 9% . LED . LED .
LED LED
November 2008 18
7. .
300 400 500 600 700 8000
10
20
30
40
50
60
70
80
90
100
% T
rans
mitt
ance
Wavelength (nm)
JCR6175 EG6301 TX2336 IVS2335 DYMAX9617 EPOXY
8. .
6. .
. LED LED
. LED
. , , ,
LED .
. / , //Glass ceramic . // // glass ceramic .
. , ,
. LED
. LED . ,
. LED . , , / . , / . , LED , . LED
. 8 .
90%
(EG6301, TX2335) .
. LED . . .
November 2008 19
9. . 10. LED ( ).
11. LED ().
[3] Lianqiao Yang, Sun Ho Jang, W. J. Hwang, and Moo Whan
Shin, Thermochimica Acta. 455, 95 (2007).
LED PCB . / . 3D HDI-Via Thin insulator filler Package on Package . 9 . chip de-
lamination .[3] / TIM (Thermal Interface Material) .
LED LED . LED 4 .
LED . epi-up (non-flip chip) epi-down (flip chip) Au . 10 (
) .
.
. (Ag paste)
chip on board . . 11 . . .
PPA . PPA 6 LED .
LED
November 2008 20
13. .
-10 0 10 20 30 40 50 60 70 80 90
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
Rth (K
/W)
Applied force (kgf)
No TIM Thermal tape Thermal grease
14. .
15. LED .
[4] Lan Kim and Moo Whan Shin, IEEE Trans. Component and
Packaging Technology 30, No. 4 (2007).
[5] Lan Kim, Jong Hwa Choi, Sun Ho Jang, and Moo Whan
Shin, Thermochimica Acta. 455, 21 (2007).
[6] Lianqiao Yang, Jianzheng Hu, Lan Kim and Moo Whan
Shin, Phys. Stat. Sol. (c) 3, 2187 (2006).
[7] Lianqiao Yang, Jianzheng Hu, and Moo Whan Shin, Solid
State Phenomena 124-126, 483-486 (2007).
0 1 2 3 4 5 6 7 8 9 10 11
20
40
60
80
100
120T
empe
ratu
re r
ise
(o C)
Chip number
i:0=10:1 i:0=1:1 i:0=1:10
12. .
. LTCC(Low Temp. Cofired Ceramic) thermal via . PCB . .
LED
. , , . 12 LED .
.[4] .
. LED . LED . LED , ( , , ),[5] [6] . LED . JEDEC 51-2 .
[7] LED
. 13, 14 LED . LED LED
. LED DC . LED
AC LED . AC LED LED LED .[8] LED
November 2008 21
17. LED .
16. LED (),
LED ().
[8] Lianqiao Yang, Jianzheng Hu and Moo Whan Shin, IEEE
Electron Device Letters 29, No.8 (2008).
[9] Jianzheng Hu, Lianqiao Yang, and Moo Whan Shin, IEEE
Transactions on Device and Materials Reliability 8, No. 2
(2008).
[10] JianZheng Hu, Lianqiao Yang, Woong Joon Hwang and
Moo Whan Shin, J. Crystal Growth 288, 157 (2006).
[11] Jianzheng Hu, Lianqiao Yang, Moo Whan Shin, Micro-
electronics Journal 38, 148 (2007).
. 15 LED
. LED .
.
Thermo-mechanical
LED thermo-mechanical delamination . Thermo-me-chanical . Thermo-mechanical , , , . LED .[9] 16 LED
. LED .[10] LED LED . Thermo-mechanical .
LED . .[11] 17 . LED LED .
LED . LED
, .
. LED , / , TIM
.